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1. 发明公开

EP3242535A2 PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION 有权转让
公开(公告)号：EP3242535A2
公开(公告)日：2017-11-08
申请号：EP17172059.2
申请日：2012-03-05
申请人： MediaTek Inc.
发明人： CHEN, Nan-Jang
IPC分类号： H05K1/02 , H01P3/08
CPC分类号： H05K1/0219 , H01P3/08 , H05K1/0224 , H05K1/0298 , H05K2201/0715 , H05K2201/09236
摘要： A printed circuit board (PCB) is disclosed. The PCB (200) includes a substrate (202) have a top surface (202a) and a bottom surface (202b). A first conductive layer (203) is disposed on the top surface of the substrate. The first conductive layer comprises a first signal net (203a) and a second signal net (203b). An outermost insulating layer (204) is disposed on the top surface of the substrate to cover the substrate and the first conductive layer. The outmost insulating layer comprises an opening (209) to expose a portion of the second signal net. And, a second conductive layer (207) is disposed on the outermost insulating layer and substantially covering at least a portion of the first signal net. The second conductive layer is filled into the opening to electrically connect to the second signal net which is able to provide one of a ground potential and a power potential. The thickness of outermost insulating layer (204) is less than 1 mm.

2. 发明公开

EP3076426A1 ELECTRONIC COMPONENT STORING PACKAGE AND ELECTRONIC DEVICE 有权
标题翻译： AUFBEWAHRUNGSPACKUNGFÜREINE ELEKTRONISCHE KOMPONENTE UND ELEKTRONISCHE VORRICHTUNG
公开(公告)号：EP3076426A1
公开(公告)日：2016-10-05
申请号：EP14864242.4
申请日：2014-11-18
申请人： Kyocera Corporation
发明人： NIINO,Noritaka
IPC分类号： H01L23/02 , H01L23/08 , H03H9/02 , H03H9/25
CPC分类号： H01L23/053 , H01L21/50 , H01L23/057 , H01L23/08 , H01L23/10 , H01L41/053 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2924/16195 , H03H9/1014 , H03H9/1071 , H05K1/0218 , H05K1/0224 , H05K1/183 , H05K9/0024 , H05K9/0052 , H05K9/0071 , H05K9/0098 , H05K2201/0707 , H05K2201/09036 , H05K2201/10371 , H01L2924/00014
摘要： An electronic component housing package and the like capable of reducing time of infrared heating operation are provided. An electronic component housing package (10) includes an insulating substrate (1) including a plurality of insulating layers (11) stacked on top of each other, an upper surface of the insulating substrate (1) being provided with an electronic component (4) mounting section. The plurality of insulating layers (11) each containing a first metal oxide as a major constituent. The insulating substrate further includes a first metal layer (2) in frame-like form disposed on an upper surface of an uppermost one (11) of the plurality of insulating layers (11). The first metal layer (2) contains a second metal oxide which is higher in infrared absorptivity than the first metal oxide.
摘要翻译：提供能够减少红外线加热操作时间的电子部件外壳封装等。一种电子部件壳体封装（10），包括绝缘基板（1），绝缘基板（1）包括堆叠在彼此顶部的多个绝缘层（11），所述绝缘基板（1）的上表面设置有电子部件（4）安装部分。多个绝缘层（11）各自含有第一金属氧化物作为主要成分。所述绝缘基板还包括设置在所述多个绝缘层（11）的最上面（11）的上表面上的框状形式的第一金属层（2）。第一金属层（2）含有与第一金属氧化物相比红外线吸收率更高的第二金属氧化物。

3. 发明授权

EP2112871B1 Circuit board with improved ground layer 有权
标题翻译：印刷电路板具有提高的接地层
公开(公告)号：EP2112871B1
公开(公告)日：2016-07-13
申请号：EP08251484.5
申请日：2008-04-22
申请人： Hon Hai Precision Industry Co., Ltd.
发明人： Lin, Yu-Hsu , Wu, Jeng-Da , Chao, Chih-Hang
IPC分类号： H05K1/02
CPC分类号： H05K1/0253 , H05K1/0224 , H05K2201/09681

4. 发明授权

EP2726925B1 MULTICHANNEL RF FEEDTHROUGHS 有权
标题翻译：多通道RF馈线
公开(公告)号：EP2726925B1
公开(公告)日：2016-06-15
申请号：EP12803948.4
申请日：2012-06-27
申请人： Finisar Corporation
发明人： ZHAO, Yan Yang , HUEBNER, Bernd , DU, Tengda , LEE, Yuheng
IPC分类号： G02B6/38 , G02B6/46 , H05K1/02 , G02B6/42 , H05K1/11 , H05K1/14
CPC分类号： G02B6/4279 , G01J1/0425 , G02B6/4246 , G02B6/428 , G02B6/4292 , H05K1/0219 , H05K1/0224 , H05K1/0243 , H05K1/0274 , H05K1/0284 , H05K1/0298 , H05K1/115 , H05K1/117 , H05K1/147 , H05K2201/09227 , H05K2201/09409 , H05K2201/0949 , H05K2201/09618 , H05K2201/09672 , H05K2201/10121
摘要： Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.

5. 发明公开

EP2684431A4 PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION 审中-公开
标题翻译： ENTWURF EINERBESTÜCKTENLEITERPLATTEFÜREINE HOCHGESCHWINDIGKEITSANWENDUNG
公开(公告)号：EP2684431A4
公开(公告)日：2014-12-10
申请号：EP12755093
申请日：2012-03-05
申请人： MEDIATEK INC
发明人： CHEN NAN-JANG
IPC分类号： H05K1/02
CPC分类号： H05K1/0219 , H01P3/08 , H05K1/0224 , H05K1/0298 , H05K2201/0715 , H05K2201/09236
摘要： A printed circuit board (PCB) is disclosed. The PCB (200) includes a substrate (202) have a top surface (202a) and a bottom surface (202b). A first conductive layer (203) is disposed on the top surface of the substrate. The first conductive layer comprises a first signal net (203a) and a second signal net (203b). An outermost insulating layer (204) is disposed on the top surface of the substrate to cover the substrate and the first conductive layer. The outmost insulating layer comprises an opening (209) to expose a portion of the second signal net. And, a second conductive layer (207) is disposed on the outermost insulating layer and substantially covering at least a portion of the first signal net. The second conductive layer is filled into the opening to electrically connect to the second signal net which is able to provide one of a ground potential and a power potential. The thickness of outermost insulating layer (204) is less than 1 mm.
摘要翻译：公开了印刷电路板（PCB）。 PCB包括具有顶表面和底表面的基底。第一导电层设置在基板的顶表面上。第一导电层包括第一信号网和第二信号网。最外层绝缘层设置在基板的顶表面上以覆盖基板和第一导电层。最外层绝缘层包括露出第二信号网的一部分的开口。并且，第二导电层设置在最外绝缘层上并且基本覆盖第一信号网的至少一部分。第二导电层被填充到开口中以电连接到能够提供地电位和功率电位之一的第二信号网。

6. 发明公开

EP2784808A1 RESIN FOR ELECTRICAL COMPONENTS, SEMICONDUCTOR DEVICE, AND WIRING BOARD 失效转让
标题翻译： HARZFÜRELEKTRISCHE BAUELEMENTE，HALBLEITERVORRICHTUNG UND LEITERPLATTE
公开(公告)号：EP2784808A1
公开(公告)日：2014-10-01
申请号：EP12851940.2
申请日：2012-10-18
申请人： Panasonic Corporation
发明人： MINAMIO, Masanori , IKEUCHI, Hiroki
IPC分类号： H01L23/29 , H01L23/31 , H05K1/03 , H05K3/46
CPC分类号： H05K1/0306 , H01L23/295 , H01L23/3107 , H01L23/4275 , H01L23/4334 , H01L23/49537 , H01L23/49575 , H01L23/49822 , H01L23/49861 , H01L23/49894 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/48137 , H01L2224/48247 , H01L2224/4903 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/3025 , H05K1/0201 , H05K1/0203 , H05K1/0209 , H05K1/0224 , H05K1/0256 , H05K1/0373 , H05K1/186 , H05K3/284 , H05K3/285 , H05K3/4676 , H05K2201/0227 , H05K2201/0376 , H05K2201/0723 , H05K2201/1056 , H05K2201/10969 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device is a resin package structure including a semiconductor element T1 molded with a first resin 6. The first resin 6 contains a filler 7 including an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect of the filler 7 achieves a structure with satisfactory heat dissipation and a high withstand voltage.
摘要翻译：半导体器件是包括用第一树脂6模制的半导体元件T1的树脂封装结构。第一树脂6包含填充物7，该填料7包括用相变材料封装的电绝缘胶囊，其吸收周围的热量和相变以提高介电强度。填料7的效果达到了具有良好散热性和高耐压性的结构。

7. 发明公开

EP2512036A4 WIRELESS TERMINAL AND IMPLEMENTATION METHOD FOR REDUCING PEAK VALUE OF SPECIFIC ABSORPTION RATE (SAR) 有权
标题翻译：无线终端和实施用于减少SAR的峰值
公开(公告)号：EP2512036A4
公开(公告)日：2014-09-17
申请号：EP10849705
申请日：2010-07-19
申请人： ZTE CORP
发明人： ZHANG LU
IPC分类号： H04B1/40 , H04M1/02 , H05K1/02
CPC分类号： H05K1/02 , H05K1/0224 , H05K1/0298 , H05K3/00 , H05K2201/09145 , H05K2201/09354 , Y10T29/49124
摘要： The disclosure discloses a wireless terminal with a reduced Specific Absorption Rate (SAR) peak. The wireless terminal comprises a Printed Circuit Board (PCB), wherein a fractal gap is formed at an edge of a metal ground on the PCB to disturb distribution of induced current at the edge of the metal ground. The disclosure also discloses a method for reducing an SAR peak. On the premise of the non-influence on the communication quality of the wireless terminal, the SAR and the production cost can be reduced and the structure space of wireless terminal can be saved by using the wireless terminal and the method.

8. 发明公开

EP2388868A4 CONNECTOR AND CABLE ASSEMBLY 审中-公开
标题翻译：连接器和导线结构
公开(公告)号：EP2388868A4
公开(公告)日：2014-09-17
申请号：EP10731262
申请日：2010-01-14
申请人： FUJIKURA LTD
发明人： KOJIMA SHIGERU
IPC分类号： H01R13/658 , H01R9/05 , H01R24/00 , H01R12/24 , H01R24/02
CPC分类号： H01R12/598 , H01R12/61 , H01R12/62 , H01R13/6476 , H05K1/0224 , H05K1/0253 , H05K1/117 , H05K2201/09681

9. 发明公开

EP2716437A1 Verbundbauteil mit elektrischen Leitungen 审中-公开
公开(公告)号：EP2716437A1
公开(公告)日：2014-04-09
申请号：EP12187229.5
申请日：2012-10-04
申请人： Magna Steyr Fahrzeugtechnik AG & Co KG
发明人： Hofer, Bernhard
IPC分类号： B29C70/88
CPC分类号： H05K1/038 , B29C70/885 , H01B7/0861 , H01B7/0876 , H05K1/0224 , H05K1/0366 , H05K1/0393
摘要： Es wird ein Verbundbauteil aus Kunststoff- Faser- Verbundwerkstoff mit mindestens zwei Lagen aus faserverstärktem Material vorgeschlagen, wobei zwischen die mindestens zwei Lagen von faserverstärktem Material mindestens eine elektrische Leitung eingebracht ist.
摘要翻译：该复合部件具有以预设方式布置的两个纤维增强材料层（3）。电线（6）设置在两个纤维增强材料层之间，并连接到电气端子（7）。电线部分由金属线或电线（4）组成。金属线由相互扭曲和/或编织的单根线组成。

10. 发明公开

EP1747704A4 PRINTED WIRING BOARD, MANUFACTURING METHOD AND ELECTRONIC DEVICE 审中-公开
标题翻译：线路板，方法及电子设备
公开(公告)号：EP1747704A4
公开(公告)日：2011-10-12
申请号：EP05740730
申请日：2005-05-16
申请人： MEADVILLE ENTPR HK LTD
发明人： MANSIKKAMAEKI PAULIINA , PELTOLA TERO , LOISA JUULIA
IPC分类号： H05K1/02 , H05K20060101 , H05K1/00 , H05K1/18
CPC分类号： H05K3/284 , H05K1/0224 , H05K1/0253 , H05K1/0271 , H05K1/0284 , H05K1/0298 , H05K1/189 , H05K3/0014 , H05K2201/0129 , H05K2201/09336 , H05K2201/09681 , H05K2201/09781 , H05K2201/10598 , H05K2201/2009 , H05K2203/063 , H05K2203/1311 , H05K2203/1316 , H05K2203/1322 , H05K2203/302
摘要： A printed wiring board, an electronic device and a method for manufacturing a printed wiring board. A printed wiring board (1) comprises an insulating layer (2, 2a, 2b) and a circuit pattern (3, 3a, 3b) arranged on at least one surface of the insulating layer (2, 2a, 2b) and made of a conductive material. At least one surface of the insulating layer (2, 2a, 2b) is provided with a support pattern (6, 6a, 6b), which comprises material lines (7, 7a, 7b) arranged at a distance from each other.

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