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11. 发明授权

EP2583301B1 ENDPOINT DETERMINATION FOR CAPILLARY-ASSISTED FLOW CONTROL 失效转让
公开(公告)号：EP2583301B1
公开(公告)日：2018-12-05
申请号：EP11796569.9
申请日：2011-06-18
申请人： ENTEGRIS INC.
发明人： SWEENEY, Joseph, D. , AVILA, Anthony, M. , WODJENSKI, Michael, J. , DESPRES, Joseph, R. , BAUM, Thomas, H.
IPC分类号： H01J37/317 , H01L21/66 , H01L21/02 , H01L21/67 , G05D7/06
CPC分类号： F17D3/01 , F17D3/00 , G05D7/0635 , H01J37/3171 , H01J2237/006 , H01J2237/30466 , H01L21/67017 , H01L21/67253 , Y10T137/0324 , Y10T137/86389
摘要： Apparatus and method for determining endpoint of a fluid supply vessel in which fluid flow is controlled through a flow passage disposed in an interior volume of the fluid supply vessel with a static flow restricting device and a selectively actuatable valve element upon establishing fluid flow. The endpoint determination can be employed to terminate fluid supply from the fluid supply vessel and/or to switch from a fluid-depleted supply vessel to a fresh vessel for continuity or renewal of fluid supply operation. The apparatus and method are suitable for use with fluidutilizing apparatus such as ion implanters.

12. 发明公开

EP2924710A1 Imaging a sample with multiple beams and a single detector 审中-公开
标题翻译： Abbildung einer Probe mittels mehrerer Strahlen und einem einzigen Detektor
公开(公告)号：EP2924710A1
公开(公告)日：2015-09-30
申请号：EP14161519.5
申请日：2014-03-25
申请人： FEI COMPANY
发明人： Potocek, Pavel , Kooijman, Cornelis , Slingerland, Hendrik , Veen, van, Gerard , Boughorbel, Faysal , Faber, Pybe
IPC分类号： H01J37/28 , H01J37/30
CPC分类号： H01J37/28 , H01J37/3005 , H01J2237/226 , H01J2237/24495 , H01J2237/30466 , H01J2237/31749
摘要： The invention relates to a multi-beam apparatus (210) for inspecting a sample (232) with at least a first focused beam and a second focused beam, the apparatus equipped to scan the first and the second beam (243, 218) over the sample, the apparatus equipped with at least one detector (240) for detecting secondary radiation emitted by the sample when said sample is irradiated by the first and the second beam, the detector capable of outputting a detector signal representing the intensity of the secondary radiation detected by the detector, in working the detector signal comprising information caused by the first and the second beam, characterized in that the apparatus is equipped with a programmable controller (219) programmed for processing the detector signal using a source separation technique, as a result of which the programmable controller is equipped to output a signal representing information caused by a single beam.
摘要翻译：本发明涉及一种用于使用至少第一聚焦光束和第二聚焦光束来检测样品（232）的多光束装置（210），该装置被配备成扫描第一和第二光束（243,218）所述装置配备有至少一个检测器（240），用于当所述样品被所述第一和第二光束照射时检测由所述样品发射的次级辐射，所述检测器能够输出表示检测到的次级辐射的强度的检测器信号通过检测器处理包括由第一和第二光束引起的信息的检测器信号，其特征在于，该装置配备有可编程控制器（219），其被编程为使用源分离技术来处理检测器信号，作为可编程控制器被配备为输出表示由单个波束引起的信息的信号。

13. 发明公开

EP2696364A1 ION BEAM DEVICE AND MACHINING METHOD 审中-公开
标题翻译： IONENSTRAHLVORRICHTUNG UND BEARBEITUNGSVERFAHRENDAFÜR
公开(公告)号：EP2696364A1
公开(公告)日：2014-02-12
申请号：EP12763892.2
申请日：2012-01-13
申请人： Hitachi High-Technologies Corporation
发明人： KITAYAMA, Shinya , TOMIMATSU, Satoshi , ONISHI, Tsuyoshi
IPC分类号： H01J37/317 , H01J37/20 , H01J37/244
CPC分类号： H01J37/317 , H01J37/20 , H01J37/222 , H01J2237/30466 , H01J2237/31745 , H01J2237/31749
摘要： Provided are a device and method capable of machining a machining target such as a sample, a probe, or a sample table without requiring a high degree of device operation skill. First, a shape generation process of determining a shape of a machining target on the basis of an ion beam scanning signal and an absorption current of the machining target is performed. Next, a machining pattern positioning process of positioning a machining pattern over an image of the machining target is performed. Further, an ion beam stopping process of stopping ion beam irradiation is performed from a result of comparison between the image of the machining target and the machining pattern while the machining target is machined through the ion beam irradiation.
摘要翻译：提供了能够加工诸如样品，探针或样品台之类的加工对象的装置和方法，而不需要高度的装置操作技能。首先，执行基于加工对象的离子束扫描信号和吸收电流来确定加工对象的形状的形状生成处理。接下来，执行将加工图案定位在加工对象的图像上的加工图案定位处理。此外，从加工对象的图像与加工图案的比较的结果，通过离子束照射加工加工对象，进行停止离子束照射的离子束停止处理。

14. 发明公开

EP2583301A2 ENDPOINT DETERMINATION FOR CAPILLARY-ASSISTED FLOW CONTROL 失效转让
标题翻译：终点测定流量控制KAPILLARGESTÜTZTE
公开(公告)号：EP2583301A2
公开(公告)日：2013-04-24
申请号：EP11796569.9
申请日：2011-06-18
申请人： Advanced Technology Materials, Inc.
发明人： SWEENEY, Joseph, D. , AVILA, Anthony, M. , WODJENSKI, Michael, J. , DESPRES, Joseph, R. , BAUM, Thomas, H.
IPC分类号： H01L21/66 , H01L21/02
CPC分类号： F17D3/01 , F17D3/00 , G05D7/0635 , H01J37/3171 , H01J2237/006 , H01J2237/30466 , H01L21/67017 , H01L21/67253 , Y10T137/0324 , Y10T137/86389
摘要： Apparatus and method for determining endpoint of a fluid supply vessel in which fluid flow is controlled through a flow passage disposed in an interior volume of the fluid supply vessel with a static flow restricting device and a selectively actuatable valve element upon establishing fluid flow. The endpoint determination can be employed to terminate fluid supply from the fluid supply vessel and/or to switch from a fluid-depleted supply vessel to a fresh vessel for continuity or renewal of fluid supply operation. The apparatus and method are suitable for use with fluidutilizing apparatus such as ion implanters.

15. 发明授权

EP1903596B1 Electron microscope for inspecting and processing of an object with miniaturized structures and method thereof 有权转让
标题翻译：电子显微镜用于与微型化结构及其方法检查和处理对象
公开(公告)号：EP1903596B1
公开(公告)日：2012-06-27
申请号：EP07018076.5
申请日：2007-09-14
申请人： Carl Zeiss NTS GmbH
发明人： Bihr, Johannes , Panteleit, Friedhelm, Dr. , Clauss, Tobias , Budach, Michael
IPC分类号： H01J37/317 , H01J37/305 , H01J37/28 , G03F1/00 , H01J37/244 , H01J37/301 , H01J37/304 , H01L21/768
CPC分类号： H01J37/301 , G03F1/72 , G03F1/86 , H01J37/244 , H01J37/28 , H01J37/304 , H01J37/3056 , H01J2237/006 , H01J2237/18 , H01J2237/24475 , H01J2237/2448 , H01J2237/2449 , H01J2237/30466 , H01J2237/30472 , H01J2237/31732 , H01J2237/31744

16. 发明授权

EP2068343B1 Charged particle source with automated tip formation 有权
标题翻译：具有自动尖端结构带电粒子源
公开(公告)号：EP2068343B1
公开(公告)日：2011-08-31
申请号：EP07022031.4
申请日：2007-11-13
申请人： ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH
发明人： Winkler, Dieter , Weigel, Udo , Grimm, Stefan
IPC分类号： H01J37/073 , H01J37/08 , H01J37/26 , H01J37/304 , H01J9/00 , H01J27/26
CPC分类号： H01J37/073 , H01J27/26 , H01J37/08 , H01J37/265 , H01J37/304 , H01J2237/06341 , H01J2237/0805 , H01J2237/0807 , H01J2237/30466 , H01J2237/30477 , H01J2237/31749

17. 发明公开

EP2233907A1 Forming an image while milling a work piece 审中-公开
标题翻译： Erzeugung eines BildeswährenddesFräsenseinesWerkstücks
公开(公告)号：EP2233907A1
公开(公告)日：2010-09-29
申请号：EP09156391.6
申请日：2009-03-27
申请人： FEI Company
发明人： Faber, Pybe , Geurts, Remco
IPC分类号： G01N1/28 , H01J37/305 , H01J37/304
CPC分类号： H01J37/3056 , G01N1/286 , H01J37/304 , H01J2237/30466 , H01J2237/31745 , H01J2237/31749
摘要： Dual beam instruments, comprising a Scanning Electron Microscope (SEM) column for imaging and a Focused Ion Beam (FIB) column for milling, are routinely used to extract samples (lamellae) from semiconductor waters. By observing the progress of the milling with the SEM column, end pointing of the milling process can be performed.
The invention offers an alternative solution to this problem, in which an instrument with only a FIB column is used.
For milling a lamella (105) to its final thickness of, for example, 30 nm, the focused ion beam (100), is scanned repeatedly along the lamella. It is found that while milling the lamella a signal can be derived from the lamella that is sufficient for end pointing. No additional electron beam for inspection is needed.
摘要翻译：常规使用包括用于成像的扫描电子显微镜（SEM）柱和用于研磨的聚焦离子束（FIB）柱）的双光束仪器从半导体水中提取样品（薄片）。通过观察用SEM柱研磨的进度，可以进行研磨过程的结束指示。本发明提供了该问题的替代解决方案，其中仅使用具有FIB列的仪器。为了将薄片（105）研磨至例如30nm的最终厚度，聚焦离子束（100）沿薄片反复扫描。发现在铣削薄片时，信号可以从对于终点指示足够的薄片获得。不需要额外的电子束进行检查。

18. 发明公开

EP2233906A1 Forming an image while milling a work piece 审中-公开
标题翻译：在铣削工件时形成图像
公开(公告)号：EP2233906A1
公开(公告)日：2010-09-29
申请号：EP10157861.5
申请日：2010-03-26
申请人： FEI COMPANY
发明人： Faber, Pybe , Geurts, Remco
IPC分类号： G01N1/28 , H01J37/305 , H01J37/304
CPC分类号： H01J37/3056 , G01N1/286 , H01J37/304 , H01J2237/30466 , H01J2237/31745 , H01J2237/31749
摘要： Dual beam instruments, comprising a Scanning Electron Microscope (SEM) column for imaging and a Focused Ion Beam (FIB) column for milling, are routinely used to extract samples (lamellae) from semiconductor wafers. By observing the progress of the milling with the SEM column, end pointing of the milling process can be performed.
The invention offers an alternative solution to this problem, in which an instrument with only a FIB column is used.
For milling a lamella (105) to its final thickness of, for example, 30 nm, the focused ion beam (100), is scanned repeatedly along the lamella. It is found that while milling the lamella a signal can be derived from the lamella that is sufficient for end pointing. No additional electron beam for inspection is needed.
摘要翻译：包含用于成像的扫描电子显微镜（SEM）柱和用于研磨的聚焦离子束（FIB）柱的双光束仪器常规用于从半导体晶片提取样品（薄片）。通过观察SEM柱的铣削进度，可以进行铣削过程的终点。本发明为这个问题提供了另一种解决方案，其中使用仅具有FIB柱的仪器。为了将薄片（105）研磨至例如30nm的最终厚度，沿着薄片重复扫描聚焦离子束（100）。据发现，在碾磨薄片时，可以从薄片中得到足以用于结束指向的信号。不需要额外的电子束进行检查。

19. 发明公开

EP2149897A1 Method for milling and end-pointing a sample 审中-公开
标题翻译： Verfahren zumFräsenund zur Endpunktbestimm einer Probe
公开(公告)号：EP2149897A1
公开(公告)日：2010-02-03
申请号：EP08161546.0
申请日：2008-07-31
申请人： FEI COMPANY
发明人： Faber, Pybe , Geurts, Remco
IPC分类号： H01J37/305 , H01J37/304
CPC分类号： H01J37/3053 , H01J37/3045 , H01J2237/221 , H01J2237/30466 , H01J2237/3118 , H01J2237/3151
摘要： The invention relates to a method for end-pointing milling of a sample with a Focused Ion Beam apparatus (FIB). Known end-pointing results in interruption of the milling only after the feature of interest is exposed. This implies that for high-speed milling the feature may already be damaged when the milling is stopped. The invention discloses that images are made while milling, and that these images are matched with a 3D model of the sample, so that milling conditions can be changed before the feature is exposed. Milling can then progress at a lower speed, offering better control, or another removal technique, such as gas assisted milling with other gasses, can be used so as to minimize damage to the feature. Hereby the method according to the invention combines high removal rate and delicate control of removed thickness.
It is noted that the invention is also applicable when other removal methods are used, such as e.g. laser ablation.
摘要翻译：本发明涉及用聚焦离子束装置（FIB）对样品进行端点铣削的方法。已知的最终指向导致仅在感兴趣的特征暴露之后中断铣削。这意味着对于高速铣削，铣削停止时，特征可能已被损坏。本发明公开了在研磨时制作图像，并且这些图像与样品的3D模型相匹配，使得在特征曝光之前可以改变研磨条件。铣削可以以更低的速度进行，提供更好的控制，或者可以使用另一种去除技术，例如使用其他气体的气体辅助研磨，以便最小化对特征的损害。因此，根据本发明的方法结合了高去除率和去除厚度的精细控制。应当注意，当使用其它去除方法时，本发明也适用，例如，激光烧蚀。

20. 发明公开

EP1903596A8 Electron microscope for inspecting and processing of an object with miniaturized structures and method thereof 有权转让
标题翻译：电子显微镜，用于检测和处理具有小型化结构的物体及其方法
公开(公告)号：EP1903596A8
公开(公告)日：2008-07-02
申请号：EP07018076.5
申请日：2007-09-14
申请人： Carl Zeiss NTS GmbH
发明人： Bihr, Johannes , Panteleit, Friedhelm, Dr. , Clauss, Tobias , Budach, Michael
IPC分类号： H01J37/317 , H01J37/305 , H01J37/28
CPC分类号： H01J37/301 , G03F1/72 , G03F1/86 , H01J37/244 , H01J37/28 , H01J37/304 , H01J37/3056 , H01J2237/006 , H01J2237/18 , H01J2237/24475 , H01J2237/2448 , H01J2237/2449 , H01J2237/30466 , H01J2237/30472 , H01J2237/31732 , H01J2237/31744
摘要： The invention relates to a method for manufacturing an object with miniaturized structures, comprising: Processing the object by supplying reaction gas during concurrent directing an electron beam onto a location to be processed, to deposit material or ablate material; and inspecting the object by scanning the surface of the object with an electron beam and leading generated backscattered electrons and secondary electrons to an energy selector, reflecting the secondary electrons from the energy selector, detecting the backscattered electrons passing the energy selector and generating an electron microscopic image of the scanned region in dependence on the detected backscattered electrons; and examining the generated electron microscopic image and deciding whether further depositing or ablating of material should be carried out. Furthermore, the invention relates to an electron microscope and a processing system which are adapted for performing the method.
摘要翻译：本发明涉及一种用于制造具有微型化结构的物体的方法，包括：通过在同时将电子束引导到待处理的位置期间供应反应气体来处理所述物体，以沉积材料或烧蚀材料; 通过用电子束扫描物体表面并引导产生的背散射电子和二次电子到能量选择器，反射来自能量选择器的二次电子，检测通过能量选择器的背散射电子并产生电子显微镜根据检测到的背散射电子扫描区域的图像; 并检查所产生的电子显微镜图像并确定是否应进一步沉积或消融材料。此外，本发明涉及适用于执行该方法的电子显微镜和处理系统。

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