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    • 24. 发明专利
    • Semiconductor inspection method and semiconductor inspection equipment
    • 半导体检测方法和半导体检测设备
    • JP2006064421A
    • 2006-03-09
    • JP2004244546
    • 2004-08-25
    • Hitachi High-Technologies Corp株式会社日立ハイテクノロジーズ
    • MATSUI MIYAKO
    • G01B15/00G01B15/04H01L21/66
    • H01J37/28G01N2223/07G01N2223/414G01N2223/6116H01J2237/24578H01J2237/2611
    • PROBLEM TO BE SOLVED: To provide an inspection equipment and a method for displaying the 3-D structure by making inspection and quantitative evaluation of the part shaded to the incident electron rays or structure buried in the wafer by only observation from upside as a technology for inspecting a wafer halfway in the process for manufacturing semiconductor.
      SOLUTION: There are provided processes for: (40) acquiring scanning image by the signal generated secondarily by irradiating the surface of the wafer with an electron beam with energy arriving at the part not exposed to the electron beam while passing through a part of the surface of the wafer; (41) forming the 3-D model of the pattern; (44) detecting the edge position information of the pattern from the obtained secondary signal; (45) detecting the intensity of the signal; (46) computing the characteristics amount of the pattern to be inspected from the detected information; and (47) displaying the 3-D structure of the pattern by constructing the 3-D structure from the computed characteristics of the pattern. The 3-D structure is thereby evaluated.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 解决的问题:提供一种检查设备和显示三维结构的方法,通过仅通过从上方观察来对被埋入晶片的入射电子束或结构遮蔽的部分进行检查和定量评估 在半导体制造工艺中半途检查晶片的技术。 解决方案:提供了以下处理:(40)通过用能量到达未暴露于电子束的部分的电子束照射晶片的表面来次级产生的信号来获取扫描图像,同时通过部件 的晶片表面; (41)形成图案的3-D模型; (44)从所获得的二次信号中检测图案的边缘位置信息; (45)检测信号的强度; (46)根据检测到的信息计算要检查的图案的特征量; 和(47)通过从所计算的图案的特征构造3-D结构来显示图案的3-D结构。 由此评估3-D结构。 版权所有(C)2006,JPO&NCIPI