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91. 发明申请

WO2004012304A1 ELECTRICAL TERMINAL 审中-公开
标题翻译：电气端子
公开(公告)号：WO2004012304A1
公开(公告)日：2004-02-05
申请号：PCT/US2003/020179
申请日：2003-06-26
申请人： ANTAYA TECHNOLOGIES CORPORATION , ANTAYA, Stephen, C. , MACHADO, Manuel, H.
发明人： ANTAYA, Stephen, C. , MACHADO, Manuel, H.
IPC分类号： H01R13/04
CPC分类号： H01R13/04 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49217 , Y10T29/49218
摘要： An electrical terminal includes a generally planar base pad having two opposed legs and an intermediate portion. The base pad legs have proximal and distal ends and are joined at the proximal ends to the intermediate portion. The legs are spaced apart from each other to form a gap between the legs. The base pad legs have inner edges facing each other which extend away from each other moving away from the proximal ends of the base pad legs to the distal ends. A connector arm having a neck extends upwardly from the intermediate portion of the base pad between the base pad legs and terminates in a blade connector for engaging with a mating terminal. The neck has a proximal end with a width that is less than the gap between the proximal ends of the base pad legs by about %2 mm to 3 mm. The neck has a narrowing section moving away from the proximal end of the neck.
摘要翻译：电气端子包括具有两个相对的腿和中间部分的大致平面的基座垫。基座支脚具有近端和远端，并且在近端处连接到中间部分。腿部彼此间隔开以在腿部之间形成间隙。基座支腿具有彼此面对的内边缘，它们彼此远离，远离基座支柱的近端移动到远端。具有颈部的连接器臂从基座垫的中间部分向上延伸，并且终止于用于与配合端子接合的刀片连接器。颈部具有近端，该近端的宽度小于基座支脚的近端之间的间隙约2毫米至3毫米。颈部具有从颈部近端移开的变窄部分。

92. 发明申请

WO02064496A3 METHOD FOR FORMING MICROELECTRONIC SPRING STRUCTURES ON A SUBSTRATE 审中-公开
标题翻译：在基板上形成微电子弹簧结构的方法
公开(公告)号：WO02064496A3
公开(公告)日：2003-08-14
申请号：PCT/US0203938
申请日：2002-02-06
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , WENZEL STUART W
发明人： ELDRIDGE BENJAMIN N , WENZEL STUART W
IPC分类号： B81C1/00 , B81B3/00 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , H01H11/04 , H01L21/768 , H01L23/48 , H01L23/482 , H01R13/24 , H05K3/40 , H05K7/10
CPC分类号： G01R1/06716 , G01R1/0483 , G01R1/06727 , G01R1/06733 , G01R1/07342 , G01R3/00 , H01L23/4822 , H01L24/72 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12036 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01R12/52 , H01R13/24 , H01R13/2407 , H05K3/4092 , H05K7/1069 , Y10T29/49147 , H01L2924/00
摘要： A layer of sacrificial material is formed over a substrate. Then, a contoured surface is developed in the sacrificial material, such as by molding the sacrificial material using a mold or stamp. The contoured surface provides a mold for at least one spring form, and preferably for an array of spring forms. If necessary, the sacrificial layer is then cured or hardened. A layer of spring material is deposited over the contoured surface of the sacrificial material, in a pattern to define at least one spring form, and preferably an array of spring forms. The sacrificial material is then at least partially removed from beneath the spring form to reveal at least one freestanding spring structure. A separate conducting tip is optionally attached to each resulting spring structure, and each structure is optionally plated or covered with an additional layer or layers of material, as desired. An alternative method for making a resilient contact structure using the properties of a fluid meniscus is additionally disclosed. In an initial step of the alternative method, a layer of material is provided over a substrate. Then, a recess is developed in the material, and fluid is provided in the recess to form a meniscus. The fluid is cured or hardened to stabilize the contoured shape of the meniscus. The stabilized meniscus is then used to define a spring form in the same manner as the molded surface in the sacrificial material.
摘要翻译：在衬底上形成牺牲材料层。然后，在牺牲材料中形成轮廓表面，例如通过使用模具或印模模制牺牲材料。轮廓表面提供用于至少一种弹簧形式的模具，并且优选地用于弹簧形式的阵列。如果需要，则牺牲层被固化或硬化。弹性材料层以牺牲材料的轮廓表面沉积在图案中以限定至少一种弹簧形式，并且优选地是弹簧形式的阵列。然后，牺牲材料至少部分地从弹簧形式的下方移除，以露出至少一个独立的弹簧结构。单独的导电尖端任选地附接到每个所得到的弹簧结构，并且根据需要，每个结构可选地被电镀或覆盖有附加的一层或多层材料。还公开了使用流体弯液面的性质制造弹性接触结构的替代方法。在替代方法的初始步骤中，在衬底上提供一层材料。然后，在该材料中形成凹部，并且在凹部中设置流体以形成弯液面。流体被固化或硬化以稳定弯液面的轮廓形状。然后将稳定的弯液面用于与牺牲材料中的模制表面相同的方式限定弹簧形式。

93. 发明申请

WO2003030600A1 プリント配線板及びプリント配線板の製造方法审中-公开
标题翻译：印刷线路板和印刷线路板的生产方法
公开(公告)号：WO2003030600A1
公开(公告)日：2003-04-10
申请号：PCT/JP2002/010144
申请日：2002-09-30
申请人：イビデン株式会社 , 中井通
发明人：中井通
IPC分类号： H05K3/34
CPC分类号： H05K1/115 , C23C18/54 , H01L21/486 , H01L23/498 , H01L23/49816 , H01L23/49822 , H01L23/538 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/13111 , H01L2224/16237 , H01L2224/45144 , H01L2224/81026 , H01L2224/81192 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01061 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H05K1/112 , H05K3/244 , H05K3/28 , H05K3/3463 , H05K3/383 , H05K3/4602 , H05K3/4644 , Y10T29/49147 , H01L2924/00 , H01L2224/05599
摘要： A printed wiring board provided with solder pads excellent in frequency characteristics, wherein single−layer tin layers (74) are provided on conductor circuits (158) and vias (160) to form solder pads (73). Accordingly, a signal transmission speed is made higher than that of a prior−art printed wiring board formed with two−layer metal layers. The absence of a nickel layer can reduce production costs and enhance electrical characteristics.
摘要翻译：一种具有频率特性优异的焊盘的印刷电路板，其中在导体电路（158）和通孔（160）上设置单层锡层（74）以形成焊盘（73）。因此，使信号传输速度比形成有两层金属层的现有技术的印刷线路板的信号传输速度更高。没有镍层可以降低生产成本并提高电气特性。

94. 发明申请

WO2003017351A1 プローブカードの製造方法审中-公开
标题翻译：探针卡制造方法
公开(公告)号：WO2003017351A1
公开(公告)日：2003-02-27
申请号：PCT/JP2002/008049
申请日：2002-08-07
申请人：株式会社アドバンテスト , 和田晃一 , 前田泰宏
发明人：和田晃一 , 前田泰宏
IPC分类号： H01L21/66
CPC分类号： G01R3/00 , G01R1/06711 , G01R1/07342 , Y10T29/49002 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49155 , Y10T29/49169 , Y10T29/49204
摘要： A method for manufacturing a probe card having on a base substrate a contact to be brought into electric contact with an electronic device terminal and transmitting/receiving a signal to/from the electronic device. The method includes a first contact element formation step for forming a first contact element of the contact on a first surface of a first sacrifice substrate, a second contact element formation step for forming a second contact element of the contact on a first surface of a second sacrifice substrate, a signal transmission path formation step for forming a signal transmission path on a base substrate, a first contact element bonding step for bonding the first surface of the first sacrifice substrate to the base substrate and joining the first contact element with the signal transmission path, and a second contact element bonding step for bonding the first surface of the second sacrifice substrate to the base substrate and joining the second contact element with the signal transmission path.
摘要翻译：一种用于制造探针卡的方法，所述探针卡在基底基板上具有与电子设备端子电接触的接触件，并且向/从电子设备发送/接收信号。该方法包括第一接触元件形成步骤，用于在第一牺牲基底的第一表面上形成接触的第一接触元件;第二接触元件形成步骤，用于在第二接触元件的第二表面的第二表面上形成接触的第二接触元件牺牲衬底，用于在基底衬底上形成信号传输路径的信号传输路径形成步骤，用于将第一牺牲衬底的第一表面接合到基底衬底并将第一接触元件与信号传输器接合的第一接触元件接合步骤以及第二接触元件接合步骤，用于将第二牺牲基板的第一表面接合到基底基板，并将第二接触元件与信号传输路径接合。

95. 发明申请

WO02055904A2 METHOD FOR ASSEMBLING MECHATRONICS SENSOR 审中-公开
标题翻译：装配机械传感器的方法
公开(公告)号：WO02055904A2
公开(公告)日：2002-07-18
申请号：PCT/US2001/051276
申请日：2001-10-29
IPC分类号： F16D25/12 , F16H61/00 , H05K3/32 , F16H59/68 , G01L9/06 , H05K5/00
CPC分类号： F16D25/12 , F16H61/0006 , H05K3/326 , Y10T29/49004 , Y10T29/49126 , Y10T29/4913 , Y10T29/49135 , Y10T29/49147 , Y10T29/49149 , Y10T74/2186 , Y10T137/87885
摘要： A method of mounting a mechatronics control module (14) includes an electronic control unit (16) having a flex foil circuit (34) with a multiple of mounted electronic components including sensors (24) which sense the hydraulic state of the transmission clutch or other frictional engagement elements within the transmission system. The sensor is mounted to a base plate (82) which is mounted to a fixture (88) which folds the flap (84). When the base plate (82) and mounted sensor are removed from the fixture (88), the flap (84) unfolds so that the circuit traces of the flex foil (34) are adjacent the contacts (94). In a final step, the circuit traces (81) are electrically connected to the contacts (94).
摘要翻译：一种安装机电一体化控制模块（14）的方法包括具有柔性箔电路（34）的电子控制单元（16），所述柔性箔电路具有多个安装的电子部件，所述多个安装的电子部件包括感测传动离合器或其它传动系统内的摩擦接合元件。传感器安装到基板（82）上，底板（82）安装在折叠翼片（84）的固定装置（88）上。当基板（82）和安装的传感器从固定装置（88）移除时，折板（84）展开，使得柔性箔（34）的电路迹线与触点（94）相邻。在最后的步骤中，电路迹线（81）电连接到触点（94）。

96. 发明申请

WO0199232A3 ELECTRICALLY SHIELDED CONNECTOR 审中-公开
标题翻译：电气屏蔽连接器
公开(公告)号：WO0199232A3
公开(公告)日：2002-06-06
申请号：PCT/US0118484
申请日：2001-06-08
申请人： INTEST IP CORP , SMITH DOUGLAS W
发明人： SMITH DOUGLAS W
IPC分类号： H01R13/24 , G01R1/04 , G01R1/067 , H01R13/652 , H01R13/658 , H01R12/16
CPC分类号： G01R1/06772 , G01R1/0416 , H01R13/6599 , H01R2201/20 , Y10S439/931 , Y10T29/49139 , Y10T29/49147 , Y10T29/49153 , Y10T29/49194 , Y10T29/49204
摘要： In an electrically shielded connector, conductive material covers an outer surface of said body and is spaced away from a conductive structure included in the connector to create electrical isolation therebetween. A channel in which the connector is situated is either plugged when conductive material is applied to the connector during manufacturing or is counter bored to create the electrical isolation.
摘要翻译：在电屏蔽连接器中，导电材料覆盖所述主体的外表面并且与包括在连接器中的导电结构间隔开，以在它们之间形成电隔离。当在制造过程中将导电材料施加到连接器上时，连接器所在的通道被插入，或者被打开以产生电隔离。

97. 发明申请

WO01048870A3 INTERCONNECT FOR MICROELECTRONIC STRUCTURES WITH ENHANCED SPRING CHARACTERISTICS 审中-公开
标题翻译：具有增强弹簧特性的微电子结构互连
公开(公告)号：WO01048870A3
公开(公告)日：2002-02-21
申请号：PCT/US2000/035450
申请日：2000-12-27
IPC分类号： H01L21/48 , H01L23/48 , H01L23/485 , H01R12/00 , H01R13/24
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/06761 , H01L21/4853 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/71 , H01L24/72 , H01L2224/05001 , H01L2224/05568 , H01L2224/11002 , H01L2224/11003 , H01L2224/13099 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01061 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/3011 , H01R12/57 , H01R12/718 , H01R13/03 , H01R13/24 , H05K3/326 , H05K3/4092 , H05K2201/0311 , Y10T29/49147 , Y10T29/49149 , Y10T29/49204 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： An interconnection element and a method of forming an interconnection element. In one embodiment, the interconnection element includes a first structure and a second structure coupled to the first structure. The second structure coupled with the first material has a spring constant greater than the spring constant of the first structure alone. In one embodiment, the interconnection element is adapted to be coupled to an electronic component tracked as a conductive path from the electronic component. In one embodiment, the method includes forming a first (interconnection) structure coupled to a substrate to define a shape suitable as an interconnection in an integrated circuit environment and then coupling, such as by coating, a second (interconnection) structure to the first (interconnection) structure to form an interconnection element. Collectively, the first (interconnection) structure and the second (interconnection) structure have a spring constant greater than a spring constant of the first (interconnection) structure.
摘要翻译：一种互连元件和形成互连元件的方法。在一个实施例中，互连元件包括耦合到第一结构的第一结构和第二结构。与第一材料耦合的第二结构具有大于单独的第一结构的弹簧常数的弹簧常数。在一个实施例中，互连元件适于耦合到从电子部件跟踪为导电路径的电子部件。在一个实施例中，该方法包括形成耦合到衬底的第一（互连）结构，以限定适合于集成电路环境中的互连的形状，然后例如通过将第二（互连）结构涂覆到第一（互连）互连）结构以形成互连元件。总的来说，第一（互连）结构和第二（互连）结构具有大于第一（互连）结构的弹簧常数的弹簧常数。

98. 发明申请

WO02010779A1 METHOD FOR MAKING A CARD WITH MULTIPLE CONTACT TIPS FOR TESTING MICROSPHERE INTEGRATED CIRCUITS, AND TESTING DEVICE USING SAID CARD 审中-公开
标题翻译：制造具有用于测试微结构集成电路的多个接触提示的卡的方法和使用固定卡的测试装置
公开(公告)号：WO02010779A1
公开(公告)日：2002-02-07
申请号：PCT/FR2001/002411
申请日：2001-07-24
IPC分类号： G01R1/06 , G01R1/067 , G01R1/073 , G01R3/00 , H05K3/24 , H05K3/40
CPC分类号： G01R1/0735 , G01R1/06738 , G01R3/00 , H05K3/243 , H05K3/4007 , Y10T29/49117 , Y10T29/49147 , Y10T29/49155
摘要： The invention concerns a method for making a card with tips for testing semiconductor chips with microsphere bond pads. A first thin adhesive coat is vacuum deposited on a flexible polyimide film, followed by a second metal coat. A combination of UV photolithography and electroforming of a metal material enables to obtain the implantation of the tips (26). The pattern of the strip conductors is obtained by a second UV lithography operation whereby the second metal layer and the first adhesive coat are etched. An insulating protective resist is deposited on the active conductive zone. The flexible film (10) is mounted on a truncated maintaining component (30) whereof the vertical translational and planar rotational movements are made possible by a guide (43) supported on a spring suspension (46). The defective alignment between the plane of the tips (26) and the printed circuit plane (32) is corrected by a correcting system (31) with three support points adjustable with screws (40).
摘要翻译：本发明涉及一种用于制造具有用于用微球接合焊盘测试半导体芯片的尖端的卡的方法。将第一薄的粘合剂涂层真空沉积在柔性聚酰亚胺膜上，随后是第二金属涂层。 UV光刻和金属材料的电铸的组合使得能够获得尖端（26）的注入。带状导体的图案通过第二UV光刻操作获得，由此蚀刻第二金属层和第一粘合剂涂层。绝缘保护性抗蚀剂沉积在有源导电区上。柔性膜（10）安装在截头保持部件（30）上，垂直平移和平面旋转运动通过支撑在弹簧悬架（46）上的引导件（43）成为可能。通过校正系统（31）校正尖端（26）的平面与印刷电路平面（32）之间的不良对准，其中三个支撑点可用螺钉（40）调节。

99. 发明申请

WO01088612A1 PHOTOLITHOGRAPHICALLY-PATTERNED OUT-OF-PLANE COIL STRUCTURES AND METHOD OF MAKING 审中-公开
标题翻译：光刻图形平面外线圈结构和制作方法
公开(公告)号：WO01088612A1
公开(公告)日：2001-11-22
申请号：PCT/US2001/014985
申请日：2001-05-10
IPC分类号： H01F41/04 , G01R1/067 , G01R3/00 , G03C5/00 , H01F17/00 , H01F17/02 , H01F27/29 , H01L21/02 , H01L21/60 , H01L21/768 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/522 , H01R9/03 , H05K7/02 , G03C5/56 , G03C5/58 , H01L21/027 , H01L33/00
CPC分类号： H01L24/13 , G01R1/06727 , G01R3/00 , H01F17/0033 , H01F17/02 , H01F41/041 , H01L21/76838 , H01L21/7688 , H01L23/498 , H01L23/49811 , H01L23/5227 , H01L24/11 , H01L24/16 , H01L24/48 , H01L28/10 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13099 , H01L2224/4847 , H01L2224/8592 , H01L2924/0001 , H01L2924/00014 , H01L2924/00015 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/01061 , H01L2924/01068 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12034 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/4902 , Y10T29/49071 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49218 , H01L2924/00 , H01L2224/05599 , H01L2224/85399 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate (14) plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member (61a) having an intrinsic stress profile. The intrinsic stress profile biases a free portion (11) away from the substrate (14) forming a loop winding (142). An anchor portion (12) remains fixed to the substrate (14). The free portion end becomes a second anchor portion (61c) which may be connected to the substrate (14) via soldering or plating. A series of individual coil structures (140) can be joined via their anchor portions to form inductors and transformers.
摘要翻译：可以用于高Q电感和变压器的片上集成的平面外微结构使磁场方向平行于衬底（14）平面，而不需要高纵横比处理。光刻图案的线圈结构包括具有固有应力分布的弹性构件（61a）。固有应力分布使形成环形绕组（142）的衬底（14）远离自由部分（11）。锚定部分（12）保持固定到基底（14）上。自由部分端部成为第二锚定部分（61c），其可通过焊接或电镀连接到基板（14）。一系列单独的线圈结构（140）可以经由其锚固部分连接以形成电感器和变压器。

100. 发明申请

WO0004584A3 SEMICONDUCTOR COMPONENT IN A CHIP FORMAT AND METHOD FOR THE PRODUCTION THEREOF 审中-公开
标题翻译：芯片形式的半导体元件及其制造方法
公开(公告)号：WO0004584A3
公开(公告)日：2000-11-16
申请号：PCT/DE9902118
申请日：1999-07-06
申请人： SIEMENS AG , HACKE HANS JUERGEN , GALUSCHKI KLAUS PETER
发明人： HACKE HANS-JUERGEN , GALUSCHKI KLAUS-PETER
IPC分类号： H01L23/485 , H05K3/32 , H05K3/34 , H01L23/48 , H01L21/60 , H01L23/31 , H01L23/482 , H01L23/532
CPC分类号： H01L24/10 , H01L24/03 , H01L24/05 , H01L24/13 , H01L2224/0401 , H01L2224/05599 , H01L2224/13 , H01L2224/13099 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01032 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/351 , H05K3/321 , H05K3/3436 , H05K2201/0212 , H05K2201/10234 , H05K2201/10992 , Y02P70/613 , Y10T29/49117 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49798 , Y10T156/1089 , H01L2924/00
摘要： The invention relates to a semiconductor component in a chip format, comprising a chip with at least one first insulating layer (3) and electric contact surfaces (2) devoid of said insulating layer. Conductors (5) run from the electric contact surfaces (2) to the foot areas (10) of external connection elements (12) along the insulating layer (3). Another insulating layer (8) is also provided with through openings (9) leading from the outside to the foot areas (10) of the external connection elements (12). A conductive adhesive (11) is placed in said openings (9) and metallic globules (12) are placed at least on the outside thereon. The semiconductor element can also contain a solder paste instead of the conductive adhesive in the through openings (9), whereby the metallized synthetic globules are placed thereon. The invention also relates to a method for producing the semiconductor element thus described.
摘要翻译：本发明涉及芯片形式的半导体器件，芯片具有至少第一绝缘层（3）和其自由电连接表面（2）。在第一绝缘层（3）上，导体轨道（5）从外连接元件（12）的电连接表面（2）延伸到脚区域（10）。进一步施加的绝缘层（8）设有从外部通向外部连接元件（12）的脚部区域（10）的通道开口（9）。在通道开口（9）中是导电粘合剂（11），放置在至少外部金属珠（12）上。半导体元件还可以在通道开口（9）中包含焊膏而不是导电粘合剂，金属化塑料珠放置在导电粘合剂上。本发明还涉及制造所述半导体器件的方法。

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