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1. 发明授权

US08273457B2 Adhesive for bonding circuit members, circuit board and process for its production 有权
公开(公告)号：US08273457B2
公开(公告)日：2012-09-25
申请号：US13166570
申请日：2011-06-22
申请人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
发明人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
IPC分类号： B32B27/38
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

2. 发明授权

US08043709B2 Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same 失效
标题翻译：电路连接材料，使用其的薄膜状电路连接材料，电路部件连接结构及其制造方法
公开(公告)号：US08043709B2
公开(公告)日：2011-10-25
申请号：US10541380
申请日：2004-06-24
申请人： Motohiro Arifuku , Itsuo Watanabe , Yasushi Gotou , Kouji Kobayashi , Kazuyoshi Kojima
发明人： Motohiro Arifuku , Itsuo Watanabe , Yasushi Gotou , Kouji Kobayashi , Kazuyoshi Kojima
IPC分类号： H01R11/01 , H01B1/22 , H01L21/60 , H05K1/14 , H05K3/36 , C09J9/02
CPC分类号： H01L24/83 , C09J9/02 , C09J163/00 , H01B1/22 , H01L24/29 , H01L2224/04026 , H01L2224/05571 , H01L2224/26145 , H01L2224/2929 , H01L2224/29399 , H01L2224/32225 , H01L2224/83101 , H01L2224/83365 , H01L2224/83385 , H01L2224/83851 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K3/323 , H05K3/3452 , H05K2203/0594 , Y10T156/10 , Y10T428/2495 , Y10T428/2852 , Y10T428/2857 , Y10T428/2991 , H01L2924/00 , H01L2224/2919 , H01L2924/01028 , H01L2924/3512 , H01L2924/00012 , H01L2224/05552
摘要： The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.
摘要翻译：本发明是一种电路连接材料，用于将电路和绝缘层彼此相邻形成的电路部件的相互连接在基板的表面上，以及电路部件，其中电极和绝缘层邻近形成彼此在板的表面上，边缘部分和绝缘层基于主表面形成比电极更大的厚度，其中该电路连接材料包含粘合剂组合物和具有平均粒径为1μm以上且小于10μm，硬度为1.961〜6.865GPa，该电路连接材料在40℃下的储能弹性模量为0.5〜3GPa，平均热膨胀系数当进行固化处理时，在25℃至100℃下为30-200ppm /℃。

3. 发明申请

US20110247873A1 ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION 有权
公开(公告)号：US20110247873A1
公开(公告)日：2011-10-13
申请号：US13166570
申请日：2011-06-22
申请人： Itsuo WATANABE , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
发明人： Itsuo WATANABE , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
IPC分类号： H05K1/11 , H05K13/04 , B32B37/14 , B32B37/10 , B32B37/12
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

4. 发明申请

US20100263208A1 CIRCUIT CONNECTING METHOD 有权
标题翻译：电路连接方法
公开(公告)号：US20100263208A1
公开(公告)日：2010-10-21
申请号：US12740801
申请日：2008-02-06
申请人： Motohiro Arifuku , Kazuyoshi Kojima , Kouji Kobayashi
发明人： Motohiro Arifuku , Kazuyoshi Kojima , Kouji Kobayashi
IPC分类号： H05K3/36
CPC分类号： H05K3/361 , H05K3/28 , H05K3/323 , H05K2201/0191 , H05K2203/0594 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144
摘要： The invention provides a circuit connecting method that can satisfactorily reduce connection resistance between circuit electrodes electrically connected via an anisotropic conductive film for circuit connection.The circuit connecting method comprises a step of preparing a circuit member 12 having circuit electrodes 12b formed on a glass substrate 12a, a step of preparing a flexible wiring board 14 having circuit electrodes 14b formed on a base 14a and provided with a solder resist 18 at the sections of the circuit electrodes 14b other than the sections that are connected to the circuit electrodes 12b, and a step of bonding the circuit member 12 to the flexible wiring board 14 via an anisotropic conductive film for circuit connection 16 so that part of the anisotropic conductive film for circuit connection 16 overlaps with part of the solder resist 18. The thickness h3 of the anisotropic conductive film for circuit connection 16 is no greater than the total of the height h1 of the circuit electrodes 12b and the height h2 of the circuit electrodes 14b.
摘要翻译：本发明提供一种电路连接方法，其可以令人满意地减小经由用于电路连接的各向异性导电膜电连接的电路电极之间的连接电阻。电路连接方法包括制备具有形成在玻璃基板12a上的电路电极12b的电路部件12的步骤，制备柔性布线基板14的步骤，该柔性布线基板14具有形成在基座14a上的电路电极14b，并设置有阻焊剂18 除了连接到电路电极12b的部分之外的电路电极14b的部分，以及通过用于电路连接16的各向异性导电膜将电路部件12接合到柔性布线板14的步骤，使得部分各向异性用于电路连接的导电膜16与阻焊剂18的一部分重叠。用于电路连接16的各向异性导电膜的厚度h3不大于电路电极12b的高度h1和电路电极的高度h2的总和 14b。

5. 发明申请

US20100025097A1 CIRCUIT CONNECTION STRUCTURE 审中-公开
标题翻译：电路连接结构
公开(公告)号：US20100025097A1
公开(公告)日：2010-02-04
申请号：US12447543
申请日：2007-10-30
申请人： Kazuyoshi Kojima , Kouji Kobayashi , Motohiro Arifuku , Nichiomi Mochizuki
发明人： Kazuyoshi Kojima , Kouji Kobayashi , Motohiro Arifuku , Nichiomi Mochizuki
IPC分类号： H05K1/14
CPC分类号： H01B1/22 , C08K7/16 , C08K9/02 , C09J9/02 , C09J11/02 , H01L24/05 , H01L24/16 , H01L24/29 , H01L24/81 , H01L25/0657 , H01L2224/0401 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29399 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0665 , H01L2924/07811 , H01L2924/10253 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K3/323 , H05K3/361 , H05K2201/0221 , H01L2924/00 , H01L2924/01028 , H01L2924/01026 , H01L2924/01027 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： There is provided a circuit connection structure that can provide satisfactory electrical connection between opposing circuit electrodes and that can sufficiently increase the long-term reliability of electrical characteristics between circuit electrodes. A circuit connection structure 1 comprising a first circuit member 30 having a first circuit electrode 32 formed on the main side 31a of a first circuit board 31, a second circuit member 40 situated opposing the first circuit member 30 and having a second circuit electrode 42 formed on the main side 41a of a second circuit board 41, and a circuit-connecting member 10 provided between the main side of the first circuit member 30 and the main side of the second circuit member 40 and electrically connecting the first and second circuit electrodes 32, 42, characterized in that the thickness of the first and second circuit electrodes 32, 42 is at least 50 nm, the circuit-connecting member 10 is obtained by curing a circuit-connecting material containing an adhesive composition and conductive particles 12 having multiple protrusions 14 on the surface side, and the outermost layer of the conductive particles 12 is composed of nickel or a nickel alloy.
摘要翻译：提供了一种电路连接结构，其可以在相对的电路电极之间提供令人满意的电连接，并且可以充分增加电路电极之间的电特性的长期可靠性。电路连接结构1包括第一电路构件30，第一电路构件30具有形成在第一电路板31的主侧31a上的第一电路电极32，与第一电路构件30相对的第二电路构件40，并且形成有第二电路电极42 在第二电路基板41的主面41a和设置在第一电路部件30的主面与第二电路部件40的主面之间并电连接第一和第二电路电极32的电路连接部件10 42，其特征在于，第一和第二电路电极32,42的厚度为至少50nm，电路连接部件10通过固化含有粘合剂组合物的电路连接材料和具有多个突起的导电粒子12而获得 14，导电粒子12的最外层由镍或镍合金构成。

6. 发明授权

US08132319B2 Circuit connecting method 有权
标题翻译：电路连接方式
公开(公告)号：US08132319B2
公开(公告)日：2012-03-13
申请号：US12740801
申请日：2008-02-06
申请人： Motohiro Arifuku , Kazuyoshi Kojima , Kouji Kobayashi
发明人： Motohiro Arifuku , Kazuyoshi Kojima , Kouji Kobayashi
IPC分类号： H05K3/30
CPC分类号： H05K3/361 , H05K3/28 , H05K3/323 , H05K2201/0191 , H05K2203/0594 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144
摘要： The invention provides a circuit connecting method that can satisfactorily reduce connection resistance between circuit electrodes electrically connected via an anisotropic conductive film for circuit connection.The circuit connecting method comprises a step of preparing a circuit member 12 having circuit electrodes 12b formed on a glass substrate 12a, a step of preparing a flexible wiring board 14 having circuit electrodes 14b formed on a base 14a and provided with a solder resist 18 at the sections of the circuit electrodes 14b other than the sections that are connected to the circuit electrodes 12b, and a step of bonding the circuit member 12 to the flexible wiring board 14 via an anisotropic conductive film for circuit connection 16 so that part of the anisotropic conductive film for circuit connection 16 overlaps with part of the solder resist 18. The thickness h3 of the anisotropic conductive film for circuit connection 16 is no greater than the total of the height h1 of the circuit electrodes 12b and the height h2 of the circuit electrodes 14b.
摘要翻译：本发明提供一种电路连接方法，其可以令人满意地减小经由用于电路连接的各向异性导电膜电连接的电路电极之间的连接电阻。电路连接方法包括制备具有形成在玻璃基板12a上的电路电极12b的电路部件12的步骤，制备柔性布线基板14的步骤，该柔性布线基板14具有形成在基座14a上的电路电极14b，并设置有阻焊剂18 除了连接到电路电极12b的部分之外的电路电极14b的部分，以及通过用于电路连接16的各向异性导电膜将电路部件12接合到柔性布线板14的步骤，使得部分各向异性用于电路连接的导电膜16与阻焊剂18的一部分重叠。用于电路连接16的各向异性导电膜的厚度h3不大于电路电极12b的高度h1和电路电极的高度h2的总和 14b。

7. 发明申请

US20110247757A1 CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE, AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：电路连接材料，电路形成电路连接材料，电路部件连接结构及其制造方法
公开(公告)号：US20110247757A1
公开(公告)日：2011-10-13
申请号：US13163442
申请日：2011-06-17
申请人： Motohiro ARIFUKU , Itsuo Watanabe , Yasushi Gotou , Kouji Kobayashi , Kazuyoshi Kojima
发明人： Motohiro ARIFUKU , Itsuo Watanabe , Yasushi Gotou , Kouji Kobayashi , Kazuyoshi Kojima
IPC分类号： H05K13/04 , B32B37/06 , B32B37/12 , B32B37/14 , B32B37/02 , B32B37/10 , B82Y99/00 , B82Y30/00
CPC分类号： H01L24/83 , C09J9/02 , C09J163/00 , H01B1/22 , H01L24/29 , H01L2224/04026 , H01L2224/05571 , H01L2224/26145 , H01L2224/2929 , H01L2224/29399 , H01L2224/32225 , H01L2224/83101 , H01L2224/83365 , H01L2224/83385 , H01L2224/83851 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K3/323 , H05K3/3452 , H05K2203/0594 , Y10T156/10 , Y10T428/2495 , Y10T428/2852 , Y10T428/2857 , Y10T428/2991 , H01L2924/00 , H01L2224/2919 , H01L2924/01028 , H01L2924/3512 , H01L2924/00012 , H01L2224/05552
摘要： The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.
摘要翻译：本发明是一种电路连接材料，用于将电路和绝缘层彼此相邻形成的电路部件的相互连接在基板的表面上，以及电路部件，其中电极和绝缘层邻近形成彼此在板的表面上，边缘部分和绝缘层基于主表面形成比电极更大的厚度，其中该电路连接材料包含粘合剂组合物和具有平均粒径为1μm以上且小于10μm，硬度为1.961〜6.865GPa，该电路连接材料在40℃下的储能弹性模量为0.5〜3GPa，平均热膨胀系数当进行固化处理时，在25℃至100℃下为30-200ppm /℃。

8. 发明授权

US07879445B2 Adhesive for bonding circuit members, circuit board and process for its production 有权
标题翻译：用于接合电路元件，电路板及其生产工艺的粘合剂
公开(公告)号：US07879445B2
公开(公告)日：2011-02-01
申请号：US11702552
申请日：2007-02-06
申请人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
发明人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
IPC分类号： B32B27/38
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.
摘要翻译：一种用于将半导体芯片接合并固定到电路板并电连接两个电极的粘合剂，并且包含粘合剂树脂组合物和无机填料，其含量为10至200重量份，100重量份的100重量份粘合剂树脂组合物。

9. 发明申请

US20100140556A1 FILMY ADHESIVE FOR CIRCUIT CONNECTION 审中-公开
标题翻译：电胶连接胶片
公开(公告)号：US20100140556A1
公开(公告)日：2010-06-10
申请号：US12664530
申请日：2007-06-13
申请人： Kazuyoshi Kojima , Kouji Kobayashi , Motohiro Arifuku
发明人： Kazuyoshi Kojima , Kouji Kobayashi , Motohiro Arifuku
IPC分类号： H01B1/12
CPC分类号： H05K3/323 , H01R4/04 , H01R12/52 , H05K2201/0133
摘要： A filmy adhesive for circuit connection that is interposed between circuit electrodes opposed to each other and by heating and applying pressure to the circuit electrodes opposed to each other, attains electrical connection between the electrodes along the direction of pressure application, characterized in that the angle of contact of the adhesive after hardening with water is 90° or greater.
摘要翻译：用于电路连接的胶粘剂，其插入在彼此相对的电路电极之间并且通过对彼此相对的电路电极进行加热和施加压力而实现沿着压力施加方向的电极之间的电连接，其特征在于，硬化后的粘合剂与水接触90°以上。

10. 发明申请

US20070137887A1 Adhesive for bonding circuit members, circuit board and process for its production 有权
标题翻译：用于粘合电路元件，电路板及其生产工艺的粘合剂
公开(公告)号：US20070137887A1
公开(公告)日：2007-06-21
申请号：US11702552
申请日：2007-02-06
申请人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
发明人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
IPC分类号： H05K1/09 , B32B7/02
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.
摘要翻译：一种用于将半导体芯片接合并固定到电路板并电连接两个电极的粘合剂，并且包含粘合剂树脂组合物和无机填料，其含量为10至200重量份，100重量份的100重量份粘合剂树脂组合物。

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