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1. 发明授权

EP4125115B1 CHIP PACKAGE ASSEMBLY AND ELECTRONIC DEVICE COMPRISING THE CHIP PACKAGE ASSEMBLY 有权
公开(公告)号：EP4125115B1
公开(公告)日：2024-03-20
申请号：EP22186640.3
申请日：2022-07-25
发明人： PENG, Hao , LIAO, Xiaojing , HOU, Zhaozheng
IPC分类号： H01L21/48 , H01L25/00 , H01L25/065 , H01L23/367 , H01L23/552 , H01L23/538 , H01L23/14 , H01L23/13 , H01L23/36

2. 发明公开

EP4336551A1 POWER MODULE COMPRISING A SEMICONDUCTOR MODULE COMPONENT AND AN ALIGNMENT PART, AND METHOD FOR FORMING THE POWER MODULE 审中-公开
公开(公告)号：EP4336551A1
公开(公告)日：2024-03-13
申请号：EP22194844.1
申请日：2022-09-09
申请人： Hitachi Energy Ltd
发明人： TRUESSEL, Dominik , MALEKI, Milad , FISCHER, Fabian , SANTOLARIA, Lluis
IPC分类号： H01L23/31 , H05K7/14 , H01L23/552 , H01L25/07
摘要： A power module (100) comprising a semiconductor module component (10) and an alignment part (20) is provided, wherein the alignment part (20) is fixed on a lateral top surface (10T) of the semiconductor module component (10) and comprises at least one recessed portion (20R). The semiconductor module component (10) comprises at least one terminal (12, 13) which - at least in places - is orientated vertically with respect to the lateral top surface (10T) of the semiconductor module component (10) and for the purpose of alignment along lateral directions, is located at least partly within the at least one recessed portion (20R). Along a vertical direction, the at least one terminal (12, 13) protrudes beyond the at least one recessed portion (20R).
Moreover, a method for forming the power module (100) comprising a semiconductor module component (10) is provided.

3. 发明公开

EP4336550A1 SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR 审中-公开
公开(公告)号：EP4336550A1
公开(公告)日：2024-03-13
申请号：EP23195227.6
申请日：2023-09-04
申请人： NXP USA, Inc.
发明人： Vincent, Michael B. , Hayes, Scott M. , Gong, Zhiwei , van Gemert, Leo , Kamphuis, Antonius Hendrikus Jozef , Huang, Wen Hung
IPC分类号： H01L23/29 , H01L23/31 , H01L23/538 , H01L23/552 , H01L23/66 , H01L21/60 , H01L23/498
摘要： A method of forming a semiconductor device is provided. The method includes encapsulating with an encapsulant at least a portion of a semiconductor die and a package substrate, the encapsulant including an additive selectively activated by way of a laser. A first opening is formed in the encapsulant, the first opening exposing a predetermined first portion of the package substrate. The additive is activated at the sidewalls of the first opening. A second opening is formed in the encapsulant, the second opening encircling the first opening and exposing a predetermined second portion of the package substrate. The additive is activated at the sidewalls the second opening. A conductive material is plated on the additive activated portions of the encapsulant.

4. 发明公开

EP4298669A1 A DEVICE FOR SHIELDING AT LEAST ONE QUANTUM COMPONENT 审中-公开
公开(公告)号：EP4298669A1
公开(公告)日：2024-01-03
申请号：EP22712011.0
申请日：2022-02-17
申请人： Teknologian Tutkimuskeskus VTT OY
发明人： LEHTINEN, Janne , KEMPPINEN, Antti , MYKKÄNEN, Emma , PRUNNILA, Mika , RONZANI, Alberto
IPC分类号： H01L23/552 , B82Y10/00 , G06N10/00 , H01L35/32 , H01L23/38 , H01L29/66

5. 发明授权

EP3074986B1 ELEKTRONISCHES BAUELEMENT UND VERWENDUNG DESSELBEN 有权
公开(公告)号：EP3074986B1
公开(公告)日：2023-11-08
申请号：EP14802889.7
申请日：2014-11-25
发明人： DERNOVSEK, Oliver , FEICHTINGER, Thomas
IPC分类号： H01C1/06 , H01G4/30 , H01C7/18 , H01G2/22 , H01G4/224 , H01L23/552

6. 发明公开

EP4252279A1 FLEXIBLE ELECTRONIC CIRCUITS WITH SUPPORT STRUCTURES 审中-公开
公开(公告)号：EP4252279A1
公开(公告)日：2023-10-04
申请号：EP21816510.8
申请日：2021-11-24
申请人： Pragmatic Semiconductor Limited
发明人： COBB, Brian , SCULLION, Laurence , PRICE, Richard
IPC分类号： H01L23/16 , H01L23/552 , H01L23/66

7. 发明公开

EP4243067A2 ELECTRONIC PACKAGE ARRANGEMENTS 审中-公开
公开(公告)号：EP4243067A2
公开(公告)日：2023-09-13
申请号：EP23181904.6
申请日：2019-12-17
申请人： Qorvo US, Inc.
发明人： NAIR, Deepukumar, M. , DRY, Robert Charles , DEKOSKY, Jeffrey
IPC分类号： H01L23/552
摘要： Electronic package arrangements and related methods are disclosed that provide one or more of improved thermal management and electromagnetic shielding. Electronic packages are disclosed that include arrangements of one or more electronic devices, overmold bodies, and heat spreaders or metal frame structures. The heat spreaders or metal frame structures may be arranged over the electronic devices to form heat dissipation paths that draw operating heat away from the electronic devices in one or more directions including above and below the electronic packages. The heat spreaders or metal frame structures may also be arranged to form electromagnetic shields that reduce crosstalk between the electronic devices within the electronic packages and to suppress unwanted emissions from either escaping or entering the electronic packages.

8. 发明授权

EP4044224B1 ELECTRONIC COMPONENT PACKAGE BODY, ELECTRONIC COMPONENT ASSEMBLY STRUCTURE, AND ELECTRONIC DEVICE 有权
公开(公告)号：EP4044224B1
公开(公告)日：2023-07-05
申请号：EP22154144.4
申请日：2022-01-31
发明人： XIANG, Zhiqiang
IPC分类号： H01L23/49 , H01L23/498 , H01L23/538 , H01L23/552 , H01L23/00

9. 发明公开

EP4184574A1 PACKAGING MODULE AND PACKAGING METHOD THEREFOR, AND ELECTRONIC DEVICE 审中-公开
公开(公告)号：EP4184574A1
公开(公告)日：2023-05-24
申请号：EP21851432.1
申请日：2021-07-19
申请人： Huawei Technologies Co., Ltd.
发明人： JI, Zhongli , LIU, Xulei , HU, Fengtian , ZHANG, Hongwu
IPC分类号： H01L23/552
摘要： This application provides a packaging module and a packaging method therefor, and an electronic device. The packaging module includes at least two device groups and a shielding structure configured to shield the at least two device groups. The shielding structure includes a partition structure configured to perform electromagnetic isolation between every two adjacent device groups. The partition structure includes a plurality of conductive pillars and conductive adhesive, and a conductivity of the conductive pillar is greater than a conductivity of the conductive adhesive. The plurality of conductive pillars are arranged at intervals and are electrically connected to a ground layer of a substrate, the conductive adhesive fills a gap between any adjacent conductive pillars, and any adjacent conductive pillars are electrically connected by using the conductive adhesive. It can be learned from the description that the partition structure is formed by using the conductive pillar and the conductive adhesive, and the conductivity of the conductive pillar is greater than that of the conductive adhesive, to improve a conductivity of the partition structure; and the conductive pillar is used as a part of the partition structure, an amount of the conductive adhesive is reduced, and costs of the entire shielding structure are reduced, thereby reducing costs of the entire packaging module.

10. 发明公开

EP4179568A1 PACKAGE COMPRISING PASSIVE DEVICE CONFIGURED AS ELECTROMAGNETIC INTERFERENCE SHIELD 审中-公开
公开(公告)号：EP4179568A1
公开(公告)日：2023-05-17
申请号：EP21735046.1
申请日：2021-05-28
申请人： QUALCOMM INCORPORATED
发明人： HAN, Jeahyeong , RAE, David Fraser , KUMAR, Rajneesh
IPC分类号： H01L23/552 , H01L25/16

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