专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09089714B2 Stitched components of an active implantable medical device 有权
标题翻译：有源可植入医疗器械的缝合部件
公开(公告)号：US09089714B2
公开(公告)日：2015-07-28
申请号：US12549831
申请日：2009-08-28
申请人： David Robinson
发明人： David Robinson
IPC分类号： A61N1/05 , A61N1/375 , H05K3/10 , A61N1/36 , A61N1/372
CPC分类号： A61N1/375 , A61B2562/125 , A61N1/0551 , A61N1/3605 , A61N1/37229 , H05K3/103 , H05K2201/0129 , H05K2201/0281 , H05K2201/0308 , H05K2201/10287 , H05K2201/10598 , H05K2203/1189 , Y10T29/4913
摘要： An active implantable medical device (AIMD) comprising an implantable electronics module and a tissue interface. At least one of the electronics module and the tissue interface comprises an electrically non-conductive, biocompatible and needle-piercable base having one or more biocompatible electrically conductive strands of conductive filaments stitched to the base. As used herein, stitching a conductive filament to a base refers to sewing, embroidering or otherwise securing the filament to the base through the use of hand or machine needlework.
摘要翻译：一种包括可植入电子模块和组织界面的主动植入式医疗装置（AIMD）。电子模块和组织界面中的至少一个包括具有一个或多个与基底缝合的导电丝的一个或多个生物相容的导电股线的非导电，生物相容性和针刺的基底。如本文所使用的，将导电丝缝合到基部是指通过使用手或机针刺将缝线，刺绣或以其他方式将灯丝固定到基座。

2. 发明授权

US08737085B2 Wiring board with a built-in component and method for manufacturing the same 有权
标题翻译：具有内置组件的接线板及其制造方法
公开(公告)号：US08737085B2
公开(公告)日：2014-05-27
申请号：US12299861
申请日：2006-05-24
申请人： Kenji Sasaoka
发明人： Kenji Sasaoka
IPC分类号： H05K1/18
CPC分类号： H05K3/4632 , H05K1/0366 , H05K1/186 , H05K1/188 , H05K3/429 , H05K3/4602 , H05K3/4611 , H05K3/4614 , H05K3/4647 , H05K3/4652 , H05K2201/0355 , H05K2201/10636 , H05K2203/061 , H05K2203/063 , H05K2203/1189 , Y02P70/611 , Y10T29/4913
摘要： Disclosed is a wiring board with a built-in component and a method for manufacturing the same, the wiring board including: a wiring pattern; an electric/electronic component electrically and mechanically connected with a surface of said wiring pattern; and an insulating layer formed on the same surface of said wiring pattern as said electric/electronic component is connected and configured so as to embed said electric/electronic component, said insulating layer having an insulating resin and a reinforcing material included in the insulating resin, wherein the reinforcing material of said insulating layer exists in the insulating resin without reaching a region of said electric/electronic component in a lateral direction, and wherein the insulating resin of said insulating layer reaches said electric/electronic component so as to adhere to said electric/electronic component.
摘要翻译：公开了具有内置部件的布线板及其制造方法，所述布线板包括：布线图案; 与所述布线图案的表面电气机械连接的电气/电子部件; 并且形成在与所述电气/电子部件的所述布线图案的同一表面上的绝缘层被连接并构造成嵌入所述电气/电子部件，所述绝缘层具有绝缘树脂和包含在绝缘树脂中的增强材料，其中所述绝缘层的增强材料存在于所述绝缘树脂中，而不会在横向方向上到达所述电气/电子部件的区域，并且其中所述绝缘层的绝缘树脂到达所述电子/电子部件以便粘附到所述电气 /电子元件。

3. 发明授权

US08444882B2 Anisotropic conductive film and light emitting device 有权
标题翻译：各向异性导电膜和发光装置
公开(公告)号：US08444882B2
公开(公告)日：2013-05-21
申请号：US13142956
申请日：2010-02-22
申请人： Shiyuki Kanisawa , Hiroyuki Kumakura , Hidetsugu Namiki
发明人： Shiyuki Kanisawa , Hiroyuki Kumakura , Hidetsugu Namiki
IPC分类号： H01B1/02 , H01B1/22 , H01L33/00 , B32B5/16
CPC分类号： H01L24/32 , C08K3/08 , C08K9/04 , C09J7/10 , C09J11/04 , C09J2201/36 , C09J2205/102 , C09J2463/00 , H01L33/46 , H01L33/60 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/83101 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/181 , H05K3/323 , H05K2201/10106 , H05K2201/2054 , H05K2203/1189 , Y10T428/25 , Y10T428/28 , H01L2924/00014 , H01L2924/00
摘要： An anisotropic conductive film is provided that does not have a light-reflecting layer on a light emitting diode element which causes costs to increase when a light emitting device that uses an LED element is flip-chip mounted, and that does not cause emission efficiency to deteriorate. Further, a light emitting device that uses such an anisotropic conductive film is provided. This anisotropic conductive film has a structure in which a light-reflecting insulating adhesive layer and an anisotropic conductive adhesive layer are laminated, wherein the light-reflecting insulating adhesive layer has a structure in which light-reflecting particles are dispersed in an insulating adhesive. The light emitting device has a structure in which a light emitting diode element is flip-chip-mounted on a substrate, with this anisotropic conductive film provided between a connection terminal on the substrate and a bump for connection of the light emitting diode element.
摘要翻译：提供一种各向异性导电膜，其在发光二极管元件上不具有光反射层，当使用LED元件的发光器件被倒装芯片安装时，导致成本增加，并且不会导致发射效率恶化。此外，提供了使用这种各向异性导电膜的发光器件。这种各向异性导电膜具有层叠反光绝缘粘合剂层和各向异性导电粘合剂层的结构，其中反光绝缘粘合剂层具有其中光反射颗粒分散在绝缘粘合剂中的结构。发光器件具有将发光二极管元件倒装芯片安装在基板上的结构，其中该各向异性导电膜设置在基板上的连接端子和用于连接发光二极管元件的突起之间。

4. 发明授权

US08308887B2 Via hole forming method using electrophotographic printing method 有权
标题翻译：通孔形成方法采用电子照相印刷法
公开(公告)号：US08308887B2
公开(公告)日：2012-11-13
申请号：US13182465
申请日：2011-07-14
申请人： Kazuhiro Isebo , Norio Sakai , Kenji Kawakami , Nobuaki Ogawa
发明人： Kazuhiro Isebo , Norio Sakai , Kenji Kawakami , Nobuaki Ogawa
IPC分类号： B44C1/17 , B44C1/165 , C03B29/00 , B29C65/00 , B23P19/00
CPC分类号： H05K3/4061 , G03G15/224 , G03G15/225 , G03G15/6585 , G03G15/6591 , H05K1/0306 , H05K3/1266 , H05K3/4611 , H05K3/4629 , H05K2203/0143 , H05K2203/0156 , H05K2203/0517 , H05K2203/1189 , H05K2203/1545 , Y10T29/5313 , Y10T29/5317 , Y10T156/10 , Y10T156/109
摘要： A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method.
摘要翻译：通孔形成方法和多层板制造方法通过减少所需的工艺来提高制造成品率。通孔形成方法包括：第一步骤，通过将包含导电材料并具有突出部分的调色剂颗粒附着到第一感光构件的表面上以使得突出部分被引导到外部来形成调色剂图像; 以及将第一感光构件的表面相对于包含绝缘材料的生片的一个主表面并将调色剂图像转印到生片的一个主表面的第二步骤，使得调色剂颗粒的突出部分突出到生片从而到达生片的另一个主表面和调色剂颗粒被埋在生片中。通孔使用电子照相印刷法形成。

5. 发明授权

US08299369B2 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery 有权
标题翻译：电源 - 接地平面分区和通孔连接，以利用通道/沟槽进行电力输送
公开(公告)号：US08299369B2
公开(公告)日：2012-10-30
申请号：US12605198
申请日：2009-10-23
申请人： Gary A. Brist , Gary Baxter Long , Daryl A. Sato
发明人： Gary A. Brist , Gary Baxter Long , Daryl A. Sato
IPC分类号： H05K1/11
CPC分类号： H05K1/0265 , H05K1/0206 , H05K1/0219 , H05K1/0221 , H05K3/005 , H05K3/4644 , H05K2201/09036 , H05K2201/09509 , H05K2201/09518 , H05K2201/09981 , H05K2203/0108 , H05K2203/1189 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T29/49167
摘要： An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.
摘要翻译：一种包括多个金属化平面的装置，一个或多个分离多个金属化平面的电介质层; 以及连接到所述多个金属化平面中的至少一个的一个或多个导电沟槽。

6. 发明授权

US08247697B2 Anisotropic conductive film, joined structure and method for producing the joined structure 有权
标题翻译：各向异性导电膜，接合结构和接合结构的制造方法
公开(公告)号：US08247697B2
公开(公告)日：2012-08-21
申请号：US12626279
申请日：2009-11-25
申请人： Tomoyuki Ishimatsu
发明人： Tomoyuki Ishimatsu
IPC分类号： H01B5/00
CPC分类号： H05K3/323 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H05K2203/1189 , Y10T156/10 , H01L2924/00
摘要： Provided is an anisotropic conductive film having enhanced adhesion strength to a circuit member and attaining high conduction reliability; a joined structure; and a method for producing the joined structure. The conductive film electrically connects a first circuit member with a second circuit member having a nitrogen atom containing film on a surface thereof facing the first circuit member, the conductive film including a first layer which is to be located at a first circuit member side, and a second layer which is to be located at a second circuit member side, wherein the first layer comprises a cationic curing agent and a first thermosetting resin, and the second layer comprises a radical curing agent and a second thermosetting resin, and wherein at least one of the first and second layers comprises conductive particles, and the difference in maximum exothermic peak temperature between the first and second layers is within the range up to 20° C.
摘要翻译：提供了具有对电路部件的附着强度提高并且获得高导电可靠性的各向异性导电膜; 接合结构; 和接合结构体的制造方法。导电膜在与第一电路部件相对的表面上将第一电路部件与具有氮原子的膜的第二电路部件电连接，该导电膜包括位于第一电路部件侧的第一层，以及第二层，其位于第二电路构件侧，其中第一层包含阳离子固化剂和第一热固性树脂，第二层包含自由基固化剂和第二热固性树脂，并且其中至少一个的第一层和第二层包括导电颗粒，并且第一层和第二层之间的最大放热峰温度的差异在高达20℃的范围内

7. 发明申请

US20120153506A1 WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：配线基板和半导体器件，以及制造半导体器件的方法
公开(公告)号：US20120153506A1
公开(公告)日：2012-06-21
申请号：US13329582
申请日：2011-12-19
申请人： Yoshihiro MACHIDA
发明人： Yoshihiro MACHIDA
IPC分类号： H01L23/498 , H05K1/11 , H01L21/56
CPC分类号： H05K3/3452 , H01L21/563 , H01L23/49894 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81193 , H01L2224/8182 , H01L2224/83192 , H01L2224/83862 , H01L2224/9211 , H01L2924/00013 , H05K3/3436 , H05K2201/0989 , H05K2201/10977 , H05K2203/1189 , H01L2224/81 , H01L2224/83 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A wiring substrate includes a plurality of connection pads, and a protection insulating layer in which opening portion exposing said plurality of connection pads collectively is provided, wherein a notched opening portion is provided to a sidewall of the opening portion of the protection insulating layer in area between said plurality of connection pads. When a semiconductor chip is flip-chip connected to the connection pads by the prior sealing technology, a void occurring in the sealing resin is trapped in the notched opening portion.
摘要翻译：布线基板包括多个连接焊盘，以及保护绝缘层，其中开放部分共同地露出所述多个连接焊盘，其中在区域中的保护绝缘层的开口部分的侧壁上设有开槽部分在所述多个连接焊盘之间。当通过现有的密封技术将半导体芯片倒装芯片连接到连接焊盘时，在密封树脂中发生的空隙被捕获在缺口开口部分中。

8. 发明申请

US20120118939A1 PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：制造半导体器件的工艺和装置
公开(公告)号：US20120118939A1
公开(公告)日：2012-05-17
申请号：US13295581
申请日：2011-11-14
申请人： Keiyo KUSANAGI , Koichi HATAKEYAMA , Mitsuhisa WATANABE , Yusuke NAKANOYA , Hidenori MATSUSHITA , Toru MEURA , Kenzou MAEJIMA , Hiroki NIKAIDO , Mina NIKAIDO
发明人： Keiyo KUSANAGI , Koichi HATAKEYAMA , Mitsuhisa WATANABE , Yusuke NAKANOYA , Hidenori MATSUSHITA , Toru MEURA , Kenzou MAEJIMA , Hiroki NIKAIDO , Mina NIKAIDO
IPC分类号： B23K1/008 , B23K31/02
CPC分类号： B23K1/0016 , H01L24/13 , H01L24/29 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/97 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/81193 , H01L2224/81203 , H01L2224/81209 , H01L2224/81815 , H01L2224/83192 , H01L2224/83203 , H01L2224/83862 , H01L2224/92125 , H01L2224/97 , H01L2924/00013 , H01L2924/01029 , H01L2924/15787 , H01L2924/181 , H05K3/3436 , H05K3/3489 , H05K2201/10674 , H05K2201/10977 , H05K2203/068 , H05K2203/1189 , Y02P70/613 , H01L2924/00014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/014 , H01L2924/00
摘要： The process for manufacturing the semiconductor device and the apparatus, which achieve stable production of semiconductor devices with improved connection reliability, is presented. First terminals of circuit boards 1 are arranged to face the corresponding bumps of semiconductor chips 2, respectively, and the resin layer 3 is disposed between the respective first terminals and the respective bumps to form laminates, and the laminates are simultaneously compressed from a direction of lamination, while heating a plurality of laminates. In such case, the diaphragm 54 disposed in a heating furnace 51 is abutted against a plurality of laminates or a member 531 to elastically deform the members while a plurality of laminates is heated in the heating furnace 51, so that laminates are simultaneously compressed from a direction of lamination, while heating thereof in a vacuum.
摘要翻译：本发明提供了制造半导体器件的方法以及实现稳定生产具有改进的连接可靠性的半导体器件的装置。电路板1的第一端子被分别布置成与半导体芯片2的相应凸块相对，并且树脂层3设置在相应的第一端子和相应的凸块之间以形成层压体，并且层叠体同时从同时加热多个层压板。在这种情况下，设置在加热炉51中的隔膜54抵靠多个层压体或构件531，以在加热炉51中加热多个层压体的同时使构件弹性变形，使得层压体同时从层叠方向，同时在真空中加热。

9. 发明授权

US08114243B2 Mounting method using thermocompression head 有权
标题翻译：使用热压头的安装方法
公开(公告)号：US08114243B2
公开(公告)日：2012-02-14
申请号：US12374240
申请日：2007-07-18
申请人： Kazutaka Furuta , Masaki Taniguchi
发明人： Kazutaka Furuta , Masaki Taniguchi
IPC分类号： C09J5/00 , B32B37/00
CPC分类号： H05K3/328 , B30B5/02 , B30B15/065 , H01L24/75 , H01L24/83 , H01L24/90 , H01L2224/16 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/75303 , H01L2224/75304 , H01L2224/75315 , H01L2224/75316 , H01L2224/83101 , H01L2224/83192 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/014 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K3/305 , H05K2201/10674 , H05K2201/10977 , H05K2203/1189 , H01L2924/00
摘要： A mounting method is provided using a thermocompression head which can mount an electric component in a short time with high connection reliability. The method is provided for mounting an electric component on a wiring board by using a thermocompression head having an elastic pressure bonding member composed of an elastomer on a heatable metal head main body. In the method, after arranging an adhesive agent on a mounting region on the wiring board, an electric component is arranged on a mounting region, and the electric component is bonded on the wiring board by thermocompression by using the thermocompression head. At the time of performing thermocompression bonding, while pressing a top region of the electric component by a metal portion of the head main body, and adhesive in the vicinity of a side portion region of the electric component is pressed by a taper section of the elastic adhesive member.
摘要翻译：提供了一种使用热压头的安装方法，其可以在短时间内以高连接可靠性安装电气部件。该方法用于通过使用在可加热金属头主体上具有由弹性体构成的弹性压接构件的热压头将电气部件安装在布线板上。在该方法中，在布线基板的安装区域上配置粘合剂之后，在安装区域上配置电气部件，通过使用热压头通过热压接将电气部件接合在布线基板上。在进行热压接时，通过头主体的金属部分按压电气部件的顶部区域，并且电气部件的侧部区域附近的粘合剂被弹性部分的锥形部分挤压粘合剂。

10. 发明申请

US20120012379A1 Printed circuit board 审中-公开
标题翻译：印刷电路板
公开(公告)号：US20120012379A1
公开(公告)日：2012-01-19
申请号：US13200355
申请日：2011-09-23
申请人： Ho-Sik Park , Keung-Jin Sohn , Joon-Sik Shin , Sang-Youp Lee , Joung-Gul Ryu , Jung-Hwan Park , Jee-Soo Mok
发明人： Ho-Sik Park , Keung-Jin Sohn , Joon-Sik Shin , Sang-Youp Lee , Joung-Gul Ryu , Jung-Hwan Park , Jee-Soo Mok
IPC分类号： H05K1/11
CPC分类号： H05K3/4069 , H05K3/20 , H05K3/281 , H05K3/4602 , H05K3/4647 , H05K3/4658 , H05K3/4682 , H05K2201/09481 , H05K2203/0156 , H05K2203/066 , H05K2203/1189 , Y10T29/49124
摘要： A printed circuit board including: an insulation layer; a first pattern buried in one surface of the insulation layer; a first resin layer laminated on one surface of the insulation layer to cover the first pattern; a second pattern buried in the other surface of the insulation layer; a via electrically connecting the first pattern with the second pattern; and a second resin layer laminated on the other surface of the insulation layer to cover the second pattern.
摘要翻译：一种印刷电路板，包括：绝缘层; 绝缘层的一个表面中的第一图案; 层叠在所述绝缘层的一个表面上以覆盖所述第一图案的第一树脂层; 掩埋在所述绝缘层的另一个表面中的第二图案; 通孔，电连接第一图案与第二图案; 以及层叠在所述绝缘层的另一表面上以覆盖所述第二图案的第二树脂层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式