会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明专利
    • Display device, simulator, simulation method and program
    • 显示设备,模拟器,模拟方法和程序
    • JP2005165549A
    • 2005-06-23
    • JP2003401804
    • 2003-12-01
    • Toshiba Corp株式会社東芝
    • TODA TOSHIYUKI
    • G06F17/50H01L21/822H01L27/04
    • PROBLEM TO BE SOLVED: To provide a device allowing acquisition of a user interface allowing a user to quantitatively evaluate temperature characteristics of each part of a semiconductor device.
      SOLUTION: This display device has: a temperature distribution information calculation part 120 calculating temperature distribution information about internal temperature of the semiconductor device when simulation of the semiconductor device is performed; at least one of a volume value information calculation part 130 calculating total information about a volume value in a portion inside the semiconductor device corresponding to a prescribed temperature range, a heat capacity value information calculation part 140 calculating total information about a heat capacity value, and a thermal energy value information calculation part 150 calculating total information about a thermal energy value; a temperature scale display part 102 of the calculated internal temperature; and an output part 160 outputting the total information calculated by the volume value information calculation part 130, the heat capacity value information calculation part 140 or the thermal energy value information calculation part 150.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供允许获取用户界面的设备,允许用户定量评估半导体器件的每个部分的温度特性。 解决方案:该显示装置具有:温度分布信息计算部120,在进行半导体装置的模拟时,计算关于半导体装置的内部温度的温度分布信息; 体积值信息计算部130中的至少一个计算与规定温度范围对应的半导体装置内部的体积值的总体信息,热容量值信息计算部140,计算热容量值的总体信息,以及 热能值信息计算部150计算关于热能值的总体信息; 所计算的内部温度的温度标尺显示部分102; 以及输出部160,其输出由体积值信息计算部130,热容值信息计算部140或热能值信息计算部150计算出的总信息。(C)2005,JPO&NCIPI
    • 4. 发明专利
    • Nonvolatile semiconductor storage device, and its manufacturing method
    • 非易失性半导体存储器件及其制造方法
    • JP2008004614A
    • 2008-01-10
    • JP2006170121
    • 2006-06-20
    • Toshiba Corp株式会社東芝
    • KITO TAKASHIAOKI NOBUTOSHIKITO MASARUKATSUMATA RYUTAKONDO MASAKIKUSUNOKI NAOKITODA TOSHIYUKIITO SANAETANIMOTO KOKICHIAOCHI HIDEAKINITAYAMA AKIHIROSHIRATA RIICHIRO
    • H01L21/8247H01L27/115H01L29/788H01L29/792
    • H01L29/7881H01L21/84H01L27/115H01L27/11521H01L27/11568H01L27/1203H01L29/42336
    • PROBLEM TO BE SOLVED: To provide a nonvolatile semiconductor storage device which is superior in short channel characteristic, writing characteristic and retention, and to provide its manufacturing method.
      SOLUTION: The nonvolatile semiconductor storage device is provided with a semiconductor area 10, element isolation areas 13 which are arranged in the semiconductor area 10 and is extended in the direction of column, a selective epitaxial growth layer 12 which is arranged on the semiconductor area 10 pinched by the element isolation areas 13 and of which section along the direction of row is like a projected shape, a source/drain area arranged on the selective epitaxial growth layer 12, a gate insulation film 14 which is pinched by the element isolation areas 13 and is arranged on the selective epitaxial growth layer 12 between the source/drain area, a floating gate electrode layer 15 which is pinched by the element isolation areas 13 and is arranged on the gate insulation film 14, a gate-to-gate insulation film 16 which is arranged in the floating gate electrode layer 15 and the upper surface of the element isolation areas 13, and a control gate electrode layer 17 which is arranged on the gate-to-gate insulation film 16 and is extended in the direction of row.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种在短通道特性,写入特性和保持性方面优异的非易失性半导体存储装置,并提供其制造方法。 解决方案:非易失性半导体存储装置设置有半导体区域10,设置在半导体区域10中并沿列方向延伸的元件隔离区域13,选择性外延生长层12布置在 由元件隔离区域13夹持的半导体区域10,沿着行方向的部分类似于投影形状,布置在选择性外延生长层12上的源极/漏极区域,被元件夹持的栅极绝缘膜14 隔离区域13,并且布置在源极/漏极区域之间的选择性外延生长层12上,被元件隔离区域13夹持并布置在栅极绝缘膜14上的浮置栅极电极层15,栅极 - 布置在浮置栅极层15和元件隔离区域13的上表面中的栅极绝缘膜16和布置在栅极绝缘膜16中的控制栅电极层17 在栅极至栅极绝缘膜16上并沿行方向延伸。 版权所有(C)2008,JPO&INPIT
    • 7. 发明专利
    • Nonvolatile semiconductor memory
    • 非易失性半导体存储器
    • JP2006294940A
    • 2006-10-26
    • JP2005115013
    • 2005-04-12
    • Toshiba Corp株式会社東芝
    • TANIMOTO KOKICHITODA TOSHIYUKIKUSUNOKI NAOKIAOKI NOBUTOSHISHIRATA RIICHIROARAI FUMITAKA
    • H01L21/8247H01L27/115H01L29/788H01L29/792
    • PROBLEM TO BE SOLVED: To provide a nonvolatile semiconductor memory wherein the high speed collective erasure of memory signals can be obtained in an NAND-type flash memory having SOI structure. SOLUTION: This nonvolatile semiconductor memory comprises a plurality of memory cell transistors MT 11 -MT 1n which are formed with channel regions 411-41n of a first conductivity type contiguous to a buried insulating layer 2 and are arranged in the column direction, a first selective gate transistor STS1 formed with a channel region 42 of a second conductivity type which is adjacent to one end of the arrangement of the memory cell transistors MT 11 -MT 1n and contiguous to the buried insulating layer 2, a source line contact region 46 of the second conductivity type which is electrically connected to the channel region 42 of the second conductivity type and has impurity density higher than that of the channel region 42, and a source line contact plug 18 which is electrically connected to a source region 43 of the first conductivity type in the first selective gate transistor STS1 and electrically connected to the source line contact region 46. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供一种非易失性半导体存储器,其中可以在具有SOI结构的NAND型闪速存储器中获得存储信号的高速集合擦除。 解决方案:这种非易失性半导体存储器包括由第一导电类型连续的沟道区域411-41n形成的多个存储单元晶体管MT-SB 11-SB 埋入绝缘层2并沿列方向布置,第一选择栅极晶体管STS1形成有第二导电类型的沟道区42,该沟道区42与存储单元晶体管MT11的布置的一端相邻 与掩埋绝缘层2邻接的第二导电类型的源极线接触区域46与第二导电类型的沟道区域42电连接,并且具有 杂质浓度高于沟道区域42的源极线接触插塞18,与第一选择栅极晶体管STS1中的第一导电类型的源极区43电连接并与源极线接触区域46电连接的源极线接触插塞18。

      COPYRI GHT:(C)2007,JPO&INPIT

    • 8. 发明专利
    • Nonvolatile semiconductor memory device and its controlling method
    • 非线性半导体存储器件及其控制方法
    • JP2006294711A
    • 2006-10-26
    • JP2005110373
    • 2005-04-06
    • Toshiba Corp株式会社東芝
    • TODA TOSHIYUKITANIMOTO KOKICHIKUSUNOKI NAOKIAOKI NOBUTOSHISHIRATA RIICHIROARAI FUMITAKA
    • H01L21/8247H01L27/115H01L29/788H01L29/792
    • PROBLEM TO BE SOLVED: To provide a nonvolatile semiconductor memory device which can perform writing, reading, and erasing operations normally.
      SOLUTION: The nonvolatile semiconductor memory device comprises memory cell transistors MT
      11 -MT
      1n which include source regions 421-42n of the same conductivity n
      - -type, drain regions 422-42(n+1) of the same conductivity type, and channel regions 411-41n of the same conductivity type. All of these are formed in contact with a buried insulation layer 2 in a semiconductor layer 3 formed on the buried insulation layer 2 on a support substrate 1. The thickness T
      SOI of the channel regions 411-41n is not less than 1 nm nor more than the gate length L of the memory cell transistor MT
      11 -MT
      1n plus 6 nm.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供一种能够正常执行写入,读取和擦除操作的非易失性半导体存储器件。 解决方案:非易失性半导体存储器件包括存储单元晶体管,其包括相同电导率的源极区域421-42n n - < / SP>型,相同导电类型的漏区422-42(n + 1)以及相同导电类型的沟道区411-41n。 所有这些都形成为与形成在支撑基板1上的掩埋绝缘层2上的半导体层3中的掩埋绝缘层2接触。沟道区域411-41n的厚度T SOI 不小于1nm且不大于存储单元晶体管MT <11> -MT 1n 的栅极长度L加上6nm。 版权所有(C)2007,JPO&INPIT
    • 10. 发明专利
    • Nonvolatile semiconductor storage device
    • 非易失性半导体存储器件
    • JP2013197546A
    • 2013-09-30
    • JP2012066386
    • 2012-03-22
    • Toshiba Corp株式会社東芝
    • NAKAI TSUKASAAOKI NOBUTOSHIIZUMIDA TAKASHIKONDO MASAKITODA TOSHIYUKI
    • H01L21/336H01L21/8247H01L27/10H01L27/115H01L27/28H01L29/788H01L29/792H01L51/05H01L51/30
    • H01L29/788G11C16/0466H01L27/11524H01L27/11548H01L27/11556H01L27/1157H01L27/11575H01L27/11582H01L29/66825
    • PROBLEM TO BE SOLVED: To provide a high-quality nonvolatile semiconductor storage device.SOLUTION: A nonvolatile semiconductor storage device comprises: a substrate 11; a laminate ML having a structure in which a plurality of first insulation layers 21 and a plurality of first electrode layers 22 are alternately stacked one by one in a first direction perpendicular to the substrate 11; a second insulation layer 32 formed along the first direction on an inner wall of a first through hole 28 which pierces the first insulation layers 21 and the first electrode layers 22; an intermediate layer 33 formed on a surface of the second insulation layer 32; a third insulation layer 34 formed on a surface of the intermediate layer 33; and a columnar first semiconductor region 36 which is formed on a surface of the third insulation layer 34 and extends along the first direction. The intermediate layer 33 includes: a charge storage region 33b at a position adjacent to the first electrode layers 22 in a second direction orthogonal to the first direction, which consists primarily of carbon; and an insulation regions 33a for electrically separating the plurality of charge storage regions 33b which are adjacent in the first direction to a position adjacent to the first insulation layer 21 in the second direction.
    • 要解决的问题:提供高质量的非易失性半导体存储装置。解决方案:非易失性半导体存储装置包括:基板11; 具有多个第一绝缘层21和多个第一电极层22在垂直于基板11的第一方向上交替堆叠的结构的层压体ML; 在穿过第一绝缘层21和第一电极层22的第一通孔28的内壁上沿着第一方向形成的第二绝缘层32; 形成在第二绝缘层32的表面上的中间层33; 形成在中间层33的表面上的第三绝缘层34; 以及形成在第三绝缘层34的表面上并沿着第一方向延伸的柱状的第一半导体区域36。 中间层33包括:主要由碳组成的与第一方向正交的第二方向的与第一电极层22相邻的位置处的电荷存储区域33b; 以及绝缘区域33a,用于将在第一方向上相邻的多个电荷存储区域33b沿第二方向电分离到与第一绝缘层21相邻的位置。