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1. 发明授权

US08578592B2 Method of manufacturing laminated rotor core 有权
标题翻译：层叠转子铁心的制造方法
公开(公告)号：US08578592B2
公开(公告)日：2013-11-12
申请号：US13509190
申请日：2011-04-01
申请人： Akira Nagai , Mei Arazoe , Go Kato
发明人： Akira Nagai , Mei Arazoe , Go Kato
IPC分类号： H02K15/03 , H02K1/27
CPC分类号： H02K15/03 , H02K1/276
摘要： A method of manufacturing a laminated rotor core, includes a first process of placing segment dummy plates between an iron core and a die, each of each segment dummy plates covering one or more of plural magnet insertion portions and including a resin injection hole communicating to the one or more of the magnet insertion portions; a second process of injecting a resin from resin reservoir parts formed in any one of an upper die and a lower die holding the iron core through the resin injection hole of each segment dummy plate to the corresponding one or more of the magnet insertion portions; and a third process of detaching the segment dummy plates together with excess resin after the resin injected to the one or more of the magnet insertion portions is cured.
摘要翻译：一种叠层转子铁芯的制造方法，其特征在于，包括：在铁芯和模具之间配置分段虚拟板的第一工序，各个虚拟板各自覆盖多个磁体插入部的一个或多个，一个或多个磁体插入部分; 将形成在保持铁芯的上模和下模中的任一个中的树脂储存部分注入树脂的第二过程通过每个段虚拟板的树脂注入孔到相应的一个或多个磁体插入部分; 以及在注入到所述一个或多个所述磁体插入部分中的树脂被固化之后，将多个模板与多余的树脂一起分离的第三过程。

2. 发明授权

US08273457B2 Adhesive for bonding circuit members, circuit board and process for its production 有权
公开(公告)号：US08273457B2
公开(公告)日：2012-09-25
申请号：US13166570
申请日：2011-06-22
申请人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
发明人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
IPC分类号： B32B27/38
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

3. 发明授权

US08044524B2 Adhesive for connection of circuit member and semiconductor device using the same 失效
标题翻译：用于连接电路元件和使用其的半导体器件的粘合剂
公开(公告)号：US08044524B2
公开(公告)日：2011-10-25
申请号：US12500114
申请日：2009-07-09
申请人： Akira Nagai
发明人： Akira Nagai
IPC分类号： H01L29/40 , H01L23/29
CPC分类号： C09J11/04 , C08K3/08 , C08K3/22 , C08L2666/28 , C09J163/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/90 , H01L2224/05111 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/0558 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/13144 , H01L2224/16238 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29369 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81903 , H01L2224/83101 , H01L2224/83191 , H01L2224/83851 , H01L2224/90 , H01L2224/9211 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/15788 , H01L2924/00011 , H01L2224/16225 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/0665 , H01L2224/81 , H01L2224/83
摘要： An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition.
摘要翻译：一种用于连接电路部件的粘合剂，其被插入在具有突出连接端子的半导体芯片和形成在其上的布线图案的板之间，用于将连接端子和彼此面对的布线图案电连接，并通过施加压力来接合半导体芯片和板 /热，含有含有热可塑性树脂的树脂组合物，交联性树脂和用于形成交联性树脂的交联结构的硬化剂; 和分散在树脂组合物中的复合氧化物颗粒。

4. 发明申请

US20110247873A1 ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION 有权
公开(公告)号：US20110247873A1
公开(公告)日：2011-10-13
申请号：US13166570
申请日：2011-06-22
申请人： Itsuo WATANABE , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
发明人： Itsuo WATANABE , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
IPC分类号： H05K1/11 , H05K13/04 , B32B37/14 , B32B37/10 , B32B37/12
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

5. 发明申请

US20110127667A1 ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME 审中-公开
标题翻译：用于连接电路部件和使用其的半导体器件的粘合剂
公开(公告)号：US20110127667A1
公开(公告)日：2011-06-02
申请号：US13023195
申请日：2011-02-08
申请人： Akira Nagai
发明人： Akira Nagai
IPC分类号： H01L23/48 , C08K3/18 , C08K3/34 , C08K3/38 , C09J163/00 , H01B1/20
CPC分类号： C09J11/04 , C08K3/08 , C08K3/22 , C08L2666/28 , C09J163/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/90 , H01L2224/05111 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/0558 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/13144 , H01L2224/16238 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29369 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81903 , H01L2224/83101 , H01L2224/83191 , H01L2224/83851 , H01L2224/90 , H01L2224/9211 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/15788 , H01L2924/00011 , H01L2224/16225 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/0665 , H01L2224/81 , H01L2224/83
摘要： An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition.
摘要翻译：一种用于连接电路部件的粘合剂，其被插入在具有突出连接端子的半导体芯片和形成在其上的布线图案的板之间，用于将连接端子和彼此面对的布线图案电连接，并通过施加压力来接合半导体芯片和板 /热，含有含有热可塑性树脂的树脂组合物，交联性树脂和用于形成交联性树脂的交联结构的硬化剂; 和分散在树脂组合物中的复合氧化物颗粒。

6. 发明申请

US20110121447A1 ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME 审中-公开
公开(公告)号：US20110121447A1
公开(公告)日：2011-05-26
申请号：US13023208
申请日：2011-02-08
申请人： Akira Nagai
发明人： Akira Nagai
IPC分类号： H01L23/48 , C08K3/22 , C08K3/38 , C08K3/34 , C09J163/00 , H01B1/14
CPC分类号： C09J11/04 , C08K3/08 , C08K3/22 , C08L2666/28 , C09J163/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/90 , H01L2224/05111 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/0558 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/13144 , H01L2224/16238 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29369 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81903 , H01L2224/83101 , H01L2224/83191 , H01L2224/83851 , H01L2224/90 , H01L2224/9211 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/15788 , H01L2924/00011 , H01L2224/16225 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/0665 , H01L2224/81 , H01L2224/83
摘要： An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition.

7. 发明申请

US20100003771A1 PRODUCTION METHOD OF SEMICONDUCTOR DEVICE AND BONDING FILM 有权
标题翻译：半导体器件和粘结膜的生产方法
公开(公告)号：US20100003771A1
公开(公告)日：2010-01-07
申请号：US12306285
申请日：2007-06-20
申请人： Akira Nagai , Masaaki Yasuda , Keiichi Hatakeyama , Tetsuya Enomoto
发明人： Akira Nagai , Masaaki Yasuda , Keiichi Hatakeyama , Tetsuya Enomoto
IPC分类号： H01L21/60 , H01L21/301 , H01L21/683 , C08L63/00
CPC分类号： H01L21/6835 , H01L21/67092 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/90 , H01L2221/6834 , H01L2223/54426 , H01L2223/54473 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13144 , H01L2224/16225 , H01L2224/274 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81121 , H01L2224/81191 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/83191 , H01L2224/838 , H01L2224/83851 , H01L2224/83885 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01052 , H01L2924/01058 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07811 , H01L2924/15788 , H01L2924/00 , H01L2924/3512 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： To provide a method of manufacturing semiconductor devices, the method being capable of efficiently obtaining a singulated semiconductor chip upon which an adhesive is adhered and also capable of excellently bonding a semiconductor chip to a wiring substrate, and provide an adhesive film. A layered product 60 in which a dicing tape 9, an adhesive layer 3, and a semiconductor wafer 6 are stacked in this order so that a circuit surface 6a of the semiconductor wafer 6 may face the dicing tape 9 side. A cutting position is recognized by recognizing a circuit pattern P in the circuit surface 6a from a rear surface 6b of the semiconductor wafer 6. At least the semiconductor wafer 6 and the adhesive layer 3 are cut in the thickness direction of the layered product 60. The dicing tape 9 is cured to peel off the dicing tape 9 and the adhesive layer 3. A projection electrode 4 of a semiconductor chip 26 is aligned with a wiring 12 of a wiring substrate 40. The wiring substrate 40 and the semiconductor chip 26 are bonded via an adhesive layer 23 so that the wiring 12 and the projection electrode 4 may be electrically connected to each other.
摘要翻译：为了提供一种制造半导体器件的方法，该方法能够有效地获得附着有粘合剂的单片半导体芯片，并且还能够将半导体芯片优良地接合到布线基板，并且提供粘合膜。依次层叠有切割带9，粘合层3和半导体晶片6的层叠体60，使半导体晶片6的电路面6a面向切割带9侧。通过从半导体晶片6的后表面6b识别电路表面6a中的电路图案P来识别切割位置。至少半导体晶片6和粘合剂层3在层叠体60的厚度方向上被切割。将切割胶带9固化以剥离切割胶带9和粘合剂层3.半导体芯片26的投影电极4与布线基板40的布线12对准。布线基板40和半导体芯片26是通过粘合剂层23粘合，使得布线12和突起电极4可以彼此电连接。

8. 发明授权

US07112627B2 Low dielectric loss tangent films and wiring films 失效
标题翻译：低介电损耗角正切膜和布线膜
公开(公告)号：US07112627B2
公开(公告)日：2006-09-26
申请号：US10385720
申请日：2003-03-12
申请人： Satoru Amou , Shinji Yamada , Takao Ishikawa , Akira Nagai , Masatoshi Sugimasa
发明人： Satoru Amou , Shinji Yamada , Takao Ishikawa , Akira Nagai , Masatoshi Sugimasa
IPC分类号： C08L9/00
CPC分类号： H05K1/032 , Y10T428/31721 , Y10T428/31855 , Y10T428/31909 , Y10T442/2861 , Y10T442/3854 , Y10T442/3862 , Y10T442/3886 , Y10T442/3902 , Y10T442/3911 , Y10T442/678
摘要： A curing low dielectric loss tangent film using a low dielectric loss tangent composition containing a polyfunctional styrene compound having excellent dielectric characteristics, and a wiring film using the same as an insulating layer are provided. The low dielectric loss tangent film contains a high molecular weight material and a crosslinking ingredient with a weight average molecular weight of 1000 or less having a plurality of styrene groups shown by the following general formula: (where R represents a hydrocarbon skeleton, R1, which may be identical or different with each other, represents a hydrogen atom or a hydrocarbon group of 1 to 20 carbon atoms, R2, R3 and R4, which may be identical or different with each other, each represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, m represents an integer of 1 to 4, and n represents an integer of 2 or greater).
摘要翻译：提供了使用包含具有优异介电特性的多官能苯乙烯化合物的低介电损耗角正切组合物的固化低介电损耗角正切薄膜和使用其的绝缘层的布线膜。低介电损耗角正切膜含有高分子量材料和重均分子量为1000以下的具有多个苯乙烯基团的交联成分，所述苯乙烯基团由以下通式表示：（其中R表示烃骨架，R ^{1可以相同或不同，表示氢原子或1-20个碳原子的烃基，R 2，R 3 O，和R 4彼此可以相同或不同，各自表示氢原子或1〜6个碳原子的烷基，m表示1〜4的整数，n表示 2以上的整数）。}

9. 发明授权

US06998958B2 Remote control system for a vehicle 有权
标题翻译：车辆遥控系统
公开(公告)号：US06998958B2
公开(公告)日：2006-02-14
申请号：US10875208
申请日：2004-06-25
申请人： Suguru Asakura , Akira Nagai , Kentaro Yoshimura , Munehisa Nozawa , Sadanori Watarai
发明人： Suguru Asakura , Akira Nagai , Kentaro Yoshimura , Munehisa Nozawa , Sadanori Watarai
IPC分类号： G05B19/00
CPC分类号： B60R25/245 , G07C9/00309 , G07C2209/63
摘要： A remote control system for precisely identifying a distance from the vehicle to an entry key and favorably controlling a vehicle-mounted device such as a door corresponding to the distance. The system comprises a transmitter transmitting different types of response demand signals within a predetermined communication area outside the vehicle, a vehicle mounted receiver for receiving a response signal released from a portable transmitter/receiver in response to the reception of the response demand signal, a controller controlling the vehicle mounted device corresponding to the reception of the response signal by the vehicle mounted receiver. Locking and/or unlocking door(s) of the vehicle are controlled on the basis of whether or not the receiver receives the response signal to a response demand signal other than one having the largest communication area.
摘要翻译：一种远程控制系统，用于精确地识别从车辆到入口钥匙的距离，并且有利地控制与该距离相对应的诸如门的车载装置。该系统包括在车辆外部的预定通信区域内发送不同类型的响应需求信号的发送器，用于响应于响应请求信号的接收而从便携式发送器/接收器接收到响应信号的车载接收器，控制器根据车载接收机的响应信号的接收来控制车载装置。基于接收机是否接收到具有最大通信区域的响应请求信号的响应请求信号来控制车辆的锁定和/或解锁门。

10. 发明授权

US06989600B2 Integrated circuit device having reduced substrate size and a method for manufacturing the same 失效
标题翻译：具有减小的基板尺寸的集成电路装置及其制造方法
公开(公告)号：US06989600B2
公开(公告)日：2006-01-24
申请号：US10240651
申请日：2001-03-30
申请人： Masaharu Kubo , Ichiro Anjo , Akira Nagai , Osamu Kubo , Hiromi Abe , Hitoshi Akamine
发明人： Masaharu Kubo , Ichiro Anjo , Akira Nagai , Osamu Kubo , Hiromi Abe , Hitoshi Akamine
IPC分类号： H01L23/48
CPC分类号： H01L24/12 , H01L21/76838 , H01L23/49816 , H01L23/49822 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05024 , H01L2224/05025 , H01L2224/05147 , H01L2224/05184 , H01L2224/05571 , H01L2224/05572 , H01L2224/05573 , H01L2224/05644 , H01L2224/05655 , H01L2224/05671 , H01L2224/13099 , H01L2224/13111 , H01L2224/16 , H01L2224/73253 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/01044 , H01L2924/0105 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/04941 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/00 , H01L2924/00014
摘要： CMOS logic LSI comprises, as a part thereof, n-channel MISFET's (Qn), p-channel MISFET's (Qp) and a first-layer wiring (11) to a third-layer (13) formed on a main surface of a silicon substrate (1), and as another part, a fourth-layer wiring (14) to a seventh-layer wiring (17) formed on a main surface of a glass substrate (30) different from the silicon substrate (1). The main surface of the silicon substrate (1) and the main surface of the glass substrate (30) are arranged in face-to-face relation with each other, and a plurality of microbumps (20A) formed at the uppermost portion of the silicon substrate (1) and a plurality of microbumps (20B) formed at the uppermost portion of the glass substrate (30) are electrically connected, thereby constituting the CMOS logic LSI as a whole.
摘要翻译： CMOS逻辑LSI的一部分包括形成在硅的主表面上的n沟道MISFET（Qn），p沟道MISFET（Qp）和第一层布线（11）到第三层（13）基板（1），另一部分形成在与硅基板（1）不同的玻璃基板（30）的主面上形成的第七层布线（17）。硅基板（1）的主表面和玻璃基板（30）的主表面彼此面对面地布置，并且形成在所述玻璃基板的最上部的多个微丸（20A）硅基板（1）和形成在玻璃基板（30）的最上部的多个微胶片（20A）电连接，从而构成整体上的CMOS逻辑LSI。

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