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1. 发明申请

WO2014106503A2 METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE STRUCTURE ON A NON-CONDUCTIVE SUBSTRATE MATERIAL, AND ADDITIVE AND SUBSTRATE MATERIAL INTENDED THEREFOR 审中-公开
标题翻译：方法用于生产导电结构体上非导电基底，并在此给出关于添加剂和备份
公开(公告)号：WO2014106503A2
公开(公告)日：2014-07-10
申请号：PCT/DE2013100412
申请日：2013-12-06
申请人： LPKF LASER & ELECTRONICS AG
发明人： KRÜGER ROBIN ALEXANDER , RÖSENER BERND , JOHN WOLFGANG , SCHNOOR ARNE , OSTHOLT ROMAN
IPC分类号： C23C18/16
CPC分类号： C23C18/1868 , C08J3/226 , C08J2323/06 , C08J2323/12 , C08J2375/04 , C08J2467/02 , C08J2467/03 , C08K3/22 , C08K2003/2248 , C08K2003/2272 , C23C18/1608 , C23C18/1612 , C23C18/1639 , C23C18/1641 , C23C18/1642 , C23C18/204 , C23C18/28 , H01B1/02 , H05K3/185 , H05K2201/0236 , H05K2201/0999 , H05K2203/107 , H05K2203/1157 , C08L67/02
摘要： The invention relates to a method for producing an electrically conductive structure, in particular a conducting track, on a non-conductive substrate material, which contains an additive (1) having at least one metal compound. For this purpose, the substrate material is irradiated by means of a laser in order to selectively activate the metal compounds, for example inorganic metal compounds, contained in the additive (1). The metal seeds formed by the activation are then metallized in order to create the electrically conductive structure on the substrate material. Because the additive (1) is provided with an in particular full-surface coating before the additive is introduced into the substrate material, such that the additive (1) is reduced and the coating is oxidized by the laser activation, the reaction partners necessary for the required chemical reaction with the additive (1) are provided by the coating. Because of the thereby significantly reduced interaction with the substrate material, the limitation to certain plastics or plastic groups also is lifted.
摘要翻译：本发明涉及一种用于产生导电结构，特别是一个导体线路，在一个非导电性载体材料，其中包含与至少一种金属化合物的添加剂（1）的方法。载体材料是由激光的手段来激活金属化合物如（1）中包含的添加剂，例如无机选择性照射其上。然后由活化所形成的金属核被金属化，以提供在载体材料上的导电结构。通过将添加剂（1）在载体材料提供有之前引入一个特定的全表面涂层，从而使由激光激活，添加剂（1）被还原和涂层被氧化以被用于与该添加剂所要求的化学反应（1）由包衣提供了必要的反应物。由于与在同一时间所述载体材料得到的基本上减少的相互作用，在某些塑料或塑料基的限制删去。

2. 发明申请

WO2016058594A3 METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE STRUCTURE AND SUPPORT MATERIAL PRODUCED ACCORDING TO SAID METHOD 审中-公开
标题翻译：方法用于生产导电结构体和带有这种方法制成的打底
公开(公告)号：WO2016058594A3
公开(公告)日：2016-06-16
申请号：PCT/DE2015100416
申请日：2015-10-07
申请人： LPKF LASER & ELECTRONICS AG
发明人： KRÜGER ROBIN ALEXANDER , RÖSENER BERND , FENGLER MALTE
IPC分类号： H05K3/18 , C23C18/16 , C23C18/20 , C23C18/30
CPC分类号： C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/204 , C23C18/30 , H05K1/0373 , H05K3/185 , H05K2201/0236 , H05K2201/09118 , H05K2203/107
摘要： The invention relates to a method for producing an electrical conductive structure, in particular a conductor path, on a non-conductive support material which contains an additive having at least one metal compound. Said support material is at least partially exposed to electromagnetic radiation in order to activate the metal compounds contained in the additive, catalytically active germs thus forming in the activated areas with respect to an external, currentless metallization, said germs generating the electrically conductive structure on the non-conductive support material. During the method and prior to metallization, in order to efficiently and economically increase the proportion and the activity of the catalytically active germs, at least one part of the germs in the activated areas is substituted by a chemical exchange reaction by means of at least one catalytically active metal as an exchange metal. Also, the metallization takes place on the exchange metal and the optionally remaining, catalytically active germs in an external currentless metallization bath. As a result, in particular all two-step metallization processes become superfluous due to the fact that the claimed essentially increased catalytic activity allows a simple and fast metallization. The claimed method is suitable, preferably, also for plastic materials as support material which display a lower metallization suitability.
摘要翻译：本发明涉及一种用于产生导电结构，特别是一个导体线路，在一个非导电性载体材料，其包含添加剂，其包括至少一种金属化合物的方法。载体材料部分电磁辐射暴露于激活包含在添加剂，从而形成相对于如此激活区到随后的化学镀，其产生对非导电性载体材料中的导电结构的催化活性核的金属化合物。为了提高效率，在激活区域中的馏分和催化活性核的活动之前的金属化成本的方法的有效性，所述细菌中的至少一部分由至少一种催化活性金属作为替代金属代替通过化学交换反应。因此，金属化的金属置换，并在电金属化浴的任选剩余的催化活性核进行。这使得可以用特别的两步金属化工艺来分配，因为本发明显著增强的催化活性能够容易和快速的金属化。特征在于本发明的方法还优选的是这种塑料作为载体材料，其显示出较低的Metallisierungseignung合适的。

3. 发明申请

WO2014161535A2 METHOD AND DEVICE FOR SEPARATING A SUBSTRATE 审中-公开
标题翻译：用于分离基板的方法和装置
公开(公告)号：WO2014161535A2
公开(公告)日：2014-10-09
申请号：PCT/DE2014100119
申请日：2014-04-03
申请人： LPKF LASER & ELECTRONICS AG
发明人： KRÜGER ROBIN ALEXANDER , AMBROSIUS NORBERT , OSTHOLT ROMAN
IPC分类号： B23K26/00
CPC分类号： C03B33/0222 , B23K26/0006 , B23K26/0057 , B23K26/0619 , B23K26/0624 , B23K26/064 , B23K26/364 , B23K26/402 , B23K2201/40 , B23K2203/50 , B23K2203/54 , B23K2203/56 , C03B33/033 , C03B33/091 , C03C15/00 , C03C17/002 , C03C2218/32
摘要： The invention relates to a method and device for separating a substrate (2) by means of a laser beam (3). The duration of the effect of the laser beam (3) is extremely short such that the substrate (2) is only modified concentrically about the laser beam axis (Z) without it degrading the substrate material. Whilst the laser beam (3) acts upon the substrate (2), said substrate (2) moves relative to a laser machining head (10) such that a plurality of filament-type modifications are produced along a separating surface (5) which is to be incorporated. Said laser beam (3) is initially diverted by a transmission medium (8) having a higher intensity-dependent refractive index than air, and subsequently reaches the substrate (2). As the intensity of the used pulsed laser is not constant but increases to a maximum over the temporal course of the single pulse, and then reduces, the refractive index also changes. The focus point (9a) of the laser beam (3) moves between the outer surfaces (11, 12) of the substrate (2) along the beam axis (Z) such that it reaches the desired modification along the beam axis (Z) without correcting the laser machining head (10) in the z-axis.
摘要翻译：本发明涉及借助激光辐射（3）分离衬底（2）的方法和设备。激光辐射（3）的作用持续时间被选择为非常短，使得仅发生围绕激光束的光束轴（Z）同心地改变衬底（2），而不引起衬底材料的破坏。当激光辐射（3）作用在基底（2）上时，基底（2）相对于激光加工头（10）移动，从而沿着要引入的分型面（5）产生多个丝状改变。激光辐射（3）首先由透射介质（8）引导，透射介质（8）具有比空气更高的依赖折射率的折射率，然后撞击基底（2）。所使用的脉冲激光强度不是恒定的，但是在单个脉冲的时间过程中具有达到最大上升强度然后下降强度的事实，折射率改变。因此，基板（2）沿所述波束轴（Z）的外表面迁移之间的激光辐射（3）（11，12）的聚焦点（9A），使得沿着光束轴（Z）未经激光加工头的跟踪所希望的改性（10）进入Z轴。

4. 发明申请

WO2014161534A2 METHOD AND DEVICE FOR PROVIDING THROUGH-OPENINGS IN A SUBSTRATE AND A SUBSTRATE PRODUCED IN SAID MANNER 审中-公开
标题翻译：方法和装置导入所述中断而导致基材和生产这种衬底
公开(公告)号：WO2014161534A2
公开(公告)日：2014-10-09
申请号：PCT/DE2014100118
申请日：2014-04-03
申请人： LPKF LASER & ELECTRONICS AG
发明人： KRÜGER ROBIN ALEXANDER , AMBROSIUS NORBERT , OSTHOLT ROMAN
IPC分类号： B23K26/00
CPC分类号： B23K26/382 , B23K26/0006 , B23K26/0057 , B23K26/0624 , B23K26/064 , B23K26/402 , B23K2201/40 , B23K2203/50 , B23K2203/54 , B23K2203/56 , H01L21/486 , H01L23/147 , H01L23/15 , H01L23/49827
摘要： The invention relates to a method and device for creating, by means of a laser beam, a plurality of recesses (5) in a substrate (2) which can be used as an interposer, and to a substrate (2) produced in said manner. According to the invention, a laser beam (3) is directed to the surface of a substrate (2). The duration of the effect of the laser beam (3) is extremely short such that the substrate (2) is only modified concentrically about the laser beam axis (Z) without it reaching a recess of the substrate material. Said laser beam (3) is initially diverted by a transmission medium (8) having a higher intensity-dependent refractive index than air, and subsequently reaching the substrate (2). As the intensity of the used pulsed laser is not constant but increases to a maximum over the temporal course of the single pulse, and then reduces, the refractive index also changes. The focus point (9a) of the laser beam (3) moves between the outer surfaces (11, 12) of the substrate (2) along the beam axis (Z) such that it reaches the desired modification along the beam axis (Z) without correcting the laser processing head (10) in the z-axis.
摘要翻译：本发明涉及一种用于通过激光束的装置，以及以这种方式衬底（2）制造的产品中作为内插基板（2）一种使用插入的多个凹部（5）的方法和装置。为了这个目的，在基板（2）的表面上的激光辐射（3）被引导。激光辐射（3）的动作的时段是在这种情况下非常短的选择，使得只在基板的变形例（2）同心的激光束的束轴（Z）发生时，而不存在在基底材料中的凹部。激光辐射（3）通过（8），其具有比空气更大的强度相关的折射率的透射介质最初定向，然后撞击在衬底（2）上。其特征在于，所使用的脉冲激光的强度不是恒定的，而是具有最多上升，然后通过单脉冲，也折射率变化的时间过程落下强度。因此，基板（2）沿所述波束轴（Z）的外表面迁移之间的激光辐射（3）（11，12）的聚焦点（9A），使得沿着光束轴（Z）未经激光加工头的跟踪所希望的改性（10）在来自Z轴。

5. 发明申请

WO2014094729A3 METHOD FOR THE METALLATION OF A WORKPIECE AND A LAYER STRUCTURE MADE UP OF A WORKPIECE AND A METAL LAYER 审中-公开
标题翻译：方法喷镀金属工件与建设工作和一层金属层
公开(公告)号：WO2014094729A3
公开(公告)日：2014-08-14
申请号：PCT/DE2013100405
申请日：2013-12-03
申请人： LPKF LASER & ELECTRONICS AG
发明人： OSTHOLT ROMAN , KRÜGER ROBIN ALEXANDER , RÖSENER BERND , HAUMANN EUGEN
IPC分类号： C25D5/00 , C23C18/16 , C23C18/18 , C23C18/20 , C23C18/30 , C25D5/02 , H05K3/18
CPC分类号： H05K3/181 , B44F3/00 , C23C18/1608 , C23C18/165 , C23C18/1841 , C23C18/2013 , C23C18/204 , C23C18/208 , C23C18/30 , C23C18/31 , C23C18/38 , C25D5/00 , C25D5/02 , H05K1/0296 , H05K3/0014 , H05K3/182 , H05K3/381 , H05K2201/2072 , H05K2203/0113
摘要： The invention relates to a method for the metallation of a workpiece surface. The workpiece surface is provided, in the regions to be metallized, with periodic microstructures (6) that are preferably transfered to the workpiece surface by forming or molding a tool (2) microstructured by means of laser radiation (5). Then at least the microstructured regions of the workpiece surface are metallized in an adhesive manner in order to produce the layer structure.
摘要翻译：本发明涉及一种用于在工件表面的金属化的处理。在区域被设置在工件表面与（6）周期微结构优选地通过转化被金属化或由（5）微结构化工具（2）被转移到工件表面的激光辐射的方式投英寸随后，至少待金属工件表面的微结构化区域和作为层结构粘接生成。

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