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1. 发明专利

JP2011171647A Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：JP2011171647A
公开(公告)日：2011-09-01
申请号：JP2010036114
申请日：2010-02-22
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： NAKANISHI MASAYUKI , TOGAWA TETSUJI , ITO KENYA , SEKI MASAYA , IWADE KENJI , KUBOTA TAKEO
IPC分类号： H01L21/304
CPC分类号： H01L21/02038 , B24B9/065 , B24B21/002 , B24B37/042 , H01L21/02087 , H01L21/304 , H01L21/76256
摘要： PROBLEM TO BE SOLVED: To efficiently polish an outer periphery of a silicon substrate by using a polishing tape under polishing conditions respectively suited to a deposition film and silicon arranged under the deposition film.
SOLUTION: While rotating a device substrate 14 configured by depositing a deposition film on the surface of silicon at a first rotation speed, a first polishing tape 34 is pressed to the outer periphery of the device substrate 14 to remove the deposition film 12 located on the outer periphery of the device substrate 14, and while rotating the device substrate 14 at a second rotational speed, a second polishing tape 52 is pressed to the silicon 10 located on the outer periphery of the device substrate 14 exposed by removing the deposition film 12 to grind the silicon 10 up to predetermined depth.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：通过在分别适合沉积膜和布置在沉积膜下方的硅的研磨条件下使用研磨带来有效地抛光硅衬底的外周。解决方案：在通过以第一转速将沉积膜沉积在硅表面上而构成的器件衬底14的同时，将第一研磨带34按压到器件衬底14的外周，以去除沉积膜12 位于器件基板14的外周上，并且在以第二转速旋转器件基板14的同时，将第二研磨带52压在位于器件基板14的外周上的硅10上，通过去除沉积薄膜12将硅10研磨至预定深度。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2006187863A Substrate polishing device 审中-公开
标题翻译：基板抛光装置
公开(公告)号：JP2006187863A
公开(公告)日：2006-07-20
申请号：JP2006064395
申请日：2006-03-09
申请人： Ebara Corp , 株式会社荏原製作所
发明人： ITO KENYA , AIZAWA HIDEO
IPC分类号： B24B37/00 , B24B37/07 , B24B37/12 , B24B47/12 , B24B57/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate polishing device of a compact constitution occupying a reduced area and capable of being stably operated with suppressing vibration of a drive shaft. SOLUTION: The substrate polishing device is equipped with a polishing table 48 having a polishing plate 50 and the drive shaft 68 connected eccentrically with the polishing table 48 and causing the polishing table 48 to make translational and circular motion integrally with the polishing plate 50. The size of the polishing table 48 is designed to be almost equal to the substrate to be polished, and a plurality of polishing liquid jetting holes 50a communicating with a space 78 formed between the polishing plate 50 and the polishing table 48 are formed inside the polishing plate 50. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种占据减小面积并且能够在抑制驱动轴的振动的情况下稳定操作的致密构造的基板研磨装置。解决方案：衬底抛光装置配备有抛光台48，抛光台48具有抛光板50和与抛光台48偏心连接的驱动轴68，并使抛光台48与抛光板一体地进行平移和圆周运动抛光台48的尺寸被设计成几乎等于要抛光的基板，并且在内部形成有与在抛光板50和抛光台48之间形成的空间78连通的多个抛光液体喷射孔50a 抛光板50.版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2006066891A Substrate processing method and substrate processing apparatus 审中-公开
标题翻译：基板加工方法和基板加工装置
公开(公告)号：JP2006066891A
公开(公告)日：2006-03-09
申请号：JP2005200309
申请日：2005-07-08
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： SHIGETA ATSUSHI , TOYODA GEN , YANO HIROYUKI , OISHI KUNIO , ITO KENYA , NAKANISHI MASAYUKI , YAMAGUCHI KENJI
IPC分类号： H01L21/304 , B24B9/00 , B24B37/013 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To allow the peripheral portion of a semiconductor substrate to be polished by an appropriate amount without causing a lack of polishing or excessive polishing. SOLUTION: A substrate processing method is used to polish the peripheral portion of a semiconductor substrate 13. The substrate processing method comprises: a process of bringing the polishing surface of a polishing mechanism 20 into contact with the principal surface of the peripheral portion of the substrate 13, and pressing the polishing surface against the principal surface; a process of polishing the principal surface by rotating the substrate 13 with a motor 12, and detecting the polishing end point of the principal surface by monitoring the polished state of the principal surface; a process of stopping polishing of the principal surface when the polishing end point is detected, and determining the polishing time for a surface other than the principal surface, which is to be polished subsequently, on the basis of the polishing time for the principal surface which is determined when polishing is finished; and a process of polishing the surface for the determined polishing time. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了允许半导体衬底的周边部分被适当地抛光，而不会导致抛光不足或过度抛光。解决方案：使用基板处理方法来抛光半导体基板13的周边部分。基板处理方法包括：使抛光机构20的抛光表面与周边部分的主表面接触的过程并且将抛光表面压靠在主表面上; 通过用马达12旋转基板13来研磨主表面的过程，并且通过监测主表面的抛光状态来检测主表面的抛光终点; 在检测到研磨终点时停止主表面的研磨的处理，以及随后要研磨的主面以外的表面的研磨时间，基于主面的研磨时间抛光结束后确定; 以及抛光表面以确定抛光时间的过程。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2004273852A Substrate processing apparatus 审中-公开
公开(公告)号：JP2004273852A
公开(公告)日：2004-09-30
申请号：JP2003064051
申请日：2003-03-10
申请人： Ebara Corp , 株式会社荏原製作所
发明人： HONGO AKIHISA , ITO KENYA
IPC分类号： C23F1/08 , H01L21/306
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which comparatively easily manages treating liquid such as etching liquid, and much more enhances the uniformity of processing such as etching.
SOLUTION: The substrate processing apparatus includes: a substrate holder 10 for supporting and turning a substrate W; a freely turnable turning plate 30 located while facing the front side of the rear side of the substrate W supported by the substrate holder 10 apart by a prescribed interval; and a first liquid supply unit 34a for supplying a first treatment liquid Q between the turning plate 30 and the substrate W supported by the substrate holder 10.
COPYRIGHT: (C)2004,JPO&NCIPI

5. 发明专利

JP2004055927A Apparatus and method for processing substrate 有权
公开(公告)号：JP2004055927A
公开(公告)日：2004-02-19
申请号：JP2002213078
申请日：2002-07-22
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SAITO TAKAYUKI , SUZUKI TSUKURU , YAMADA KAORU , ITO KENYA , KAMEZAWA MASAYUKI , YAMAGUCHI KENJI
IPC分类号： H01L21/306 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and a method for processing a substrate which can supply a treating liquid to the substrate, without scattering the liquid, can thereby maintain a clean atmosphere in a chamber and can reduce the amount of the liquid used.
SOLUTION: The apparatus for processing a substrate includes a rotating holding unit 11 for making the substrate W rotate, while holding the substrate W substantially horizontally, and a treatment liquid supply unit 15 provided at a peripheral edge of the rotating substrate W for supplying the liquid to the substrate W so that the liquid stands still to the substrate W.
COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2003159619A METHOD AND APPARATUS FOR ASSEMBLING SOFT HOLLOW CYLINDRICAL MEMBER AND SUPPORTING SHAFT 审中-公开
公开(公告)号：JP2003159619A
公开(公告)日：2003-06-03
申请号：JP2001359452
申请日：2001-11-26
申请人： EBARA CORP
发明人： TATEISHI HIDEKI , ITO KENYA , KAMEZAWA MASAYUKI , HAMADA TOSHIMI
IPC分类号： B08B1/00 , B23P19/02 , B23P21/00
摘要： PROBLEM TO BE SOLVED: To provide a method and apparatus for assembling a soft hollow cylindrical member and a supporting shaft, which is capable of suppressing deformation of the surface of the soft hollow cylindrical member, reducing the number of times the surface is touched, and shortening the assembly time by fixing the soft hollow cylindrical member to the outer peripheral portion of the supporting shaft by inserting the supporting shaft into the hollow portion of the soft hollow cylindrical member, the surface of the supporting shaft being treated so as not to be slippery. SOLUTION: In the apparatus for assembling the soft hollow cylindrical member (a sponge roll 2) and the supporting shaft 3 for fixing the soft hollow cylindrical member to the outer peripheral surface portion of the supporting shaft 3 by inserting the supporting shaft 3 into the hollow portion 2a of the soft hollow cylindrical member, the apparatus is provided with guide clamps 20 for gripping the end portions of insertion guides 4, 4 inserted into the hollow portion 2a of the soft hollow cylindrical member for guiding the supporting shaft 3 to be inserted into the hollow portion 2a of the soft hollow cylindrical member, a pusher 30 for inserting the supporting shaft 3 along the insertion guides 4, 4 into the hollow portion 2a of the soft hollow cylindrical member, and a roll clamp 40 for suppressing deformation of the surface of the soft hollow cylindrical member into which the supporting shaft 3 is inserted and further for fixing the soft hollow cylindrical member. COPYRIGHT: (C)2003,JPO

7. 发明专利

JP2002280344A SUBSTRATE PROCESSOR 失效
公开(公告)号：JP2002280344A
公开(公告)日：2002-09-27
申请号：JP2001075665
申请日：2001-03-16
申请人： EBARA CORP
发明人： ITO KENYA , INOUE KATSUTAKA
IPC分类号： B08B1/04 , B08B3/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate processor capable of simultaneously performing a processing, such as scrub washing to the front surface and back surface of a substrate without damaging the circuits formed on the substrate. SOLUTION: This substrate processor is provided with a rotation support body 7 for supporting and rotating a disk-like substrate W having the front surface Wa and the back surface Wb, a first roll 1 which is in slidable contact with the front surface Wa, while being rotated around a first rotary axis Ax1 and a second roll 2 to be in slidable contact with the back surface Wb, and while being rotated around a second rotary axis Ax2 provided facing the first roll 1, so as to hold the substrate W therebetween, for which the second rotary axis Ax2 is almost parallel to the first rotary axis Ax1. At least one of the first roll 1 and the second roll 2 is constituted, so as to make the length in the direction of the rotary axis Ax1 or Ax2 of the roll at a part, to be in slidable contact cover only the outer peripheral part of the substrate W.

8. 发明专利

JP2002016035A CLEANING APPARATUS AND METHOD 失效
公开(公告)号：JP2002016035A
公开(公告)日：2002-01-18
申请号：JP2000197233
申请日：2000-06-29
申请人： TOSHIBA CORP , EBARA CORP
发明人： TOMITA HIROSHI , SATO MOTOYUKI , NADAHARA SOICHI , SHIRAKASHI MICHIHIKO , ITO KENYA
IPC分类号： B01F3/04 , B01F5/04 , B08B1/00 , B08B1/04 , B08B3/02 , B08B3/08 , B08B7/04 , H01L21/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a single-wafer type cleaning method for cleaning a wafer with a recess on the surface effectively, without increasing cost, even if an ammonia solution which includes ozone is used. SOLUTION: An ozone gas and an ammonia solution are fed to a position directly above a wafer 7 having the recess on the surface to generate a gas dissolved solution, in which the ozone gas is dissolved in the ammonia solution. Then, the wafer is subjected to physical cleaning in a contact or non-contact manner by using the gas dissolved solution.

9. 发明专利

JPH11138436A WASHING DEVICE FOR WASHING TOOL AND WASHING DEVICE FOR OBJECT TO BE PROCESSED 失效
公开(公告)号：JPH11138436A
公开(公告)日：1999-05-25
申请号：JP33099397
申请日：1997-11-13
申请人： EBARA CORP
发明人： MATSUDA NAOKI , ITO KENYA
IPC分类号： B24B55/12 , B08B3/04 , H01L21/00
摘要： PROBLEM TO BE SOLVED: To provide a washing device for a washing tool and a washing device for an object to be processed, having the washing effect not to be decreased caused by sticking of solid matters removed by washing to a sponge part of the washing tool. SOLUTION: A washing device for a pen-type sponge washing tool for washing an object to be processed while supplying washing liquid onto the surface of the object to be processed is provided with a first tank 11 and a second tank 12. A drain port 14 is provided on the bottom of the first tank 11 so that washing liquid may be allowed to flow from a washing nozzle 13 to the inner wall surface of the first tank 11 without staying it, and a drain port 15 is provided on the bottom of the second tank 12 so that washing liquid in the first tank 11 may be allowed to overflow into the second tank 12 when the pen-type sponge washing tool is washed while being lowered and inserted into the first tank 11.

10. 发明专利

JPH10291151A PROCESSING DEVICE FOR BASE PLATE 失效
公开(公告)号：JPH10291151A
公开(公告)日：1998-11-04
申请号：JP11753697
申请日：1997-04-21
申请人： EBARA CORP
发明人： ITO KENYA , AIZAWA HIDEO
IPC分类号： B24B37/07 , B24B37/10 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To reduce a size of a tool, disc by installing a driving part for the translation circular motion of the tool disc in an almost horizontal plane. SOLUTION: A top ring 52 as a pressing means which adsorbs and holds a base on an upper face thereof, and presses the base to an abrasive disc 36 with a specific pressure, is installed at a lower part of a tool disc 20. A shaft 54 is risen while rotated, in a condition that the base is held on the upper face of the top ring 52, while simultaneously giving the integral translation circular motion to the tool disc 20 and the abrasive disc 36 by the rotation of a driving shaft 28 in accompany with the driving of a motor 10, whereby the upper face of the base is abraded. The polishing liquid is supplied to the face to be abraded from a polishing liquid exhaust nozzle 36a of the abrasive plate 36. The polishing liquid is supplied by the supply pressure of a supply device from a supply source thereof.

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