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    • 6. 发明申请
    • METHOD OF PROGRAMMING, READING AND ERASING MEMORY-DIODE IN A MEMORY-DIODE ARRAY
    • 存储二极管阵列中编程,读取和擦除存储器二极管的方法
    • WO2006071683A1
    • 2006-07-06
    • PCT/US2005/046406
    • 2005-12-20
    • SPANSION LLCBILL, Colin, S.KAZA, SwaroopFANG, Tzu-NingSPITZER, Stuart
    • BILL, Colin, S.KAZA, SwaroopFANG, Tzu-NingSPITZER, Stuart
    • G11C16/10
    • G11C11/36
    • A memory array (140) includes first and second sets of conductors (142), (144) and a plurality of memory-diodes (130), each connecting in a forward direction a conductor (BL) of the first set (142) with a conductor (WL) of the second set (144). An electrical potential is applied across a selected memory-diode (130), from higher to lower potential in the forward direction, intended to program the selected memory-diode (130). During this intended programming, each other memory-diode (130) in the array (140) has provided thereacross in the forward direction thereof an electrical potential lower than its threshold voltage. The threshold voltage of each memory-diode (130) can be established by applying an electrical potential across that memory-diode (130) from higher to lower potential in the reverse direction. By so establishing a sufficient threshold voltage, and by selecting appropriate electrical potentials applied to conductors of the array (140), problems related to current leakage and disturb are avoided.
    • 存储器阵列(140)包括第一和第二组导体(142),(144)和多个存储器二极管(130),每个存储器二极管(130)在前向方向上与第一组(142)的导体(BL) 第二组(144)的导体(WL)。 在所选择的存储器二极管(130)上施加电势,从正向上的较高电位到较低的电位,用于对所选择的存储器二极管(130)进行编程。 在该期望的编程期间,阵列(140)中的每个其它存储器二极管(130)在其正向方向上提供了低于其阈值电压的电位。 每个存储二极管(130)的阈值电压可以通过在该存储二极管(130)上施加从相反方向的较高电位到较低电位的电位来建立。 通过这样建立足够的阈值电压,并且通过选择施加到阵列(140)的导体的适当电势,避免了与电流泄漏和干扰有关的问题。
    • 9. 发明申请
    • VERTICAL JFET AS USED FOR SELECTIVE COMPONENT IN A MEMORY ARRAY
    • 用于存储阵列中选择性组件的垂直JFET
    • WO2006029280A1
    • 2006-03-16
    • PCT/US2005/032027
    • 2005-09-07
    • SPANSION LLCBILL, Colin, S.VANBUSKIRK, Michael, A.
    • BILL, Colin, S.VANBUSKIRK, Michael, A.
    • H01L27/10H01L27/098
    • H01L27/10H01L27/098
    • Systems and methods are disclosed that facilitate providing a selective functionality to a polymer memory cell (602) in a memory array while increasing device density in the memory cell array. A vertical JFET (400, 500, 604, 700, 800, 900) is described to which voltages can be selectively applied to control internal current flow there through, which in turn can be employed to manipulate the state of a polymer memory cell (602) coupled to the vertical JFET (400, 500, 604, 700, 800, 900). By mitigating gaps between gates (402, 504, 606, 704, 804, 906), or wordlines (606, 906), and drains (404, 506, 706, 806) of the vertical JFETs (400, 500, 604, 700, 800, 900), feature size can be reduced to permit increased device density. Furthermore, vertical JFETs (400, 500, 604, 700, 800, 900) in the array can be coupled to gates (402, 504, 606, 704, 804, 906) on only two opposite sides, permitting the JFETs (400, 500, 604, 700, 800, 900) to be arranged without gate crossbars between them, further increasing device density. In this manner, the present invention provides switching characteristics to a memory cell and overcomes problematic bulkiness associated with conventional MOS devices.
    • 公开了系统和方法,其有助于提供存储器阵列中的聚合物存储器单元(602)的选择性功能,同时增加存储器单元阵列中的器件密度。 描述了可以选择性地施加电压以控制其中的内部电流的垂直JFET(400,500,600,700,800,900),其可以用于操纵聚合物存储器单元(602 )耦合到垂直JFET(400,500,600,700,800,900)。 通过减轻垂直JFET(400,500,604,700)的门(402,504,606,704,806)或字线(606,906)和漏极(404,506,706,806)之间的间隙 ,800,900),可以减小特征尺寸以允许增加装置密度。 此外,阵列中的垂直JFET(400,500,604,700,800,900)可以仅在两个相对侧耦合到栅极(402,504,606,704,804,906),从而允许JFET(400, 500,604,700,800,900),以便在它们之间没有栅极交叉杆,从而进一步增加了器件密度。 以这种方式,本发明向存储器单元提供开关特性,并且克服了与常规MOS器件相关的有问题的体积性。
    • 10. 发明申请
    • ERASING AND PROGRAMMING AN ORGANIC MEMORY DEVICE AND METHODS OF OPERATING AND FABRICATING
    • 擦除和编程有机存储器件及其操作和制作方法
    • WO2004102579A1
    • 2004-11-25
    • PCT/US2004/011811
    • 2004-04-16
    • ADVANCED MICRO DEVICES, INC.LAN, ZhidaBILL, Colin, S.VANBUSKIRK, Michael, A.
    • LAN, ZhidaBILL, Colin, S.VANBUSKIRK, Michael, A.
    • G11C13/02
    • G11C13/0014B82Y10/00G11C11/5664G11C13/0009G11C13/0016G11C2213/15G11C2213/56G11C2213/71
    • An organic memory cell (100, 1300, 1500) made of two electrodes (104, 110, 1304, 1306, 1502, 1504) with a selectively conductive media (106/108, 1308) between the two electrodes (104, 110, 1304, 1306, 1502, 1504) is disclosed. The selectively conductive media (106/108, 1308) contains an organic layer (108, 300, 400, 500) and passive layer (106, 200). The selectively conductive media (106/108, 1308) is programmed by applying bias voltages that program a desired impedance state (1301, 1302, 1303) for a memory cell (100, 1300, 1500). The desired impedance state (1301, 1302, 1303) represents one or more bits of information and the memory cell (100, 1300, 1500) does not require constant power or refresh cycles to maintain the desired impedance state. Furthermore, the selectively conductive media (106/108, 1308) is read by applying a current and reading the impedance of the media (106/108, 1308) in order to determine the impedance state (1301, 1302, 1303) of the memory cell (100, 1300, 1500). Methods of making the organic memory devices/cells (100, 1300, 1500), methods of using the organic memory devices/cells (100, 1300, 1500), and devices such as computers containing the organic memory devices/cells (100, 1300, 1500) are also disclosed.
    • 由两个电极(104,110,1304,1306,1502,1504)制成的有机存储单元(100,1300,1500)在两个电极(104,110,1304)之间具有选择性导电介质(106/108,1308) ,1306,1502,1504)。 选择性导电介质(106/108,1308)包含有机层(108,300,400,500)和无源层(106,200)。 选择性导电介质(106/108,1308)通过施加用于存储单元(100,1300,1500)编程期望的阻抗状态(1301,1301,1303)的偏压来编程。 期望的阻抗状态(1301,1301,1303)表示一个或多个信息位,并且存储单元(100,1300,1500)不需要恒定的功率或刷新周期来保持所需的阻抗状态。 此外,通过施加电流并读取介质(106/108,1308)的阻抗来读取选择性导电介质(106/108,1308),以便确定存储器的阻抗状态(1301,1301,1303) 细胞(100,1300,1500)。 制造有机存储器件/单元(100,1300,1500)的方法,使用有机存储器件/单元(100,1300,1500)的方法以及诸如包含有机存储器件/单元(100,1300)的计算机 ,1500)也被公开。