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1. 发明申请

WO2014106503A2 METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE STRUCTURE ON A NON-CONDUCTIVE SUBSTRATE MATERIAL, AND ADDITIVE AND SUBSTRATE MATERIAL INTENDED THEREFOR 审中-公开
标题翻译：方法用于生产导电结构体上非导电基底，并在此给出关于添加剂和备份
公开(公告)号：WO2014106503A2
公开(公告)日：2014-07-10
申请号：PCT/DE2013100412
申请日：2013-12-06
申请人： LPKF LASER & ELECTRONICS AG
发明人： KRÜGER ROBIN ALEXANDER , RÖSENER BERND , JOHN WOLFGANG , SCHNOOR ARNE , OSTHOLT ROMAN
IPC分类号： C23C18/16
CPC分类号： C23C18/1868 , C08J3/226 , C08J2323/06 , C08J2323/12 , C08J2375/04 , C08J2467/02 , C08J2467/03 , C08K3/22 , C08K2003/2248 , C08K2003/2272 , C23C18/1608 , C23C18/1612 , C23C18/1639 , C23C18/1641 , C23C18/1642 , C23C18/204 , C23C18/28 , H01B1/02 , H05K3/185 , H05K2201/0236 , H05K2201/0999 , H05K2203/107 , H05K2203/1157 , C08L67/02
摘要： The invention relates to a method for producing an electrically conductive structure, in particular a conducting track, on a non-conductive substrate material, which contains an additive (1) having at least one metal compound. For this purpose, the substrate material is irradiated by means of a laser in order to selectively activate the metal compounds, for example inorganic metal compounds, contained in the additive (1). The metal seeds formed by the activation are then metallized in order to create the electrically conductive structure on the substrate material. Because the additive (1) is provided with an in particular full-surface coating before the additive is introduced into the substrate material, such that the additive (1) is reduced and the coating is oxidized by the laser activation, the reaction partners necessary for the required chemical reaction with the additive (1) are provided by the coating. Because of the thereby significantly reduced interaction with the substrate material, the limitation to certain plastics or plastic groups also is lifted.
摘要翻译：本发明涉及一种用于产生导电结构，特别是一个导体线路，在一个非导电性载体材料，其中包含与至少一种金属化合物的添加剂（1）的方法。载体材料是由激光的手段来激活金属化合物如（1）中包含的添加剂，例如无机选择性照射其上。然后由活化所形成的金属核被金属化，以提供在载体材料上的导电结构。通过将添加剂（1）在载体材料提供有之前引入一个特定的全表面涂层，从而使由激光激活，添加剂（1）被还原和涂层被氧化以被用于与该添加剂所要求的化学反应（1）由包衣提供了必要的反应物。由于与在同一时间所述载体材料得到的基本上减少的相互作用，在某些塑料或塑料基的限制删去。

2. 发明申请

WO2017063899A3 METHOD FOR CREATING PATTERNED COATINGS ON A MOLDED ARTICLE, AND DEVICE FOR CARRYING OUT SAID METHOD 审中-公开
标题翻译：在成型部件上制造结构涂层的方法和装置进行该方法
公开(公告)号：WO2017063899A3
公开(公告)日：2017-06-29
申请号：PCT/EP2016073386
申请日：2016-09-30
申请人： PLASMA INNOVATIONS GMBH , LPKF LASER & ELECTRONICS AG
发明人： BISGES MICHAEL , OSTHOLT ROMAN , RÖSENER BERND , DUNKER DANIEL
IPC分类号： H05K3/10 , C23C24/04 , H05K3/02 , H05K3/14 , H05K13/00
CPC分类号： H05K3/102 , C23C24/106 , H05K3/14 , H05K2203/025 , H05K2203/0522 , H05K2203/081 , H05K2203/088 , H05K2203/095 , H05K2203/107 , H05K2203/1344
摘要： The invention relates to a method for creating patterned coatings on a molded article, in particular for creating metal conductor path structures on non-planar, three-dimensional circuit substrates. In order to devise a subtractive method for the cost-effective mass production of such three-dimensional plastic circuit substrates having metal conductor path structures, the following steps are carried out: - providing a molded article which has a surface comprising a first area and a second area, at least one surface property in the first area of the surface being different from that in the second area; - applying a coating covering at least the first area and the second area to the surface of the molded article, the adhesion of said coating being greater in the first area than in the second area because of the at least one different surface property; and - partially removing the coating by means of a removal process which is applied to the entire coating at a constant removal power that is determined such that the entire coating is removed in the second area while the coating remains in place on the entire surface of each first area. Also disclosed is a device for carrying out said method.
摘要翻译：本发明涉及用于在模制部件上制造结构化涂层的方法，特别是在非平面空间电路载体上制造金属互连结构。为了提供一种用于质量减成法，低成本生产由具有金属导体轨道结构塑料这样的空间的电路载体的，提出了以下步骤： - 提供具有表面包括第一区域和第二区域，其中在所述第一表面上的模具部件从在至少一个表面性质在所述第二区域中的表面区域的差别， - 将涂层施加到所述模制品的表面，至少覆盖所述第一区域和所述第二区域，其中，在所述第一区域中的涂层的粘合力由于所述至少一个不同的表面特性高于第二范围，以及 - 通过应用于整个涂层的消融工艺部分去除涂层，其具有恒定的去除速率，使得涂层i 第二个区域完全移除，并保留在整个区域的第一个区域。另外，给出了用于执行该方法的装置。

3. 发明申请

WO2014094729A3 METHOD FOR THE METALLATION OF A WORKPIECE AND A LAYER STRUCTURE MADE UP OF A WORKPIECE AND A METAL LAYER 审中-公开
标题翻译：方法喷镀金属工件与建设工作和一层金属层
公开(公告)号：WO2014094729A3
公开(公告)日：2014-08-14
申请号：PCT/DE2013100405
申请日：2013-12-03
申请人： LPKF LASER & ELECTRONICS AG
发明人： OSTHOLT ROMAN , KRÜGER ROBIN ALEXANDER , RÖSENER BERND , HAUMANN EUGEN
IPC分类号： C25D5/00 , C23C18/16 , C23C18/18 , C23C18/20 , C23C18/30 , C25D5/02 , H05K3/18
CPC分类号： H05K3/181 , B44F3/00 , C23C18/1608 , C23C18/165 , C23C18/1841 , C23C18/2013 , C23C18/204 , C23C18/208 , C23C18/30 , C23C18/31 , C23C18/38 , C25D5/00 , C25D5/02 , H05K1/0296 , H05K3/0014 , H05K3/182 , H05K3/381 , H05K2201/2072 , H05K2203/0113
摘要： The invention relates to a method for the metallation of a workpiece surface. The workpiece surface is provided, in the regions to be metallized, with periodic microstructures (6) that are preferably transfered to the workpiece surface by forming or molding a tool (2) microstructured by means of laser radiation (5). Then at least the microstructured regions of the workpiece surface are metallized in an adhesive manner in order to produce the layer structure.
摘要翻译：本发明涉及一种用于在工件表面的金属化的处理。在区域被设置在工件表面与（6）周期微结构优选地通过转化被金属化或由（5）微结构化工具（2）被转移到工件表面的激光辐射的方式投英寸随后，至少待金属工件表面的微结构化区域和作为层结构粘接生成。

4. 发明申请

WO2016058594A3 METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE STRUCTURE AND SUPPORT MATERIAL PRODUCED ACCORDING TO SAID METHOD 审中-公开
标题翻译：方法用于生产导电结构体和带有这种方法制成的打底
公开(公告)号：WO2016058594A3
公开(公告)日：2016-06-16
申请号：PCT/DE2015100416
申请日：2015-10-07
申请人： LPKF LASER & ELECTRONICS AG
发明人： KRÜGER ROBIN ALEXANDER , RÖSENER BERND , FENGLER MALTE
IPC分类号： H05K3/18 , C23C18/16 , C23C18/20 , C23C18/30
CPC分类号： C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/204 , C23C18/30 , H05K1/0373 , H05K3/185 , H05K2201/0236 , H05K2201/09118 , H05K2203/107
摘要： The invention relates to a method for producing an electrical conductive structure, in particular a conductor path, on a non-conductive support material which contains an additive having at least one metal compound. Said support material is at least partially exposed to electromagnetic radiation in order to activate the metal compounds contained in the additive, catalytically active germs thus forming in the activated areas with respect to an external, currentless metallization, said germs generating the electrically conductive structure on the non-conductive support material. During the method and prior to metallization, in order to efficiently and economically increase the proportion and the activity of the catalytically active germs, at least one part of the germs in the activated areas is substituted by a chemical exchange reaction by means of at least one catalytically active metal as an exchange metal. Also, the metallization takes place on the exchange metal and the optionally remaining, catalytically active germs in an external currentless metallization bath. As a result, in particular all two-step metallization processes become superfluous due to the fact that the claimed essentially increased catalytic activity allows a simple and fast metallization. The claimed method is suitable, preferably, also for plastic materials as support material which display a lower metallization suitability.
摘要翻译：本发明涉及一种用于产生导电结构，特别是一个导体线路，在一个非导电性载体材料，其包含添加剂，其包括至少一种金属化合物的方法。载体材料部分电磁辐射暴露于激活包含在添加剂，从而形成相对于如此激活区到随后的化学镀，其产生对非导电性载体材料中的导电结构的催化活性核的金属化合物。为了提高效率，在激活区域中的馏分和催化活性核的活动之前的金属化成本的方法的有效性，所述细菌中的至少一部分由至少一种催化活性金属作为替代金属代替通过化学交换反应。因此，金属化的金属置换，并在电金属化浴的任选剩余的催化活性核进行。这使得可以用特别的两步金属化工艺来分配，因为本发明显著增强的催化活性能够容易和快速的金属化。特征在于本发明的方法还优选的是这种塑料作为载体材料，其显示出较低的Metallisierungseignung合适的。

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