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1. 发明申请

WO2007087247A3 WAFER LEVEL CHIP PACKAGING 审中-公开
标题翻译： WAFER LEVEL芯片包装
公开(公告)号：WO2007087247A3
公开(公告)日：2008-01-03
申请号：PCT/US2007001598
申请日：2007-01-22
申请人： TESSERA TECH HUNGARY KFT , OGANESIAN VAGE , GRINMAN ANDREY , ROSENSTEIN CHARLES , HAZANOVICH FELIX , OVRUTSKY DAVID , DAYAN AVI , AKSENTON YULIA , HECHT ILYA , HUMPSTON GILES , NYSTROM MICHAEL J , AVSIAN OSHER , BURTZLAFF ROBERT , REIFEL MITCHELL HAYES
发明人： OGANESIAN VAGE , GRINMAN ANDREY , ROSENSTEIN CHARLES , HAZANOVICH FELIX , OVRUTSKY DAVID , DAYAN AVI , AKSENTON YULIA , HECHT ILYA , HUMPSTON GILES , NYSTROM MICHAEL J , AVSIAN OSHER , BURTZLAFF ROBERT , REIFEL MITCHELL HAYES
IPC分类号： H01L21/50 , B81B7/00 , B81C1/00 , H01L23/10
CPC分类号： B81C1/00269 , B81C2203/0118 , H01L21/50 , H01L23/10 , H01L24/48 , H01L24/73 , H01L27/14618 , H01L27/14687 , H01L31/0203 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/16235 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Packaged microelectronic elements are provided (112). In an exemplary embodiment, a microelectronic element (132) having a front face (26) and a plurality of peripheral edges (119) bounding the front face has a device region (14) at the front face and a contact region (16) with a plurality of exposed contacts (18) adjacent to at least one of the peripheral edges (119). The packaged element may include a plurality of support walls (32) overlying the front' face (26) of the microelectronic element (132) such that a lid (40) can be mounted to the support walls (32) above the microelectronic element (132). For example, the lid (40) may have an inner surface (22) confronting the front face (26). In a particular embodiment, some of the contacts (18) can be exposed beyond edges (140) of the lid (40).
摘要翻译：提供封装的微电子元件（112）。在示例性实施例中，具有前表面（26）和限定前表面的多个周边边缘（119）的微电子元件（132）在前表面具有一个器件区域（14）和一个具有与所述周边边缘（119）中的至少一个相邻的多个暴露的触点（18）。封装元件可以包括覆盖微电子元件（132）的前面（26）的多个支撑壁（32），使得盖子（40）可以安装到微电子元件上方的支撑壁（32）上 132）。例如，盖（40）可以具有与前表面（26）相对的内表面（22）。在特定实施例中，一些触点（18）可以暴露在盖（40）的边缘（140）之外。

2. 发明申请

WO2007087249A2 WAFER LEVEL PACKAGING TO LIDDED CHIPS 审中-公开
标题翻译：水平包装到吊灯
公开(公告)号：WO2007087249A2
公开(公告)日：2007-08-02
申请号：PCT/US2007001608
申请日：2007-01-22
申请人： TESSERA TECH HUNGARY KFT , HUMPSTON GILES , NYSTROM MICHAEL J , OGANESIAN VAGE , AKSENTON YULIA , AVSIAN OSHER , BURTZLAFF ROBERT , DAYAN AVI , GRINMAN ANDREY , HAZANOVICH FELIX , HECHT ILYA , ROSENSTEIN CHARLES , OVRUTSKY DAVID
发明人： HUMPSTON GILES , NYSTROM MICHAEL J , OGANESIAN VAGE , AKSENTON YULIA , AVSIAN OSHER , BURTZLAFF ROBERT , DAYAN AVI , GRINMAN ANDREY , HAZANOVICH FELIX , HECHT ILYA , ROSENSTEIN CHARLES , OVRUTSKY DAVID
IPC分类号： H01L23/10 , B81C1/00 , H01L21/50
CPC分类号： B81C1/00285 , B81C2203/0118 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/1461 , H01L2924/16235 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： Methods are provided for making a plurality of lidded microelectronic elements (112). In an exemplary embodiment, a lid wafer (11) is assembled with a device wafer (10). Desirably, the lid wafer (11) is severed into a plurality of lid elements (40) to remove portions (46) of the lid wafer (11) overlying contacts (18) at a front face (26) of the device wafer (10) adjacent to dicing lanes (19) of the device wafer (10). Thereafter, desirably, the device wafer (10) is severed along the dicing lanes (19) to provide a plurality of lidded microelectronic elements (112).
摘要翻译：提供了制造多个带盖的微电子元件（112）的方法。在示例性实施例中，盖晶片（11）与装置晶片（10）组装。理想地，盖晶片（11）被切割成多个盖元件（40），以去除覆盖在晶片（10）的装置晶片（10）的前表面（26）处的触点（18）的部分（46））与器件晶片（10）的切割通道（19）相邻。此后，期望地，器件晶片（10）沿着切割通道（19）切断，以提供多个带盖的微电子元件（112）。

3. 发明申请

WO2008054660A3 WAFER-LEVEL FABRICATION OF LIDDED CHIPS WITH ELECTRODEPOSITED DIELECTRIC COATING 审中-公开
标题翻译：电沉积电介质涂层晶片的晶片级制备
公开(公告)号：WO2008054660A3
公开(公告)日：2008-07-31
申请号：PCT/US2007022518
申请日：2007-10-23
申请人： TESSERA TECH HUNGARY KFT , OGANESIAN VAGE , GRINMAN ANDREY , ROSENSTEIN CHARLES , HAZANOVICH FELIX , OVRUTSKY DAVID , DAYAN AVI , AKSENTON YULIA , HECHT ILYA , HABA BELGACEM , HUMPSTON GILES
发明人： OGANESIAN VAGE , GRINMAN ANDREY , ROSENSTEIN CHARLES , HAZANOVICH FELIX , OVRUTSKY DAVID , DAYAN AVI , AKSENTON YULIA , HECHT ILYA , HABA BELGACEM , HUMPSTON GILES
IPC分类号： H01L23/538
CPC分类号： H01L23/3114 , H01L21/6836 , H01L23/481 , H01L24/06 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/48 , H01L24/94 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L31/0203 , H01L31/02325 , H01L2221/68327 , H01L2224/0231 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/11334 , H01L2224/114 , H01L2224/1147 , H01L2224/116 , H01L2224/13022 , H01L2224/13099 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/274 , H01L2224/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07811 , H01L2924/10253 , H01L2924/12044 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/351 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A unit including a semiconductor element, e.g., a chip-scale package (350, 1350) or an optical sensor unit (10) is fabricated. A semiconductor element (300) has semiconductive or conductive material (316) exposed at at least one of the front (302) and rear surfaces (114) and conductive features (310) exposed thereat which are insulated from the semiconductive or conductive material. By electrodeposition, an insulative layer (304) is formed to overlie the at least one of exposed semiconductive material or conductive material. Subsequently, a plurality of conductive contacts (308) and a plurality of conductive traces (306) are formed overlying the electrodeposited insulative layer (304) which connect the conductive features (310) to the conductive contacts (308). An optical sensor unit (10) can be incorporated in a camera module (1030) having an optical element (1058) in registration with an imaging area (1026) of the semiconductor element (1000).
摘要翻译：制造包括半导体元件（例如，芯片级封装（350,1350）或光学传感器单元（10））的单元。半导体元件（300）具有暴露在正面（302）和背面（114）中的至少一个处的半导体或导电材料（316）以及暴露在其处的与半导体或导电材料绝缘的导电特征（310）。通过电沉积，形成绝缘层（304）以覆盖暴露的半导体材料或导电材料中的至少一个。随后，多个导电触点（308）和多个导电迹线（306）形成为覆盖将导电部件（310）连接到导电触点（308）的电沉积绝缘层（304）。光学传感器单元（10）可以包含在具有与半导体元件（1000）的成像区域（1026）配准的光学元件（1058）的相机模块（1030）中。

4. 发明申请

WO2009020572A3 STACK PACKAGES USING RECONSTITUTED WAFERS 审中-公开
标题翻译：堆叠包装使用重复晶圆
公开(公告)号：WO2009020572A3
公开(公告)日：2009-05-22
申请号：PCT/US2008009353
申请日：2008-08-01
申请人： TESSERA TECH HUNGARY KFT , TESSERA INC , AVSIAN OSHER , GRINMAN ANDREY , HUMPSTON GILES , MARGALIT MOTI
发明人： AVSIAN OSHER , GRINMAN ANDREY , HUMPSTON GILES , MARGALIT MOTI
IPC分类号： H01L21/98 , H01L23/538 , H01L25/065
CPC分类号： H01L25/00 , H01L21/50 , H01L21/568 , H01L24/24 , H01L24/73 , H01L25/0657 , H01L25/50 , H01L2224/12105 , H01L2224/16225 , H01L2224/24145 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06513 , H01L2225/06524 , H01L2225/06551 , H01L2225/06582 , H01L2924/01078 , H01L2924/12042 , H01L2924/15311 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A stacked microelectronic unit (80) is provided which has a top surface (34) and a bottom surface remote from the top surface and a plurality of vertically stacked microelectronic elements (12, 12A) therein, including at least one microelectronic element (12A) having a front face (14A) adjacent to the top surface and a rear face (16A) oriented towards the bottom surface. Each of the microelectronic elements (12, 12A) has traces (24, 24A) extending from contacts (22, 22A) at the front face beyond edges of the microelectronic element. A dielectric layer (116) contacts edges of the microelectronic elements and underlies the rear face of the at least one microelectronic element. Leads are connected to the traces (24, 24A) extending along the dielectric layer (116). Unit contacts (74), exposed at the top surface, are connected to the leads (66).
摘要翻译：提供堆叠微电子单元（80），其具有远离顶表面的顶表面（34）和底表面以及其中包括至少一个微电子元件（12A）的多个垂直堆叠微电子元件（12,12A）具有与顶面相邻的前面（14A）和面向底面的后面（16A）。微电子元件（12,12A）中的每一个具有从正面处的触点（22,22A）延伸超过微电子元件的边缘的迹线（24,24A）。介电层（116）接触微电子元件的边缘并位于至少一个微电子元件的背面之下。引线连接到沿电介质层（116）延伸的迹线（24,24A）。暴露在顶表面的单元触点（74）连接到引线（66）。

5. 发明申请

WO2009020572A8 STACK PACKAGES USING RECONSTITUTED WAFERS 审中-公开
标题翻译：使用重构波形的堆栈包
公开(公告)号：WO2009020572A8
公开(公告)日：2010-03-18
申请号：PCT/US2008009353
申请日：2008-08-01
申请人： TESSERA TECH HUNGARY KFT , TESSERA INC , AVSIAN OSHER , GRINMAN ANDREY , HUMPSTON GILES , MARGALIT MOTI
发明人： AVSIAN OSHER , GRINMAN ANDREY , HUMPSTON GILES , MARGALIT MOTI
IPC分类号： H01L21/98 , H01L23/538 , H01L25/065
CPC分类号： H01L25/00 , H01L21/50 , H01L21/568 , H01L24/24 , H01L24/73 , H01L25/0657 , H01L25/50 , H01L2224/12105 , H01L2224/16225 , H01L2224/24145 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06513 , H01L2225/06524 , H01L2225/06551 , H01L2225/06582 , H01L2924/01078 , H01L2924/12042 , H01L2924/15311 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A stacked microelectronic unit (80) is provided which has a top surface (34) and a bottom surface remote from the top surface and a plurality of vertically stacked microelectronic elements (12, 12A) therein, including at least one microelectronic element (12A) having a front face (14A) adjacent to the top surface and a rear face (16A) oriented towards the bottom surface. Each of the microelectronic elements (12, 12A) has traces (24, 24A) extending from contacts (22, 22A) at the front face beyond edges of the microelectronic element. A dielectric layer (116) contacts edges of the microelectronic elements and underlies the rear face of the at least one microelectronic element. Leads are connected to the traces (24, 24A) extending along the dielectric layer (116). Unit contacts (74), exposed at the top surface, are connected to the leads (66).
摘要翻译：提供堆叠的微电子单元（80），其具有顶表面（34）和远离顶表面的底表面和其中的多个垂直堆叠的微电子元件（12,12A），其包括至少一个微电子元件（12A）具有与顶表面相邻的前表面（14A）和朝向底表面定向的后表面（16A）。微电子元件（12,12A）中的每一个具有从位于微电子元件的边缘的前面的触点（22,22A）延伸的迹线（24,24A）。电介质层（116）接触微电子元件的边缘并且位于至少一个微电子元件的后表面之下。引线连接到沿着电介质层（116）延伸的迹线（24,24A）。在顶表面暴露的单元触点（74）连接到引线（66）。

6. 发明申请

WO2010104610A3 STACKED MICROELECTRONIC ASSEMBLY WITH MICROELECTRONIC ELEMENTS HAVING VIAS EXTENDING THROUGH BOND PADS 审中-公开
标题翻译：具有通过粘结垫延伸的VIAS的微电子元件的堆叠微电子组件
公开(公告)号：WO2010104610A3
公开(公告)日：2011-01-13
申请号：PCT/US2010000777
申请日：2010-03-12
申请人： TESSERA TECHNOLOGIES HUNGARY KFT , KRIMAN MOSHE , AVSIAN OSHER , HABA BELGACEM , HUMPSTON GILES , BURSHTYN DMITRI
发明人： KRIMAN MOSHE , AVSIAN OSHER , HABA BELGACEM , HUMPSTON GILES , BURSHTYN DMITRI
IPC分类号： H01L21/98 , H01L21/768 , H01L23/48 , H01L25/065
CPC分类号： H01L25/0657 , H01L21/76805 , H01L23/481 , H01L25/50 , H01L2224/02371 , H01L2224/0401 , H01L2224/13024 , H01L2224/24145 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2924/1461 , H01L2924/00
摘要： A cover assembly for a Lithium-ion battery container to improve the durability of the battery. A high pressure injection molded polymer is combined with flanges disposed on the current collecting posts of the battery to provide an improved seal for the battery cover, especially at the interface of the cover and the current collecting posts. The injection molded polymer is fused to the flanges, current collecting posts and container cover to result in a diffusion path of increased length for gases and/or liquids which are known to enter or escape from battery containers. Additional polymer layers can be applied to the assembly to further improve the seal.
摘要翻译：一种用于锂离子电池容器的盖组件，用于提高电池的耐久性。高压注塑聚合物与设置在电池的集流柱上的凸缘组合，为电池盖提供改进的密封，特别是在盖和集流柱的界面处。注塑聚合物与凸缘，集流柱和容器盖融合，以产生已知从电池容器进入或逸出的气体和/或液体的长度增大的扩散路径。另外的聚合物层可以施加到组件上以进一步改善密封。

7. 发明申请

WO2010104610A8 STACKED MICROELECTRONIC ASSEMBLY WITH MICROELECTRONIC ELEMENTS HAVING VIAS EXTENDING THROUGH BOND PADS 审中-公开
标题翻译：具有通过粘结垫延伸的VIAS的微电子元件的堆叠微电子组件
公开(公告)号：WO2010104610A8
公开(公告)日：2011-11-17
申请号：PCT/US2010000777
申请日：2010-03-12
申请人： TESSERA INC , KRIMAN MOSHE , AVSIAN OSHER , HABA BELGACEM , HUMPSTON GILES , BURSHTYN DMITRI
发明人： KRIMAN MOSHE , AVSIAN OSHER , HABA BELGACEM , HUMPSTON GILES , BURSHTYN DMITRI
IPC分类号： H01L21/98 , H01L21/768 , H01L23/48 , H01L25/065
CPC分类号： H01L25/0657 , H01L21/76805 , H01L23/481 , H01L25/50 , H01L2224/02371 , H01L2224/0401 , H01L2224/13024 , H01L2224/24145 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2924/1461 , H01L2924/00
摘要： A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements (101, 102). Each of the first and second microelectronic elements can include a conductive layer (610) extending along a face (608) of such microelectronic element. At least one of the first and second microelectronic elements can include a recess (618) extending from the rear surface towards the front surface, and a conductive via (605) extending from the recess through the bond pad (603) and electrically connected to the bond pad, with a conductive layer (610) connected to the via and extending along a rear face (608) of the microelectronic element (101, 102) towards an edge (620) of the microelectronic element. A plurality of leads (224) can extend from the conductive layers (610) of the first and second microelectronic elements and a plurality of terminals (616) of the assembly can be electrically connected with the leads.
摘要翻译：提供堆叠的微电子组件，其包括第一和第二堆叠的微电子元件（101,102）。第一和第二微电子元件中的每一个可以包括沿着这种微电子元件的面（608）延伸的导电层（610）。第一和第二微电子元件中的至少一个可以包括从后表面朝向前表面延伸的凹槽（618），以及从凹部穿过接合焊盘（603）延伸并电连接到接合焊盘，其中导电层（610）连接到通孔并且沿着微电子元件（101,102）的后表面（608）朝着微电子元件的边缘（620）延伸。多个引线（224）可以从第一和第二微电子元件的导电层（610）延伸，并且组件的多个端子（616）可以与引线电连接。

8. 发明申请

WO2007059193A2 LOW PROFILE IMAGE SENSOR PACKAGE 审中-公开
标题翻译：低剖面图像传感器包装
公开(公告)号：WO2007059193A2
公开(公告)日：2007-05-24
申请号：PCT/US2006044301
申请日：2006-11-14
申请人： TESSERA INC , HUMPSTON GILES , NYSTROM MICHAEL J
发明人： HUMPSTON GILES , NYSTROM MICHAEL J
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L2224/48091 , H01L2224/48464 , H01L2924/00014
摘要： A microelectronic element such as an imaging semiconductor chip (72) is packaged by bonding a lid wafer (20') having recesses (32) open to its bottom surface to a device wafer (50) including a plurality of the microelectronic elements or chips, so that the recesses overlie active regions such as imaging regions (58) of the device wafer. Where the devices include microlenses (60) associated with an imaging region of each chip, the microlenses may be received in the recesses. Land regions (24') of the lid wafer may be disposed very close to the top surface (52) of the device wafer, as for example, abutting the top surface of the device wafer or separated from such top surface only by an extremely thin coating of a bonding material such as an adhesive or solder. The bonded lid wafer and device wafer may be severed to form individual units (70) . The top surface (22) of the lid wafer may be precisely parallel with the top surface of the device wafer.
摘要翻译：诸如成像半导体芯片（72）的微电子元件通过将具有其底表面开口的凹口（32）的盖晶片（20'）结合到包括多个微电子元件或芯片的器件晶片（50）而被封装，使得凹槽覆盖诸如器件晶片的成像区域（58）的有源区域。在装置包括与每个芯片的成像区域相关联的微透镜（60）的情况下，微透镜可以被容纳在凹部中。盖晶片的区域（24'）可以非常靠近器件晶片的顶表面（52）设置，例如，邻接器件晶片的顶表面或与顶表面分离，仅极薄粘合材料如粘合剂或焊料的涂覆。接合的盖子晶片和器件晶片可以被切断以形成单独的单元（70）。盖晶片的顶表面（22）可以精确地平行于器件晶片的顶表面。

9. 发明申请

WO2007103224A3 STRUCTURE AND METHOD OF MAKING LIDDED CHIPS 审中-公开
标题翻译：结构及其制作方法
公开(公告)号：WO2007103224A3
公开(公告)日：2008-02-14
申请号：PCT/US2007005456
申请日：2007-03-01
申请人： TESSERA INC , TUCKERMAN DAVID B , HUMPSTON GILES , NYSTROM MICHAEL J , GOUDGE CHARLES LIAM , WOLL ANITA
发明人： TUCKERMAN DAVID B , HUMPSTON GILES , NYSTROM MICHAEL J , GOUDGE CHARLES LIAM , WOLL ANITA
IPC分类号： H01L21/50 , B81B7/00 , B81C1/00 , H01L23/10
CPC分类号： B81C1/00301 , B81B2207/095 , B81C2203/0118 , C04B2237/366 , H01L27/14618 , H01L31/0203 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/11334 , H01L2224/32225 , H01L2224/48227 , H01L2224/4824 , H01L2224/73265 , H01L2224/8592 , H01L2924/01322 , H01L2924/01327 , H01L2924/07811 , H01L2924/10253 , H01L2924/1461 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： Methods are provided for fabricating packaged chips (2901) having protective layers, e.g., lids (2912) or other overlying layers (2903) having transparent, partially transparent, or opaque characteristics or a combination of such characteristics. Methods are provided for fabricating the packaged chips. Lidded chip structures (2901) and assemblies (3031) including lidded chips are also provided.
摘要翻译：提供了用于制造具有保护层的封装芯片（2901）的方法，例如具有透明，部分透明或不透明特性或这些特性的组合的盖（2912）或其它覆盖层（2903）。提供了制造封装芯片的方法。还提供了包括带芯芯片的芯片结构（2901）和组件（3031）。

10. 发明申请

WO2005086532A3 PACKAGED ACOUSTIC AND ELECTROMAGNETIC TRANSDUCER CHIPS 审中-公开
标题翻译：包装声音和电磁传感器卡
公开(公告)号：WO2005086532A3
公开(公告)日：2006-01-26
申请号：PCT/US2005006565
申请日：2005-03-01
申请人： TESSERA INC , HUMPSTON GILES , OSBORN PHILIP R , THOMPSON JESSE BURL , KUBOTA YOICHI , TSENG CHUNG-CHUAN , BURTZLAFF ROBERT , HABA BELGACEM , TUCKERMAN DAVID B , WARNER MICHAEL
发明人： HUMPSTON GILES , OSBORN PHILIP R , THOMPSON JESSE BURL , KUBOTA YOICHI , TSENG CHUNG-CHUAN , BURTZLAFF ROBERT , HABA BELGACEM , TUCKERMAN DAVID B , WARNER MICHAEL
IPC分类号： B81B7/00 , H01L23/495 , H04R19/00 , H04R19/04
CPC分类号： B81B7/0077 , B81B2201/0257 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/05568 , H01L2224/05624 , H01L2224/16 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/07811 , H01L2924/09701 , H01L2924/10155 , H01L2924/10253 , H01L2924/12041 , H01L2924/19041 , H01L2924/3025 , H04R19/005 , H01L2924/00 , H01L2924/00014
摘要： Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed to one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chop and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of the said device and from said device.
摘要翻译：本文公开了封装芯片的各种实施例及其制造方法。本文公开的一种这样的封装芯片包括具有前表面，与正面相对的后表面的芯片和在前表面和后表面中的一个处的器件，该器件可操作为声能和电磁能中的至少一个的换能器并且所述芯片包括暴露于所述前表面和后表面中的一个的多个接合焊盘。封装芯片包括具有介电元件和设置在电介质元件上的金属层的封装元件，封装元件具有面向斩波的内表面和背离芯片的外表面。金属层包括暴露在内表面和外表面中的至少一个的多个触点，触点导电地连接到接合焊盘。金属层还包括第一开口，用于沿着所述装置和所述装置中的至少一个的方向通过声能和电磁能中的至少一个。

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