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1. 发明申请

US20110065260A1 PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART 有权
公开(公告)号：US20110065260A1
公开(公告)日：2011-03-17
申请号：US12950398
申请日：2010-11-19
申请人： Takashi KAWAMORI , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
发明人： Takashi KAWAMORI , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
IPC分类号： H01L21/78 , B29C65/52
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.

2. 发明授权

US06303727B1 Linear triene compound and copolymer 失效
标题翻译：线性三烯化合物和共聚物
公开(公告)号：US06303727B1
公开(公告)日：2001-10-16
申请号：US09320838
申请日：1999-05-26
申请人： Ken Maeda , Masaaki Yasuda , Terunori Fujita , Keiji Okada , Makoto Kamimura , Kazuyuki Takimoto , Hidetatsu Murakami , Masaaki Kawasaki , Keiji Watanabe
发明人： Ken Maeda , Masaaki Yasuda , Terunori Fujita , Keiji Okada , Makoto Kamimura , Kazuyuki Takimoto , Hidetatsu Murakami , Masaaki Kawasaki , Keiji Watanabe
IPC分类号： C08F13600
CPC分类号： C08F236/22 , C07C2/04 , C07C11/21 , C07C2527/24 , C07C2531/14
摘要： A novel and useful linear triene compound represented by the following formula (1) is co-polymerized with an &agr;-olefin to obtain an ethylenically unsaturated copolymer which is superior in weather-ability, heat resitance and fastness to ozone, together with superior scorch stability and vulcanizability at high velocity in which R1, R2, R3, R4, R5 and R6 stand each, independently of each other, for hydrogen atom or an alkyl having 1-3 carbon atoms, R7 represents an alkyl having 1-3 carbon atoms and n is an integer of 0-5, with the proviso that each of R4s or of R5s may be identical with or different from each other, respectively, when n is 2 or greater.
摘要翻译：由下式（1）表示的新型有用的线性三烯化合物与α-烯烃共聚，得到耐候性，耐热性和耐臭氧性优异的烯属不饱和共聚物，以及优异的焦烧稳定性和R 1，R 2，R 3，R 4，R 5和R 6各自独立地表示氢原子或具有1-3个碳原子的烷基的高速度下的硫化性，R7表示具有1-3个碳原子的烷基，n表示是0-5的整数，条件是当n为2或更大时，R 4或R 5中的每一个可以分别彼此相同或不同。

3. 发明授权

US5910591A Method of preparation of 4-hydroxy-1,2,2,6,6-pentamethylpiperidine 失效
标题翻译： 4-羟基-1,2,2,6,6-五甲基哌啶的制备方法
公开(公告)号：US5910591A
公开(公告)日：1999-06-08
申请号：US953517
申请日：1997-10-17
申请人： Masaaki Yasuda
发明人： Masaaki Yasuda
IPC分类号： C07D211/46 , C07D211/44
CPC分类号： C07D211/46
摘要： The present invention relates to a method for preparing 4-hydroxy-1,2,2,6,6-pentamethylpiperidine comprising the following steps:(i) reacting 4-hydroxy-2,2,6,6-tetramethylpiperidine with at least one compound selected from the group consisting of formaldehyde, paraformaldehyde and trioxane, optionally in the presence of formic acid;(ii) neutralizing the reaction product of step (i) by adding a base thereto; and(iii) after the neutralization, separating the crude product from the aqueous layer and crystallizing and filtering the crude product to thereby obtain crystals of 4-hydroxy-1,2,2,6,6-pentamethylpiperidine with a water content of 3% by weight or less. The present invention also relates to a method for preparing 4-hydroxy-1,2,2,6,6-pentamethylpiperidine, comprising reacting 4-hydroxy-2,2,6,6-tetramethylpiperidine with at least one compound selected from the group consisting of formaldehyde, paraformaldehyde and trioxane, optionally in the presence of formic acid added in an amount smaller than that of 4-hydroxy-2,2,6,6-tetramethylpiperidine in terms of mole.
摘要翻译：本发明涉及一种制备4-羟基-1,2,2,6,6-五甲基哌啶的方法，包括以下步骤：（i）使4-羟基-2,2,6,6-四甲基哌啶与至少一种选自甲醛，多聚甲醛和三恶烷的化合物，任选在甲酸存在下; （ii）通过向其中加入碱来中和步骤（i）的反应产物; 和（iii）中和后，将粗产物与水层分离并使粗产物结晶并过滤，从而得到水含量为3％的4-羟基-1,2,2,6,6-五甲基哌啶晶体，以下。本发明还涉及一种制备4-羟基-1,2,2,6,6-五甲基哌啶的方法，包括使4-羟基-2,2,6,6-四甲基哌啶与至少一种选自下组的化合物由甲醛，多聚甲醛和三恶烷组成，任选在甲酸的存在下加入的量小于4-羟基-2,2,6,6-四甲基哌啶的摩尔量。

4. 发明授权

US08673539B2 Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part 有权
标题翻译：感光性粘合剂组合物，使用该粘合剂组合物，粘合剂膜，粘合片，具有粘合剂层的半导体晶片，半导体器件和电子部件
公开(公告)号：US08673539B2
公开(公告)日：2014-03-18
申请号：US13672847
申请日：2012-11-09
申请人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
发明人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
IPC分类号： G03F7/00 , G03F7/40 , G03F7/26
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译：一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。

5. 发明授权

US08445177B2 Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part 有权
标题翻译：感光性粘合剂组合物，使用该粘合剂组合物，粘合剂膜，粘合片，具有粘合剂层的半导体晶片，半导体器件和电子部件
公开(公告)号：US08445177B2
公开(公告)日：2013-05-21
申请号：US12950353
申请日：2010-11-19
申请人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
发明人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
IPC分类号： G03F7/00 , G03F7/004 , G03F7/027
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译：一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。

6. 发明授权

US08034659B2 Production method of semiconductor device and bonding film 有权
标题翻译：半导体器件和接合膜的制造方法
公开(公告)号：US08034659B2
公开(公告)日：2011-10-11
申请号：US12306285
申请日：2007-06-20
申请人： Akira Nagai , Masaaki Yasuda , Keiichi Hatakeyama , Tetsuya Enomoto
发明人： Akira Nagai , Masaaki Yasuda , Keiichi Hatakeyama , Tetsuya Enomoto
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , H01L21/67092 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/90 , H01L2221/6834 , H01L2223/54426 , H01L2223/54473 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13144 , H01L2224/16225 , H01L2224/274 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81121 , H01L2224/81191 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/83191 , H01L2224/838 , H01L2224/83851 , H01L2224/83885 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01052 , H01L2924/01058 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07811 , H01L2924/15788 , H01L2924/00 , H01L2924/3512 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： To provide a method of manufacturing semiconductor devices, the method being capable of efficiently obtaining a singulated semiconductor chip upon which an adhesive is adhered and also capable of excellently bonding a semiconductor chip to a wiring substrate, and provide an adhesive film. A layered product 60 in which a dicing tape 9, an adhesive layer 3, and a semiconductor wafer 6 are stacked in this order so that a circuit surface 6a of the semiconductor wafer 6 may face the dicing tape 9 side. A cutting position is recognized by recognizing a circuit pattern P in the circuit surface 6a from a rear surface 6b of the semiconductor wafer 6. At least the semiconductor wafer 6 and the adhesive layer 3 are cut in the thickness direction of the layered product 60. The dicing tape 9 is cured to peel off the dicing tape 9 and the adhesive layer 3. A projection electrode 4 of a semiconductor chip 26 is aligned with a wiring 12 of a wiring substrate 40. The wiring substrate 40 and the semiconductor chip 26 are bonded via an adhesive layer 23 so that the wiring 12 and the projection electrode 4 may be electrically connected to each other.
摘要翻译：为了提供一种制造半导体器件的方法，该方法能够有效地获得附着有粘合剂的单片半导体芯片，并且还能够将半导体芯片优良地接合到布线基板，并且提供粘合膜。依次层叠有切割带9，粘合层3和半导体晶片6的层叠体60，使半导体晶片6的电路面6a面向切割带9侧。通过从半导体晶片6的后表面6b识别电路表面6a中的电路图案P来识别切割位置。至少半导体晶片6和粘合剂层3在层叠体60的厚度方向上被切割。将切割胶带9固化以剥离切割胶带9和粘合剂层3.半导体芯片26的投影电极4与布线基板40的布线12对准。布线基板40和半导体芯片26是通过粘合剂层23粘合，使得布线12和突起电极4可以彼此电连接。

7. 发明申请

US20100314783A1 PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART 有权
标题翻译：感光性粘合剂组合物，使用它们，粘合膜，粘合片，具有粘合层的半导体膜，半导体器件和电子部件
公开(公告)号：US20100314783A1
公开(公告)日：2010-12-16
申请号：US12859720
申请日：2010-08-19
申请人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
发明人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
IPC分类号： H01L23/48 , G03F7/004 , G03F7/20 , B32B7/12
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译：一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。

8. 发明授权

US07851131B2 Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part 有权
标题翻译：感光性粘合剂组合物，使用该粘合剂组合物，粘合剂膜，粘合片，具有粘合剂层的半导体晶片，半导体器件和电子部件
公开(公告)号：US07851131B2
公开(公告)日：2010-12-14
申请号：US11969358
申请日：2008-01-04
申请人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
发明人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
IPC分类号： G03F7/00 , G03F7/004
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译：一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; （C）光聚合引发剂。

9. 发明授权

US06223429B1 Method of production of semiconductor device 失效
标题翻译：半导体器件的生产方法
公开(公告)号：US06223429B1
公开(公告)日：2001-05-01
申请号：US08981509
申请日：1998-07-30
申请人： Aizou Kaneda , Masaaki Yasuda , Itsuo Watanabe , Tomohisa Ohta , Fumio Inoue , Yoshiaki Tsubomatsu , Toshio Yamazaki , Hiroto Ohata , Kenzo Takemura , Akira Nagai , Osamu Watanabe , Naoyuki Shiozawa , Kazuyoshi Kojima , Toshiaki Tanaka , Kazunori Yamamoto
发明人： Aizou Kaneda , Masaaki Yasuda , Itsuo Watanabe , Tomohisa Ohta , Fumio Inoue , Yoshiaki Tsubomatsu , Toshio Yamazaki , Hiroto Ohata , Kenzo Takemura , Akira Nagai , Osamu Watanabe , Naoyuki Shiozawa , Kazuyoshi Kojima , Toshiaki Tanaka , Kazunori Yamamoto
IPC分类号： H05K330
CPC分类号： H01L24/83 , H01L23/3121 , H01L23/49816 , H01L23/49883 , H01L24/29 , H01L24/32 , H01L24/97 , H01L25/18 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29384 , H01L2224/29444 , H01L2224/29469 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/73253 , H01L2224/81192 , H01L2224/8319 , H01L2224/838 , H01L2224/83951 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H01L2924/19041 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2924/00 , H01L2224/13111 , H01L2924/00014
摘要： To provide a highly reliable semiconductor device structure that enables cost reduction in the production of packages, inclusive of the cost for chips, and may cause less changes in connection resistance even under conditions of a long-term environmental resistance test. In a semiconductor device comprising a semiconductor chip face-down bonded to a wiring board, it has a structure wherein projecting metal portions are provided at the opposing wiring board terminals without forming bumps on bonding pads of the chip, the whole chip surface is bonded with an organic, anisotropic conductive adhesive material, and the whole or at least an edge of the back of the chip is covered with a sealing material.
摘要翻译：为了提供高可靠性的半导体器件结构，其能够降低封装的生产成本，包括芯片的成本，并且即使在长期耐环境测试的条件下也可能导致连接电阻的变化较小。在包括面向下接合到布线板的半导体芯片，其结构是在相对的布线板端子处设置突出的金属部分，而不在芯片的焊盘上形成凸块，整个芯片表面用有机的各向异性导电粘合剂材料，并且芯片的背面的整个或至少一个边缘被密封材料覆盖。

10. 发明授权

US6040407A Chain polyene group-containing norbornene compound and unsaturated ethylene copolymer using the same 失效
标题翻译：含链多烯基的降冰片烯化合物和使用其的不饱和乙烯共聚物
公开(公告)号：US6040407A
公开(公告)日：2000-03-21
申请号：US860442
申请日：1997-06-26
申请人： Tatsuyoshi Ishida , Masaaki Yasuda , Hitoshi Onishi , Noriaki Kihara , Toshiyuki Tsutsui , Toshihiro Sagane , Masaaki Kawasaki , Hidenari Nakahama
发明人： Tatsuyoshi Ishida , Masaaki Yasuda , Hitoshi Onishi , Noriaki Kihara , Toshiyuki Tsutsui , Toshihiro Sagane , Masaaki Kawasaki , Hidenari Nakahama
IPC分类号： C07C2/50 , C07C13/43 , C08F210/18 , C08F10/02
CPC分类号： C08F210/18 , C07C13/43 , C07C2/50 , C07C2102/42
摘要： The chain polyene-group containing norbornene compound of the invention is represented by the formula [I]: ##STR1## wherein n is an integer of 1 to 5, R.sup.1 is an alkyl group of 1 to 5 carbon atoms, and R.sup.2 and R.sup.3 are each independently a hydrogen atom or an alkyl group of 1 to 5 carbon atoms.The unsaturated ethylene copolymer of the invention is a random copolymer of 30 to 92% by mol of (i) ethylene units, 6 to 70% by mol of (ii) specific .alpha.-olefin units and 0.1 to 30% by mol of (iii) units derived from the norbornene compound [I], where the molar ratio of (i)/(ii) is in the range of 40/60 to 92/8 and the unit (iii) is represented by the specific formula, and has an intrinsic viscosity [.eta.] of 0.05 to 10 dl/g.The novel unsaturated ethylene copolymer is excellent in weathering resistance, heat resistance and ozone resistance and has a high vulcanizing rate.
摘要翻译： PCT No.PCT / JP95 / 02655第 371日期：1997年6月26日 102（e）日期1997年6月26日PCT 1995年12月25日PCT PCT。 WO96 / 20150 PCT出版物日本1996年7月4日本发明的含链多烯基的降冰片烯化合物由式[I]表示：其中n为1〜5的整数，R1为碳原子数1〜5的烷基，R2和 R 3各自独立地为氢原子或1〜5个碳原子的烷基。本发明的不饱和乙烯共聚物为（i）乙烯单元为30〜92摩尔％，（ii）特定α-烯烃单元为6〜70摩尔％，（iii）为0.1〜30摩尔％）衍生自降冰片烯化合物[I]的单元，其中（i）/（ii）的摩尔比在40/60至92/8的范围内，单元（iii）由具体式表示，并且具有特性粘度η为0.05-10dl / g。新型不饱和乙烯共聚物耐候性，耐热性和耐臭氧性优异，硫化速度高。

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