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1. 发明授权

US09431883B2 Method of manufacturing laminated core having permanent magnets sealed with resin 有权
标题翻译：制造具有用树脂密封的永磁体的层叠铁心的方法
公开(公告)号：US09431883B2
公开(公告)日：2016-08-30
申请号：US14123869
申请日：2012-05-07
申请人： Satoshi Matsubayashi , Akira Nagai , Go Kato
发明人： Satoshi Matsubayashi , Akira Nagai , Go Kato
IPC分类号： H02K15/02 , H02K15/00 , H02K15/03 , H02K1/27
CPC分类号： H02K15/0025 , H02K1/276 , H02K15/03 , Y10T29/49009
摘要： A method of manufacturing a laminated core, having a laminated core body 10a formed by laminating plural core sheets 11 and having magnet insertion holes 13, 14 with openings 17, 18 opening to a inner space 15 or an external side, inserting and resin-sealing permanent magnets 20, 21 in the magnet insertion holes 13, 14, with the openings 17, 18 blocked by a blocking member 23, the method including: temporarily connecting blocking member pieces 32 to be the blocking member 23 in each of the core sheets 11 and removing the blocking member 23 with the laminated core body 10a resin-sealed. By this, without a special blocking member, the permanent magnets 20, 21 are resin-sealed while the magnet insertion holes 13, 14, parts of which have the openings 17, 18, are blocked.
摘要翻译：一种层叠铁芯的制造方法，具有层叠铁芯体10a，其通过层叠多个铁芯片11而形成，并且具有通向具有向内部空间15或外侧开口的开口17,18的磁体插入孔13,14，插入和树脂封闭磁体插入孔13,14中的永磁体20,21，其中开口17,18被阻挡构件23阻挡，该方法包括：在每个芯片11中临时连接作为阻挡构件23的阻挡构件片32 并且用树脂密封的层叠芯体10a移除阻挡构件23。由此，没有特殊的阻挡构件，永磁体20,21被树脂密封，同时其一部分具有开口17,18的磁体插入孔13,14被阻挡。

2. 发明授权

US08916254B2 Method for manufacturing laminated core and laminated core 有权
标题翻译：层叠铁心和层压铁芯的制造方法
公开(公告)号：US08916254B2
公开(公告)日：2014-12-23
申请号：US13319890
申请日：2010-04-23
申请人： Akira Nagai , Jin Oda , Tatsuhiko Mizutani , Yosuke Kurono
发明人： Akira Nagai , Jin Oda , Tatsuhiko Mizutani , Yosuke Kurono
IPC分类号： B32B3/02 , H02K1/16 , H02K15/02
CPC分类号： H02K1/16 , H02K15/024 , Y10T428/21 , Y10T428/24802
摘要： A method for manufacturing a laminated core is provided that makes positions of boundary parts of laminated blocks and improves an efficiency of a welding operation of the blocks. The above-described object is achieved by the method of manufacturing the laminated core 10 including a process that forms a plurality of blocks 12 having a plurality of welding parts 13 to 15 of different forms or colors at intervals of prescribed angles in the circumferential direction, a process that laminates the plurality of blocks 12 under a state that the blocks are rotated at intervals of the prescribed angles and a process that welds the welding parts 13 to 15 having the different forms or colors of the laminated blocks 12 to form integrally the plurality of blocks 12.
摘要翻译：提供一种层叠铁芯的制造方法，其形成层叠块的边界部的位置，提高块的焊接效率。上述目的是通过制造叠层铁芯10的方法来实现的，该方法包括在圆周方向上以规定角度间隔形成具有不同形式或颜色的多个焊接部13至15的多个块12的工序，在块以规定角度的间隔旋转的状态下层叠多个块12的处理以及对具有不同形状或颜色的层叠块12的焊接部13〜15进行焊接的工序，以一体形成多个的块12。

3. 发明授权

US08273458B2 Adhesive for bonding circuit members, circuit board and process for its production 有权
标题翻译：用于粘合电路元件，电路板及其生产工艺的粘合剂
公开(公告)号：US08273458B2
公开(公告)日：2012-09-25
申请号：US13166591
申请日：2011-06-22
申请人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
发明人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
IPC分类号： B32B27/38
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.
摘要翻译：一种用于将半导体芯片接合并固定到电路板并电连接两个电极的粘合剂，并且包含粘合剂树脂组合物和无机填料，其含量为10至200重量份，100重量份的100重量份粘合剂树脂组合物。

4. 发明申请

US20120222289A1 METHOD OF MANUFACTURING LAMINATED ROTOR CORE 有权
标题翻译：制造层压转子芯的方法
公开(公告)号：US20120222289A1
公开(公告)日：2012-09-06
申请号：US13509190
申请日：2011-04-01
申请人： Akira Nagai , Mei Arazoe , Go Kato
发明人： Akira Nagai , Mei Arazoe , Go Kato
IPC分类号： H02K15/02
CPC分类号： H02K15/03 , H02K1/276
摘要： A method of manufacturing a laminated rotor core, including inserting permanent magnets into magnet insertion portions of an iron core formed by laminating plural core sheets; and thereafter to fix the magnets, injecting resin into the magnet insertion portions from a resin reservoir part in a die holding the iron core; the method comprising: a first process of placing a segment dummy plate between the body and the die, the plate covering one or more of the plural magnet insertion portions individually and including a resin injection hole continuing thereto; a second process of injecting the resin from the resin reservoir part of the die through the resin injection hole of the plate to the corresponding magnet insertion portions; and a third process of detaching the dummy plate with excess resin after the resin injected to the magnet insertion portions is cured; and the method improving a resin sealing process.
摘要翻译：一种叠层转子铁心的制造方法，其特征在于，包括：将永久磁铁插入通过层叠多个芯片而形成的铁心的磁铁插入部; 然后固定磁体，将树脂从保持铁芯的模具中的树脂储存部分注入到磁体插入部分中; 该方法包括：将主体和模具之间的段虚拟板放置在一起的第一工序，所述板单独地覆盖所述多个磁体插入部中的一个或多个，并且包括与其连续的树脂注入孔; 将树脂从模具的树脂储存部分通过板的树脂注入孔注入到相应的磁体插入部分的第二工序; 以及在注入到磁体插入部分中的树脂被固化之后用过量树脂分离虚拟板的第三过程; 以及改善树脂密封工艺的方法。

5. 发明申请

US20120091846A1 ROTOR CORE 有权
标题翻译：转子芯
公开(公告)号：US20120091846A1
公开(公告)日：2012-04-19
申请号：US13377938
申请日：2010-04-28
申请人： Akira Nagai , Go Kato
发明人： Akira Nagai , Go Kato
IPC分类号： H02K1/27
CPC分类号： H02K1/2766 , H02K15/03
摘要： There is provided a rotor core which increases the quality and reliability thereof by preventing the occurrence of a core separation of the rotor core. There is provided a rotor core including a plurality of substantially cylindrical core blocks which are stacked on each other; and a plurality of magnets, characterized in that a plurality of magnet holes extending in an axial direction are provided in the plurality of core blocks so as to extend over the plurality of core blocks in that the plurality of magnets are accommodated in each of the plurality of magnet accommodation holes and fixed therein with a resin, and in that an axial position of core block boundary planes where the plurality of core blocks are brought into abutment with each other and an axial position of magnet boundary planes where the plurality of magnets are brought into abutment with each other differ from each other.
摘要翻译：提供了一种通过防止转子芯的芯分离的发生而提高其质量和可靠性的转子芯。提供了一种转子芯，其包括彼此堆叠的多个基本上圆柱形的核心块; 以及多个磁体，其特征在于，在所述多个芯体中设置有沿轴向延伸的多个磁体孔，以便在所述多个磁芯块中延伸，因为所述多个磁体容纳在所述多个磁芯中的磁体容纳孔并且用树脂固定，并且其中多个芯块彼此抵接的芯块边界面的轴向位置以及多个磁体被带入的磁体边界平面的轴向位置彼此抵接彼此不同。

6. 发明申请

US20120058313A1 METHOD FOR MANUFACTURING LAMINATED CORE AND LAMINATED CORE 有权
标题翻译：制造层压核和层压核的方法
公开(公告)号：US20120058313A1
公开(公告)日：2012-03-08
申请号：US13319890
申请日：2010-04-23
申请人： Akira Nagai , Jin Oda , Tatsuhiko Mizutani , Yosuke Kurono
发明人： Akira Nagai , Jin Oda , Tatsuhiko Mizutani , Yosuke Kurono
IPC分类号： B32B3/10 , B23K31/02
CPC分类号： H02K1/16 , H02K15/024 , Y10T428/21 , Y10T428/24802
摘要： A method for manufacturing a laminated core is provided that makes positions of boundary parts of laminated blocks and improves an efficiency of a welding operation of the blocks. The above-described object is achieved by the method of manufacturing the laminated core 10 including a process that forms a plurality of blocks 12 having a plurality of welding parts 13 to 15 of different forms or colors at intervals of prescribed angles in the circumferential direction, a process that laminates the plurality of blocks 12 under a state that the blocks are rotated at intervals of the prescribed angles and a process that welds the welding parts 13 to 15 having the different forms or colors of the laminated blocks 12 to form integrally the plurality of blocks 12.
摘要翻译：提供一种层叠铁芯的制造方法，其形成层叠块的边界部的位置，提高块的焊接效率。上述目的是通过制造叠层铁芯10的方法来实现的，该方法包括在圆周方向上以规定角度间隔形成具有不同形式或颜色的多个焊接部13至15的多个块12的工序，在块以规定角度的间隔旋转的状态下层叠多个块12的处理以及对具有不同形状或颜色的层叠块12的焊接部13〜15进行焊接的工序，以一体形成多个的块12。

7. 发明授权

US08084130B2 Epoxy resin molding material for sealing and electronic component device 失效
标题翻译：环氧树脂成型材料用于密封和电子部件装置
公开(公告)号：US08084130B2
公开(公告)日：2011-12-27
申请号：US12444026
申请日：2007-09-25
申请人： Mitsuyoshi Hamada , Akira Nagai , Hiroaki Ikeba , Ken Nanaumi , Kouhei Yasuzawa
发明人： Mitsuyoshi Hamada , Akira Nagai , Hiroaki Ikeba , Ken Nanaumi , Kouhei Yasuzawa
IPC分类号： B32B27/04 , B32B27/18 , B32B27/38 , C08L63/00 , C08L83/04 , H01L23/29
CPC分类号： H01L23/295 , C08G77/14 , C08G77/18 , C08K3/013 , C08K5/54 , C08L83/00 , C09J163/00 , H01L23/296 , H01L2924/0002 , Y10T428/31511 , Y10T428/31663 , H01L2924/00
摘要： The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.
摘要翻译：本发明提供一种密封环氧树脂成型材料，其流畅性和耐回焊性优异，而不降低其固化性，以及电子部件装置设置有用该材料密封的元件。用于密封的环氧树脂成型材料包括（A）环氧树脂，（B）固化剂，（C）固化促进剂，（D）无机填料和（E）烷氧基硅烷聚合物，其中烷氧基硅烷聚合物（E）是通过使特定烷氧基硅烷化合物的烷氧基甲硅烷基部分聚合而得到的聚合物。

8. 发明申请

US20110247874A1 ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION 有权
公开(公告)号：US20110247874A1
公开(公告)日：2011-10-13
申请号：US13166577
申请日：2011-06-22
申请人： Itsuo WATANABE , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
发明人： Itsuo WATANABE , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
IPC分类号： H05K1/11 , H05K13/04 , B32B37/14 , B32B37/10 , B32B37/12
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

9. 发明申请

US20110247867A1 ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION 有权
标题翻译：联系电路会员，电路板及其生产工艺
公开(公告)号：US20110247867A1
公开(公告)日：2011-10-13
申请号：US13166591
申请日：2011-06-22
申请人： Itsuo WATANABE , Kenzo TAKEMURA , Akira NAGAI , Kazuhiro ISAKA , Osamu WATANABE , Kazuyoshi KOJIMA
发明人： Itsuo WATANABE , Kenzo TAKEMURA , Akira NAGAI , Kazuhiro ISAKA , Osamu WATANABE , Kazuyoshi KOJIMA
IPC分类号： H05K1/02 , B32B37/12
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.
摘要翻译：一种用于将半导体芯片接合并固定到电路板并电连接两个电极的粘合剂，并且包含粘合剂树脂组合物和无机填料，其含量为10至200重量份，100重量份的100重量份粘合剂树脂组合物。

10. 发明授权

US08034659B2 Production method of semiconductor device and bonding film 有权
标题翻译：半导体器件和接合膜的制造方法
公开(公告)号：US08034659B2
公开(公告)日：2011-10-11
申请号：US12306285
申请日：2007-06-20
申请人： Akira Nagai , Masaaki Yasuda , Keiichi Hatakeyama , Tetsuya Enomoto
发明人： Akira Nagai , Masaaki Yasuda , Keiichi Hatakeyama , Tetsuya Enomoto
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , H01L21/67092 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/90 , H01L2221/6834 , H01L2223/54426 , H01L2223/54473 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13144 , H01L2224/16225 , H01L2224/274 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81121 , H01L2224/81191 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/83191 , H01L2224/838 , H01L2224/83851 , H01L2224/83885 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01052 , H01L2924/01058 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07811 , H01L2924/15788 , H01L2924/00 , H01L2924/3512 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： To provide a method of manufacturing semiconductor devices, the method being capable of efficiently obtaining a singulated semiconductor chip upon which an adhesive is adhered and also capable of excellently bonding a semiconductor chip to a wiring substrate, and provide an adhesive film. A layered product 60 in which a dicing tape 9, an adhesive layer 3, and a semiconductor wafer 6 are stacked in this order so that a circuit surface 6a of the semiconductor wafer 6 may face the dicing tape 9 side. A cutting position is recognized by recognizing a circuit pattern P in the circuit surface 6a from a rear surface 6b of the semiconductor wafer 6. At least the semiconductor wafer 6 and the adhesive layer 3 are cut in the thickness direction of the layered product 60. The dicing tape 9 is cured to peel off the dicing tape 9 and the adhesive layer 3. A projection electrode 4 of a semiconductor chip 26 is aligned with a wiring 12 of a wiring substrate 40. The wiring substrate 40 and the semiconductor chip 26 are bonded via an adhesive layer 23 so that the wiring 12 and the projection electrode 4 may be electrically connected to each other.
摘要翻译：为了提供一种制造半导体器件的方法，该方法能够有效地获得附着有粘合剂的单片半导体芯片，并且还能够将半导体芯片优良地接合到布线基板，并且提供粘合膜。依次层叠有切割带9，粘合层3和半导体晶片6的层叠体60，使半导体晶片6的电路面6a面向切割带9侧。通过从半导体晶片6的后表面6b识别电路表面6a中的电路图案P来识别切割位置。至少半导体晶片6和粘合剂层3在层叠体60的厚度方向上被切割。将切割胶带9固化以剥离切割胶带9和粘合剂层3.半导体芯片26的投影电极4与布线基板40的布线12对准。布线基板40和半导体芯片26是通过粘合剂层23粘合，使得布线12和突起电极4可以彼此电连接。

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