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    • 1. 发明公开
    • COMPOSITE SUBSTRATE WITH PROTECTION FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • 用于制造半导体器件保护膜的方法复合基材
    • EP2677534A1
    • 2013-12-25
    • EP12746625.8
    • 2012-02-13
    • Sumitomo Electric Industries, Ltd.
    • SATOH, IsseiYOSHIDA, HiroakiYAMAMOTO, YoshiyukiHACHIGO, AkihiroMATSUBARA, Hideki
    • H01L21/20
    • H01L29/2003H01L21/02104H01L21/76254
    • A protective-film-attached composite substrate (2Q) includes a support substrate (10), an oxide film (20) disposed on the support substrate (10), a semiconductor layer (30a) disposed on the oxide film (20), and a protective film (40) protecting the oxide film (20) by covering a portion (20s, 20t) that is a part of the oxide film (20) and covered with none of the support substrate (10) and the semiconductor layer (30a). A method of manufacturing a semiconductor device includes the steps of: preparing the protective-film-attached composite substrate (2Q); and epitaxially growing, on the semiconductor layer (30a) of the protective-film-attached composite substrate (2Q), at least one functional semiconductor layer causing an essential function of a semiconductor device to be performed. Thus, there are provided a protective-film-attached composite substrate having a large effective region where a high-quality functional semiconductor layer can be epitaxially grown, and a method of manufacturing a semiconductor device in which the protective-film-attached composite substrate is used.
    • 的保护膜相连的复合基板(2Q)包括支撑基板(10),以氧化物计的电影(20),其设置在设置于成膜氧化物(20),所述支撑基片(10),半导体层(30A),和 通过覆盖的部分保护的氧化物膜 - (20)的保护膜(40)(20S,20T)确实是氧化物薄膜 - (20)的一部分,并且覆盖有没有支持衬底(10)和所述半导体层(30A )。 一种制造半导体器件的方法包括以下步骤:制备保护膜相连的复合基板(2Q); 和外延生长,保护膜相连的复合基板的半导体层(30A)(2Q)上,至少一个功能性半导体层产生原因的半导体装置的基本功能将被执行。 因此,存在提供一种具有大的有效区域,其中高品质的功能的半导体层可以外延生长在保护膜相连的复合基板,以及制造在保护膜相连的复合衬底是半导体器件的方法 使用。
    • 7. 发明公开
    • METHOD FOR PRODUCING GaN FILM
    • VERFAHREN ZUR HERSTELLUNG EINES GAN-FILMS
    • EP2551892A1
    • 2013-01-30
    • EP11841250.1
    • 2011-11-10
    • Sumitomo Electric Industries, Ltd.
    • SATOH, IsseiSEKI, YukiUEMATSU, KojiYAMAMOTO, YoshiyukiMATSUBARA, HidekiFUJIWARA, ShinsukeYOSHIMURA, Masashi
    • H01L21/02H01L21/20H01L21/205
    • H01L33/007H01L21/76256H01L33/0079
    • The present method of manufacturing a GaN-based film includes the steps of preparing a composite substrate (10), the composite substrate including a support substrate (11) in which a coefficient of thermal expansion in a main surface (11m) is more than 0.8 time and less than 1.2 times as high as a coefficient of thermal expansion of GaN crystal in a direction of a axis and a single crystal film (13) arranged on a side of the main surface (11m) of the support substrate (11), the single crystal film (13) having threefold symmetry with respect to an axis perpendicular to a main surface (13m) of the single crystal film (13), and forming a GaN-based film (20) on the main surface (13m) of the single crystal film (13) in the composite substrate (10). Thus, a method of manufacturing a GaN-based film capable of manufacturing a GaN-based film having a large main surface area and less warpage is provided.
    • 本发明的GaN系膜的制造方法具有以下步骤:制备复合基板(10),所述复合基板包括主表面(11m)的热膨胀系数大于0.8的支撑基板(11) 时间小于GaN晶体沿轴向的热膨胀系数和布置在支撑基板(11)的主表面(11m)侧的单晶膜(13)的1.2倍以下, 所述单晶膜(13)相对于垂直于所述单晶膜(13)的主表面(13m)的轴线具有三重对称性,并且在所述主晶面(13m)上形成GaN基膜(20) 复合衬底(10)中的单晶膜(13)。 因此,提供了一种制造能够制造具有大的主表面积和较少翘曲的GaN基膜的GaN基膜的方法。
    • 8. 发明公开
    • APPARATUS FOR PRODUCING NITRIDE SEMICONDUCTOR CRYSTAL, METHOD FOR PRODUCING NITRIDE SEMICONDUCTOR CRYSTAL, AND NITRIDE SEMICONDUCTOR CRYSTAL
    • DEVICE用于制造氮化物半导体,用于生产氮化物半导体与氮化物半导体
    • EP2383373A1
    • 2011-11-02
    • EP10733470.8
    • 2010-01-20
    • Sumitomo Electric Industries, Ltd.
    • SATOH, IsseiMIYANAGA, MichimasaYAMAMOTO, YoshiyukiNAKAHATA, Hideaki
    • C30B29/38C30B23/06
    • C30B23/066C30B29/403
    • Affords nitride semiconductor crystal manufacturing apparatuses that are durable and that are for manufacturing nitride semiconductor crystal in which the immixing of impurities from outside the crucible is kept under control, and makes methods for manufacturing such nitride semiconductor crystal, and the nitride semiconductor crystal itself, available.
      A nitride semiconductor crystal manufacturing apparatus (100) is furnished with a crucible (101), a heating unit (125), and a covering component (110). The crucible (101) is where, interiorly, source material (17) is disposed. The heating unit (125) is disposed about the outer periphery of the crucible (101), where it heats the crucible (101) interior. The covering component (110) is arranged in between the crucible (101) and the heating unit (125). The covering component (110) includes a first layer (111) formed along the side opposing the crucible (101), and made of a metal whose melting point is higher than that of the source material (17), and a second layer (112) formed along the outer periphery of the first layer (111), and made of a carbide of the metal that constitutes the first layer (111).
    • 得到氮化物半导体晶体制造装置那样耐用,并是用于制造氮化物半导体晶体,其中来自该坩埚外部的杂质的混入在控制下保持,并且使得用于制造搜索氮化物半导体晶体的方法,和氮化物半导体晶体本身,可用 , 一种氮化物半导体晶体制造装置(100)配有一个坩埚(101),一个加热单元(125),和覆盖部件(110)。 所述坩埚(101)是其中,在内部,源材料(17)布置。 所述加热单元(125)被设置在所述坩埚(101),在那里它加热坩埚(101)内部的外周。 所述覆盖部件(110)被布置在所述坩埚(101)和加热单元(125)之间。 所述覆盖部件(110)包括沿所述侧相对的坩埚(101)形成,并且由金属的熔点比所述源材料(17),以及第二层的更高的第一层(111)(112 沿着第一层(111)的外周形成,并且由金属制成的碳化物的)那样构成所述第一层(111)。