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    • 3. 发明申请
    • SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
    • 半导体结构及其形成方法
    • WO2012163047A1
    • 2012-12-06
    • PCT/CN2011/082110
    • 2011-11-11
    • TSINGHUA UNIVERSITYWANG, JingGUO, Lei
    • WANG, JingGUO, Lei
    • H01L29/06H01L27/088H01L21/8234
    • H01L21/764H01L21/823412H01L21/823418H01L21/823481
    • A semiconductor structure and a method for forming the same are provided. The semiconductor structure comprises: a substrate (1100); a plurality of convex structures (1200) formed on the substrate (1100), in which every two adjacent convex structures (1200) are separated by a cavity; a plurality of floated films (1300), in which each floated film (1300) is formed between the every two adjacent convex structures (1200) and connected with tops of the every two adjacent convex structures (1200), the floated films (1300) are partitioned into a plurality of sets, a channel layer is formed on a convex structure (1200) between the floated films (1300) in each set, a source region and a drain region are formed on two sides of the channel layer respectively, and an isolation portion (1200) is set between two adjacent sets of floated films (1300); and a gate stack (1400) formed on each channel layer.
    • 提供半导体结构及其形成方法。 半导体结构包括:衬底(1100); 形成在所述基板(1100)上的多个凸起结构(1200),其中每两个相邻凸起结构(1200)由空腔分隔开; 多个浮动膜(1300),其中每个浮动膜(1300)形成在每两个相邻的凸起结构(1200)之间并与每两个相邻凸起结构(1200)的顶部连接,浮动膜(1300) 被划分为多组,在每组中的浮动膜(1300)之间的凸形结构(1200)上形成沟道层,在沟道层的两侧分别形成源极区和漏极区,以及 隔离部分(1200)设置在两组相邻的漂浮膜(1300)之间; 和形成在每个沟道层上的栅叠层(1400)。
    • 4. 发明申请
    • TUNNELING DEVICE AND METHOD FOR FORMING THE SAME
    • 隧道装置及其形成方法
    • WO2012116529A1
    • 2012-09-07
    • PCT/CN2011/076342
    • 2011-06-24
    • TSINGHUA UNIVERSITYCUI, NingLIANG, RenrongWANG, JingXU, Jun
    • CUI, NingLIANG, RenrongWANG, JingXU, Jun
    • H01L29/78H01L21/336
    • H01L29/7391H01L21/26586
    • The present disclosure provides a tunneling device, which comprises: a substrate (1100); a channel region (1300) formed in the substrate, and a source region (1500) and a drain region (1400) formed on two sides of the channel region (1300); and a gate stack (1600) formed on the channel region (1300) and a first side wall (1910) and a second side wall (1920) formed on two sides of the gate stack (1600), wherein the gate stack (1600) comprises: a first gate dielectric layer (1631); at least a first gate electrode (1610) and a second gate electrode (1620) formed on the first gate dielectric layer (1631); a second gate dielectric layer (1632) formed between the first gate electrode (1610) and the first side wall (1910); and a third gate dielectric layer (1633) formed between the second gate electrode (1620) and the second side wall (1920).
    • 本公开提供一种隧道装置,其包括:基板(1100); 形成在所述基板中的沟道区域(1300),以及形成在所述沟道区域(1300)的两侧的源极区域(1500)和漏极区域(1400)。 以及形成在所述沟道区域(1300)上的栅极堆叠(1600)和形成在所述栅极堆叠(1600)的两侧上的第一侧壁(1910)和第二侧壁(1920),其中所述栅极堆叠(1600) 包括:第一栅介质层(1631); 形成在所述第一栅极介电层(1631)上的至少第一栅电极(1610)和第二栅电极(1620)。 形成在第一栅电极(1610)和第一侧壁(1910)之间的第二栅介质层(1632); 和形成在第二栅电极(1620)和第二侧壁(1920)之间的第三栅介质层(1633)。
    • 5. 发明申请
    • SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
    • 半导体结构及其形成方法
    • WO2012163049A1
    • 2012-12-06
    • PCT/CN2011/082112
    • 2011-11-11
    • TSINGHUA UNIVERSITYWANG, JingGUO, Lei
    • WANG, JingGUO, Lei
    • H01L29/06H01L29/24H01L21/8234H01L27/088
    • H01L29/778H01L21/764H01L21/823412H01L21/823418H01L21/823481H01L29/66431
    • A semiconductor structure and a method for forming the same are provided. The semiconductor structure comprises: a Si substrate (1100); a plurality of convex structures (1200) formed on the Si substrate (1100), in which every two adjacent convex structures (1200) are separated by a cavity in a predetermined pattern, and the cavity between every two adjacent convex structures (1200) is less than 50nm in width; a first semiconductor film (1300), in which the first semiconductor film (1300) is formed between the every two adjacent convex structures (1200) and connected with tops of the every two adjacent convex structures (1200); a buffer layer (2100) formed on the first semiconductor film (1300); and a high-mobility III-V compound semiconductor layer (2000) formed on the buffer layer (2100).
    • 提供半导体结构及其形成方法。 半导体结构包括:Si衬底(1100); 形成在Si衬底(1100)上的多个凸起结构(1200),其中每两个相邻凸起结构(1200)以预定图案被空腔隔开,并且每两个相邻凸起结构(1200)之间的空腔是 宽度小于50nm; 第一半导体膜(1300),其中第一半导体膜(1300)形成在每两个相邻的凸起结构(1200)之间并与每两个相邻凸起结构(1200)的顶部连接; 形成在所述第一半导体膜(1300)上的缓冲层(2100); 和形成在缓冲层(2100)上的高迁移率III-V族化合物半导体层(2000)。
    • 10. 发明申请
    • STRAINED GE-ON-INSULATOR STRUCTURE AND METHOD FOR FORMING THE SAME
    • 应变导电绝缘体结构及其形成方法
    • WO2012119418A1
    • 2012-09-13
    • PCT/CN2011/078946
    • 2011-08-25
    • TSINGHUA UNIVERSITYWANG, JingXU, JunGUO, Lei
    • WANG, JingXU, JunGUO, Lei
    • H01L21/336H01L21/20
    • H01L21/76283H01L21/76251H01L29/7843H01L29/7846H01L29/7848H01L29/78684
    • A strained Ge-on-insulator structure is provided, comprising: a silicon substrate (1100), in which an oxide insulating layer (1200) is formed on a surface of the silicon substrate (1100); a Ge layer (1300) formed on the oxide insulating layer (1200), in which a first passivation layer (1400) is formed between the Ge layer (1300) and the oxide insulating layer (1200); a gate stack (1600, 1700) formed on the Ge layer (1300), a channel region formed below the gate stack (1600, 1700), and a source (1800) and a drain (1800) formed on sides of the channel region; and a plurality of shallow trench isolation structures (1900) extending into the silicon substrate (1100) and filled with an insulating dielectric material to produce a strain in the channel region. Further, a method for forming the strained Ge-on-insulator structure is also provided.
    • 提供了一种应变绝缘体上的结构,包括:在硅衬底(1100)的表面上形成氧化物绝缘层(1200)的硅衬底(1100); 形成在氧化物绝缘层(1200)上的Ge层(1300),其中在Ge层(1300)和氧化物绝缘层(1200)之间形成第一钝化层(1400); 形成在Ge层(1300)上的栅极堆叠(1600,1700),形成在栅极叠层(1600,1700)下方的沟道区域,以及形成在沟道区域侧面上的源极(1800)和漏极(1800) ; 以及多个浅沟槽隔离结构(1900),其延伸到硅衬底(1100)中并且填充有绝缘介电材料以在沟道区域中产生应变。 此外,还提供了用于形成应变的绝缘体上Ge的结构的方法。