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1. 发明授权

EP1983567B1 HOLLOW PACKAGE MADE OF RESIN, AND MANUFACTURING METHOD THEREFOR 有权
公开(公告)号：EP1983567B1
公开(公告)日：2018-08-15
申请号：EP07707681.8
申请日：2007-01-30
申请人： Mtex Matsumura Corporation
发明人： SUZUKI, Daisuke , KONDO, Masayuki
IPC分类号： H01L23/08 , H01L23/498 , H01L27/146 , H01L31/0203 , H04N5/225
CPC分类号： H01L31/0203 , H01L23/49861 , H01L27/14618 , H01L2924/0002 , H04N5/2253 , H01L2924/00
摘要： The present invention provides a resinous hollow package that includes a moisture-proof island that is a planar structure disposed below a semiconductor element mounting surface of the resinous hollow package, the semiconductor element mounting surface having an area of 200 mm 2 or more and the maximum wave height of a wave curve of 35 µm or less. The resinous hollow package of the invention has an excellent moisture resistance due to the moisture-proof island included therein. Further, since the flatness of the semiconductor element mounting surface is excellent, decrease in the amount of light in a peripheral portion of an image can be suppressed in a digital single-lens reflex camera or the like with a large solid-state image sensor, even when a wide angle lens is used. According to the method of producing the resinous hollow package of the invention, by carrying out insert-molding while fixing the moisture-proof island with projection(s) disposed to the mold to prevent displacement thereof, the resinous hollow package having the maximum wave height of the semiconductor element mounting surface of 35 µm or less can be provided.

2. 发明公开

EP2645415A3 Lead frame, semiconductor device, and method for manufacturing lead frame 有权
标题翻译：引线框架，半导体装置以及制造引线框架的方法
公开(公告)号：EP2645415A3
公开(公告)日：2018-01-24
申请号：EP13160808.5
申请日：2013-03-25
申请人： Shinko Electric Industries Co., Ltd.
发明人： Kobayashi, Toshio , Shimizu, Hiroshi , Kimura, Yasuyuki , Kobayashi, Kazutaka , Okabe, Toshiyuki
IPC分类号： H01L23/495 , H01L21/48 , H01L33/62 , H01L23/00 , H01L23/36 , H01L33/64 , H01L23/498 , H01L25/065
CPC分类号： H01L23/49586 , H01L21/4828 , H01L23/36 , H01L23/49548 , H01L23/49568 , H01L23/49861 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L33/62 , H01L33/644 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/16238 , H01L2224/16245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48248 , H01L2224/4911 , H01L2924/00014 , H01L2924/12041 , H01L2924/181 , H01L2924/18301 , H01L2924/3025 , H01L2933/0066 , H01L2924/01079 , H01L2924/01047 , H01L2924/01029 , H01L2924/00 , H01L2924/00012 , H01L2924/207
摘要： A lead frame includes a plurality of leads (10) defined by an opening (11) extending in a thickness direction. An insulating resin layer (20) fills the opening to entirely cover side surfaces (10C) of each lead and to support the leads. A first surface (10A) of each lead is exposed from a first surface (20A) of the insulating resin layer (20).
摘要翻译：引线框架包括由在厚度方向上延伸的开口（11）限定的多个引线（10）。绝缘树脂层（20）填充开口以完全覆盖每个引线的侧表面（10C）并支撑引线。每个引线的第一表面（10A）从绝缘树脂层（20）的第一表面（20A）暴露。

3. 发明公开

EP3223308A1 HEAT DISSIPATION SUBSTRATE FOR MOUNTING ELECTRIC COMPONENT 审中-公开
标题翻译：用于安装电子元件的散热基板
公开(公告)号：EP3223308A1
公开(公告)日：2017-09-27
申请号：EP15861673.0
申请日：2015-11-20
申请人： NSK Ltd.
发明人： SHIMAKAWA Shigeru , SUNAGA Takashi , SEKINE Takaaki , KOGURE Teruyoshi , SUZUKI Ryoichi
IPC分类号： H01L23/36 , H01L23/12 , H01L23/48 , H01L23/50
CPC分类号： H01L23/49568 , B29C45/14065 , B29C2045/14122 , B62D5/0406 , G01R1/203 , H01L23/12 , H01L23/36 , H01L23/48 , H01L23/49524 , H01L23/49531 , H01L23/49537 , H01L23/49558 , H01L23/49861 , H01L23/50 , H01L24/34 , H01L24/37 , H01L25/071 , H01L28/20 , H01L2224/34 , H01L2224/37147 , H01L2224/37599 , H02K11/33 , H05K1/181 , H05K3/202 , H05K2201/09881 , H01L2924/00014 , H01L2924/00012
摘要： [Problem]
An object of the present invention is to provide an electronic part mounting heat-dissipating substrate which enables a circuit for which a power semiconductor in which a large current flows is used to reduce the wiring resistances of a large power operation and improve the heat dissipation.
[Means for Solving]
The present invention is an electronic part mounting heat-dissipating substrate which comprises: lead frames 110 of wiring pattern shapes on a conductor plate; and an insulating member 130 between the lead frames 110; wherein a plate surface of a part arrangement surface of the lead frames 110 and a top surface of the insulating member at a side of the part arrangement surface form one continuous surface, wherein the part arrangement surface is provided on both surfaces of the electronic part mounting heat-dissipating substrate, a reductant circuit which includes at least similar dual-system circuit is formed on the electronic part mounting heat-dissipating substrate, a first-system circuit of the dual-system circuit is formed on a first surface of the electronic part mounting heat-dissipating substrate, a second-system circuit of the dual-system circuit is formed on a second surface of the electronic part mounting heat-dissipating substrate, and the common lead frames which are commonly used in a portion of a circuit wiring are used to the first surface and the second surface of the electronic part mounting heat-dissipating substrate.
摘要翻译：发明内容本发明的目的在于提供一种电子部件安装用散热基板，该电子部件安装用散热基板能够使用流过大电流的功率半导体的电路来降低大功率动作的布线电阻，散热。用于解决问题的手段本发明是一种电子部件安装散热基板，其包括：导体板上的布线图案形状的引线框110; 以及引线框架110之间的绝缘构件130; 其中引线框架110的部分布置表面的板表面和部分布置表面侧的绝缘构件的顶表面形成一个连续表面，其中部件布置表面设置在电子部件安装件的两个表面上在所述电子部件安装散热基板上形成包括至少类似的双系统电路的还原电路，所述双系统电路的第一系统电路形成在所述电子部件的第一表面上安装散热基板时，双系统电路的第二系统电路形成在电子部件安装散热基板的第二表面上，并且共同用于电路布线的一部分的公共引线框架是用于电子部件安装散热基板的第一表面和第二表面。

4. 发明公开

EP3223307A1 HEAT DISSIPATION SUBSTRATE FOR MOUNTING ELECTRIC COMPONENT 审中-公开
标题翻译：用于安装电子元件的散热基板
公开(公告)号：EP3223307A1
公开(公告)日：2017-09-27
申请号：EP15861086.5
申请日：2015-11-20
申请人： NSK Ltd.
发明人： SHIMAKAWA Shigeru , SUNAGA Takashi , SEKINE Takaaki , KOGURE Teruyoshi , SUZUKI Ryoichi
IPC分类号： H01L23/36 , H01L23/12 , H01L23/48 , H01L23/50
CPC分类号： H01L23/49568 , B29C45/14 , B62D5/0403 , B62D5/0406 , B62D5/0409 , G01R1/203 , H01C1/14 , H01L21/4821 , H01L21/565 , H01L23/12 , H01L23/36 , H01L23/48 , H01L23/49537 , H01L23/49541 , H01L23/49575 , H01L23/49589 , H01L23/49861 , H01L23/50 , H01L24/37 , H01L24/40 , H01L25/072 , H01L2224/37124 , H01L2224/37147 , H01L2224/37599 , H01L2224/40 , H01L2224/40245 , H01L2924/0002 , H01L2924/18301 , H02K11/33 , H05K7/2089 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： [Problem]
An object of the present invention is to provide an electronic part mounting heat-dissipating substrate which enables a circuit for which a power semiconductor in which a large current flows is used to reduce the wiring resistances of a large power operation and improve the heat dissipation.
[Means for Solving]
The present invention is an electronic part mounting heat-dissipating substrate which comprises lead frames of wiring pattern shapes formed by conductor plate and an insulating member 130 which is provided between the lead frames 110, wherein a plate surface of a part arrangement surface of said conductor plate and a top surface of said insulating member at a side of said part arrangement surface form one continuous surface, the lead frames have different thicknesses, the thick lead frame 110H is used for a large current signal and the thin lead frame 110L is used for a small current signal, a plate surface of a back surface of the part arrangement surface and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane.
摘要翻译：发明内容本发明的目的在于提供一种电子部件安装用散热基板，该电子部件安装用散热基板能够使用流过大电流的功率半导体的电路来降低大功率动作的布线电阻，散热。用于解决问题的手段本发明是一种电子部件安装散热基板，其包括由导体板形成的布线图案形状的引线框架和设置在引线框架110之间的绝缘构件130，其中，部件的板表面所述导体板的布置表面和所述部分布置表面一侧的所述绝缘构件的顶表面形成一个连续表面，所述引线框架具有不同的厚度，所述厚引线框架110H用于大电流信号，并且所述细引线框110L用于小电流信号，部件配置面的背面的板面与部件配置面侧的背面侧的绝缘部件的顶面在同一平面上形成。

5. 发明公开

EP3100302A1 HIGH-TEMPERATURE CYCLING BGA PACKAGING 审中-公开
标题翻译： TEMPERATURWECHSELBELASTUNG VON BGA-VERPACKUNG
公开(公告)号：EP3100302A1
公开(公告)日：2016-12-07
申请号：EP14889592.3
申请日：2014-04-18
申请人： Halliburton Energy Services, Inc.
发明人： BONDARENKO, Oleg
IPC分类号： H01L23/48 , H01L23/34
CPC分类号： H01L23/49838 , H01L23/32 , H01L23/49805 , H01L23/49811 , H01L23/49816 , H01L23/49833 , H01L23/49861 , H01L24/17 , H01L24/81 , H01L2224/16055 , H01L2224/16057 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/81191 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K1/141 , H05K1/181 , H05K3/3426 , H05K3/3436 , H05K2201/049 , H05K2201/10015 , H05K2201/10734 , H01L2924/00014 , H01L2924/00012
摘要： An example method for attaching a ball grid array chip to a circuit board includes providing an adapter for attaching a chip with a plurality of solder balls to a circuit board, the adapter having an adapter substrate made from a material having substantially the same coefficient of thermal expansion as the substrate used in the chip and having at least one electrical contact site on a mounting surface of the adapter substrate for engaging a solder ball on the ball grid array chip and a plurality of lead wires extending from each side of the adapter substrate. At least one of the lead wires is electrically connected to at least one electrical contact site on the adapter substrate.
摘要翻译：用于将球栅阵列芯片附接到电路板的示例性方法包括提供用于将具有多个焊球的芯片附接到电路板的适配器，所述适配器具有由具有基本上相同的热系数的材料制成的适配器基板膨胀作为在芯片中使用的衬底，并且在适配器衬底的安装表面上具有至少一个电接触部位，用于接合球栅阵列芯片上的焊球和从适配器衬底的每一侧延伸的多根引线。导线中的至少一个电连接到适配器基板上的至少一个电接触部位。

6. 发明授权

EP2784808B1 RESIN FOR ELECTRICAL COMPONENTS, SEMICONDUCTOR DEVICE, AND WIRING BOARD 失效转让
标题翻译：电子元件用树脂，半导体器件和接线板
公开(公告)号：EP2784808B1
公开(公告)日：2016-07-06
申请号：EP12851940.2
申请日：2012-10-18
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： MINAMIO, Masanori , IKEUCHI, Hiroki
IPC分类号： H01L23/29 , H01L23/31 , H05K1/03 , H05K3/46 , H01L23/498 , H01L23/427 , H01L23/433 , H01L23/495 , H05K1/02 , H05K3/28 , H01L23/00 , H05K1/18
CPC分类号： H05K1/0306 , H01L23/295 , H01L23/3107 , H01L23/4275 , H01L23/4334 , H01L23/49537 , H01L23/49575 , H01L23/49822 , H01L23/49861 , H01L23/49894 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/48137 , H01L2224/48247 , H01L2224/4903 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/3025 , H05K1/0201 , H05K1/0203 , H05K1/0209 , H05K1/0224 , H05K1/0256 , H05K1/0373 , H05K1/186 , H05K3/284 , H05K3/285 , H05K3/4676 , H05K2201/0227 , H05K2201/0376 , H05K2201/0723 , H05K2201/1056 , H05K2201/10969 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device is a resin package structure including a semiconductor element T1 molded with a first resin 6. The first resin 6 contains a filler 7 including an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect of the filler 7 achieves a structure with satisfactory heat dissipation and a high withstand voltage.

7. 发明公开

EP2892074A4 POWER MODULE SUBSTRATE AND POWER MODULE 失效
标题翻译： STROMMODULSUBSTRAT UND STRMMODUL
公开(公告)号：EP2892074A4
公开(公告)日：2016-04-13
申请号：EP13833834
申请日：2013-06-27
申请人： MITSUBISHI MATERIALS CORP
发明人： OI SOTARO
IPC分类号： H01L23/12 , H01L23/36 , H01L23/373 , H01L23/433 , H01L23/498 , H05K1/02 , H05K1/03 , H05K1/09 , H05K1/11 , H05K1/18
CPC分类号： H05K1/0203 , H01L23/3735 , H01L23/4334 , H01L23/49811 , H01L23/49861 , H01L2924/0002 , H05K1/0271 , H05K1/0298 , H05K1/0306 , H05K1/09 , H05K1/115 , H05K1/181 , H05K2201/017 , H01L2924/00
摘要： To provide a power-module substrate having a multi-layered structure which can meet higher integration by improving a performance of a power-cycle and a performance of a heat cycle: a plurality of circuit-layer metal-plates 4A to 4E, 5A, and 5B made of copper or copper alloy are bonded in a layered state intermediating a first ceramic substrate 2; a metal member 12 connecting both the circuit-layer metal-plates disposed on both surfaces of the first ceramic substrate 2 is inserted into a through hole 11 formed in the first ceramic substrate 2; a second ceramic substrate 3 is bonded on a surface of one side of the circuit-layer metal-plates 4A to 4E, 5A and 5B in the layered state; and a heat-radiation-layer metal-plate 6 made of aluminum or aluminum alloy is bonded on a surface of the second ceramic substrate 3 counter to the circuit-layer metal-plates 4A to 4E, 5A, and 5B.
摘要翻译：提供具有多层结构的功率模块基板，其可以通过改善功率循环的性能和加热循环的性能来满足更高的集成度：多个电路层金属板4A至4E，5A，由铜或铜合金制成的5B以中间化第一陶瓷基板2的层状结合; 将设置在第一陶瓷基板2的两面的电路层金属板连接的金属部件12插入到形成在第一陶瓷基板2中的通孔11中; 第二陶瓷基板3以层叠的状态接合在电路层金属板4A〜4E，5A和5B的一侧的表面上; 并且在第二陶瓷基板3的与电路层金属板4A〜4E，5A，5B相对的表面上接合由铝或铝合金制成的散热层金属板6。

9. 发明公开

EP2997596A1 HIGH PERFORMANCE POWER MODULE 有权
标题翻译：高性能电源模块
公开(公告)号：EP2997596A1
公开(公告)日：2016-03-23
申请号：EP14730035.4
申请日：2014-05-14
申请人： Cree, Inc.
发明人： DAS, Mrinal, K. , CALLANAN, Robert, J. , LIN, Henry , PALMOUR, John, Williams
IPC分类号： H01L27/06 , H01L21/82 , H01L21/8252 , H01L29/739 , H01L29/778 , H01L29/78 , H01L29/06
CPC分类号： H01L27/0605 , H01L21/8213 , H01L21/8252 , H01L23/49861 , H01L25/072 , H01L25/18 , H01L27/0629 , H01L27/095 , H01L29/0696 , H01L29/1095 , H01L29/1608 , H01L29/41741 , H01L29/66068 , H01L29/7395 , H01L29/7802 , H01L2224/48137 , H01L2224/48139 , H01L2224/49111 , H01L2924/13055 , H01L2924/19107 , H02M7/003 , H01L2924/00
摘要： The present disclosure relates to a power module that has a housing with an interior chamber and a plurality of switch modules interconnected to facilitate switching power to a load. Each of the plurality of switch modules comprises at least one transistor and at least one diode mounted within the interior chamber and both the at least one transistor and the at least one diode are majority carrier devices, are formed of a wide bandgap material system, or both. The switching modules may be arranged in virtually any fashion depending on the application. For example, the switching modules may be arranged in a six-pack, full H-bridge, half H-bridge, single switch or the like.

10. 发明公开

EP2988328A1 Power semiconductor module and method of manufacturing there same 有权转让
标题翻译： Leistungshalbleitermodul und Verfahren zur Herstellung davon
公开(公告)号：EP2988328A1
公开(公告)日：2016-02-24
申请号：EP14181407.9
申请日：2014-08-19
申请人： ABB Technology Oy
发明人： Liu, Chunlei , Cottet, Didier , Brem, Franziska , Kicin, Slavo
IPC分类号： H01L23/14 , H01L23/492 , H01L23/538
CPC分类号： H01L23/49861 , H01L21/4821 , H01L21/4846 , H01L23/142 , H01L23/3675 , H01L23/492 , H01L23/49537 , H01L23/49562 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/071 , H01L25/18 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2224/24137 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/8384 , H01L2224/92244 , H01L2924/13055 , H01L2924/13091 , H01L2924/15153 , H01L2924/00
摘要： The present disclosure describes a power electronics module comprising a lead frame in which a chip of a first semiconductor device is embedded, a first PCB mounted on top of the lead frame and the chip of the first semiconductor device, and a support frame mounted on top of the PCB, the support frame comprising a cavity in which the chip of a second semiconductor device is embedded, wherein the chips of the first semiconductor device and the second semiconductor device are positioned on top of each other, and the first PCB comprises a first electrically conducting path between the chips of the first semiconductor device and the second semiconductor device.
摘要翻译：本公开描述了一种电力电子模块，其包括引线框架，其中嵌入有第一半导体器件的芯片，安装在引线框架的顶部上的第一PCB和第一半导体器件的芯片，以及安装在顶部的支撑框架所述支撑框架包括其中嵌入有第二半导体器件的芯片的空腔，其中所述第一半导体器件和所述第二半导体器件的芯片位于彼此的顶部，并且所述第一PCB包括第一第一半导体器件的芯片与第二半导体器件之间的导电路径。

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