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1. 发明申请

WO2012050333A3 RADIANT HEAT CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, HEAT GENERATING DEVICE PACKAGE HAVING THE SAME, AND BACKLIGHT 审中-公开
标题翻译：辐射热电路板，其制造方法，具有该发光装置的发热装置包和背光
公开(公告)号：WO2012050333A3
公开(公告)日：2012-08-30
申请号：PCT/KR2011007494
申请日：2011-10-10
申请人： LG INNOTEK CO LTD , PARK HYUN GYU , CHO IN HEE , AN YUN HO , PARK JAE MAN , KIM EUN JIN , KIM HAE YEON , LEE HYUK SOO
发明人： PARK HYUN GYU , CHO IN HEE , AN YUN HO , PARK JAE MAN , KIM EUN JIN , KIM HAE YEON , LEE HYUK SOO
IPC分类号： H01L23/34 , H01L33/64 , H05K7/20
CPC分类号： H05K7/205 , F21V29/70 , G02F1/133615 , H01L23/3677 , H01L25/0753 , H01L33/647 , H01L2224/16225 , H05K1/0204 , H05K1/056 , H05K1/113 , H05K3/30 , H05K3/4608 , H05K13/00 , H05K2201/09054 , H05K2201/10106 , H05K2201/10969 , Y10T29/4913
摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
摘要翻译：提供一种用于安装多个发热装置的辐射热电路板。辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热装置附接到该金属突起，暴露一体金属突起的绝缘构件，绝缘构件包括设置在金属板上的多个绝缘层，以及布置在绝缘构件上的第一和第二电极焊盘，布置的第一和第二电极焊盘彼此电分离。第一和第二电极焊盘从设置在绝缘层彼此不同的绝缘层上的电路线接收电压。因此，可以在发热装置之间设置辐射突起以改善热辐射。

2. 发明申请

WO2012087058A2 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：WO2012087058A2
公开(公告)日：2012-06-28
申请号：PCT/KR2011/010024
申请日：2011-12-23
申请人： LG INNOTEK CO., LTD. , LEE, Sang Myung , YOON, Sung Woon , LEE, Hyuk Soo , LEE, Sung Won , CHUN, Ki Do
发明人： LEE, Sang Myung , YOON, Sung Woon , LEE, Hyuk Soo , LEE, Sung Won , CHUN, Ki Do
IPC分类号： H05K3/40 , H05K3/46
CPC分类号： H05K1/0298 , H05K3/064 , H05K3/388 , H05K3/428 , H05K3/4647 , H05K3/4652 , H05K3/4682 , H05K2201/0341 , H05K2203/0376
摘要： Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.
摘要翻译：公开了一种印刷电路板及其制造方法。印刷电路板包括核心绝缘层，穿过核心绝缘层形成的至少一个通孔，埋在核心绝缘层中的内部电路层以及位于核心绝缘层的顶表面或底表面上的外部电路层其中，所述通孔包括第一部分，在所述第一部分下方的第二部分，在所述第一部分和所述第二部分之间的第三部分以及包括与所述第一部分至第三部分中的金属不同的金属的至少一个阻挡层。内部电路层和通孔同时形成，使得处理步骤减少。由于提供了奇数电路层，印刷电路板具有轻薄的结构。

3. 发明申请

WO2012033343A3 INTRA-PREDICTION ENCODING/DECODING APPARATUS AND METHOD FOR OMITTING THE TRANSMISSION OF PREDICTION MODE INFORMATION USING CHARACTERISTICS OF REFERENCE PIXELS 审中-公开
标题翻译：使用参考像素特性来预测传输预测模式信息的内部预测编码/解码装置和方法
公开(公告)号：WO2012033343A3
公开(公告)日：2012-05-31
申请号：PCT/KR2011006625
申请日：2011-09-07
申请人： SK TELECOM CO LTD , SONG JINHAN , LIM JEONGYEON , JUNG TAE YOUNG , LEE HYUK , JEONG JECHANG
发明人： SONG JINHAN , LIM JEONGYEON , JUNG TAE YOUNG , LEE HYUK , JEONG JECHANG
IPC分类号： H04N7/34
CPC分类号： H04N19/00569 , H04N19/11 , H04N19/14 , H04N19/176 , H04N19/46 , H04N19/593
摘要： Disclosed are an intra-prediction encoding/decoding apparatus and a method for omitting the transmission of prediction mode information using characteristics of reference pixels. The intra-prediction encoding apparatus according to one embodiment of the present invention comprises: a characteristic information calculation unit, which selects at least one of the reference pixels close to the current block to be encoded so as to calculate characteristic information on a direction; a comparison unit comparing the characteristic information on the direction calculated by the characteristic information calculation unit with a predetermined reference value; a prediction mode determination unit determining a prediction mode of the current block as a mode corresponding to the selected reference pixel, when a result of the comparison by the comparison unit meets a predetermined condition; and an encoding unit encoding a residual value between the current block and prediction block according to a determined mode, if the result of the comparison meets the predetermined condition, and omitting encoding mode information on the determined mode.
摘要翻译：公开了使用参考像素的特性来省略预测模式信息的发送的帧内预测编码/解码装置和方法。根据本发明的一个实施例的帧内预测编码装置包括：特征信息计算单元，其选择接近当前要编码的块的参考像素中的至少一个，以计算方向上的特征信息; 比较单元，将由特征信息计算单元计算的方向的特征信息与预定参考值进行比较; 当比较单元的比较结果满足预定条件时，预测模式确定单元确定当前块的预测模式作为与所选择的参考像素相对应的模式; 以及编码单元，如果比较结果满足预定条件，则根据确定的模式来编码当前块和预测块之间的残差，并且省略关于所确定的模式的编码模式信息。

4. 发明申请

WO2012005497A3 DEVICE AND METHOD FOR CONTROLLING COMPRESSOR, AND REFRIGERATOR INCLUDING SAME 审中-公开
标题翻译：用于控制压缩机的装置和方法，以及包括其的制冷器
公开(公告)号：WO2012005497A3
公开(公告)日：2012-05-03
申请号：PCT/KR2011004916
申请日：2011-07-05
申请人： LG ELECTRONICS INC , JEONG SANGSUB , LEE HYUK , OH WONSIK , KIM JONGKWON , LEE BORAM
发明人： JEONG SANGSUB , LEE HYUK , OH WONSIK , KIM JONGKWON , LEE BORAM
IPC分类号： F04B49/06 , F04C28/00 , F04C28/08 , F25D29/00
CPC分类号： F25B49/022 , F04B35/04 , F04B49/06 , F04B2203/0202 , F04B2203/0204 , F04C2240/403 , F04C2240/808 , F04C2270/86 , F04D27/001 , F25B49/025 , F25B2600/021 , F25D29/00 , Y02B30/741
摘要： Disclosed are a compressor control device, a method for controlling a compressor, and a refrigerator including the same. The present invention enables: a compressor to be driven by using a mode selectively to be driven by an inverter and a mode which directly uses a supply voltage, according to the quality of electricity of the supply voltage; loss which is caused by the use of the inverter to be reduced or removed by directly providing the supply voltage to the compressor within a certain voltage or frequency range; and increased energy efficiency by reducing power consumption.
摘要翻译：公开了压缩机控制装置，压缩机的控制方法和包括该压缩机的冰箱。本发明能够：根据电源电压的质量，通过使用选择性地由逆变器驱动的模式和直接使用电源电压的模式来驱动压缩机; 通过在一定的电压或频率范围内直接向压缩机提供电源电压而使逆变器的使用所引起的损耗; 并通过降低功耗来提高能源效率。

5. 发明申请

WO2012050333A2 RADIANT HEAT CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, HEAT GENERATING DEVICE PACKAGE HAVING THE SAME, AND BACKLIGHT 审中-公开
标题翻译：辐射热管电路板，制造该电路板的方法，具有该电路板的热生成装置包装以及背光
公开(公告)号：WO2012050333A2
公开(公告)日：2012-04-19
申请号：PCT/KR2011/007494
申请日：2011-10-10
申请人： LG INNOTEK CO., LTD. , PARK, Hyun Gyu , CHO, In Hee , AN, Yun Ho , PARK, Jae Man , KIM, Eun Jin , KIM, Hae Yeon , LEE, Hyuk Soo
发明人： PARK, Hyun Gyu , CHO, In Hee , AN, Yun Ho , PARK, Jae Man , KIM, Eun Jin , KIM, Hae Yeon , LEE, Hyuk Soo
IPC分类号： H01L23/34 , H05K7/20 , H01L33/64
CPC分类号： H05K7/205 , F21V29/70 , G02F1/133615 , H01L23/3677 , H01L25/0753 , H01L33/647 , H01L2224/16225 , H05K1/0204 , H05K1/056 , H05K1/113 , H05K3/30 , H05K3/4608 , H05K13/00 , H05K2201/09054 , H05K2201/10106 , H05K2201/10969 , Y10T29/4913
摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
摘要翻译：提供了一种用于安装多个发热装置的辐射热电路板。该辐射热电路板包括金属板，该金属板包括集成金属突起，该多个发热器件附接到集成金属突起，暴露该集成金属突起的绝缘构件，该绝缘构件包括设置在该金属板上的多个绝缘层，以及设置在绝缘构件上的第一和第二电极焊盘，设置的第一和第二电极焊盘彼此电隔离。第一电极焊盘和第二电极焊盘从设置在绝缘构件的彼此不同的绝缘层上的电路布线接收电压。因此，辐射投影可以设置在发热设备之间以改善热辐射。

6. 发明申请

WO2012011701A2 RADIANT HEAT CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：辐射热电路板及其制造方法
公开(公告)号：WO2012011701A2
公开(公告)日：2012-01-26
申请号：PCT/KR2011/005218
申请日：2011-07-15
申请人： LG INNOTEK CO., LTD. , AN, Yun Ho , KIM, Eun Jin , LEE, Hyuk Soo , PARK, Jae Man , CHO, In Hee , PARK, Hyun Gyu , KIM, Hae Yeon
发明人： AN, Yun Ho , KIM, Eun Jin , LEE, Hyuk Soo , PARK, Jae Man , CHO, In Hee , PARK, Hyun Gyu , KIM, Hae Yeon
IPC分类号： H05K7/20 , H05K1/02
CPC分类号： H05K1/181 , H01L23/3677 , H01L2224/48227 , H05K1/0204 , H05K1/03 , H05K1/09 , H05K3/0061 , H05K2201/10106 , H05K2203/0369
摘要： Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.
摘要翻译：公开了一种辐射热电路板及其制造方法。用于在其上安装发热装置的辐射热电路板包括金属板，金属板包括具有焊料的金属突起，发热器件附着到金属突起，金属突起上的接合层，金属突起上的绝缘层暴露金属突起的金属板以及绝缘层上的电路图案。通过在安装垫下方设置包括散热突起的金属板，从发热装置发出的热量直接传递到金属板，从而提高散热效率。散热突起的表面镀有包含铜的合金，从而改善了与焊料的粘附性，从而降低了故障率。

7. 发明申请

WO2012005530A2 RECIPROCATING COMPRESSOR 审中-公开
标题翻译：再生压缩机
公开(公告)号：WO2012005530A2
公开(公告)日：2012-01-12
申请号：PCT/KR2011004984
申请日：2011-07-07
申请人： LG ELECTRONICS INC , KI SUNGHYUN , LEE HYUK , HONG EONPYO
发明人： KI SUNGHYUN , LEE HYUK , HONG EONPYO
IPC分类号： F04B39/12 , F04B17/04 , F04B35/04 , F04B39/00
CPC分类号： F04B9/00 , F04B35/045 , F04B39/121 , F04B39/127
摘要： The present invention relates to a reciprocating compressor in which a cylinder of a compression unit is tightly fixed to a hermetic shell, and a stator of a reciprocating motor is fixed to the hermetic shell by a support spring consisting of a leaf spring, so as to reduce the gap between a compressor body and the hermetic shell and thus reduce the size of the compressor. In addition, the masses of the members of the reciprocating motor and of the compression unit, as well as the elasticity of the spring supporting the members, are properly adjusted to offset the force being applied to the hermetic shell, thereby minimizing the vibrations of the hermetic shell. Further, the relative velocity of the reciprocating motor increases such that the relative velocity of the reciprocating motor is faster than the relative velocity of the compression unit, thereby improving the efficiency of the motor.
摘要翻译：本发明涉及一种往复式压缩机，其中压缩单元的缸体紧密地固定在密封壳体上，并且往复式电动机的定子通过由板簧组成的支撑弹簧固定在密封壳体上，减少压缩机主体和密封壳之间的间隙，从而减小压缩机的尺寸。此外，往复式电动机和压缩单元的构件的质量以及支撑构件的弹簧的弹性被适当地调节以抵消施加到密封壳的力，从而最小化密封壳。此外，往复式电动机的相对速度增加，使得往复式电动机的相对速度比压缩单元的相对速度快，从而提高电动机的效率。

8. 发明申请

WO2011014029A3 A FABRIC TREATING MACHINE 审中-公开
标题翻译：一种织物处理机
公开(公告)号：WO2011014029A3
公开(公告)日：2011-04-21
申请号：PCT/KR2010005004
申请日：2010-07-29
申请人： LG ELECTRONICS INC , KIM YOUNG JONG , LEE HYUK SOO
发明人： KIM YOUNG JONG , LEE HYUK SOO
IPC分类号： D06F37/24 , D06F37/12 , F16F15/10
CPC分类号： D06F37/24 , D06F37/20 , D06F37/206
摘要： A fabric treating machine according a present invention comprises a first vibration mitigation part which is disposed between a stator and a bearing unit. Therefore, it can reduce the transfer of the vibration from the driving unit to the bearing unit, and the vibration of an inner tub and an outer tub can be reduced, and a noise can be reduced. Thus, a reliability of product can be improved. Also, a fabric treating machine according a present invention comprises a vibration mitigation part which is disposed between an upper bearing unit and a lower bearing unit. Therefore, it can reduce the vibration transfer from the lower bearing unit to the upper bearing unit, and the vibration of an inner tub and an outer tub can be reduced, and a noise can be reduced.
摘要翻译：根据本发明的织物处理机包括设置在定子和轴承单元之间的第一振动缓解部分。因此，可以减少从驱动单元到轴承单元的振动的传递，并且可以减小内桶和外桶的振动，并且可以降低噪音。因此，可以提高产品的可靠性。而且，根据本发明的织物处理机包括设置在上轴承单元和下轴承单元之间的减振部分。因此，可以减少从下轴承单元到上轴承单元的振动传递，并且可以减小内桶和外桶的振动，并且可以降低噪音。

9. 发明申请

WO2010036051A2 STRUCTURE AND MANUFACTURE METHOD FOR MULTI-ROW LEAD FRAME AND SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：用于多引线框架和半导体封装的结构和制造方法
公开(公告)号：WO2010036051A2
公开(公告)日：2010-04-01
申请号：PCT/KR2009005481
申请日：2009-09-25
申请人： LG INNOTEK CO LTD , KIM JI YUN , SHIN HYUN SUB , LEE SUNG WON , LEE HYUNG EUI , SEO YEONG UK , RYU SUNG WUK , LEE HYUK SOO
发明人： KIM JI YUN , SHIN HYUN SUB , LEE SUNG WON , LEE HYUNG EUI , SEO YEONG UK , RYU SUNG WUK , LEE HYUK SOO
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L21/4832 , H01L23/49503 , H01L23/49513 , H01L23/49541 , H01L23/49568 , H01L23/49582 , H01L24/48 , H01L24/73 , H01L24/95 , H01L2224/32057 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/73265 , H01L2224/83385 , H01L2224/85001 , H01L2224/85411 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85457 , H01L2224/85464 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15153 , H01L2924/15165 , H01L2924/157 , H01L2924/181 , H01L2924/19043 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching.
摘要翻译：本发明涉及多排引线框架和半导体封装的结构和制造方法，其特征在于在金属材料上形成焊盘部分（第一步骤）; 在第一图案形成之后执行表面电镀工艺或有机材料涂层（第二步骤）; 在金属材料上形成第二图案（第三步骤）; 并且在第二图案形成之后封装半导体芯片（第四步骤），由此通过施加渐进蚀刻来最小化底切现象。

10. 发明申请

WO2007078144A3 AIR-CONDITIONING SYSTEM AND CONTROLLING METHOD THEREOF 审中-公开
标题翻译：空调系统及其控制方法
公开(公告)号：WO2007078144A3
公开(公告)日：2009-06-11
申请号：PCT/KR2007000026
申请日：2007-01-03
申请人： LG ELECTRONICS INC , KO YOUNG HWAN , LEE HYUK SOO , KIM BUM SUK , PARK SANG KYOUNG , KIM BYUNG SOON
发明人： KO YOUNG HWAN , LEE HYUK SOO , KIM BUM SUK , PARK SANG KYOUNG , KIM BYUNG SOON
IPC分类号： F24F3/14
CPC分类号： F25B13/00 , F25B1/10 , F25B31/004 , F25B43/00 , F25B43/006 , F25B2313/02741 , F25B2341/0662 , F25B2400/075 , F25B2400/0751 , F25B2400/13 , F25B2400/23 , F25B2500/01 , F25B2600/0253 , F25B2600/2509 , F25B2600/2519 , Y02B30/741
摘要： The present invention discloses an air conditioning system comprises a phase separator (500) separating a gaseous refrigerant and a liquid refrigerant from a flowing refrigerant, an evaporator (600) evaporating the liquid refrigerant separated by the phase separator (500), and at least one compressor (100) including a first compressing part (110) receiving the refrigerant via the evaporator (600) and a second compressing part (120) receiving both of the gaseous refrigerant separated by the phase separator (500) and the refrigerant via the first compressing part (110), wherein a volume of a first cylinder of the first compressing part (110) is different from a volume of a second cylinder of the second compressing part (120).
摘要翻译：本发明公开了一种空调系统，包括从流动制冷剂分离气态制冷剂和液体制冷剂的相分离器（500），蒸发由相分离器（500）分离的液体制冷剂的蒸发器（600），以及至少一个压缩机（100）包括经由蒸发器（600）接收制冷剂的第一压缩部件（110）和接收由相分离器（500）分离的两种气态制冷剂的第二压缩部件（120）和通过第一压缩部分（110），其中所述第一压缩部分（110）的第一气缸的体积与所述第二压缩部分（120）的第二气缸的体积不同。

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