会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明申请
    • METHODS TO FORM WIDE HEATER TRENCHES AND TO FORM MEMORY CELLS TO ENGAGE HEATERS
    • 形成宽加热器的方法和形成记忆细胞进入加热器的方法
    • WO2008124444A1
    • 2008-10-16
    • PCT/US2008/059148
    • 2008-04-02
    • MARVELL WORLD TRADE LTD.SUTARDJA, PantasWU, AlbertCHANG, RunziWEI, Chien-ChuanLEE, WinstonLEE, Peter
    • SUTARDJA, PantasWU, AlbertCHANG, RunziWEI, Chien-ChuanLEE, WinstonLEE, Peter
    • H01L45/00
    • H01L45/1233H01L27/2445H01L27/2463H01L45/06H01L45/126H01L45/144H01L45/1675H01L45/1683
    • Embodiments of the present invention, provide a method that includes providing a wafer including multiple cells, each cell including at least one emitter (108), and performing a lithographic operation on the wafer. The lithographic operation comprises forming heater trenches adjacent the emitters, each heater trench having a width' that extends over at least respective portions of two cells. Embodiments of the present invention also provide a method that includes providing wafer including multiple cells, each cell including at least -one emitter. The method further includes performing a lithographic operation in a word line direction of the wafer across the cells to form pre-heater element arrangements, performing a lithographic operation in a bit line direction of the wafer across the pre-heater element arrangements to form a pre-heater element adjacent each emitter, and performing a lithographic operation in the word line direction across a portion of the pre-heater elements to form a heater element (402a, 402b) adjacent each emitter. Other embodiments are also described.
    • 本发明的实施例提供了一种方法,其包括提供包括多个单元的晶片,每个单元包括至少一个发射极(108),并对所述晶片进行光刻操作。 光刻操作包括在发射器附近形成加热器沟槽,每个加热器沟槽具有在两个单元的至少相应部分上延伸的宽度。 本发明的实施例还提供了一种方法,其包括提供包括多个单元的晶片,每个单元包括至少一个发射极。 所述方法还包括在晶片的字线方向上执行平版印刷操作,以形成预热器元件布置,在跨过预热器元件布置的晶片的位线方向上执行平版印刷操作,以形成预先 加热器元件,并且跨越预热器元件的一部分在字线方向上执行光刻操作,以形成与每个发射器相邻的加热器元件(402a,402b)。 还描述了其它实施例。
    • 9. 发明申请
    • SRAM CELLS SUITABLE FOR FIN FIELD-EFFECT TRANSISTOR (FINFET) PROCESS
    • SRAM CELLS适用于FIN场效应晶体管(FINFET)工艺
    • WO2014070852A1
    • 2014-05-08
    • PCT/US2013/067441
    • 2013-10-30
    • MARVELL WORLD TRADE LTD.LEE, WinstonLEE, Peter
    • LEE, WinstonLEE, Peter
    • G11C11/412G11C11/419
    • G11C11/419G11C11/412
    • A static random access memory (SRAM) cell includes first (220) and second (228) n-channel transistors, first (224) and second (232) p-channel transistors, first (234) and second (238) enable transistors, and first (208) and second (212) pass gates. The first n-channel transistor (220), the first p-channel transistor (224), and the first enable transistor (234) are connected in series between first (240) and second (236) reference potentials. The second n- channel transistor (228), the second p-channel transistor (232), and the second enable transistor (238) are connected in series between the first (240) and second (236) reference potentials. The first pass gate (208) is configured to selectively connect a first bitline (BL) to a first node. The first node is connected to a gate of the first n-channel transistor (220) and a gate of the first p-channel transistor (224). The second pass gate (212) is configured to selectively connect a second bitline (BLB) to a second node. The second node is connected to a gate of the second n-channel transistor (228) and a gate of the second p-channel transistor (232). The gate of the first (234) and second (238) enable transistors are respectively controlled by the first (BL) and second (BLB) bit lines so as to avoid conflict or competition between the first (224) and second (232) p-channel transistors and the first (208) and second (212) pass gates during a write operation. The present application further discloses word line repeaters and pulsed word line operation during reading.
    • 静态随机存取存储器(SRAM)单元包括第一(220)和第二(228)n沟道晶体管,第一(224)和第二(232)p沟道晶体管,第一(234) 和第二(238)启用晶体管,以及第一(208)和第二(212)传输门。 第一n沟道晶体管(220),第一p沟道晶体管(224)和第一启用晶体管(234)串联连接在第一(240)和第二(236)参考电位之间。 第二n沟道晶体管(228),第二p沟道晶体管(232)和第二启用晶体管(238)串联连接在第一(240)和第二(236)参考电位之间。 第一通过门(208)被配置为选择性地将第一位线(BL)连接到第一节点。 第一节点连接到第一n沟道晶体管(220)的栅极和第一p沟道晶体管(224)的栅极。 第二通过门(212)被配置为选择性地将第二位线(BLB)连接到第二节点。 第二节点连接到第二n沟道晶体管(228)的栅极和第二p沟道晶体管(232)的栅极。 第一(234)和第二(238)启用晶体管的栅极分别由第一(BL)和第二(BLB)位线控制,以避免第一(224)和第二(232)p之间的冲突或竞争 (208)和第二(212)通道门电路。 本申请进一步公开了在读取期间的字线转发器和脉冲字线操作。