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1. 发明申请

WO2015091673A1 BONDED ASSEMBLIES WITH PRE-DEPOSITED POLYMER BALLS ON DEMARCATED AREAS AND METHODS OF FORMING SUCH BONDED ASSEMBLIES 审中-公开
标题翻译：与已形成聚合物的复合材料组合在已形成的区域上的形成和形成这种结合组件的方法
公开(公告)号：WO2015091673A1
公开(公告)日：2015-06-25
申请号：PCT/EP2014/078268
申请日：2014-12-17
申请人： CONPART AS
发明人： REDFORD, Keith , KRISTIANSEN, Helge , SUGDEN, Mark , TILSET, Bente Gilbu , WARSZYNSKI, Piotr , LIU, Changqing , WHALLEY, David , HUTT, David
IPC分类号： H01L21/60 , H01L23/485
CPC分类号： H01L24/11 , G02B6/4232 , H01L21/4867 , H01L21/4882 , H01L21/563 , H01L23/293 , H01L23/3737 , H01L23/49811 , H01L24/05 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05541 , H01L2224/05548 , H01L2224/05552 , H01L2224/05567 , H01L2224/05568 , H01L2224/11005 , H01L2224/11334 , H01L2224/11442 , H01L2224/1148 , H01L2224/13005 , H01L2224/13021 , H01L2224/13023 , H01L2224/13078 , H01L2224/1319 , H01L2224/13561 , H01L2224/1358 , H01L2224/13609 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13664 , H01L2224/13669 , H01L2224/1411 , H01L2224/17107 , H01L2224/29011 , H01L2224/2919 , H01L2224/321 , H01L2224/73103 , H01L2224/73204 , H01L2224/81191 , H01L2224/81815 , H01L2224/81903 , H01L2224/83102 , H01L2224/83862 , H01L2224/83865 , H01L2224/83871 , H01L2224/83874 , H01L2224/9205 , H01L2224/92125 , H01L2924/12042 , H05K3/3478 , H05K3/368 , H05K3/4007 , H05K2201/0221 , H05K2201/10977 , H01L2224/05571 , H01L2924/00012 , H01L2924/00014 , H01L2924/0665 , H01L2924/207 , H01L2924/206 , H01L2924/20754 , H01L2924/2075 , H01L2924/00
摘要： A method of forming a bonded assembly is described. A liquid-based dispersion of fine polymer balls (
摘要翻译：描述形成接合组件的方法。将细聚合物球（<50μm直径）的液体分散体施加到具有多个宽度小于5球直径的多个分界区域（14）的第一基板（16）。通过电气，化学或物理刺激将球（12）推动成对准，并且去除来自分散体的液体以将聚合物球留在分界区域中。第一衬底相对于第二衬底（18）对准并且被压在一起以部分地压缩聚合物球。通过粘合组件来固定组件的几何形状。在优选实施例中，球（12）具有2-6μm的直径，并且使用电泳和表面张力将其推到就位。聚合物球可以涂覆在Au和In中，并作为单独的球放置在基底上。

2. 发明申请

WO2014149579A1 INSULATED TOP SIDE BUMP CONNECTION FOR A POWER DEVICE, FOR EXAMPLE FOR GATE, SOURCE AND DRAIN CONTACTS OF A POWER FIELD EFFECT TRANSISTOR 审中-公开
标题翻译：用于功率器件的绝缘顶部保护连接，用于电源场效应晶体管的栅极，源极和漏极触点的示例
公开(公告)号：WO2014149579A1
公开(公告)日：2014-09-25
申请号：PCT/US2014/019728
申请日：2014-03-01
申请人： MICROCHIP TECHNOLOGY INCORPORATED
发明人： DIX, Gregory , MELCHER, Roger
IPC分类号： H01L23/485 , H01L23/482 , H01L23/495 , H01L23/31 , H01L25/065 , H01L21/60
CPC分类号： H01L23/4952 , H01L23/3171 , H01L23/4824 , H01L23/4951 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/48 , H01L24/49 , H01L24/81 , H01L2224/0401 , H01L2224/05554 , H01L2224/05567 , H01L2224/05647 , H01L2224/1148 , H01L2224/13014 , H01L2224/13021 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/1329 , H01L2224/133 , H01L2224/1403 , H01L2224/14133 , H01L2224/14163 , H01L2224/16112 , H01L2224/16245 , H01L2224/17107 , H01L2224/48247 , H01L2224/49171 , H01L2224/81191 , H01L2224/81801 , H01L2224/8185 , H01L2924/00014 , H01L2924/1305 , H01L2924/1306 , H01L2924/014 , H01L2924/0665 , H01L2924/00 , H01L2224/05552 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor power chip comprises a semiconductor die (102, 140, 172, 173, 210, 220, 230, 240, 240') having a power device, for example a power field effect transistor, fabricated on a substrate (210) thereof, wherein the power device has at least one first contact element (e.g. a gate contact element) (110), a plurality of second contact elements (source contact elements) (120) and a plurality of third contact elements (drain contact elements) (130) arranged on top of the semiconductor die (102, 140, 172, 173, 210, 220, 230, 240, 240'); and an insulation layer (150) disposed on top of the semiconductor die (102, 140, 172, 173, 210, 220, 230, 240, 240') and patterned to provide openings (104, 106, 108, 154, 154', 156, 156', 158, 158') to access the plurality of second (120) and third (130) contact elements and the at least one first contact element (110). The gate (104, 154, 154') and drain (108, 158, 158') openings in the insulation layer (150) are arranged on one side of the top surface of the die (102, 140, 172, 173, 210, 220, 230, 240, 240') and the source (106, 156, 156') openings are arranged on the opposite side of the top surface of the die (102, 140, 172, 173, 210, 220, 230, 240, 240'). The openings in the insulation layer (150) are circular (104, 106, 108) or preferably elliptic (154, 154', 156, 156', 158, 158'). Solder or conductive epoxy bumps (160) are placed in the openings (104, 106, 108, 154, 154', 156, 156', 158, 158') for bonding the first (110), second (120) and third (130) contacts to lead frame fingers (204, 204', 206, 206', 208). The lead frame is optionally substantially larger than the die (220, 230) of the semiconductor power chip. The lead frame may connect together a source of a first semiconductor chip with a drain of a second semiconductor chip or sources of a first and a second semiconductor chip. A further chip (620) may be wire-bonded to the lead frame.
摘要翻译：半导体功率芯片包括具有制造在其基板（210）上的功率器件（例如功率场效应晶体管）的半导体管芯（102,140,172,173,210,220,230,240,240'），其中所述功率器件具有至少一个第一接触元件（例如，栅极接触元件）（110），多个第二接触元件（源极接触元件）（120）和多个第三接触元件（漏极接触元件）（130）），其布置在所述半导体管芯（102,140,172,173,210,220,230,240,240'）的顶部上; 以及设置在所述半导体管芯（102,140,172,173,210,220,230,240,240'）的顶部上并被图案化以提供开口（104,106,108,154,154'）的绝缘层（150），156,156'，158,158'）以访问所述多个第二（120）和第三（130）接触元件和所述至少一个第一接触元件（110）。绝缘层（150）中的栅极（104,154,154'）和漏极（108,158,158'）开口布置在管芯（102,140,172,173,210）的顶表面的一侧，220,230,240,240'），并且所述源（106,156,156'）开口布置在所述管芯（102,140,172,23） 240，240'）。绝缘层（150）中的开口是圆形（104,106,108）或优选椭圆形（154,154'，156,156'，158,158'）。焊接或导电环氧树脂凸块（160）放置在开口（104,106,108,154,154'，156,156'，158,158'）中，用于将第一（110），第二（120）和第三（ 130）接触以引导框架指状物（204,204'，206,206'，208）。引线框架可选地基本上大于半导体功率芯片的管芯（220,230）。引线框架可将第一半导体芯片的源极与第二半导体芯片的漏极或第一和第二半导体芯片的源极连接在一起。另外的芯片（620）可以引线接合到引线框架。

3. 发明申请

WO2012043764A1 接着剤組成物、半導体装置の製造方法及び半導体装置审中-公开
标题翻译：胶粘组合物，制造半导体器件的方法和半导体器件
公开(公告)号：WO2012043764A1
公开(公告)日：2012-04-05
申请号：PCT/JP2011/072462
申请日：2011-09-29
申请人：日立化成工業株式会社 , 本田一尊 , 永井朗 , 榎本哲也
发明人：本田　一尊 , 永井　朗 , 榎本　哲也
IPC分类号： H01L21/60 , C09J7/00 , C09J11/04 , C09J11/06 , C09J163/00 , H01L23/29 , H01L23/31 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： C09J163/00 , C08K9/04 , H01L24/04 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/05571 , H01L2224/05611 , H01L2224/05616 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06181 , H01L2224/1148 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/29 , H01L2224/291 , H01L2224/2919 , H01L2224/73104 , H01L2224/81815 , H01L2224/83191 , H01L2224/83862 , H01L2224/9211 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01012 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/10335 , H01L2924/351 , H01L2924/00 , C08K9/00 , H01L2224/29298 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/05552
摘要：　本発明は、半導体チップ及び配線回路基板のそれぞれの接続部が互いに電気的に接続された半導体装置、又は、複数の半導体チップのそれぞれの接続部が互いに電気的に接続された半導体装置において接続部を封止する接着剤組成物であって、エポキシ樹脂と、硬化剤と、アクリル系表面処理フィラーとを含有する接着剤組成物に関する。
摘要翻译：本发明涉及一种用于将半导体器件中的连接部件密封的粘合剂组合物，其中半导体芯片和布线电路板的各个连接部分彼此电连接或者在半导体器件中互连，其中多个连接部分的半导体芯片彼此电连接。粘合剂组合物包含环氧树脂，固化剂和丙烯酸表面处理填料。

4. 发明申请

WO2010017512A2 ENHANCED RELIABILITY FOR SEMICONDUCTOR DEVICES USING DIELECTRIC ENCASEMENT 审中-公开
标题翻译：用电介质加载提高半导体器件的可靠性
公开(公告)号：WO2010017512A2
公开(公告)日：2010-02-11
申请号：PCT/US2009053205
申请日：2009-08-07
申请人： FLIPCHIP INT LLC , RECHE JOHN J H , JOHNSON MICHAEL E , BURGESS GUY F , CURTIS ANTHONY P , LICHTENTHAL STUART
发明人： RECHE JOHN J H , JOHNSON MICHAEL E , BURGESS GUY F , CURTIS ANTHONY P , LICHTENTHAL STUART
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L24/11 , H01L23/293 , H01L23/564 , H01L24/05 , H01L24/13 , H01L24/94 , H01L2224/0401 , H01L2224/05567 , H01L2224/0558 , H01L2224/05644 , H01L2224/1131 , H01L2224/11334 , H01L2224/1148 , H01L2224/13007 , H01L2224/13022 , H01L2224/131 , H01L2224/16 , H01L2224/274 , H01L2924/00013 , H01L2924/0002 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2224/13099 , H01L2224/05552
摘要： A method and device for enhanced reliability for semiconductor devices using dielectric encasement is disclosed. The method and device are directed to improving the reliability of the solder joint that connects the integrated circuit (IC) chip to the substrate. The method comprises applying a layer of a photoimageable permanent dielectric material to a top surface of the semiconductor device, and patterning the layer of the photoimageable permanent dielectric material to have an opening over each feature. The method further comprises dispensing or stencil printing fluxing material into the permanent dielectric material openings, and applying solder, which contains no flux, to a top surface of the fluxing material. In one or more embodiments, the method further comprises heating the semiconductor device to a reflow temperature appropriate for the reflow of the solder, thereby causing the solder to conform to sidewalls of the permanent dielectric material openings to form a protective seal.
摘要翻译：公开了一种用于使用电介质外壳增强半导体器件的可靠性的方法和设备。该方法和装置旨在改善将集成电路（IC）芯片连接到衬底的焊接点的可靠性。该方法包括将可光成像永久介电材料层施加到半导体器件的顶表面，并且将可光成像永久介电材料层图案化以在每个结构上具有开口。该方法还包括将助焊材料分配或模版印刷到永久介电材料开口中，并且将不含助焊剂的焊料施加到助熔材料的顶表面。在一个或多个实施例中，该方法还包括将半导体器件加热到适合于焊料回流的回流温度，由此使得焊料符合永久电介质材料开口的侧壁以形成保护性密封。

5. 发明申请

WO2008156100A1 回路基板及び半導体装置审中-公开
标题翻译：电路板和半导体器件
公开(公告)号：WO2008156100A1
公开(公告)日：2008-12-24
申请号：PCT/JP2008/061099
申请日：2008-06-18
申请人：ローム株式会社 , 森藤忠洋 , 上田茂幸
发明人：森藤忠洋 , 上田茂幸
IPC分类号： H01L21/60
CPC分类号： H05K3/3484 , H01L23/3192 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/0554 , H01L2224/1147 , H01L2224/11472 , H01L2224/11474 , H01L2224/1148 , H01L2224/13021 , H01L2224/13022 , H01L2224/13099 , H01L2224/16237 , H01L2224/73204 , H01L2224/81193 , H01L2224/81801 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H05K3/3452 , H05K2201/0191 , H05K2201/0989 , H05K2203/043 , H05K2203/0568 , H01L2224/29099
摘要：　半導体チップがフリップチップ実装される回路基板１は、基板本体２の表面に形成される電極パッド３と、基板本体２の表面を覆い、電極パッド３を露出させる開口部４ａを有するソルダレジスト層４と、を備える。ソルダレジスト層４は、電極パッド３と接しないように形成され、且つ、前記電極パッドの最大幅をＬ、前記ソルダレジスト層の厚みをＨとした場合に、Ｈ／Ｌが１．０≦Ｈ／Ｌ≦１．５を満たすように形成される。
摘要翻译：为了将半导体芯片倒装芯片安装在电路板（1）上，设置有形成在基板主体（2）的表面上的电极焊盘（3）和覆盖板主体（2）的表面，并具有用于使电极焊盘（3）露出的开口部（4a）。阻焊层（4）形成为不与电极焊盘（3）接触，并且具有满足不等式1.0 = H / L = 1.5的值H / L，其中，L是最大宽度电极焊盘，H是阻焊层的厚度。

6. 发明申请

WO2008131395A3 SOLDER BUMP INTERCONNECT FOR IMPROVED MECHANICAL AND THERMO MECHANICAL PERFORMANCE 审中-公开
标题翻译： SOLDER BUMP INTERCONNECT改善机械和热学机械性能
公开(公告)号：WO2008131395A3
公开(公告)日：2008-12-18
申请号：PCT/US2008061186
申请日：2008-04-22
申请人： FLIPCHIP INT LLC , ALVARADO REYNANTE , LU YUAN , REDBURN RICHARD
发明人： ALVARADO REYNANTE , LU YUAN , REDBURN RICHARD
IPC分类号： H01L21/60
CPC分类号： H01L24/05 , H01L23/3171 , H01L23/3192 , H01L24/02 , H01L24/03 , H01L24/13 , H01L2224/0235 , H01L2224/0239 , H01L2224/0345 , H01L2224/0346 , H01L2224/0401 , H01L2224/04042 , H01L2224/05022 , H01L2224/05073 , H01L2224/05124 , H01L2224/05155 , H01L2224/05164 , H01L2224/05166 , H01L2224/05541 , H01L2224/05548 , H01L2224/05554 , H01L2224/05555 , H01L2224/05567 , H01L2224/05572 , H01L2224/0558 , H01L2224/05644 , H01L2224/05647 , H01L2224/05666 , H01L2224/1148 , H01L2224/13006 , H01L2224/13007 , H01L2224/13021 , H01L2224/13022 , H01L2224/131 , H01L2224/45144 , H01L2224/45147 , H01L2224/48644 , H01L2224/48647 , H01L2224/48666 , H01L2224/48844 , H01L2224/48847 , H01L2224/48866 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/12044 , H01L2924/14 , H01L2924/3011 , H01L2924/351 , H01L2924/00014 , H01L2924/00015 , H01L2224/13099 , H01L2924/00
摘要： An apparatus and method for a semiconductor package including a bump on input-output (IO) structure are disclosed involving a device pad, an under bump metai pad (UBM), a polymer, and a passivation layer. The shortest distance from the center of the device pad to its outer edge, and the shortest distance from the center of the UBM to its outer edge are in a ratio from 0.5:1 to 0.95:1. Also, the shortest distance from the center of the polymer to its outer edge, and the shortest distance from the center of the UBM to its outer edge are in a ratio from 0.35:1 to 0.85:1. Additionally, the shortest distance from the center of the passivation layer to its outer edge, and the shortest distance from the center of the UBM to its outer edge are in a ratio from 0.35:1 to 0.80:1.
摘要翻译：公开了一种用于包括输入输出（IO）结构上的凸块的半导体封装的设备和方法，其涉及器件焊盘，凸块下金属焊盘（UBM），聚合物和钝化层。从器件焊盘的中心到其外边缘的最短距离以及从UBM的中心到其外边缘的最短距离以0.5：1到0.95：1的比率。而且，从聚合物中心到其外边缘的最短距离以及从UBM中心到其外边缘的最短距离以0.35:1到0.85:1的比率。此外，从钝化层的中心到其外边缘的最短距离以及从UBM的中心到其外边缘的最短距离在0.35：1到0.80：1之间。

7. 发明申请

WO2006054005A1 COMPOSANT A PROTUBERANCES CONDUCTRICES DUCTILES ENTERREES ET PROCEDE DE CONNEXION ELECTRIQUE ENTRE CE COMPOSANT ET UN COMPOSANT MUNI DE POINTES CONDUCTRICES DURES 审中-公开
标题翻译：带有导电导电块的组件和用于电连接的方法，该组件具有硬导线提供的组件和组件之间的电连接
公开(公告)号：WO2006054005A1
公开(公告)日：2006-05-26
申请号：PCT/FR2005/050795
申请日：2005-09-29
申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE , DAVOINE, Cécile , FENDLER, Manuel
发明人： DAVOINE, Cécile , FENDLER, Manuel
IPC分类号： H05K3/34
CPC分类号： H01L24/13 , H01L24/11 , H01L24/83 , H01L24/90 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/114 , H01L2224/11464 , H01L2224/1147 , H01L2224/11474 , H01L2224/1148 , H01L2224/116 , H01L2224/13083 , H01L2224/13084 , H01L2224/13109 , H01L2224/13111 , H01L2224/13155 , H01L2224/16225 , H01L2224/16237 , H01L2224/29111 , H01L2224/73204 , H01L2224/81191 , H01L2224/81193 , H01L2224/83894 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01067 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H05K3/321 , H05K3/4007 , H05K2201/0367 , H05K2201/0373 , H05K2201/10977 , H05K2203/0278 , Y10T29/49126 , H01L2224/13099 , H01L2924/01082 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： L'invention concerne un procédé de connexion électrique entre un premier composant (10) comportant, sur une face, un ensemble de premiers plots (8) et un ensemble de pointes conductrices dures (13) et un second composant (11) comportant, sur une face, un ensemble de second plots (9) et un ensemble de protubérances conductrices ductiles (14) , dans lequel on met en vis-à-vis les deux faces et on les rapproche de telle façon que les pointes (13) puissent pénétrer dans ces protubérances (14) , dans lequel les protubérances sont enterrées. L'invention concerne également un composant muni d'un ensemble de protubérances conductrices ductiles enterrées.
摘要翻译：本发明涉及一种用于第一部件（10）之间的电连接的方法，所述第一部件（10）的一侧包括一组第一接触焊盘（8）和一组硬导电尖端（13）和第二部件（11），所述第二部件一侧是一组第二垫（9）和一组延性导电凸块（14），其包括彼此相对放置并使它们更靠近在一起，使得尖端（13）可以穿透到所述凸块（14）中，所说的颠簸被埋了。本发明还涉及配备有一组埋地延性导电凸块的部件。

8. 发明申请

WO2006041413A1 POLYMER ENCAPSULATED DICING LANE (PEDL) TECHNOLOGY FOR Cu/LOW/ULTRA-LOW k DEVICES 审中-公开
标题翻译：用于铜/低/超低k器件的POLYMER ENICPSULATED DICING LANE（PEDL）TECHNOLOGY
公开(公告)号：WO2006041413A1
公开(公告)日：2006-04-20
申请号：PCT/SG2005/000345
申请日：2005-10-07
申请人： AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH , KRIPESH, Vaidyanathan , YOON, Seung, Wook , VETRIVEL PERIASAMY, Ganesh
发明人： KRIPESH, Vaidyanathan , YOON, Seung, Wook , VETRIVEL PERIASAMY, Ganesh
IPC分类号： H01L21/304
CPC分类号： H01L24/12 , H01L23/3185 , H01L23/3192 , H01L24/05 , H01L24/11 , H01L24/48 , H01L24/73 , H01L2224/02166 , H01L2224/0231 , H01L2224/0401 , H01L2224/04042 , H01L2224/05548 , H01L2224/05567 , H01L2224/1148 , H01L2224/13022 , H01L2224/13099 , H01L2224/131 , H01L2224/45144 , H01L2224/48463 , H01L2224/48599 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01057 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/1306 , H01L2924/13091 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/00 , H01L2224/05552 , H01L2224/05556 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A process for packaging semiconductor devices for flip chip and wire bond applications, wherein specific material the semiconductor devices are protected during device processing sequences and dicing procedures. After definition the copper interconnect structures [2a] surrounded by a low k insulator layer [4], a protective, first photosensitive polymer layer [6] comprised with a low dielectric constant is applied. Openings are then defined in the f photosensitive polymer layer exposing portions of the top surface of the copper interconnect structures, and a dicing lane opening is defined in materials between copper interconnect. An opening is defined in the second photosensitive polymer layer [9] followed by a placement of the solder ball. A reflow anneal procedure results in the solder wetting only the portion of the exposed redistribution shape. Solder ball, flip chip regions are separated from the bond regions by dicing performed in the dicing lane [7b].
摘要翻译：一种用于封装用于倒装芯片和引线接合应用的半导体器件的方法，其中半导体器件在器件处理序列和切割过程期间被保护。在定义之后，施加由低k绝缘体层[4]包围的铜互连结构[2a]，具有低介电常数的保护性第一光敏聚合物层[6]。然后在f光敏聚合物层中限定露出铜互连结构的顶表面的部分，并且在铜互连之间的材料中限定切割通道开口。在第二光敏聚合物层[9]中限定开口，随后放置焊球。回流退火程序导致焊料仅润湿暴露再分布形状的部分。通过在切割车道中进行的切割将焊球，倒装芯片区域与结合区域分离[7b]。

9. 发明申请

WO00019517A1 SEMICONDUCTOR CHIP AND MANUFACTURE METHOD THEREOF 审中-公开
标题翻译：半导体芯片及其制造方法
公开(公告)号：WO00019517A1
公开(公告)日：2000-04-06
申请号：PCT/JP1999/005285
申请日：1999-09-27
IPC分类号： H01L21/288 , H01L21/60 , H01L23/31 , H01L23/485
CPC分类号： H01L24/12 , H01L21/288 , H01L23/3114 , H01L24/11 , H01L24/16 , H01L2224/05001 , H01L2224/05022 , H01L2224/05023 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11472 , H01L2224/1148 , H01L2224/11822 , H01L2224/11901 , H01L2224/11902 , H01L2224/13022 , H01L2224/13023 , H01L2224/13082 , H01L2224/131 , H01L2224/13609 , H01L2224/16 , H01L2224/73104 , H01L2224/92144 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12033 , H01L2924/12042 , H01L2924/14 , H01L2924/351 , H01L2224/13099 , H01L2924/00
摘要： An aluminum electrode pad (32) of a semiconductor chip (30) is plated with copper to form a via (42), which is so flexible as to absorb the stress produced by the difference in thermal expansion between the semiconductor chip (30) and its substrate (50). Hence the semiconductor chip (30) is mounted highly reliably on the substrate (50), thereby enhancing the connection reliability of the semiconductor chip (30).
摘要翻译：半导体芯片（30）的铝电极焊盘（32）镀有铜以形成通孔（42），该通路（42）是如此柔性的，以便吸收由半导体芯片（30）和其基板（50）。因此，半导体芯片30被高度可靠地安装在基板50上，从而提高半导体芯片30的连接可靠性。

10. 发明申请

WO2015008330A1 感光性樹脂組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置审中-公开
标题翻译：感光树脂组合物，胶粘剂，粘合片，粘合剂图案，带粘合层的半导体滤波器和半导体器件
公开(公告)号：WO2015008330A1
公开(公告)日：2015-01-22
申请号：PCT/JP2013/069303
申请日：2013-07-16
申请人：日立化成株式会社
发明人：峯岸　知典 , 満倉　一行
IPC分类号： G03F7/037 , G03F7/004 , G03F7/027
CPC分类号： C09J179/08 , C09J7/20 , C09J2201/122 , C09J2203/326 , C09J2205/31 , C09J2479/08 , G03F7/027 , G03F7/037 , G03F7/038 , G03F7/0387 , G03F7/0751 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L2224/1132 , H01L2224/1141 , H01L2224/1148 , H01L2224/131 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/13187 , H01L2224/1329 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13355 , H01L2224/13364 , H01L2224/13369 , H01L2224/13387 , H01L2224/1339 , H01L2224/16145 , H01L2224/16227 , H01L2224/27003 , H01L2224/271 , H01L2224/27436 , H01L2224/27515 , H01L2224/27618 , H01L2224/27848 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/2939 , H01L2224/29391 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/81002 , H01L2224/81203 , H01L2224/83002 , H01L2224/83203 , H01L2224/83855 , H01L2224/83856 , H01L2224/83862 , H01L2224/92 , H01L2224/9211 , H01L2224/94 , H01L2924/07025 , H01L2924/066 , H01L2924/0665 , H01L2924/00014 , H01L2924/05442 , H01L2924/00012 , H01L2224/27 , H01L2224/11 , H01L2924/014 , H01L2924/0538 , H01L2924/01044 , H01L2224/81 , H01L2224/83 , H01L21/78
摘要：　本発明は、（Ａ）末端基としてフェノール性水酸基を有するアルカリ可溶性樹脂、（Ｂ）放射線重合性化合物及び（Ｃ）光開始剤を含有する感光性樹脂組成物、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置を提供する。
摘要翻译：本发明提供（A）具有酚羟基作为末端基团的碱溶性树脂，（B）可辐射聚合化合物，和（C）含有光引发剂的感光性树脂组合物。本发明还提供一种粘合片，粘合剂图案，设置有粘合剂层的半导体晶片，半导体器件和使用其的膜粘合剂。

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