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    • 3. 发明申请
    • P-DOPING-FREE SCHOTTKY-ON-HETEROJUNCTION LIGHT-EMITTING DIODE AND HIGH-ELECTRON-MOBILITY LIGHT-EMITTING TRANSISTOR
    • 无掺杂的肖特基二极管发光二极管和高电子发光发光晶体管
    • WO2015131846A1
    • 2015-09-11
    • PCT/CN2015/073753
    • 2015-03-06
    • THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    • CHEN, JingLI, BaikuiWANG, JiannongTANG, Xi
    • H01L27/15
    • H01L27/15H01L29/2003H01L29/7787H01L33/0041
    • A p-doping-free Schottky-on-heterojunction light-emitting-diode (SoH-LED) and a high-electron-mobility light-emitting transistor (HEM-LET) including the SoH-LED and integration of HEMT and SoH-LED are described. In an aspect, a light emitting device structure is provided that includes a substrate and a p-doping free heterostructure including a channel layer formed on and adjacent to the substrate and comprising a material with a first bandgap, a barrier layer formed on and adjacent to the channel layer and comprising a material with a second bandgap larger than the first bandgap, and a two-dimensional electron gas (2DEG) channel formed at an interface between the channel layer and the barrier layer. The light emitting device structure further includes a Schottky anode electrode formed on and adjacent to the barrier layer, and an ohmic cathode electrode formed on and adjacent to the barrier layer and electrically coupled to the 2DEG layer.
    • 包含SoH-LED和HEMT和SoH-LED集成的高电子迁移率发光二极管(SoH-LED)和高电子迁移率发光晶体管(HEM-LET)的P型掺杂肖特基 - 异质结发光二极管 被描述。 在一方面,提供了一种发光器件结构,其包括衬底和p掺杂自由异质结构,其包括形成在衬底上并与衬底相邻的沟道层,并且包括具有第一带隙的材料,形成在其上并与之相邻的阻挡层 所述沟道层包括具有大于所述第一带隙的第二带隙的材料,以及形成在所述沟道层和所述势垒层之间的界面处的二维电子气(2DEG)沟道。 发光器件结构还包括形成在势垒层上并与阻挡层相邻的肖特基阳极电极和形成在阻挡层上并与阻挡层相邻并且电耦合到2DEG层的欧姆阴极电极。
    • 5. 发明申请
    • POWER DEVICE WITH INTEGRATED GATE DRIVER
    • 带集成栅极驱动器的电源设备
    • WO2017190652A1
    • 2017-11-09
    • PCT/CN2017/082833
    • 2017-05-03
    • THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    • CHEN, JingTANG, Gaofei
    • H02M1/08H03K17/687
    • A self-bootstrap integrated gate driver circuit with high driving speed, enhanced driving capability and rail-to-rail output. A capacitor (120) and a diode (118) are used with a first inverter (102) coupled to a control signal input terminal, a second inverter (104) coupled to the first inverter (102), a push-pull circuit (106) comprising a pull-up transistor (116) and a pull-down transistor (115) and a power device comprising a power device transistor (108) with a gate. The control signal input at one state controls the first inverter (102) to a first output state, turns on the pull-down transistor (115) to discharge the gate of the power device transistor (108), turns off the power device and charges the capacitor (120) through the diode (118). The control signal input in another state controls the first inverter (102) to a second output state, turns off the pull-down transistor (115) and turns on the pull-up transistor (116) via the capacitor (120) to turn on the power device.
    • 具有高驱动速度,增强驱动能力和轨到轨输出的自引导集成栅极驱动器电路。 电容器(120)和二极管(118)与耦合到控制信号输入端子的第一反相器(102),耦合到第一反相器(102)的第二反相器(104),推挽电路 )包括上拉晶体管(116)和下拉晶体管(115)以及包括具有栅极的功率器件晶体管(108)的功率器件。 在一个状态下的控制信号输入控制第一反相器(102)至第一输出状态,接通下拉晶体管(115)以使功率器件晶体管(108)的栅极放电,关断功率器件并对电荷进行充电 电容器(120)通过二极管(118)。 在另一个状态下输入的控制信号控制第一反相器(102)进入第二输出状态,关断下拉晶体管(115)并通过电容器(120)导通上拉晶体管(116)导通 功率器件。

    • 9. 发明申请
    • SEMICONDUCTOR DEVICE WITH HYBRID CHANNEL CONFIGURATION
    • 具有混合通道配置的半导体器件
    • WO2018033034A1
    • 2018-02-22
    • PCT/CN2017/097326
    • 2017-08-14
    • THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    • CHEN, JingWEI, Jin
    • H01L29/78H01L29/76H01L21/336
    • H01L29/66068H01L29/0865H01L29/1033H01L29/1037H01L29/1095H01L29/41766H01L29/42376H01L29/7802H01L29/7816
    • A semiconductor device (100) as described herein includes a substrate (111), a drift layer (112) formed onto the substrate (111), a trench formed into the drift layer (112) at a first surface of the drift layer (112) opposite the substrate (111), wherein the trench extends into the drift layer (112) to a trench depth and defines respective sidewalls of a mesa region orthogonal to the first surface of the drift layer (112), respective planar body regions (113) positioned in the drift layer (112) at the trench surface, respective planar source regions (114) positioned in the drift layer (112) at the trench surface and encapsulated by the respective planar body regions (113), respective mesa body regions (103) positioned in the mesa structure at the first surface of the drift layer (112), and respective mesa source regions (104) positioned in the mesa structure at the first surface of the drift layer (112) and encapsulated by the respective mesa body regions (103).
    • 本文所述的半导体器件(100)包括衬底(111),形成在衬底(111)上的漂移层(112),形成在漂移层(112)中的沟槽 所述漂移层(112)的与所述衬底(111)相对的第一表面,其中所述沟槽延伸到所述漂移层(112)中至沟槽深度并且限定与所述漂移层(112)的所述第一表面正交的台面区域的相应侧壁 ),位于沟槽表面处的漂移层(112)中的相应的平面本体区域(113),位于沟槽表面处的漂移层(112)中并且由相应的平面本体区域( 位于漂移层(112)的第一表面处的台面结构中的相应台面本体区域(103)以及位于漂移层(112)的第一表面处的台面结构中的相应台面源极区域(104) )并由相应的台面本体区域(103)封装。
    • 10. 发明申请
    • SEMICONDUCTOR DEVICE WITH III-NITRIDE CHANNEL REGION AND SILICON CARBIDE DRIFT REGION
    • 具有III-氮化物沟道区和碳化硅漂移区的半导体器件
    • WO2017071635A1
    • 2017-05-04
    • PCT/CN2016/103726
    • 2016-10-28
    • THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    • CHEN, JingWEI, Jin
    • H01L29/267H01L29/772H01L21/8232
    • H01L29/267H01L21/8258H01L27/0605H01L27/085H01L29/0623H01L29/0646H01L29/1066H01L29/1608H01L29/2003H01L29/207H01L29/4236H01L29/66462H01L29/7786H01L29/7788H01L29/808
    • Techniques are provided for forming a semiconductor device. In an aspect, a semiconductor device (100) is provided that includes a silicon carbide (SiC) structure (102) and a III-nitride structure (104). The SiC structure includes a drain electrode (106), a substrate layer (108) that is formed on the drain electrode and includes SiC, and a drift layer (110) formed on the substrate layer. The drift layer includes p-well regions (112a, 112b) that allow current to flow through a region (134) between the p-well regions. The III-nitride structure includes a set of III-nitride semiconductor layers formed on the SiC structure, a passivation layer (1608) formed on the set of III-nitride semiconductor layers, a source electrode (126) electrically coupled to the p-well regions, and gate electrodes (1606a, 1606b) electrically isolated from the set of III-nitride semiconductor layers. In an aspect, the SiC structure includes a transition layer (111) that includes connecting regions (114a, 114b). In another aspect, the III-nitride structure includes connection electrodes (130a, 130b) electrically coupled to the connecting regions.
    • 提供了用于形成半导体器件的技术。 一方面,提供了一种半导体器件(100),其包括碳化硅(SiC)结构(102)和III族氮化物结构(104)。 SiC结构包括漏电极(106),形成在漏电极上并包括SiC的衬底层(108)以及形成在衬底层上的漂移层(110)。 漂移层包括允许电流流过p阱区之间的区域(134)的p阱区(112a,112b)。 III族氮化物结构包括形成在SiC结构上的一组III族氮化物半导体层,形成在该组III族氮化物半导体层上的钝化层(1608),电耦合到该p阱的源极(126) 区域以及与该组III族氮化物半导体层电隔离的栅电极(1606a,1606b)。 在一个方面,SiC结构包括包含连接区域(114a,114b)的过渡层(111)。 在另一方面,III族氮化物结构包括电连接至连接区域的连接电极(130a,130b)。