专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2003033770A2 SYSTEM AND METHOD FOR ELECTROLYTIC PLATING 审中-公开
标题翻译：电镀技术的系统与方法
公开(公告)号：WO2003033770A2
公开(公告)日：2003-04-24
申请号：PCT/US2002/033530
申请日：2002-10-21
申请人： VIASYSTEMS GROUP, INC.
发明人： KEMPEN, Hein, Van
IPC分类号： C25D
CPC分类号： H05K3/0088 , C25D5/02 , C25D5/024 , C25D5/08 , C25D5/20 , C25D7/123 , C25D17/001 , H05K3/423
摘要： The present invention includes an electrolytic plating system with an elecrolytic plating bath, means for positioning the printed circuit boards in the bath, and means to alternately generate a laminar flow of electrolyte on each side of the printed circuit boards. A preferred means to alternately generate a laminar flow of electolyte comprises a floating shield with a venturi-shaped partition and an aligned partition below the printed circuit boards, and operating a plurality of eductors below the floating shield. The means to alternately generate a laminar flow of electolyte can further comprise a transport mechanism that moves the floating shield and its partitions from side to side relative to the eductors or a mechanism to move the eductors, The plating can be also be improved by using a vibrator and a spring-mounting system that prevents vibration energy being absorbed by fixed portions of the plating system.
摘要翻译：本发明包括具有电解电镀槽的电解电镀系统，用于将印刷电路板定位在电镀槽中的装置，以及在印刷电路板的每一侧交替地产生电解质层流的装置。交替产生电解液的层流的优选方法包括具有文丘里形分隔件的浮动屏蔽和印刷电路板下方的对准隔板，以及在浮动屏蔽下方操作多个喷射器。交替产生电解液的层流的装置还可以包括一个运输机构，该运输机构使浮动屏蔽件及其隔板相对于喷射器从一侧移动到另一侧，或者使喷射器移动的机构。还可以通过使用振动器和弹簧安装系统，其防止振动能被电镀系统的固定部分吸收。

2. 发明申请

WO03005616A3 SYSTEM AND METHOD FOR INTEGRATING OPTICAL LAYERS IN A PCB FOR INTER-BOARD COMMUNICATIONS 审中-公开
标题翻译：用于在板间通信中集成PCB中的光学层的系统和方法
公开(公告)号：WO03005616A3
公开(公告)日：2003-03-20
申请号：PCT/US0219840
申请日：2002-06-24
申请人： VIASYSTEMS GROUP INC
发明人： TOURNE JOSEPH A A M
IPC分类号： G02B6/122 , G02B6/13 , G02B6/138 , G02B6/43 , H05K1/02 , H05K3/00 , H05K3/38 , H05K3/46 , B23K26/00
CPC分类号： G02B6/43 , G02B6/138 , H05K1/0274 , H05K3/0008 , H05K3/0032 , H05K3/4652 , H05K2201/0187 , H05K2201/0195 , H05K2201/09918
摘要： Polymers of differing refraction indices are embedded within a PCB (14) to provide optical connectivity of the PCB (14) with other circuit boards via an optic backplane. The creation of islands of polymer material (12) of refractive index n1 completely surrounded by polymer material (16) with refractive index n2 where n1 has a higher index than n2 allows the islands of n1 indexed polymer to serve as optical waveguides. A process of forming a multi-layered PCB (14) with the optical waveguide islands using successive laminations and using laser ablation to write the optical connection scheme is taught. Further, the use of uniquely marked targets in a copper layer (10, 11) to align the optical waveguides in production is also taught. Additionally, the use of clearing polymer materials and reinforcing polymer voids with prepreg lamination to allow a simple, high tolerance insertion of through-holes is taught.
摘要翻译：折射率不同的聚合物嵌入PCB（14）内，以通过光学背板提供PCB（14）与其他电路板的光学连接。折射率n1的聚合物材料岛（12）的岛的形成完全被具有折射率n2的聚合物材料（16）包围，其中n1具有比n2更高的折射率，允许n1索引聚合物的岛用作光学波导。教导了使用连续叠片和使用激光烧蚀来写入光学连接方案来形成具有光波导岛的多层PCB（14）的过程。此外，还教导了在铜层（10,11）中使用独特标记的靶以在生产中对准光波导。另外，还教导了使用清洁聚合物材料和增强聚合物空隙以及预浸料层压以允许简单，高公差地插入通孔。

3. 发明申请

WO2003101161A2 AN INDOOR-OUTDOOR EQUIPMENT ENCLOSURE AND METHOD FOR ASSEMBLING THE SAME 审中-公开
标题翻译：室内外设备外壳及其组装方法
公开(公告)号：WO2003101161A2
公开(公告)日：2003-12-04
申请号：PCT/US2003/016452
申请日：2003-05-22
申请人： VIASYSTEMS GROUP, INC , WYATT, Brendan , KIERNAN, Barry
发明人： WYATT, Brendan , KIERNAN, Barry
IPC分类号： H05K
CPC分类号： H05K7/183 , H02B1/301
摘要： A cabinet for supporting electronic equipment. The cabinet has a rigidinternal assembly structure and a cladding kit. The internal assembly definesa cavity into which the electronic equipment can be fitted. The internalassembly structure has height, a plurality of posts, and at least two panels.Each of the panels has a plurality of recesses formed therein. At least one postincludes mounting tabs positionable within the recesses formed within thepanels for precisely locating the post with respect to the panels. The cladding kit has at least two post trims connected to the internal assembly structure andat least one panel connected to the post trims. Each of the post trims has a body member, a first connector and a second connector. The first connectorand the second connector of the post trim cooperate to connect the post trimto the posts of the internal assembly structure.
摘要翻译：用于支持电子设备的机柜。机柜具有固定装置结构和包层套件。内部组件定义了可以安装电子设备的腔体。内部组装结构具有高度，多个柱和至少两个面板。每个面板上形成有多个凹部。至少一个后部包括能够定位在形成在所述面板内的凹部内的安装片，用于相对于面板精确定位柱。包层套件具有连接到内部组件结构的至少两个柱后修剪，并且至少一个连接到柱后修剪的面板。每个后装饰件具有主体部件，第一连接器和第二连接器。支柱装饰件的第一连接器和第二连接器配合以将柱塞连接到内部装配结构的柱。

4. 发明申请

WO03033770A3 SYSTEM AND METHOD FOR ELECTROLYTIC PLATING 审中-公开
标题翻译：电镀技术的系统与方法
公开(公告)号：WO03033770A3
公开(公告)日：2003-09-18
申请号：PCT/US0233530
申请日：2002-10-21
申请人： VIASYSTEMS GROUP INC
发明人： KEMPEN HEIN VAN
IPC分类号： C25D5/02 , C25D5/08 , C25D7/00 , C25D17/00 , C25D17/06 , C25D21/10 , H05K3/00 , H05K3/18 , H05K3/42 , C25B9/00 , C25D5/20
CPC分类号： H05K3/0088 , C25D5/02 , C25D5/024 , C25D5/08 , C25D5/20 , C25D7/123 , C25D17/001 , H05K3/423
摘要： The present invention includes an electrolytic plating system with an elecrolytic plating bath, means for positioning the printed circuit boards in the bath, and means to alternately generate a laminar flow of electrolyte on each side of the printed circuit boards. A preferred means to alternately generate a laminar flow of electolyte comprises a floating shield (20) with a venturi-shaped partition (25) and an aligned partition (24) below the printed circuit boards, and operating a plurality of eductors (22) below the floating shield. The means to alternately generate a laminar flow of electrolyte can further comprise a transport mechanism that moves the floating shield and its partitions from side to side relative to the eductors or a mechanism to move the eductors. The plating can be also be improved by using a vibrator and a spring-mounting system that prevents vibration energy being absorbed by fixed portions of the plating system.
摘要翻译：本发明包括具有电解电镀槽的电解电镀系统，用于将印刷电路板定位在电镀槽中的装置，以及在印刷电路板的每一侧交替地产生电解质层流的装置。交替产生电解液层流的优选方法包括在印刷电路板下方具有文丘里形分隔壁（25）和对准的隔板（24）的浮动屏蔽件（20）和在下面操作多个喷射器（22）浮动盾牌。交替地产生电解质层流的装置还可以包括传送机构，其使浮动屏蔽件及其隔板相对于喷射器从一侧移动到另一侧，或移动喷射器的机构。还可以通过使用振动器和弹簧安装系统来改善电镀，该系统防止电镀系统的固定部分吸收的振动能量。

5. 发明申请

WO2003005616A2 SYSTEM AND METHOD FOR INTEGRATING OPTICAL LAYERS IN A PCB FOR INTER-BOARD COMMUNICATIONS 审中-公开
标题翻译：用于在板内通信的PCB中集成光学层的系统和方法
公开(公告)号：WO2003005616A2
公开(公告)日：2003-01-16
申请号：PCT/US2002/019840
申请日：2002-06-24
申请人： VIASYSTEMS GROUP, INC.
发明人： TOURNE, Joseph, A., A., M.
IPC分类号： H04J
CPC分类号： G02B6/43 , G02B6/138 , H05K1/0274 , H05K3/0008 , H05K3/0032 , H05K3/4652 , H05K2201/0187 , H05K2201/0195 , H05K2201/09918
摘要： Polymers of differing refraction indices are embedded within a PCB to provide optical connectivity of the PCB with other circuit boards via an optic backplane. The creation of islands of polymer material of refractive index n1 completely surrounded by polymer material with refractive index n2 where n1 has a higher index than n2 allows the islands of n1 indexed polymer to serve as optical waveguides. A process of forming a multi-layered PCB with the optical waveguide islands using successive laminations and using laser ablation to write the optical connection scheme is taught. Further, the use of uniquely marked targets in a copper layer to align the optical waveguides in production is also taught. Additionally, the use of clearing polymer materials and reinforcing polymer voids with prepreg lamination to allow a simple, high tolerance insertion of through-holes is taught.
摘要翻译：不同折射率的聚合物嵌入在PCB（14）内以通过光学背板提供PCB（14）与其它电路板的光学连接。由折射率n2的聚合物材料（16）完全包围的折射率n1的聚合物材料岛（12）的产生，其中n1具有比n2更高的折射率，可使n1指示的聚合物的岛作为光波导。教导了使用连续层叠形成光波导岛并使用激光烧蚀来写入光学连接方案的多层PCB（14）的工艺。此外，还教导了在铜层（10,11）中唯一标记的目标在生产中对准光波导的用途。另外，教导了利用预浸料层压来清除聚合物材料和增强聚合物空隙，以允许简单，高耐量的通孔插入。

6. 发明申请

WO2005004570A1 METHOD FOR MANUFACTURING A MIDPLANE 审中-公开
标题翻译：制造中间体的方法
公开(公告)号：WO2005004570A1
公开(公告)日：2005-01-13
申请号：PCT/IB2004/002560
申请日：2004-07-08
申请人： VIASYSTEMS GROUP, INC. , HERMKENS, Gerald, A., J. , THEELEN, Roger , SMEETS, Marcel , SPEETJENS, Frank , THOOLEN, Peter, J., M.
发明人： HERMKENS, Gerald, A., J. , THEELEN, Roger , SMEETS, Marcel , SPEETJENS, Frank , THOOLEN, Peter, J., M.
IPC分类号： H05K7/14
CPC分类号： H05K1/18 , H05K3/306 , H05K3/308 , H05K3/4623 , H05K3/4652 , H05K3/4697 , H05K2201/044 , H05K2201/09036 , H05K2201/09127 , H05K2201/09536 , H05K2201/09972 , H05K2201/10189 , H05K2201/1059 , H05K2201/2036 , H05K2203/1572 , Y10S428/901 , Y10T29/49126 , Y10T428/24917
摘要： A method for manufacturing a mid-plane. a multi-layer board having a connection assembly is provided and a layer with a channel formed therein to define a perimeter of a connector area is provided. The layer is bonded to the multi-layer board such that the connector area overlaps the part of the connection assembly of the multi-layer board. At least a portion of the connector area in the layer is removed to expose the connection assembly of the multi-layer board. A rigid multilayer is also disclosed. The rigid multilayer includes a multilayer board and a layer. The multi-layer board has a connection assembly. The layer has a channel formed therein to define a perimeter of a connector area. The layer is bonded to the multi-layer board such that the connector area overlaps the connection assembly of the multilayer board. The connector area can then be removed such as by depth controlled routing. As will be understood by one skilled in the art, the depth tolerance is not critical because the layer is pre-formed with the channel prior to formation of the rigid multi-layer.
摘要翻译：一种制造中平面的方法。提供了具有连接组件的多层板，并且提供了形成在其中以限定连接器区域的周边的通道的层。该层被粘合到多层板上，使得连接器区域与多层板的连接组件的部分重叠。层中的连接器区域的至少一部分被去除以暴露多层板的连接组件。还公开了一种刚性多层。刚性多层包括多层板和层。多层板具有连接组件。该层具有形成在其中的通道，以限定连接器区域的周边。该层被粘合到多层板上，使得连接器区域与多层板的连接组件重叠。然后可以通过深度控制路由来去除连接器区域。如本领域技术人员将理解的那样，深度公差不是关键的，因为在形成刚性多层之前，该层被预先形成有通道。

7. 发明申请

WO2004060035A1 CIRCUIT BOARD HAVING A MULTI-FUNCTIONAL HOLE 审中-公开
标题翻译：具有多功能孔的电路板
公开(公告)号：WO2004060035A1
公开(公告)日：2004-07-15
申请号：PCT/US2003/040346
申请日：2003-12-18
申请人： VIASYSTEMS GROUP, INC. , VAN DER LAAN, Ruud
发明人： VAN DER LAAN, Ruud
IPC分类号： H05K3/42
CPC分类号： H05K3/429 , H05K3/0008 , H05K2201/09063 , H05K2201/096 , H05K2201/09645 , H05K2203/0242 , H05K2203/167 , H05K2203/175 , Y10T29/49165
摘要： A printed circuit board (10), comprising a substrate (12), a first conductor (14) and asecond conductor (16). The substrate having an interior surface (18) defining a hole (20). The first conductor (14) is disposed within the hole (20). The second conductor (16) is disposed within the hole (20). The first conductor (14) is insulated from the second conductor (16).
摘要翻译：一种印刷电路板（10），包括基板（12），第一导体（14）和第二导体（16）。衬底具有限定孔（20）的内表面（18）。第一导体（14）设置在孔（20）内。第二导体（16）设置在孔（20）内。第一导体（14）与第二导体（16）绝缘。

8. 发明申请

WO02061481A3 FIBER OPTIC CIRCUIT BOARD CONNECTOR 审中-公开
标题翻译：光纤电路板连接器
公开(公告)号：WO02061481A3
公开(公告)日：2003-03-27
申请号：PCT/US0150732
申请日：2001-10-29
申请人： VIASYSTEMS GROUP INC
发明人： TOURNE A A M JOSEPH
IPC分类号： G02B6/00 , G02B6/30 , G02B6/36 , G02B6/38 , G02B6/42 , G02B6/43
CPC分类号： G02B6/3887 , G02B6/00 , G02B6/30 , G02B6/3817 , G02B6/3825 , G02B6/3829 , G02B6/3849 , G02B6/3873 , G02B6/3885 , G02B6/389 , G02B6/3897 , G02B6/4201 , G02B6/4206 , G02B6/4249 , G02B6/4292 , G02B6/43
摘要： An optical connector for use in multilayer electro-optic circuit boards. An electro-optical back plane circuit board uses both electrical and optical connectors to carry signals in both electrical and light form. The optical connector employs redundant alignment features to provide for reliable connectivity between plug in boards and the electro-optic back plane. A process is of forming the back plane and other multilevel circuit boards so as to embed optical connectors is disclosed.
摘要翻译：一种用于多层电光电路板的光连接器。电光背板电路板使用电和光连接器以电和光的形式携带信号。光连接器采用冗余对准特征，以提供插入板和电光背板之间的可靠连接。公开了一种形成背板和其它多层电路板以便嵌入光连接器的方法。

9. 发明申请

WO2002061481A2 FIBER OPTIC CIRCUIT BOARD CONNECTOR 审中-公开
标题翻译：光纤电路板连接器
公开(公告)号：WO2002061481A2
公开(公告)日：2002-08-08
申请号：PCT/US2001/050732
申请日：2001-10-29
申请人： VIASYSTEMS GROUP, INC.
发明人： TOURNE, A.A.M., Joseph
IPC分类号： G02B6/36
CPC分类号： G02B6/3887 , G02B6/00 , G02B6/30 , G02B6/3817 , G02B6/3825 , G02B6/3829 , G02B6/3849 , G02B6/3873 , G02B6/3885 , G02B6/389 , G02B6/3897 , G02B6/4201 , G02B6/4206 , G02B6/4249 , G02B6/4292 , G02B6/43
摘要： An optical connector for use in multilayer electro-optic circuit boards. An electro-optical back plane circuit board uses both electrical and optical connectors to carry signals in both electrical and light form. The optical connector employs redundant alignment features to provide for reliable connectivity between plug in boards and the electro-optic back plane. A process is of forming the back plane and other multilevel circuit boards so as to embed optical connectors is disclosed.
摘要翻译：一种用于多层电光电路板的光连接器。电光背板电路板使用电和光连接器以电和光的形式携带信号。光连接器采用冗余对准特征，以提供插入板和电光背板之间的可靠连接。公开了一种形成背板和其它多层电路板以便嵌入光连接器的方法。

10. 发明申请

WO2007086961A3 CIRCUIT BOARD HAVING A MULTI-SIGNAL VIA 审中-公开
标题翻译：具有多个信号的电路板
公开(公告)号：WO2007086961A3
公开(公告)日：2008-05-15
申请号：PCT/US2006041211
申请日：2006-10-20
申请人： VIASYSTEMS GROUP INC , DICKSON JOE D
发明人： DICKSON JOE D
IPC分类号： H05K1/16 , H01R12/04 , H05K1/11
CPC分类号： H05K1/115 , H05K1/114 , H05K3/0047 , H05K3/062 , H05K3/403 , H05K3/42 , H05K2201/0959 , H05K2201/09645 , H05K2203/0207 , H05K2203/0242 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： A method for producing a printed circuit board (10) is described A substrate (12) having a via (16) is provided with the via being coated with a conductive layer defining a perimeter of the via. The conductive layer defining an open via hole. The open via hole is filled with a non-conductive filling material (22). Then, the substrate is planed to remove any residue of the filling material on the surface of the substrate Then, at least two holes (24, 26) are formed in the substrate with each hole overlapping the perimeter of the via and thereby removing a portion of the conductive layer and the filling material whereby the two holes in the substrate cooperate to for at least two electrically isolated segments in the conductive layer.
摘要翻译：描述了一种用于制造印刷电路板（10）的方法。具有通孔（16）的衬底（12）设置有通孔，该导电层限定通孔的周边。导电层限定开放的通孔。打开的通孔填充有非导电填充材料（22）。然后，平铺基板以去除基板表面上的填充材料的任何残余物然后，在基板中形成至少两个孔（24,26），每个孔与通孔的周边重叠，从而去除部分的导电层和填充材料，由此衬底中的两个孔与导电层中的至少两个电隔离段相配合。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式