专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2007281136A Semiconductor substrate, and substrate inspection method 审中-公开
标题翻译：半导体基板和基板检查方法
公开(公告)号：JP2007281136A
公开(公告)日：2007-10-25
申请号：JP2006104289
申请日：2006-04-05
申请人： Toshiba Corp , 株式会社東芝
发明人： HAYASHI HIROYUKI , NAGAI TAKAMITSU , NODA TOMONOBU , KADOTA KENICHI , OZAKI HISASHIRO
IPC分类号： H01L21/66 , H01J37/28
CPC分类号： H01L22/14 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To quickly and easily inspect a defective semiconductor substrate having a short-circuit between contact wires. SOLUTION: An electric potential contrast image is acquired from a semiconductor substrate S comprising a TEG including contact wires CW alternately and repetitively formed so that one of the adjacent contact wires CW is grounded to a P well 2, and the other of the adjacent contact wires CW is insulated from the P well 2, and whether it is non-defective or defective is judged by the difference in light and darkness in the acquired image. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了快速且容易地检查在接触线之间具有短路的缺陷半导体衬底。解决方案：从包括接触线CW的TEG的半导体衬底S交替重复地形成电位对比图像，使得相邻的接触线CW中的一个接地到P阱2，另一个相邻的接触线CW与P阱2绝缘，并且通过所获取的图像中的亮度和黑暗的差异来判断是否是无缺陷或有缺陷的。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2006349691A SUBSTRATE INSPECTION DEVICE, SUBSTRATE TESTING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2006349691A
公开(公告)日：2006-12-28
申请号：JP2006201002
申请日：2006-07-24
申请人： TOSHIBA CORP
发明人： NAGAHAMA ICHIROTA , YAMAZAKI YUICHIRO , NAGAI TAKAMITSU , MIYOSHI MOTOSUKE
IPC分类号： G01N23/225 , G01R31/302 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide strain-free sensed images excelling in contrast. SOLUTION: This substrate inspection system 1 is equipped with: primary optical system 10 which generates electron beam to irradiate a substrate S as primary beam Bp; electronic detecting section 30 which detects secondary electron and the like generated from the substrate S by receiving irradiation with the primary beam Bp to output signal used as one or two-dimensional image on surface of the substrate S; and secondary optical system 20 for imaging the secondary electron and the like generated from the substrate S on the electronic detecting section 30 as secondary beam 18s. The system is also provided with laser beam irradiation device 70 which generates laser beam L to irradiate the spot where the secondary beam 18s on the substrate S surface is generated. COPYRIGHT: (C)2007,JPO&INPIT

3. 发明专利

JP2000028688A BOARD INSPECTION APPARATUS AND BOARD INSPECTION SYSTEM PROVIDED WITH THE SAME AS WELL AS CONTROL METHOD FOR BOARD INSPECTION APPARATUS 失效
公开(公告)号：JP2000028688A
公开(公告)日：2000-01-28
申请号：JP20050298
申请日：1998-07-15
申请人： TOSHIBA CORP
发明人： NAGAHAMA ICHIROTA , YAMAZAKI YUICHIRO , NAGAI TAKAMITSU , MIYOSHI MOTOSUKE
IPC分类号： G01N23/20 , G01N23/225 , G01R31/302 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a board inspection apparatus by which the magnification chromatic aberration of a secondary electron beam can be suppressed, while the irradiation region of a primary electron beam is being ensured, to provide an inspection system provided with the board inspection apparatus, and to provide a control method for the board inspection apparatus. SOLUTION: In a board inspection apparatus 90 which uses a nearly rectangular electron beam, an image-forming optical system as a telecentric system which is conjugate with an image-formation optical system in which a third lens 23 and a fourthlens 24 are controlled by secondary-optical system lens control parts 55, 56 and which is formed of a cathode lens 21 and a second lens 22 is formed, and square aperture diaphragms are arranged at focal planes 8, 9 which are mutually conjugate. As the square aperture diaphragms, movable rectangular diaphragms which are connected respectively to a driving mechanism using a piezoelectric element, comprising two rectangular flat boards arranged and installed in parallel in the direction of the long direction and in which their diaphragm widths formed of edges of sides facing to the rectangular flat boards can be adjusted are used. The movable rectangular diaphragms are arranged and installed in such a way that their long axis becomes a direction identical to that of the long axis of the cross-sectional shape of a primary electron beam 5 and that the long axis is at right angles to the long axis of the movable rectangular diaphragms.

4. 发明专利

JPH08329872A ELECTROSTATIC LENS AND ITS MANUFACTURE 失效
公开(公告)号：JPH08329872A
公开(公告)日：1996-12-13
申请号：JP13806095
申请日：1995-06-05
申请人： TOSHIBA CORP
发明人： NAGAI TAKAMITSU
IPC分类号： G21K1/087 , H01J9/14 , H01J23/083 , H01J29/46 , H01J37/12
摘要： PURPOSE: To provide an electrostatic lens and establish method of its manufacture with which the lens accuracy is enhanced and the machining and assembling works can be performed easily. CONSTITUTION: An electrostatic lens to be manufactured by this method according to the present invention is to disperse or converge a charged particle beam 15. Columns 4, 6 made of a high resistance material and a column 5 made of a low resistance material are inserted into a through hole 3 provided in an insulative cylinder 2 in such a way as alternately without gaps in between, and a through hole 7 for transmission of charged particle beam is formed in these columns in the condition that they are consolidated with the insulating cylinder.

5. 发明专利

JP2005235777A Inspection apparatus and method by electron beam, and device manufacturing method using the inspection apparatus 审中-公开
标题翻译：电子束的检查装置和方法以及使用检查装置的装置制造方法
公开(公告)号：JP2005235777A
公开(公告)日：2005-09-02
申请号：JP2005061093
申请日：2005-03-04
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： YAMAZAKI YUICHIRO , WATANABE KENJI , SOFUGAWA TAKUJI , NOMICHI SHINJI , SATAKE TORU , YOSHIKAWA SEIJI , KARIMATA TSUTOMU , NAKASUJI MAMORU , HATAKEYAMA MASAKI , MURAKAMI TAKESHI , NAGAHAMA ICHIROTA , NAGAI TAKAMITSU , SUGIHARA KAZUYOSHI
IPC分类号： H01L21/66 , H01J37/29
摘要： PROBLEM TO BE SOLVED: To improve an inspection speed detecting a failure of a sample of a wafer, etc. SOLUTION: An inspection apparatus by an electron beam is one of a mapping projection type and comprises: a primary electron optical system for forming the electron beam emitted from en electron gun into a rectangle and irradiating onto a face of a sample to be inspected; a secondary electron optical system for converging secondary electrons emitted from the sample; a detection device for converting the converged secondary electrons into an optical image through a fluorescent plate to image them to a line sensor; and a control device for controlling charge moving time to transfer the line image which is imaged in a pixel string provided with the line sensor, cooperatively with the moving speed of a stage to move the sample. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提高检测晶片样品故障等的检查速度。解决方案：电子束检查装置是映射投影型之一，包括：一次电子用于将从电子枪发射的电子束形成矩形并照射到要检查的样品的面上的光学系统; 用于会聚从样品发射的二次电子的二次电子光学系统; 检测装置，用于通过荧光板将会聚的二次电子转换为光学图像，以将其成像到线传感器; 以及控制装置，用于控制电荷移动时间，以便与用于移动样本的载物台的移动速度协调地传送被成像在设置有线传感器的像素串中的线图像。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2004138563A Method and device for determining defect information detection sensitivity data, method for managing defect detection device, and method and device for detecting defect in semiconductor device 有权
公开(公告)号：JP2004138563A
公开(公告)日：2004-05-13
申请号：JP2002305157
申请日：2002-10-18
申请人： Toshiba Corp , 株式会社東芝
发明人： HAMAGUCHI AKIRA , NAGAI TAKAMITSU
IPC分类号： G01B11/30 , G01N21/956 , G06T1/00 , G06T7/00 , G06T7/40 , H01L21/66
CPC分类号： G06K9/00 , G06K2209/19 , G06T7/0002 , G06T7/0004 , G06T7/41 , G06T2207/30148
摘要： PROBLEM TO BE SOLVED: To quantitatively determine defect detection sensitivity data for use in detecting a defect in a semiconductor device, using image data detected from the surface of each semiconductor device of the plurality of semiconductor devices. SOLUTION: The image data are taken in from a desired area of the surface of each semiconductor device of the plurality of semiconductor devices. Defect information on the desired area is obtained by comparing the data obtained by arithmetically processing the image data with a defect information detection sensitivity parameter in which a prescribed threshold value is set. By varying the threshold value which is set to the defect information detection sensitivity parameter, the step for obtaining the defect information is performed plural times, and a plurality of combination data are obtained, in which the threshold value is related to the defect information. A function showing the relationship between desired statistical quantity data and the defect information detection sensitivity parameter is prepared, using the plurality of combination data. On the basis of the function, the defect information detection sensitivity data for use in obtaining the defect information on the desired area in detecting the defect of the semiconductor device are determined. COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2000323538A METHOD AND SYSTEM FOR BOARD INSPECTING 失效
公开(公告)号：JP2000323538A
公开(公告)日：2000-11-24
申请号：JP26934699
申请日：1999-09-22
申请人： TOSHIBA CORP
发明人： NAGAHAMA ICHIROTA , YAMAZAKI YUICHIRO , NAGAI TAKAMITSU , MIYOSHI MOTOSUKE
IPC分类号： H01J37/29 , G01R1/06 , G01R31/302 , G01R31/307 , H01J37/28 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To measure the physical/electrical properties of a board correctly as well as quantitatively by inspecting the defective electrical properties of wiring formed on the board while controlling a secondary beam based on the image forming conditions for the secondary beam. SOLUTION: Image signals for respective measuring points supplied to an image signal processing section 58 are applied to an image formation determining section 62 via a predetermined signal process. The section 62 determines whether or not a secondary beam has formed an image properly at an electron detecting section based on each image signal. When having determined that the image is formed properly, the section 62 delivers the determination result to a measurement instructing section 64. In response to the determination result, the section 64 supplies image forming conditions therefor to a board surface potential calculating section 63, moves a stage to a next measuring point, injects an electron beam, and controls the secondary beam, thereby to inspect the defective electrical properties of wiring formed on the board.

8. 发明专利

JP2000208395A METHOD AND SYSTEM FOR INSPECTING SUBSTRATE 失效
公开(公告)号：JP2000208395A
公开(公告)日：2000-07-28
申请号：JP561099
申请日：1999-01-12
申请人： TOSHIBA CORP
发明人： NAGAI TAKAMITSU , NAGAHAMA ICHIROTA , YAMAZAKI YUICHIRO , MIYOSHI MOTOSUKE
IPC分类号： H01J37/22 , G01N23/225 , G03F1/84 , G03F1/86 , H01J37/04 , H01L21/027 , H01L21/66 , G03F1/08
摘要： PROBLEM TO BE SOLVED: To provide a system and a method for inspecting a substrate in which a projecting electron beam can be regulated in three directions of X, Y and θ. SOLUTION: A substrate inspection system comprises a cathode stage 1 for moving a cathode 2 in three directions of X, Y and θ and a control section 3 therefor, an electromagnetic coil 7 for turning an electron beam 8 about the beam axis and a control section 18 therefor, a Farady cup 13 and an ammeter 35 for measuring the current value of the electron beam 8, and a correction amount operating circuit 15. Current value of the electron beam 8 is measured for each coordinate by irradiating the Farady cup 13 with the electron beam 8 in a specified region by shifting a sample stage 14. Two-dimensional distribution of the current values exceeding a specified threshold level Is is then calculated and axial shift (X, Y) of the electron beam 8 is calculated based on the center of gravity of the two-dimensional distribution. Subsequently, an axial shift correction amount is fed to the cathode stage control section 3, rotational shift (θ) is calculated based on the inclination of the regression line of the two-dimensional distribution and a rotational shift correction amount is fed to the cathode stage control section 3 and the electromagnetic coil control section 18.

9. 发明专利

JP2012253168A Pattern inspection method, photomask, and method of manufacturing semiconductor device 审中-公开
标题翻译：图案检查方法，光电二极管及制造半导体器件的方法
公开(公告)号：JP2012253168A
公开(公告)日：2012-12-20
申请号：JP2011123991
申请日：2011-06-02
申请人： Toshiba Corp , 株式会社東芝
发明人： MITSUYOSHI YASURO , NAGAI TAKAMITSU
IPC分类号： H01L21/66 , G03F1/84
摘要： PROBLEM TO BE SOLVED: To provide a pattern inspection method capable of bringing defects detected by an optical inspection into an observation field in an electron microscope with high accuracy, and to provide a photomask and a method of manufacturing a semiconductor device.SOLUTION: In a pattern inspection method, a plurality of regions are formed in a wafer, each region including a device pattern formed in a chip region, a first pattern formed outside of the chip region, and a second pattern different from the first pattern formed outside of the chip region. By an optical inspection of the wafer, defects in the device pattern are detected by correlating with position coordinates on the wafer, and the second pattern correlated with position coordinates on the wafer is detected by comparing with the first pattern. Based on observation results of positioning in which an observation field in an electron microscope being aligned with the position coordinates of the detected second pattern, the position coordinates of the defects in the device pattern are corrected.
摘要翻译：要解决的问题：提供一种能够以高精度将能够通过光学检查检测到的缺陷引入电子显微镜中的观察场的图案检查方法，并提供光掩模和半导体器件的制造方法。解决方案：在图案检查方法中，在晶片中形成多个区域，每个区域包括形成在芯片区域中的器件图案，形成在芯片区域外部的第一图案和不同于芯片区域的第二图案第一图案形成在芯片区域外部。通过对晶片的光学检查，通过与晶片上的位置坐标相关来检测器件图案中的缺陷，并且通过与第一图案进行比较来检测与晶片上的位置坐标相关的第二图案。基于电子显微镜中的观察场与所检测的第二图案的位置坐标对准的定位的观察结果，校正装置图案中的缺陷的位置坐标。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2007311418A Method and device for preparing inspection recipe 审中-公开
标题翻译：用于准备检查录像的方法和装置
公开(公告)号：JP2007311418A
公开(公告)日：2007-11-29
申请号：JP2006136789
申请日：2006-05-16
申请人： Toshiba Corp , 株式会社東芝
发明人： NAGAI TAKAMITSU , ONISHI ATSUSHI , MORINAGA HIROYUKI , ITO TAKEMA , INOUE ARATA
IPC分类号： H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a method for preparing an inspection recipe for a semiconductor wafer in high accuracy and at high throughput.
SOLUTION: At least either of a wafer parameter as a settable inspection information and a sensitivity parameter of a defect inspection device is generated from the design information of a semiconductor wafer, and incorporated into a recipe for defect inspection. The defect inspection device is unnecessary to be occupied for the preparation of the recipe because a semiconductor wafer to be inspected is not actually used, and the defect inspection can be carried out without lowering the throughput of the device.
COPYRIGHT: (C)2008,JPO&INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式