专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP3309896A1 BALL-GRID-ARRAY RADIO-FREQUENCY INTEGRATED-CIRCUIT PRINTED-CIRCUIT-BOARD ASSEMBLY FOR AUTOMATED VEHICLES 审中-公开
标题翻译：用于自动化车辆的球栅阵列射频集成电路印制电路板组装
公开(公告)号：EP3309896A1
公开(公告)日：2018-04-18
申请号：EP17194590.0
申请日：2017-10-03
申请人： Delphi Technologies, Inc.
发明人： PURDEN, George, J , SHI, Shawn , ZIMMERMAN, David, W
IPC分类号： H01P3/12 , H01P5/107
CPC分类号： H01P5/08 , H01L23/49827 , H01L23/49838 , H01L23/66 , H01L24/16 , H01L2223/6616 , H01L2223/6627 , H01L2224/16227 , H01P3/10 , H01P3/121 , H01P5/107 , H05K1/0219 , H05K1/111 , H05K1/115
摘要： A ball-grid-array printed-circuit-board assembly includes a die, a plurality of solder-balls (20), a substrate (26), a top-metal layer (38), and a bottom-metal layer (44). The die includes a signal-out-pad and a plurality of ground-pads arranged about the signal-out-pad. The top-metal layer (38), a plurality of vias (28) in the substrate (26), and the bottom-metal layer (44) cooperate to form a substrate-integrated-waveguide (50). The top-metal layer (38) is configured to define a u-shaped-slot between a signal-portion of the top-metal layer (38) aligned with the signal-out-pad and the substrate-integrated-waveguide (50), and a ground-portion of the top-metal layer (38) aligned with the plurality of ground-pads. The u-shaped-slot is characterized by a slot-length that is selected based on the frequency of a signal, and a slot-width that is selected based on the via-height (36) such that the signal generates an electric field directed across the u-shaped-slot whereby the signal is propagated from the signal-portion of the top-metal layer (38) into the substrate-integrated-waveguide (50).
摘要翻译：球栅阵列印刷电路板组件包括管芯，多个焊球（20），基板（26），顶金属层（38）和底金属层（44）。管芯包括信号输出焊盘和布置在信号输出焊盘周围的多个接地焊盘。顶部金属层（38），衬底（26）中的多个通孔（28）和底部金属层（44）协作形成衬底集成波导（50）。顶部金属层（38）被配置为在与信号输出焊盘对齐的顶部金属层（38）的信号部分和衬底集成波导（50）之间限定U形槽，以及与多个接地焊盘对齐的顶部金属层（38）的接地部分。 u形槽的特征在于，根据信号的频率选择槽长度，并且基于通孔高度（36）选择槽宽度，使得信号产生被导向的电场穿过U形槽，由此信号从顶部金属层（38）的信号部分传播到衬底集成波导（50）中。

2. 发明公开

EP3178162A4 METHOD AND APPARATUS FOR FORMING BACKSIDE DIE PLANAR DEVICES AND SAW FILTER 审中-公开
公开(公告)号：EP3178162A4
公开(公告)日：2018-04-04
申请号：EP14899177
申请日：2014-08-07
申请人： INTEL CORP
发明人： GOLDMAN RICHARD J , LEE KEVIN J , SARASWAT RUCHIR , ZILLMANN UWE , COWLEY NICHOLAS P
IPC分类号： H03H7/00 , G06F1/16 , H01F27/28 , H01L21/77 , H01L23/00 , H01L23/48 , H01L23/522 , H01L23/525 , H01L23/552 , H01L23/66 , H03H7/42 , H03H9/64 , H04B1/00
CPC分类号： H01L24/09 , G06F1/16 , H01F27/2804 , H01L23/481 , H01L23/5226 , H01L23/5227 , H01L23/525 , H01L23/645 , H01L23/66 , H01L24/17 , H01L2223/6616 , H01L2223/6661 , H01L2223/6677 , H01L2224/0233 , H01L2224/0401 , H01L2224/16225 , H01L2924/0002 , H03H7/42 , H03H9/64 , H01L2924/00
摘要： Described is an apparatus which comprises: a backside of a first die having a redistribution layer (RDL); and one or more passive planar devices disposed on the backside, the one or more passive planar devices formed in the RDL.

3. 发明授权

EP3143846B1 TRANSMISSION LINE VIA STRUCTURE 有权
标题翻译：传输线通过结构
公开(公告)号：EP3143846B1
公开(公告)日：2018-03-14
申请号：EP15704621.0
申请日：2015-01-13
申请人： Xilinx, Inc.
发明人： MAHONEY, David M. , MARDI, Mohsen H.
IPC分类号： H05K1/02 , H01L21/768 , H01L23/66 , H05K1/11 , H05K3/40 , H05K3/42
CPC分类号： H01L23/66 , H01L21/76877 , H01L2223/6616 , H01L2223/6622 , H01L2924/0002 , H05K1/0222 , H05K1/0251 , H05K1/116 , H05K3/4046 , H05K3/424 , H05K2201/09809 , H05K2203/308 , H01L2924/00
摘要： In a transmission line via structure, a plurality of sub-structures are stacked in a via through the substrate along a longitudinal axis thereof. Each of the sub-structures includes a center conductor portion, an outer conductor portion, and at least one dielectric support member. The center conductor portion extends along the longitudinal axis. The outer conductor portion is disposed around the center conductor portion. The dielectric support member(s) separate the outer conductor portion and the center conductor portion and provide a non-solid volume between the outer conductor portion and the center conductor portion. Conductive paste is disposed between the center and outer conductor portions of successive ones of the plurality of sub-structures to form an outer conductor and a center conductor.

4. 发明公开

EP3178162A1 METHOD AND APPARATUS FOR FORMING BACKSIDE DIE PLANAR DEVICES AND SAW FILTER 审中-公开
标题翻译：方法和设备用于生产具有音量调节和SAW滤波器RÜCKSEITENMATRIZE
公开(公告)号：EP3178162A1
公开(公告)日：2017-06-14
申请号：EP14899177.1
申请日：2014-08-07
申请人： Intel Corporation
发明人： GOLDMAN, Richard J. , LEE, Kevin J. , SARASWAT, Ruchir , ZILLMANN, Uwe , COWLEY, Nicholas P.
IPC分类号： H03H7/00 , H04B1/00
CPC分类号： H01L24/09 , G06F1/16 , H01F27/2804 , H01L23/481 , H01L23/5226 , H01L23/5227 , H01L23/525 , H01L23/645 , H01L23/66 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/17 , H01L2223/6616 , H01L2223/6661 , H01L2223/6677 , H01L2224/0233 , H01L2224/02372 , H01L2224/02375 , H01L2224/02379 , H01L2224/0401 , H01L2224/05548 , H01L2224/16146 , H01L2224/16225 , H01L2224/17181 , H03H7/42 , H03H9/64
摘要： Described is an apparatus which comprises: a backside of a first die having a redistribution layer (RDL); and one or more passive planar devices disposed on the backside, the one or more passive planar devices formed in the RDL.
摘要翻译：所描述的是，它包括一个设备，包括：第一对具有再分布层（RDL）的的背面侧; 和设置在背面侧的一个或多个无源平面器件，所述一个或多个无源平面器件形成在RDL。

5. 发明公开

EP3080841A1 ANTENNA ON CERAMICS FOR A PACKAGED DIE 审中-公开
标题翻译：天安门广告KERAMIKFÜREINEN KOMPAKTEN CHIP
公开(公告)号：EP3080841A1
公开(公告)日：2016-10-19
申请号：EP13899094.0
申请日：2013-12-09
申请人： Intel Corporation
发明人： WOLTER, Andreas , MARUTHAMUTHU, Saravana , KNUDSEN, Mikael , MEYER, Thorsten , SEIDEMANN, Georg , HERRERO, Pablo , JAERVINEN, Pauli
IPC分类号： H01L23/66
CPC分类号： H01L23/66 , H01L21/4846 , H01L23/295 , H01L23/3128 , H01L23/481 , H01L23/49833 , H01L23/49838 , H01L23/552 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/20 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L2223/6616 , H01L2223/6677 , H01L2224/12105 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32225 , H01L2224/73253 , H01L2224/73267 , H01L2225/06517 , H01L2225/06548 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/1421 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01Q1/38 , H01Q1/50 , H01Q1/526 , H01L2924/00
摘要： An antenna is described on ceramics that may be used for a packaged die. In one example, a package has a die, a ceramic substrate over the die, an antenna attached to the ceramic substrate, and conductive leads electrically connecting the antenna to the die.
摘要翻译：在可用于封装模具的陶瓷上描述天线。在一个示例中，封装具有管芯，管芯上的陶瓷衬底，附着到陶瓷衬底的天线以及将天线电连接到管芯的导电引线。

6. 发明公开

EP2705532A4 RADIO- AND ELECTROMAGNETIC INTERFERENCE THROUGH-SILICON VIAS FOR STACKED-DIE PACKAGES, AND METHODS OF MAKING SAME 审中-公开
标题翻译：无线电和电磁干扰硅经文用于生产堆叠芯片封装和工艺
公开(公告)号：EP2705532A4
公开(公告)日：2015-03-11
申请号：EP12779644
申请日：2012-04-27
申请人： INTEL CORP
发明人： KAMGAING TELESPHOR , RAO VALLURI R
IPC分类号： H01L23/66 , H01L23/48 , H01L23/552 , H01L25/18 , H05K9/00
CPC分类号： H01L23/552 , H01L23/481 , H01L23/66 , H01L25/18 , H01L2223/6616 , H01L2223/6677 , H01L2224/16225 , H01L2225/06513 , H01L2225/06537 , H01L2225/06541 , H01L2924/15311
摘要： An apparatus includes a radio-frequency die with shielding through-silicon vias and a die backside lattice lid that shield a sector in the RF die from radio- and electromagnetic interference.

7. 发明授权

EP2451254B1 A radio frequency circuit board topology 有权
标题翻译：射频电路的PCB拓扑
公开(公告)号：EP2451254B1
公开(公告)日：2013-04-17
申请号：EP12151874.0
申请日：2005-02-24
申请人： BelAir Networks Inc.
发明人： Brunette, Gilbert P. , Johnson, Eric , Rayment, Stephen G. , Soul, Colin
IPC分类号： H05K1/02
CPC分类号： H05K1/0251 , H01L2223/6616 , H01L2223/6622 , H01L2223/6627 , H01L2924/1903 , H05K1/0222 , H05K3/429 , H05K2201/0715 , H05K2201/09618 , H05K2201/09718 , H05K2201/09809

8. 发明公开

EP2284888A2 Interposer, module and electronics device including the same 审中-公开
标题翻译：插件，模块和电动机Vorrichtung damit
公开(公告)号：EP2284888A2
公开(公告)日：2011-02-16
申请号：EP10008048.0
申请日：2010-08-02
申请人： Sony Corporation
发明人： Akiba, Akira , Mitarai, Shun , Ikeda, Koichi , Morita, Shinya
IPC分类号： H01L23/66 , H01Q1/38 , H01Q23/00 , H01Q1/22 , H01L23/498
CPC分类号： H01L23/66 , H01L23/13 , H01L23/147 , H01L23/645 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2223/6616 , H01L2223/6627 , H01L2223/6677 , H01L2224/0401 , H01L2224/05624 , H01L2224/05647 , H01L2224/16225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/49171 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/12034 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/1515 , H01L2924/15159 , H01L2924/15311 , H01L2924/1532 , H01L2924/157 , H01L2924/1903 , H01L2924/19041 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01Q1/38 , H01Q19/24 , H01Q19/30 , H05K1/024 , H05K1/141 , H05K1/16 , H05K2201/0191 , H05K2201/09036 , H05K2201/10674 , H01L2924/00 , H01L2924/20752
摘要： An interposer with which the manufacturing steps are able to be simplified and which shows superior high frequency characteristics is provided. The interposer includes: a substrate having a front face and a rear face; a wiring that is formed on the front face side of the substrate and is electrically connected to a semiconductor chip; an electric device connected to the wiring; and a concave section that is formed from the rear face side of the substrate in a position corresponding to the electric device.
摘要翻译：提供了能够简化制造步骤并且显示出优异的高频特性的插入器。所述插入件包括：具有正面和背面的基板; 形成在基板的正面侧并与半导体芯片电连接的布线; 连接到布线的电气设备; 以及从与所述电气装置对应的位置从所述基板的背面侧形成的凹部。

9. 发明授权

EP1444733B1 ELECTRONIC DEVICE CARRIER ADAPTED FOR TRANSMITTING HIGH FREQUENCY SIGNALS 有权
标题翻译： CARRIER电子元件适用于传输高频信号
公开(公告)号：EP1444733B1
公开(公告)日：2010-12-01
申请号：EP02795072.4
申请日：2002-10-25
申请人： International Business Machines Corporation
发明人： ALCOE, Dave , NOWAK, Ronald , PREDA, Francesco , OGGIONI, Stefano, Sergio
IPC分类号： H01L23/498
CPC分类号： H05K1/0219 , H01L23/16 , H01L23/36 , H01L23/49822 , H01L23/66 , H01L25/0655 , H01L2223/6616 , H01L2223/6627 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/73253 , H01L2924/01057 , H01L2924/15153 , H01L2924/1517 , H01L2924/15173 , H01L2924/15311 , H01L2924/16195 , H01L2924/1903 , H01L2924/3011 , H01L2924/3025 , H05K1/111 , H05K2201/09236 , H05K2201/09781
摘要： An electronic device carrier (110) adapted for transmitting high-frequency signals, including a circuitized substrate with a plurality of conductive layers (240a to 240g) insulated from each other, the conductive layers being arranged in a sequence from a first one of the conductive layers (240a) wherein a plurality of signal tracks (200) each one ending with a contact area (205) for transmitting a high-frequency signal are formed, and a reference structure (215a, 215b, 230) connectable to a reference voltage or ground for shielding the signal tracks the reference structure includes at least one reference track (230) formed in a second one of the conductive layers (240b) adjacent to the first conductive layer and at least one further reference track formed in one of the conductive layers (240d) different from the first and second conductive layer, a portion of each signal track excluding at least the area corresponding to the orthographic projection of associated contact area being superimposed in plan view to a corresponding reference track and at least a part of the area corresponding to the orthographic projection of the contact area associated to each signal track being superimposed in plan view to a corresponding further reference track with interposition of a floating conductive track, i.e. a track not connected to any signal, reference voltage or ground track.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式