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1. 发明申请

WO2008019508A1 METHOD AND APPARATUS FOR COUPLING AND DECOUPLING A DEVICE AND A HEAT PIPE 审中-公开
标题翻译：用于联接和解除装置和热管的方法和装置
公开(公告)号：WO2008019508A1
公开(公告)日：2008-02-21
申请号：PCT/CA2007/001461
申请日：2007-08-17
申请人： TIR TECHNOLOGY LP , SCHICK, Philippe , SPEIER, Ingo
发明人： SCHICK, Philippe , SPEIER, Ingo
IPC分类号： B29C65/02 , B23P11/00 , B23P19/00 , F28D15/02
CPC分类号： F28D15/0275 , F28F2013/006 , F28F2013/008 , H01L23/427 , H01L2924/0002 , Y10T29/49352 , H01L2924/00
摘要： The present invention provides a method and apparatus for coupling a device to a heat pipe, wherein a heat transformable material is placed at the location on the heat pipe at which the device is to be coupled. The device is positioned relative to this location and in contact with the heat transformable material and subsequent heat is applied to the end of the heat pipe opposite the coupling location. The external heat which is applied to the heat pipe is transferred along the heat pipe to the proximity of the coupling location. The heat transformable material, undergoes a change due to the application of heat and mates the device with the heat pipe. Upon the removal of the external heat source the heat transformable material changes into a substantially solid state thereby coupling the device to the heat pipe.
摘要翻译：本发明提供了一种用于将装置耦合到热管的方法和装置，其中可热变换材料放置在所述装置将要耦合的热管上的位置处。该装置相对于该位置定位并且与可热转换材料接触，并且随后的热被施加到与联接位置相对的热管的端部。施加到热管的外部热量沿着热管传递到耦合位置附近。热变形材料由于施加热量而发生变化，并将该装置与热管相配合。在去除外部热源时，热变换材料变成基本上固态，从而将该装置耦合到热管。

2. 发明申请

WO2008003167A1 LIGHTING DEVICE PACKAGE 审中-公开
标题翻译：照明设备包
公开(公告)号：WO2008003167A1
公开(公告)日：2008-01-10
申请号：PCT/CA2007/001184
申请日：2007-07-05
申请人： TIR TECHNOLOGY LP , HARRAH, Shane , SPEIER, Ingo , SCHICK, Philippe
发明人： HARRAH, Shane , SPEIER, Ingo , SCHICK, Philippe
IPC分类号： H01L33/00 , H01L21/00 , H01L23/28
CPC分类号： H01L33/56 , H01L33/64 , H01L2224/48465 , H01L2224/73265
摘要： The present invention provides a lighting device package with one or more light-emitting elements operatively coupled to a substrate and a frame disposed at least in part around the one or more light-emitting elements. The frame and substrate define a cavity in which the one or more light-emitting elements are positioned, wherein this cavity can be substantially enclosed by an optically transmissive system. At least a portion of the cavity can be filled with an encapsulation material. The frame defines one or more passageways, wherein each passageway interconnects the cavity with the outside through an outside port. For example, the outside port can be accessible from the ambient when the lighting device package is in an assembled state, thereby enabling fluidic movement of the encapsulation material into and/or out of the cavity.
摘要翻译：本发明提供了一种照明装置封装，其具有可操作地耦合到基板的一个或多个发光元件和至少部分地围绕所述一个或多个发光元件设置的框架。框架和基底限定了一个或多个发光元件定位在其中的空腔，其中该空腔可以被光学透射系统基本上包围。空腔的至少一部分可以用封装材料填充。框架限定一个或多个通道，其中每个通道通过外部端口将空腔与外部相互连接。例如，当照明装置封装处于组装状态时，外部端口可以从环境接近，从而使得封装材料能够流体地移动到和/或离开空腔。

3. 发明申请

WO2006099741A1 SOLID-STATE LIGHTING DEVICE PACKAGE 审中-公开
标题翻译：固态照明设备包装
公开(公告)号：WO2006099741A1
公开(公告)日：2006-09-28
申请号：PCT/CA2006/000442
申请日：2006-03-24
申请人： TIR SYSTEMS LTD. , SPEIER, Ingo , SCHICK, Philippe
发明人： SPEIER, Ingo , SCHICK, Philippe
IPC分类号： H01L23/34 , H01L23/02 , F21V13/04 , H01L25/075 , H01L33/00
CPC分类号： H01L33/642 , H01L25/0753 , H01L25/167 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/648 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： The present invention provides a lighting device package, which can provide a means for efficient thermal access to the lighting device package in addition to a desired level of light extraction from the one or more light-emitting elements within the lighting device package. The lighting device package comprises a substrate having a thermally conductive region to which one or more light-emitting elements are thermally connected, wherein the light-emitting elements may be relatively closely packed. An optical system is optically coupled to one or more light emitting elements, and is positioned relative to the substrate such that the optical system substantially encloses the one or more light-emitting elements on the substrate. The optical system is adapted to extract the light from the one or more light-emitting elements.
摘要翻译：本发明提供了一种照明装置封装，除了从照明器件封装内的一个或多个发光元件提取所需的光级以外，还可以提供用于有效地进入照明器件封装的装置。照明装置封装包括具有导热区域的基板，一个或多个发光元件热连接到该导热区域，其中发光元件可以相对紧密地封装。光学系统光学耦合到一个或多个发光元件，并且相对于基板定位，使得光学系统基本上将衬底上的一个或多个发光元件封闭。光学系统适于从一个或多个发光元件提取光。

4. 发明申请

WO2011072373A1 METHOD AND MAGNETIC TRANSFER STAMP FOR TRANSFERRING SEMICONDUCTOR DICE USING MAGNETIC TRANSFER PRINTING TECHNIQUES 审中-公开
标题翻译：使用磁性传输印刷技术传输半导体数字的方法和磁转印
公开(公告)号：WO2011072373A1
公开(公告)日：2011-06-23
申请号：PCT/CA2010/001950
申请日：2010-12-14
申请人： COOLEDGE LIGHTING INC. , ASHDOWN, Ian , SPEIER, Ingo , SCHICK, Philippe , SHEEN, Calvin Wade
发明人： ASHDOWN, Ian , SPEIER, Ingo , SCHICK, Philippe , SHEEN, Calvin Wade
IPC分类号： H01L21/67 , H01L21/58 , H01L33/00
CPC分类号： H01L24/95 , H01L21/6835 , H01L24/75 , H01L24/83 , H01L2221/6835 , H01L2221/68368 , H01L2221/68381 , H01L2224/2919 , H01L2224/83192 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01058 , H01L2924/0106 , H01L2924/01064 , H01L2924/01066 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01088 , H01L2924/01094 , H01L2924/01105 , H01L2924/0132 , H01L2924/0133 , H01L2924/0665 , H01L2924/14 , H01L2924/1461 , H01L2924/19041 , H01L2924/00 , H01L2924/01027 , H01L2924/01028 , H01L2924/01026
摘要： Releasable semiconductor dice are deposited with a magnetic layer a nd held by magnetic forces to a magnetic or electromagnetic transfer stamp for the transfer of the dice from a host substrate directly or indirectly to a target substrate.
摘要翻译：可释放的半导体管芯被磁性层沉积，并且通过磁力保持在磁性或电磁传递印模上，以将芯片从主体衬底直接或间接地转移到目标衬底。

5. 发明申请

WO2006056066A1 INTEGRATED MODULAR LIGHTING UNIT 审中-公开
标题翻译：集成模块化灯具
公开(公告)号：WO2006056066A1
公开(公告)日：2006-06-01
申请号：PCT/CA2005/001792
申请日：2005-11-29
申请人： TIR SYSTEMS LTD. , ASHDOWN, Ian , JUNGWIRTH, Paul , ROBINSON, Shane, P. , SCHICK, Philippe , SPEIER, Ingo , YORK, Allan, Brent
发明人： ASHDOWN, Ian , JUNGWIRTH, Paul , ROBINSON, Shane, P. , SCHICK, Philippe , SPEIER, Ingo , YORK, Allan, Brent
IPC分类号： H05B33/00 , H05B37/02 , H05B33/12 , F21S2/00
CPC分类号： F21V29/51 , F21S6/00 , F21S6/007 , F21V9/08 , F21V23/0457 , F21V29/004 , F21V29/54 , F21V29/717 , F21V29/763 , F21Y2115/10 , H05B33/0869
摘要： The present invention provides an integrated self-contained lighting module which can be used on its own, or in conjunction with other modules to produce white light, or light of any other colour within the colour spectrum. Each module comprises one or more light-emitting elements, a drive and control system, a feedback system, thermal management system, optical system, and optionally a communication system enabling communication between modules and/or other control systems. Depending on the configuration, the lighting module can operatc autonomously or its functionality can be determined based on either or both internal signals and externally received signals.
摘要翻译：本发明提供一种集成的独立照明模块，其可以单独使用，或与其它模块结合使用以产生白光，或者在色谱范围内的任何其它颜色的光。每个模块包括一个或多个发光元件，驱动和控制系统，反馈系统，热管理系统，光学系统和可选地实现模块和/或其他控制系统之间的通信的通信系统。根据配置，照明模块可以自动操作，或者可以基于内部信号和外部接收信号中的一个或两个来确定其功能。

6. 发明申请

WO2012079177A1 HYBRID ILLUMINATION SYSTEMS AND METHODS 审中-公开
标题翻译：混合照明系统和方法
公开(公告)号：WO2012079177A1
公开(公告)日：2012-06-21
申请号：PCT/CA2011/050779
申请日：2011-12-16
申请人： COOLEDGE LIGHTING INC. , ASHDOWN, Ian , SCHICK, Philippe , SPEIER, Ingo , SCOTT, Wallace
发明人： ASHDOWN, Ian , SCHICK, Philippe , SPEIER, Ingo , SCOTT, Wallace
IPC分类号： F21S19/00 , F21K99/00 , F21V8/00 , H05B37/02
CPC分类号： F21S19/005 , F21S8/06 , F21V7/0083 , F21V23/0464 , F21V23/0471 , F21V23/06 , F21W2131/405 , F21Y2103/10 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , G02C11/04 , G03B15/03 , G03B17/565
摘要： In accordance with certain embodiments, interior spaces are illuminated with a combination of harvested sunlight and artificial light emitted by one or more light- emitting elements.
摘要翻译：根据某些实施例，内部空间被收集的太阳光和由一个或多个发光元件发射的人造光的组合照射。

7. 发明申请

WO2013036561A2 BROAD-AREA LIGHTING SYSTEMS 审中-公开
标题翻译：广域照明系统
公开(公告)号：WO2013036561A2
公开(公告)日：2013-03-14
申请号：PCT/US2012/053841
申请日：2012-09-06
申请人： COOLEDGE LIGHTING, INC. , TISCHLER, Michael , SCHICK, Philippe , SHEEN, Calvin, Wade
发明人： TISCHLER, Michael , SCHICK, Philippe , SHEEN, Calvin, Wade
IPC分类号： H01L25/075 , F21V5/04 , F21V5/00 , F21K99/00
CPC分类号： H05K3/32 , H01L21/6835 , H01L24/24 , H01L24/82 , H01L25/0753 , H01L33/08 , H01L33/44 , H01L33/48 , H01L33/50 , H01L2221/6834 , H01L2221/68363 , H01L2224/16225 , H01L2224/24101 , H01L2224/24227 , H01L2224/245 , H01L2224/24992 , H01L2224/32238 , H01L2224/73204 , H01L2224/82104 , H01L2224/82105 , H01L2224/82138 , H01L2224/82855 , H01L2224/83424 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83486 , H01L2224/96 , H01L2924/01029 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/12042 , H01L2924/15153 , H01L2924/15787 , H05K3/321 , H05K13/00 , Y10T29/49117 , Y10T29/4913 , H01L2924/00014 , H01L2924/01049 , H01L2924/0105 , H01L2924/053 , H01L2224/82 , H01L2924/01013 , H01L2924/01079 , H01L2924/01047 , H01L2924/01078 , H01L2924/00
摘要： In accordance with certain embodiments, illumination systems are formed by aligning light-emitting elements with optical elements and/or disposing light-conversion materials on the light-emitting elements, as well as by providing electrical connectivity to the light-emitting elements
摘要翻译：根据某些实施例，通过将发光元件与光学元件对准和/或在发光元件上设置光转换材料以及通过提供与发光元件的电连接来形成照明系统

8. 发明申请

WO2006105638A1 ELECTRONIC DEVICE PACKAGE WITH AN INTEGRATED EVAPORATOR 审中-公开
标题翻译：具有集成蒸发器的电子设备包装
公开(公告)号：WO2006105638A1
公开(公告)日：2006-10-12
申请号：PCT/CA2006/000492
申请日：2006-04-04
申请人： TIR SYSTEMS LTD. , SCHICK, Philippe
发明人： SCHICK, Philippe
IPC分类号： H01L23/46 , H01L23/02
CPC分类号： F21V29/51 , F21V29/54 , F21V29/83 , F28D15/0275 , F28D15/04 , H01L23/3675 , H01L23/427 , H01L33/648 , H01L2924/0002 , H01L2924/12044 , H05K1/0203 , H05K1/0209 , H05K2201/10106 , H01L2924/00
摘要： The present invention provides an electronic device package that can be fabricated using standard package fabrication technologies while providing a desired level of thermal transfer capability to an attachable thermal management system. The electronic device package according to the present invention comprises a housing that is specifically designed to couple with an evaporator portion of a thermal management system, for example a heat pipe. One or more electronic devices are mounted in thermal contact with the evaporator portion of the thermal management system. Upon completion of the fabrication of the package using standard techniques, the evaporator portion of the electronic device package is operatively coupled with a secondary portion of the thermal management system. In this manner the electronic device package can be fabricated to incorporate a desired thermal management system, while being fabricated using standard package fabrication processes and machinery.
摘要翻译：本发明提供一种可以使用标准封装制造技术制造的电子器件封装，同时向可附接的热管理系统提供期望水平的热传递能力。根据本发明的电子器件封装包括专门设计成与热管理系统（例如热管）的蒸发器部分连接的壳体。一个或多个电子装置与热管理系统的蒸发器部分热接触地安装。在使用标准技术完成封装的制造之后，电子器件封装的蒸发器部分与热管理系统的次级部分可操作地耦合。以这种方式，可以制造电子器件封装以并入期望的热管理系统，同时使用标准封装制造工艺和机械制造。

9. 发明申请

WO2012000114A1 ELECTRONIC DEVICES WITH YIELDING SUBSTRATES 审中-公开
标题翻译：带有焊接基板的电子设备
公开(公告)号：WO2012000114A1
公开(公告)日：2012-01-05
申请号：PCT/CA2011/050399
申请日：2011-06-29
申请人： COOLEDGE LIGHTNING INC. , TISCHLER, Michael , SCHICK, Philippe , ASHDOWN, Ian , SHEEN, Calvin Wade , JUNGWIRTH, Paul
发明人： TISCHLER, Michael , SCHICK, Philippe , ASHDOWN, Ian , SHEEN, Calvin Wade , JUNGWIRTH, Paul
IPC分类号： H01L29/02 , H01L23/488 , H01L29/40
CPC分类号： F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
摘要翻译：根据某些实施例，尽管半导体管芯的表面具有任何非平面性或半导体管芯接触件的非共面性，半导体管芯也用压力激活的粘合剂直接粘附到屈服基底上。

10. 发明申请

WO2007053939A1 PASSIVE THERMAL MANAGEMENT SYSTEM 审中-公开
标题翻译：被动热管理系统
公开(公告)号：WO2007053939A1
公开(公告)日：2007-05-18
申请号：PCT/CA2006/001827
申请日：2006-11-08
申请人： TIR SYSTEMS LTD. , SCHICK, Philippe , JAMES, Daryl
发明人： SCHICK, Philippe , JAMES, Daryl
IPC分类号： F28F1/12 , F21V15/01 , F21V15/06 , F28D1/04
CPC分类号： F21V29/004 , F21V29/713 , F21V29/77 , F21V29/773 , F28D15/0266 , F28D15/0275 , F28F1/14 , F28F1/20 , F28F1/24 , F28F1/32 , F28F1/34
摘要： A traditional passive thermal management system can only be used effectively in a single orientation because it relies on the buoyancy of the heated air to create natural convection. A passive thermal management system is provided which includes means for transferring heat away from a heat source (10) in any orientation. The system comprises a heat pipe (14) which is thermally coupled to the heat source (10). The heat pipe (14) is capable of transferring heat away from the heat source (10), wherein this heat is transferred along the length of the heat pipe (14). Thermally coupled to the heat pipe (14) is a fin system (12), which provides a means for extraction of the heat from the heat pipe (14) and transfer of this heat to the environment thereby dissipating the heat generated at the heat source (10). The fin system (12) is configured to provide a desired level of heat transfer to the environment independent of the orientation of the thermal management system.
摘要翻译：传统的被动热管理系统只能在单一方向上有效使用，因为它依赖于热空气的浮力来产生自然对流。提供了一种被动热管理系统，其包括用于以任何方向从热源（10）传递热量的装置。该系统包括热耦合到热源（10）的热管（14）。热管（14）能够将热量从热源（10）传出，其中该热量沿着热管（14）的长度传送。与热管（14）热耦合的是翅片系统（12），其提供用于从热管（14）提取热量并将热量传递到环境的装置，从而消散在热源处产生的热量（10）。翅片系统（12）被配置为提供与热管理系统的取向无关的所需水平的传热到环境。

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