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    • 2. 发明申请
    • ANTI-STICTION TECHNIQUE FOR ELECTROMECHANICAL SYSTEMS AND ELECTROMECHANICAL DEVICE EMPLOYING SAME
    • 机电系统的防伪技术及其使用的电化学装置
    • WO2006115592A1
    • 2006-11-02
    • PCT/US2006/008600
    • 2006-03-10
    • GMBH, Robert, BoschULM, MarkusMETZ, MatthiasSTARK, BrianYAMA, GaryLUTZ, MarkusPARTRIDGE, AaronFREY, Wilhelm
    • ULM, MarkusMETZ, MatthiasSTARK, BrianYAMA, GaryLUTZ, MarkusPARTRIDGE, AaronFREY, Wilhelm
    • B81C1/00
    • B81C1/0096B81B3/0005B81C2201/112B82Y30/00H01L2224/13H01L2924/1461H01L2924/00
    • A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.
    • 机械结构设置在室中,其至少一部分由封装结构限定。 第一种方法提供了通道盖,其具有至少部分地设置在防静电通道的上方或至少一部分中的至少一个预成型件部分,以密封抗静电通道。 第二种方法提供了通道盖,其具有至少部分地设置在防静电通道上方或至少一部分中的至少一个部分,以密封抗静电通道。 该至少一个部分与机电装置分开制造,然后固定在机电装置上。 第三种方法提供了通道盖,其具有至少部分地设置在防静电通道上方或至少一部分中的至少一个部分,以密封抗静脉通道。 所述至少一个部分可以包括线球,螺柱,金属箔或焊料预制件。 一种器件包括衬底,封装结构和机械结构。 抗静电层设置在机械结构的至少一部分上。 在基板和封装结构中的至少一个中形成抗静电通道。 帽至少部分地具有设置在抗静电通道上方或至少一部分中的至少一个预制件部分,以密封抗静电通道。
    • 10. 发明申请
    • MICROELECTROMECHANICAL DEVICES AND FABRICATION METHODS
    • 微电子机械装置和制造方法
    • WO2007021396A2
    • 2007-02-22
    • PCT/US2006/026531
    • 2006-07-07
    • ROBERT BOSCH GMBHYAMA, Gary
    • YAMA, Gary
    • B81C5/00
    • B81C1/00333
    • There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes a buried polysilicon layer and a "protective layer" deposited over the buried polysilicon layer to prevent possible erosion of, or damage to the buried polysilicon layer during processing steps. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.
    • 这里描述和说明了许多发明。 在一个方面,本发明涉及MEMS器件以及制造或制造MEMS器件的技术,其具有在最终封装之前封装在室中的机械结构。 一个实施例还包括埋入式多晶硅层和“保护层” 沉积在掩埋的多晶硅层上方以防止在处理步骤期间可能侵蚀或损害掩埋的多晶硅层。 当沉积时,封装机械结构的材料包括以下属性中的一个或多个:低拉伸应力,良好的阶梯覆盖率,在进行后续处理时保持其完整性,不会显着和/或不利地影响机械结构的性能特性 腔室中的机械结构(如果在沉积期间涂覆有材料),和/或促进与高性能集成电路的集成。 在一个实施例中,封装机械结构的材料例如是硅(多晶硅,非晶硅或多孔硅,无论是掺杂的还是未掺杂的),碳化硅,硅 - 锗,锗或砷化镓。