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1. 发明专利

JP2000000539A SUBSTRATE CLEANING DEVICE 失效
公开(公告)号：JP2000000539A
公开(公告)日：2000-01-07
申请号：JP17089198
申请日：1998-06-18
申请人： EBARA CORP , TOSHIBA CORP
发明人： TAKEUCHI NORIYUKI , MIYASHITA MITSUO , SHIGETA KENICHI , WATANABE TAKESHI
IPC分类号： B08B11/02 , B08B3/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate cleaning device provided with the stabilized mechanical performance and high cleaning performance. SOLUTION: In a substrate cleaning device in which a substrate surface to be treated is cleaned by bringing a cleaning member into contact with the base surface to be treated and driving the cleaning member automatically, a plurality of rotors 3 bringing the cleaning member into contact with a substrate treated such s a semiconductor wafer are provided, and core materials 31 of the rotors are formed on a resin material, and the core materials 31 are coated with a rubber material 32. A rotating track channel 33 on which the outer periphery of the substrate to be treated is brought into contact with the outer surface of the coating of the rubber material 32 is formed.

2. 发明专利

JPH10286761A POLISHING DEVICE FOR SUBSTRATE 失效
公开(公告)号：JPH10286761A
公开(公告)日：1998-10-27
申请号：JP11015097
申请日：1997-04-11
申请人： EBARA CORP , TOSHIBA CORP
发明人： ITO KENYA , AIZAWA HIDEO , YAJIMA HIROMI , SHIGETA KENICHI , TATEYAMA YOSHIKUNI
IPC分类号： B23Q37/00 , B24B37/00 , B24B41/02
摘要： PROBLEM TO BE SOLVED: To form a polishing device compact to be installed in a narrow space, and improve convenience for transport and maintenance. SOLUTION: A first frame 10a on which a polishing table 16 having a polishing tool 48 on an upper surface is installed, and a second frame 10b on which a top ring device 12 having a rotatable top ring head 24 to hold a substrate while pressing a subject surface of the substrate to be polished to a polishing table 16 with a prescribed pressure is installed are composed as separate bodies. The first frame 10a and the second frame 10b are stacked on a base frame 10d in order to be assembled.

3. 发明专利

JP2000189907A OSCILLATION MECHANISM AND WASHING APPARATUS 失效
公开(公告)号：JP2000189907A
公开(公告)日：2000-07-11
申请号：JP37461998
申请日：1998-12-28
申请人： EBARA CORP , TOSHIBA CORP
发明人： OIKAWA FUMITOSHI , SHIGETA KENICHI , WATANABE TAKESHI
IPC分类号： B08B1/00 , B24B37/10 , H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To smoothly oscillate an oscillation arm with good accuracy by providing the above mechanism with an oscillation shaft mounted with an oscillation arm, a rotational drive source disposed with an output shaft in parallel to the oscillation shaft adjacently to the oscillation shaft and a link mechanism for transmitting the rotation of the output shaft to the oscillation arm. SOLUTION: When a step motor is driven by rotating a washing member 12, a motor shaft 26 oscillates and the oscillation thereof is transmitted via the link mechanism 30 and the oscillation shaft 16 to the oscillation arm 14, causing the washing member 12 to oscillate so as cross a semiconductor substrate in an approximately diametral direction to wash the substrate. The oscillation of the motor shaft 26 is transmitted via the link mechanism 30 to the oscillation shaft 16 in the washing apparatus. These shafts 16 and 26 and the drive link member 31 and the driven link member 34 or the link members 32 and 34 and a connecting link member 36 are so constituted as not to give rise to shaking therebetween and, therefore, the washing member 12 may be smoothly oscillated along the surface of the substrate with the good accuracy.

4. 发明专利

JPH10340870A POLISHING APPARATUS 失效
公开(公告)号：JPH10340870A
公开(公告)日：1998-12-22
申请号：JP16515297
申请日：1997-06-06
申请人： EBARA CORP , TOSHIBA CORP
发明人： AIZAWA HIDEO , ITO KENYA , YAJIMA HIROMI , SHIGETA KENICHI , TATEYAMA YOSHIKUNI
IPC分类号： H01L21/677 , H01L21/304 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide highly clean products by suppressing the increase of facilities and running costs, and preventing mutual pollution at each step. SOLUTION: In a polishing equipment providing polishing units 10a and 10b. For chemically and mechanically polishing the surface of materials to be polished, cleaning units 26a, 26b and 26c for cleaning the polished materials, and transfer units 20a and 20b for transferring the materials to be polished between the units 26a, 26b and 26c, a space housing each unit are partitioned according to the degree of cleanliness for constructing a plurality of chambers R1 to R4 , and a transfer gate 18, having temporary chambers 18a and 18b for temporarily storing the materials to be polished are provided between the chambers.

5. 发明专利

JP2001096455A POLISHING DEVICE 失效
公开(公告)号：JP2001096455A
公开(公告)日：2001-04-10
申请号：JP27425999
申请日：1999-09-28
申请人： EBARA CORP , TOSHIBA CORP
发明人： ONO KOJI , OGURI SHOZO , SASABE KENICHI , KURITA MASATO , KOJIMA YASUHISA , KEIGAWA TADANORI , SHIGETA KENICHI
IPC分类号： B24B37/00 , B24B37/04 , B24B37/30 , B24B49/10 , B24B49/16 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing device capable of restraining a polished substrate from being damaged because of being broken and/or jumping out by continuously controlling the polished substrate in its polishing process. SOLUTION: The device has a substrate holding fixture 4 capable of holding both a polishing tool 1 and a polished substrate W for pressing the polished surface of the polished substrate W against the polishing tool 1, and polishes the polished substrate W by relatively moving both the polishing tool 1 and the substrate holding fixture 4. The device is furnished with a sensor 10 set at the outer side of the substrate holding fixture 4 for measuring a distance to the surface of the polishing tool 1, and with a control means detecting any change in the measured distance up to the surface of the polishing tool 1 when the polished substrate W stands over the surface of the polishing tool 1 as abnormal polishing (including jumping out of the polished substrate W).

6. 发明专利

JP2000071166A POLISHING DEVICE AND METHOD 失效
公开(公告)号：JP2000071166A
公开(公告)日：2000-03-07
申请号：JP16990899
申请日：1999-06-16
申请人： EBARA CORP , TOSHIBA CORP
发明人： TOGAWA TETSUJI , TAKADA NOBUYUKI , KATSUOKA SEIJI , SHIGETA KENICHI
IPC分类号： B24B37/04 , B24B53/017 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a polishing device and a polishing method that prevent cracks in objects of polishing at overhanging and make no trace of scrapes on the polished surface of objects of polishing. SOLUTION: After a semiconductor wafer is polished with its entire surface put into contact with a polishing surface 5 within a turntable 20, a top ring moving/elevating mechanism 8 separates the semiconductor wafer from the polishing surface 5 by moving a top ring 3 horizontally to set the semiconductor wafer at least partly outside the polishing surface 5 before lifting the top ring 3. A dresser 10 is placed into contact with the polishing surface 5 to dress it to the outer circumference such that the internal polishing region and this outer circumference of the polishing surface 5 have no steps therebetween or become flush with each other.

7. 发明专利

JP2001198794A POLISHING DEVICE 失效
公开(公告)号：JP2001198794A
公开(公告)日：2001-07-24
申请号：JP2000012856
申请日：2000-01-21
申请人： EBARA CORP , TOSHIBA CORP
发明人： OGURI SHOZO , AIZAWA HIDEO , SHIGETA KENICHI , TATEYAMA YOSHIKUNI
IPC分类号： B24B49/18 , B24B49/12 , B24B53/00 , B24B53/007 , B24B53/017 , B24B53/02 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a polishing device capable of easily measuring the change in the state of a polishing face, properly determining the timing for dressing the polishing face and time for replacing the members constituting the polishing face and polishing the polishing face of a substrate in high quality. SOLUTION: In a polishing device provided with a top ring, a turn table 12 having a polishing face 12a and a dresser 11 regenerating the polishing face for polishing the polishing face with a workpiece to be polished intervening between the top ring and the polishing face 12a of the turn table 12 which are rotated independently of each other and capable of regenerating the polishing face 12a by means of a dresser 11 at specified timing, a nature measuring device provided with a sensor 13, etc., for observing the nature of the polishing face 12a of the turn table 12 is provided for regenerating the polishing face 12a by means of the dresser 11, an indicator 21 is provided for indicating the measuring result by observing the nature of the polishing face 12a by means of the nature measuring instrument in regenerating the polishing face 12a by means of the dresser 11.

8. 发明专利

JPH10175166A ABRASIVE LIQUID FEEDING DEVICE AND ABRASIVE LIQUID FEEDING METHOD 失效
公开(公告)号：JPH10175166A
公开(公告)日：1998-06-30
申请号：JP35306996
申请日：1996-12-13
申请人： EBARA CORP , TOSHIBA CORP
发明人： KAWASHIMA KIYOTAKA , SHIGETA KENICHI , IGUCHI KOJI
IPC分类号： B24B57/02 , G05D11/13 , G05D21/00
摘要： PROBLEM TO BE SOLVED: To provide an abrasive liquid feeding device and an abrasive liquid feeding method in which the device can be made in a small size, and at the same time, the exchanging frequency of an original liquid bottle can be reduced. SOLUTION: This device is provided with an original liquid feeding means 10 to feed the original liquid of an abrasive liquid used for polishing the surface of a polishing object; a diluent feeding means 20 to feed a diluent to dilute the original liquid; a regulating tub 30 to store an abrasive liquid made by mixing the original liquid fed form the original liquid feeding means 19, and the diluent fed from the diluent feeding means 20 to form a desired density, and at the same time, to feed the stored abrasive liquid to the polishing object. Between the original liquid feeding means 10 and the regulating tub 31, a measuring tub 41 to measure the amount of the original liquid and to feed it to the regulating tub 31 is provided. To the measuring tub 41, the diluent from the diluent feeding means 20 is also fed.

9. 发明专利

JP2002110598A CMP APPARATUS 失效
公开(公告)号：JP2002110598A
公开(公告)日：2002-04-12
申请号：JP2000292653
申请日：2000-09-26
申请人： TOSHIBA CORP
发明人： YAJIMA HIROMI , SHIGETA KENICHI
IPC分类号： B24B37/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide an apparatus which can hold a mix ratio of a polishing mixture solution always at a predetermined value, and can perform polishing operation with a good accuracy without using non-production wafer for confirmation of a processing rate to thereby improve a rate of operation in the apparatus and improve a productivity in a polishing step. SOLUTION: A processing solution dropping part, which has a plurality drop ports arranged dense from which a plurality of sorts of processing solutions are dropped on a platen, is formed at a tip end of a processing solution supply piping, so that the plurality of sorts of processing solutions drop from the drop ports into a platen rotation direction onto an upstream vicinity of a processing point of a wafer to be polished. Thereby since the processing solutions reach the processing point with a mixture ratio of the plurality of sorts of processing solutions held at a predetermined value, accurate polishing can be realized without using a non-production wafer for confirmation of a processing rate.

10. 发明专利

JP2001096457A POLISHING DEVICE AND ADJUSTING METHOD FOR POLISHING DEVICE 失效
公开(公告)号：JP2001096457A
公开(公告)日：2001-04-10
申请号：JP27526299
申请日：1999-09-28
申请人： TOSHIBA MICRO ELECTRONICS , TOSHIBA CORP
发明人： YAJIMA HIROMI , SHIGETA KENICHI , KOJIMA YASUHISA , IGUCHI KOJI
IPC分类号： B24B37/04 , B24B37/30 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing device and its adjusting method, capable of facilitating the replacement of a cushioning material layer when the polishing device is to be adjusted, and of being high in operating performance, and in yield in wafer manufacture without generating polishing scraps by boring holes in the cushioning material layer. SOLUTION: In this invention, the wafer supporting part of a polishing device is furnished with a flat plate part 5 having back pressure gas introducing holes 7 and 8 introducing back pressure gas into a wafer 4, and with a cushioning material layer 6, and it is characteristic that the back pressure gas introducing hole 8 provided for the cushioning material layer 6 is greater in cross sectional area than the back pressure gas introducing hole 7 provided for the flat plate part 5.

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