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1. 发明专利

JP2001198794A POLISHING DEVICE 失效
公开(公告)号：JP2001198794A
公开(公告)日：2001-07-24
申请号：JP2000012856
申请日：2000-01-21
申请人： EBARA CORP , TOSHIBA CORP
发明人： OGURI SHOZO , AIZAWA HIDEO , SHIGETA KENICHI , TATEYAMA YOSHIKUNI
IPC分类号： B24B49/18 , B24B49/12 , B24B53/00 , B24B53/007 , B24B53/017 , B24B53/02 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a polishing device capable of easily measuring the change in the state of a polishing face, properly determining the timing for dressing the polishing face and time for replacing the members constituting the polishing face and polishing the polishing face of a substrate in high quality. SOLUTION: In a polishing device provided with a top ring, a turn table 12 having a polishing face 12a and a dresser 11 regenerating the polishing face for polishing the polishing face with a workpiece to be polished intervening between the top ring and the polishing face 12a of the turn table 12 which are rotated independently of each other and capable of regenerating the polishing face 12a by means of a dresser 11 at specified timing, a nature measuring device provided with a sensor 13, etc., for observing the nature of the polishing face 12a of the turn table 12 is provided for regenerating the polishing face 12a by means of the dresser 11, an indicator 21 is provided for indicating the measuring result by observing the nature of the polishing face 12a by means of the nature measuring instrument in regenerating the polishing face 12a by means of the dresser 11.

2. 发明专利

JPH10340870A POLISHING APPARATUS 失效
公开(公告)号：JPH10340870A
公开(公告)日：1998-12-22
申请号：JP16515297
申请日：1997-06-06
申请人： EBARA CORP , TOSHIBA CORP
发明人： AIZAWA HIDEO , ITO KENYA , YAJIMA HIROMI , SHIGETA KENICHI , TATEYAMA YOSHIKUNI
IPC分类号： H01L21/677 , H01L21/304 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide highly clean products by suppressing the increase of facilities and running costs, and preventing mutual pollution at each step. SOLUTION: In a polishing equipment providing polishing units 10a and 10b. For chemically and mechanically polishing the surface of materials to be polished, cleaning units 26a, 26b and 26c for cleaning the polished materials, and transfer units 20a and 20b for transferring the materials to be polished between the units 26a, 26b and 26c, a space housing each unit are partitioned according to the degree of cleanliness for constructing a plurality of chambers R1 to R4 , and a transfer gate 18, having temporary chambers 18a and 18b for temporarily storing the materials to be polished are provided between the chambers.

3. 发明专利

JPH10286761A POLISHING DEVICE FOR SUBSTRATE 失效
公开(公告)号：JPH10286761A
公开(公告)日：1998-10-27
申请号：JP11015097
申请日：1997-04-11
申请人： EBARA CORP , TOSHIBA CORP
发明人： ITO KENYA , AIZAWA HIDEO , YAJIMA HIROMI , SHIGETA KENICHI , TATEYAMA YOSHIKUNI
IPC分类号： B23Q37/00 , B24B37/00 , B24B41/02
摘要： PROBLEM TO BE SOLVED: To form a polishing device compact to be installed in a narrow space, and improve convenience for transport and maintenance. SOLUTION: A first frame 10a on which a polishing table 16 having a polishing tool 48 on an upper surface is installed, and a second frame 10b on which a top ring device 12 having a rotatable top ring head 24 to hold a substrate while pressing a subject surface of the substrate to be polished to a polishing table 16 with a prescribed pressure is installed are composed as separate bodies. The first frame 10a and the second frame 10b are stacked on a base frame 10d in order to be assembled.

4. 发明专利

JP2014175333A Substrate transfer apparatus, substrate polishing device 有权
标题翻译：基板转印装置，基板抛光装置
公开(公告)号：JP2014175333A
公开(公告)日：2014-09-22
申请号：JP2013043948
申请日：2013-03-06
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KOSUGE RYUICHI , NISHIDA HIROAKI , SONE CHUICHI , AIZAWA HIDEO , TANAKA TOMOHIRO
IPC分类号： H01L21/677 , B65G49/07 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To suppress falling of a substrate in a substrate transfer apparatus.SOLUTION: A substrate transfer apparatus for transferring a substrate includes a transfer stage TS1 configured movably in the horizontal direction, and three or more substrate mounting sections 50c provided to project vertically upward from the transfer stage TS1. The substrate mounting section 50c includes a first inclined surface 51c inclining for the horizontal direction and directed to the upper side so as to mount a substrate on the inside of the three or more substrate mounting sections 50c, and a second inclined surface 52c inclining for the horizontal direction while directing the lower side, and formed above the first inclined surface.
摘要翻译：要解决的问题：抑制基板传送装置中的基板的落下。解决方案：用于传送基板的基板传送装置包括：在水平方向上可移动地配置的传送台TS1和设置成投影的三个或更多个基板安装部50c 从传送台TS1垂直向上。基板安装部50c包括倾斜水平方向并且指向上侧的第一倾斜表面51c，以便将基板安装在三个或更多个基板安装部分50c的内侧上，并且倾斜的第二倾斜表面52c用于同时引导下侧，并且形成在第一倾斜表面上方。

5. 发明专利

JP2007075949A Polishing platen and polishing device 审中-公开
标题翻译：抛光板和抛光装置
公开(公告)号：JP2007075949A
公开(公告)日：2007-03-29
申请号：JP2005267155
申请日：2005-09-14
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KOBAYASHI TAKUJI , AIZAWA HIDEO , UMEMOTO MASAO , SONE CHUICHI , TORII HIROOMI , TAKAHASHI NOBUYUKI , TSUZUKI TAKASHI
IPC分类号： B24B37/12 , H01L21/304
CPC分类号： B24B37/16
摘要： PROBLEM TO BE SOLVED: To provide a polishing platen, which is comparatively easily peeled without requiring a strong force to peel a polishing pad from the upper surface of the polishing platen, and also to provide a polishing device using the polishing platen. SOLUTION: The polishing device is equipped with the polishing platen 12, presses a polished substrate to a polishing pad surface applied on the upper surface of the polishing platen 12, and polishes the polished substrate by a relative motion between the polishing platen and the polished substrate. The polishing device is composed of: a combination of a mirror surface part 21 having a mirror finished upper surface of the polishing platen 12, and a rough surface part 22 roughly finished, and the back surface of the polishing pad is applied on the upper surface of the polishing platen 12 with an adhesive (an adhesive tape). COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供相对容易剥离的研磨台板，而不需要强力从研磨台板的上表面剥离抛光垫，并且还提供使用该研磨台板的抛光装置。解决方案：抛光装置配备有抛光台板12，将抛光的基板压在施加在研磨台板12的上表面上的抛光垫表面上，并通过抛光台板和抛光衬底。抛光装置由以下部分组成：具有抛光台板12的镜面抛光上表面的镜面部分21和粗糙表面部分22的粗加工，抛光垫的后表面被施加在上表面的粘合剂（胶带）。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2004174612A Polishing table and polishing device 审中-公开
公开(公告)号：JP2004174612A
公开(公告)日：2004-06-24
申请号：JP2002340161
申请日：2002-11-22
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TORII HIROOMI , AIZAWA HIDEO , WAKABAYASHI SATOSHI
IPC分类号： B24B37/00 , B24B37/10 , H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a polishing table and a polishing device for making an occupying area smaller by a compact configuration, improving maintainability, and realizing high-grade polishing.
SOLUTION: This polishing device includes: a hollow motor 22 for rotating a rotary shaft 24 in a housing; a base 18 connected to the rotary shaft 24 through a bearing 32 with the center O
B located in a position eccentric from the axis O
M of the rotary shaft 24 of the hollow motor 22 by a designated distance (e); a polishing member 10 having a polishing surface on the top and fitted to the base 18; a support member 36 supporting the base 18; a connecting member 40 connecting the base 18 and the support member 36 to cause the translation rotary movement of the base 18 to the support member 36; and a rotary motor 54 for rotating the support member 36 around the housing 20.
COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2004042163A Polishing device and methods for sticking and peeling off consumable/replaceable parts to/from polishing device 审中-公开
标题翻译：抛光装置和方法，用于剥离和剥离消耗/更换零件往返于抛光装置
公开(公告)号：JP2004042163A
公开(公告)日：2004-02-12
申请号：JP2002200404
申请日：2002-07-09
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TORII HIROOMI , AIZAWA HIDEO , WAKABAYASHI SATOSHI
IPC分类号： B24B37/00 , B24B49/14 , B24D9/08 , B24D18/00 , H01L21/304
CPC分类号： B24B37/20 , B24B49/14 , B24D9/085 , B24D18/0072
摘要： PROBLEM TO BE SOLVED: To provide a polishing device that easily sticks abrasive cloth, a packing film, a pressuring ring, and other consumable/replaceable parts to a polishing table or top ring and peeling these parts off the polishing table/top ring, and also to provide an easy method for sticking consumable/replaceable parts to the polishing device or peeling them off such a device. SOLUTION: In the polishing device, equipped with the top ring that supports a board and a polishing table 10 and designed to make the board supported by the top ring contact the polishing face of the polishing table 10, for polishing the board through relative motions of the polishing table 10 and the board, consumable/replaceable parts, such as abrasive cloth 11 to be adhered to the top ring and the polishing table 10, are stuck to the top ring and polishing table 10 through the intermediation of a temperature-sensitive adhesive tape 13, which becomes non-adhesive or adhesive, depending on whether its temperature surpasses a specified level. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种抛光装置，其可以将研磨布，包装膜，加压环和其他可消耗/可更换部件轻松地粘贴到抛光台或顶环上，并将这些部件从抛光台/顶部剥离并且还提供将消耗/可更换部件粘贴到抛光装置或将其从这种装置上剥离的简单方法。解决方案：在具有支撑板的顶环和抛光台10的抛光装置中，设计成使由顶环支撑的板与抛光台10的抛光面接触，用于通过抛光台10和板的相对运动，待粘附到顶环的研磨布11等可消耗/可替换部件和抛光台10通过温度敏感性粘合带13根据其温度是否超过指定水平而变得非粘合或粘合。版权所有（C）2004，JPO

8. 发明专利

JP2004006559A SUBSTRATE DELIVERY METHOD, SUBSTRATE DELIVERY MECHANISM, AND SUBSTRATE POLISHING DEVICE 审中-公开
公开(公告)号：JP2004006559A
公开(公告)日：2004-01-08
申请号：JP2002185212
申请日：2002-06-25
申请人： EBARA CORP
发明人： ISOBE SOICHI , AIZAWA HIDEO , TORII HIROOMI , KOGA DAISUKE , WAKABAYASHI SATOSHI
IPC分类号： B24B37/04 , B65G49/07 , H01L21/304 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a substrate delivery method for quickly allowing a substrate retained by a top ring to be released for delivery, and to provide a substrate delivery mechanism and a substrate polishing device. SOLUTION: In the substrate delivery mechanism comprising a top ring 10; a substrate mount section 50 for mounting a substrate Wf; and a pusher mechanism 20, the substrate mount section 50 has a top ring guide 53, the pusher mechanism 20 has a top ring guide push-up table 21. The top ring guide 53 and the top ring guide push-up table 21 can form a closed space M under the substrate Wf retained by the top ring 10 while the substrate mount section 50 is raised by the pusher mechanism 20. The substrate Wf is is released by exhausting air from the sealed space M and at the same time jetting a fluid out of a hole 12b formed in a substrate retaining surface. COPYRIGHT: (C)2004,JPO

9. 发明专利

JPH10286763A GRINDING DEVICE OF SUBSTRATE 失效
公开(公告)号：JPH10286763A
公开(公告)日：1998-10-27
申请号：JP11014897
申请日：1997-04-11
申请人： EBARA CORP
发明人： ITO KENYA , AIZAWA HIDEO
IPC分类号： B24B37/07 , B24B37/10 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a compact grinding device which can be stably operated while inhibiting the vibration of a driving shaft, by comprising a grinding table, and the driving shaft for giving the translation circular motions to the grinding table, and comprising plural balancer pieces of which the mounting positions are adjustable in a circumferential direction. SOLUTION: A grinding tool device 16 comprises a grinding table 48 making the translation circular motions, and a grinding plate 50 is fixed to an upper face of the grinding table 48. Plural recessed parts 48a, 58a are formed at equal intervals in a circumferential direction, on the corresponding positions of a lower face of the grinding table 48 and an upper face of a base 58, and the edge parts of the shaft bodies 66a, 66b are inserted into the same for mounting a crank shaft 66 having two shaft bodies 66a, 66b shifted by an eccentric amount (e), respectively through the bearings 62, 64, whereby the grinding table 48 makes the translation circular motions along a circle of radius (e). The driving shaft 68 comprises the upper and lower balancers for preventing the vibration and the mechanical abrasion, by keeping the balance when the grinding table is eccentrically driven.

10. 发明专利

JP2014147990A Polishing device 有权
标题翻译：抛光装置
公开(公告)号：JP2014147990A
公开(公告)日：2014-08-21
申请号：JP2013017193
申请日：2013-01-31
申请人： Ebara Corp , 株式会社荏原製作所
发明人： UMEMOTO MASAO , SONE CHUICHI , KOSUGE RYUICHI , AIZAWA HIDEO
IPC分类号： B24B37/00 , H01L21/304
CPC分类号： B24B37/34 , B24B37/105 , B24B53/017
摘要： PROBLEM TO BE SOLVED: To provide a polishing device capable of preventing polishing liquid from attaching to a polishing head and preventing dried polishing liquid from dropping to a polish surface.SOLUTION: A polishing device comprises: a polishing table 5 supporting a polishing tool 3 having a polish surface 3a; a polishing head having a top ring 15 for pressing a substrate W against the polish surface 3a; a polishing head cover 50 covering the polishing head; a first cleaning fluid supply mechanism 54 supplying cleaning fluid to an outer peripheral face of the polishing head 50; and a second cleaning fluid supply mechanism supplying cleaning fluid to an inner peripheral face of the polishing head 50.
摘要翻译：要解决的问题：提供一种抛光装置，其能够防止抛光液附着在抛光头上，防止干燥的抛光液滴落到抛光面上。抛光装置包括：抛光台5，其支撑具有抛光表面3a; 具有用于将基板W压靠在抛光表面3a上的顶环15的抛光头; 覆盖抛光头的抛光头罩50; 向清洗头50的外周面供给清洗液的第一清洗液供给机构54; 以及向清洗头50的内周面供给清洗液的第二清洗液供给机构。

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