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1. 发明专利

JP2004006559A SUBSTRATE DELIVERY METHOD, SUBSTRATE DELIVERY MECHANISM, AND SUBSTRATE POLISHING DEVICE 审中-公开
公开(公告)号：JP2004006559A
公开(公告)日：2004-01-08
申请号：JP2002185212
申请日：2002-06-25
申请人： EBARA CORP
发明人： ISOBE SOICHI , AIZAWA HIDEO , TORII HIROOMI , KOGA DAISUKE , WAKABAYASHI SATOSHI
IPC分类号： B24B37/04 , B65G49/07 , H01L21/304 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a substrate delivery method for quickly allowing a substrate retained by a top ring to be released for delivery, and to provide a substrate delivery mechanism and a substrate polishing device. SOLUTION: In the substrate delivery mechanism comprising a top ring 10; a substrate mount section 50 for mounting a substrate Wf; and a pusher mechanism 20, the substrate mount section 50 has a top ring guide 53, the pusher mechanism 20 has a top ring guide push-up table 21. The top ring guide 53 and the top ring guide push-up table 21 can form a closed space M under the substrate Wf retained by the top ring 10 while the substrate mount section 50 is raised by the pusher mechanism 20. The substrate Wf is is released by exhausting air from the sealed space M and at the same time jetting a fluid out of a hole 12b formed in a substrate retaining surface. COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2001135604A POLISHING APPARATUS 失效
公开(公告)号：JP2001135604A
公开(公告)日：2001-05-18
申请号：JP2000250392
申请日：2000-08-21
申请人： EBARA CORP
发明人： SAKURAI KUNIHIKO , TOGAWA TETSUJI , TAKADA NOBUYUKI , WAKABAYASHI SATOSHI , SAITO KENICHIRO , SEKIMOTO MASAHIKO , HAYAMA TAKUJI , KOGA DAISUKE
IPC分类号： B24B37/04 , H01L21/304 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a polishing apparatus applicable to dry-in/dry-out system without reducing processing capability per hour and per unit of footprint, having cleaning steps or more in a cleaning process, and capable of developing clean processing of semiconductor wafer in accordance with miniaturization. SOLUTION: The polishing apparatus is provided with polishing tables 34, 35, 36, 37 with polishing surface, top rings 32, 33 for retaining a polishing object and pressing the object onto the polishing surface, three or more cleaning devices 5, 6, 22, 23 for cleaning the object after polishing process, and transfer mechanisms 20, 21 for transferring the object after polishing between three or more cleaning device 5, 6, 22, 23. The transfer mechanisms 20, 21 are changeable in the transfer route between three or more cleaning devices 5, 6, 22, 23.

3. 发明专利

JP2008066755A Polishing device 有权
标题翻译：抛光装置
公开(公告)号：JP2008066755A
公开(公告)日：2008-03-21
申请号：JP2007304919
申请日：2007-11-26
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SAKURAI KUNIHIKO , TOGAWA TETSUJI , TAKADA NOBUYUKI , WAKABAYASHI SATOSHI , SAITO KENICHIRO , SEKIMOTO MASAHIKO , HAYAMA TAKUJI , KOGA DAISUKE
IPC分类号： H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a polishing device which can be applied to a dry-in/dry-out type polishing device and respond to cleaning of semiconductor wafers accompanying miniaturization, having three or more cleaning steps in a cleaning process without spoiling processing capacity per unit time and per unit footprint. SOLUTION: The device comprises polishing tables 34, 35, 36, and 37 with polishing surfaces, top rings 32 and 33 which hold an object to be polished to press it to the polishing surfaces, transporting mechanisms 27, 27A, and 27B equipped with a plurality of bases on which the object is placed and is movable horizontally, pressures 30 and 30' which deliver the object between the bases and the top rings 32 and 33, and inversion device 28 and 28' which can deliver the object between the bases and invert the object. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种可应用于干式/干式抛光装置并且对小型化的半导体晶片的清洁作出反应的抛光装置，其具有在清洁过程中具有三个或更多个清洁步骤而没有每单位时间和每单位占地面积的破坏处理能力。解决方案：该装置包括具有抛光表面的抛光台34,35,36和37，顶表面32和33，其保持要抛光的物体将其推压到抛光表面，输送机构27,27A和27B 配备有多个基座，物体被放置在其上并且可水平移动，将物体在基座与顶环32和33之间输送的压力30和30'以及可以在物体之间传送物体的反转装置28和28' 基础和反转对象。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2003236744A POLISHING DEVICE 审中-公开
公开(公告)号：JP2003236744A
公开(公告)日：2003-08-26
申请号：JP2002041789
申请日：2002-02-19
申请人： EBARA CORP
发明人： WAKABAYASHI SATOSHI , TORII HIROOMI , KOGA DAISUKE
IPC分类号： B25J9/06 , B24B37/04 , B25J15/08 , B65G49/07 , H01L21/304 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a polishing device for equalizing polishing profiles of polishing object after polishing, even when there is a different between polishing performances of a top ring. SOLUTION: The polishing device has three or more polishing tables having a polishing surface and top rings for pressing a wafer W on the polishing surfaces of the polishing tables. The same number of top rings 120, 220 and 320 as the number of polishing tables 110, 210 and 310 are disposed corresponding to the polishing tables 110, 210, and 310. COPYRIGHT: (C)2003,JPO

5. 发明专利

JP2003094322A POLISHING DEVICE 审中-公开
公开(公告)号：JP2003094322A
公开(公告)日：2003-04-03
申请号：JP2001283364
申请日：2001-09-18
申请人： EBARA CORP
发明人： KOGA DAISUKE , TORII HIROOMI , ISOBE SOICHI , AIZAWA HIDEO
IPC分类号： B24B37/04 , B24B37/30 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing device capable of effectively suppressing the vibration of a top ring and flatly and uniformly polishing the polishing surface of a polishing object in the high-load polishing without increasing the weight for reducing the vibration produced in the polishing and increasing the rigidity of respective parts contributing to suppressing the vibration of the polishing device. SOLUTION: This polishing device is provided with the top ring retaining the polishing object, allows the polishing object retained by the top ring to abut on the polishing surface, and polishes the polishing object by the relative movement between the polishing object and the polishing surface. The top ring 5 is provided with a tilting mechanism 4 tilting to the polishing surface and the tilting mechanism 4 is provided with a vibration absorbing mechanism 40 absorbing the vibration produced in the top ring 5 during the polishing of the polishing object W.

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