发明申请
US20110247873A1 ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION
有权
基本信息:
- 专利标题： ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION
- 申请号：US13166570 申请日：2011-06-22
- 公开(公告)号：US20110247873A1 公开(公告)日：2011-10-13
- 发明人： Itsuo WATANABE , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
- 申请人： Itsuo WATANABE , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K13/04 ; B32B37/14 ; B32B37/10 ; B32B37/12
摘要：
An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |
| ----------H05K1/11 | ..对印刷电路或印刷电路之间提供电连接的印刷元件 |