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1. 发明申请

WO2005008462A2 A PORTABLE DEVICE AND A TOUCH SENSITIVE DISPLAY THEREFOR 审中-公开
标题翻译：便携式设备和触摸敏感显示器
公开(公告)号：WO2005008462A2
公开(公告)日：2005-01-27
申请号：PCT/IB2004/051173
申请日：2004-07-08
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , DESTURA, Galileo, J., A. , HUITEMA, Hjalmar, E., A. , VAN DELDEN, Martinus, H., W., M. , VAN BEEK, Jozef, T., M. , KEMMEREN, Antonius, L., A., M.
发明人： DESTURA, Galileo, J., A. , HUITEMA, Hjalmar, E., A. , VAN DELDEN, Martinus, H., W., M. , VAN BEEK, Jozef, T., M. , KEMMEREN, Antonius, L., A., M.
IPC分类号： G06F3/00
CPC分类号： G06F3/0412 , G02F1/13338 , G06F3/0414
摘要： A portable device is provided having a touch sensitive display (100) comprising an active matrix display element (101) and a touch sensitive element (103). The touch sensitive element (103) is disposed on the viewer distal side of the active matrix display element (101) thereby not affecting the display properties. The touch sensitive element (103) comprises a first and second conductive layer (113, 115) each having a plurality of conductors. The conductive layers (113, 115) sandwich a pressure sensitive layer (117) which modifies an electrical conductivity between two conductors of the two conductive layers (113, 115) in response to a pressure point resulting from an applied pressure. Thus, accurate position detection is achieved. The conductors may be aligned with the active matrix and the requirement for calibration may be obviated.
摘要翻译：提供了具有触敏显示器（100）的便携式设备，该触敏显示器（100）包括有源矩阵显示元件（101）和触敏元件（103）。触敏元件（103）设置在有源矩阵显示元件（101）的观看者远侧，从而不影响显示属性。触敏元件（103）包括每个具有多个导体的第一和第二导电层（113,115）。导电层（113,115）夹着压力敏感层（117），该压力敏感层（117）响应于由所施加的压力导致的压力点而改变两个导电层（113,115）的两个导体之间的导电性。因此，实现了精确的位置检测。导体可以与有源矩阵对准，并且可以避免校准的要求。

2. 发明申请

WO2005101178A3 TOUCH SENSITIVE DISPLAY 审中-公开
公开(公告)号：WO2005101178A3
公开(公告)日：2005-10-27
申请号：PCT/IB2005/051155
申请日：2005-04-08
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , VAN DELDEN, Martinus, H., W., M. , VAN BEEK, Jozef, T., M. , DESTURA, Galileo, J., A. , KEMMEREN, Antonius, L., A., M.
发明人： VAN DELDEN, Martinus, H., W., M. , VAN BEEK, Jozef, T., M. , DESTURA, Galileo, J., A. , KEMMEREN, Antonius, L., A., M.
IPC分类号： G06F3/033
摘要： There is provided a touch sensitive display comprising a passive substrate (206, 306), an active substrate (102, 308), and a display material (132) disposed between the passive and active substrates, wherein driving circuitry (104) for driving a pixel of the display and touch sensing circuitry (201, 304) are arranged on the active substrate (102, 308). The touch sensing circuitry (201, 304) comprises at least one component with a first and a second electrode (224, 310, 408, 410, 508, 608, 610, 702, 704, 706), wherein the electrodes (224, 310, 408, 410, 508, 608, 610, 702, 704, 706) are arranged to displace with respect to each other in response to a touch input.

3. 发明申请

WO2005109636A1 ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备
公开(公告)号：WO2005109636A1
公开(公告)日：2005-11-17
申请号：PCT/IB2005/051433
申请日：2005-05-03
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , DEN DEKKER, Arnoldus , DIJKHUIS, Johannes, F. , PULSFORD, Nicolas, J. , VAN BEEK, Jozef, T., M. , ROOZEBOOM, Freddy , KEMMEREN, Antonius, L., A., M. , KLOOTWIJK, Johan, H. , NOLLEN, Maarten, D-J.
发明人： DEN DEKKER, Arnoldus , DIJKHUIS, Johannes, F. , PULSFORD, Nicolas, J. , VAN BEEK, Jozef, T., M. , ROOZEBOOM, Freddy , KEMMEREN, Antonius, L., A., M. , KLOOTWIJK, Johan, H. , NOLLEN, Maarten, D-J.
IPC分类号： H03H3/00
CPC分类号： H03H3/00 , H03H7/0123
摘要： The electronic device comprises a network of at least one thin-film capacitor and at least one inductor on a first side of a substrate of a semiconductor material. The substrate has a resistivity sufficiently high to limit electrical losses of the inductor and being provided with an electrically insulating surface layer on its first side. A first and a second lateral pin diode are defined in the substrate, each of the pin diodes having a doped p-region, a doped n-region and an intermediate intrinsic region. The intrinsic region of the first pin diode is larger than that of the second pin diode.
摘要翻译：电子器件包括至少一个薄膜电容器的网络和半导体材料的衬底的第一侧上的至少一个电感器。衬底的电阻率足够高以限制电感器的电损耗并且在其第一侧上设置有电绝缘表面层。在衬底中限定第一和第二横向pin二极管，每个pin二极管具有掺杂的p区，掺杂的n区和中间固有区。第一pin二极管的本征区域大于第二pin二极管的本征区域。

4. 发明申请

WO2007054858A2 INTEGRATED CAPACITOR ARRANGEMENT FOR ULTRAHIGH CAPACITANCE VALUES 审中-公开
标题翻译：用于超高电容值的集成电容器布置
公开(公告)号：WO2007054858A2
公开(公告)日：2007-05-18
申请号：PCT/IB2006/054063
申请日：2006-11-02
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , ROOZEBOOM, Freddy , KLOOTWIJK, Johan, H. , KEMMEREN, Antonius, L., A., M. , REEFMAN, Derk , VERHOEVEN, Johannes, F., C., M.
发明人： ROOZEBOOM, Freddy , KLOOTWIJK, Johan, H. , KEMMEREN, Antonius, L., A., M. , REEFMAN, Derk , VERHOEVEN, Johannes, F., C., M.
CPC分类号： H01L28/91 , H01L27/0805 , H01L27/1087 , H01L29/945
摘要： The present invention relates to an electronic device (300) comprising at least one trench capacitor (302) that can also take the form of an inverse structure, a pillar capacitor. An alternating layer sequence (308) of at least two dielectric layers (312, 316) and at least two electrically conductive layers (314, 318) is provided in the trench capacitor or on the pillar capacitor, such that the at least two electrically conductive layers are electrically isolated from each other and from the substrate by respective ones of the at least two dielectric layers. A set of internal contact pads (332, 334, 340) is provided, and each internal contact pad is connected with a respective one of the electrically conductive layers or with the substrate. By providing an individual internal contact pad for each of the electrically conductive layers, a range of switching opportunities is opened up that allows tuning the specific capacitance of the capacitor to a desired value. The electronic device of the invention thus provides a flexible trench-capacitor manufacturing platform for a multitude of combinations of electrically conductive layers with each other, or, when multiple trenches are used, between electrically conductive layers of different trench capacitors. On-chip applications such as a charge-pump circuit or a DC-to-DC voltage converter are claimed that benefit from the ultra-high capacitance density and the high breakdown voltage that can be achieved with the electronic device of the invention.
摘要翻译：本发明涉及包括至少一个沟槽电容器（302）的电子器件（300），所述沟槽电容器也可以采取反转结构的形式，即柱电容器。在沟槽电容器或柱电容器中提供至少两个电介质层（312,316）和至少两个导电层（314,318）的交替层序列（308），使得至少两个导电层通过所述至少两个电介质层中的相应电介质层将所述层彼此电隔离并且与所述衬底电隔离。提供一组内部接触垫（332,334,340），并且每个内部接触垫与相应的一个导电层或与衬底连接。通过为每个导电层提供单独的内部接触垫，打开一定范围的开关机会，允许将电容器的比电容调整到期望值。因此，本发明的电子设备提供了用于导电层彼此之间的多种组合或者当使用多个沟槽时在不同沟槽电容器的导电层之间的柔性沟槽电容器制造平台。据称，诸如电荷泵电路或DC-DC电压转换器之类的片上应用受益于可用本发明的电子器件实现的超高电容密度和高击穿电压。 p>

5. 发明申请

WO2006056959A1 METHOD OF MODIFYING SURFACE AREA AND ELECTRONIC DEVICE 审中-公开
标题翻译：修改表面区域和电子设备的方法
公开(公告)号：WO2006056959A1
公开(公告)日：2006-06-01
申请号：PCT/IB2005/053905
申请日：2005-11-25
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , KEMMEREN, Antonius, L., A., M. , ROOZEBOOM, Freddy , KLOOTWIJK, Johan, H. , WOLTERS, Robertus, A., M.
发明人： KEMMEREN, Antonius, L., A., M. , ROOZEBOOM, Freddy , KLOOTWIJK, Johan, H. , WOLTERS, Robertus, A., M.
IPC分类号： H01L21/02 , H01L21/8242
CPC分类号： H01L28/84 , H01L27/1087 , H01L29/66181
摘要： In the method a first layer, particularly of amorphous silicon, is deposited on the surface of a substrate with trenches. Part of this surface is covered with a protective layer. The first layer is thereafter maskless removed with a dry etching treatment on the substrate surface while it is kept within the trench.
摘要翻译：在该方法中，特别是非晶硅的第一层被沉积在具有沟槽的衬底的表面上。该表面的一部分被保护层覆盖。此后，第一层通过在衬底表面上进行干蚀刻处理而被除去，同时保持在沟槽内。

6. 发明申请

WO2004112136A1 ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备
公开(公告)号：WO2004112136A1
公开(公告)日：2004-12-23
申请号：PCT/IB2004/050864
申请日：2004-06-08
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , DEKKER, Ronald , HURKX, Godefridus, A., M. , JANSMAN, Andreas, B., M. , KEMMEREN, Antonius, L., A., M. , BERGERVOET, Jozef, R., M. , DE JONG, Gerben, W. , STEK, Aalbert
发明人： DEKKER, Ronald , HURKX, Godefridus, A., M. , JANSMAN, Andreas, B., M. , KEMMEREN, Antonius, L., A., M. , BERGERVOET, Jozef, R., M. , DE JONG, Gerben, W. , STEK, Aalbert
IPC分类号： H01L25/065
CPC分类号： H01L21/6835 , H01L23/5389 , H01L23/66 , H01L24/24 , H01L24/82 , H01L25/0652 , H01L29/0657 , H01L2221/68377 , H01L2224/16 , H01L2224/16227 , H01L2224/24137 , H01L2224/24147 , H01L2224/24227 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/73267 , H01L2224/92244 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12032 , H01L2924/12043 , H01L2924/1305 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15192 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/00
摘要： The electronic device of the invention comprises a substrate with semiconductor elements, in which substrate one or more cavities are provided. Further active devices are provided in the cavities and coupled to the semiconductor elements through one common multilayer interconnect structure.
摘要翻译：本发明的电子器件包括具有半导体元件的衬底，其中提供有一个或多个腔体。另外的有源器件设置在空腔中，并通过一个共同的多层互连结构耦合到半导体元件。

7. 发明申请

WO2004112134A1 PACKAGE FOR A HIGH-FREQUENCY ELECTRONIC DEVICE 审中-公开
标题翻译：高频电子设备的封装
公开(公告)号：WO2004112134A1
公开(公告)日：2004-12-23
申请号：PCT/IB2004/050863
申请日：2004-06-08
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , JANSMAN, Andreas, B., M. , DEKKER, Ronald , HURKX, Godefridus, A., M. , VAN NOORT, Wibo, D. , KEMMEREN, Antonius, L., A., M.
发明人： JANSMAN, Andreas, B., M. , DEKKER, Ronald , HURKX, Godefridus, A., M. , VAN NOORT, Wibo, D. , KEMMEREN, Antonius, L., A., M.
IPC分类号： H01L23/538
CPC分类号： H01L24/82 , H01L23/36 , H01L23/5389 , H01L23/66 , H01L24/24 , H01L2223/6644 , H01L2224/16225 , H01L2224/24137 , H01L2224/24227 , H01L2224/32225 , H01L2224/73204 , H01L2224/73267 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/1306 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/15192 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00012 , H01L2924/00
摘要： The electronic device comprises a substrate (1) with a cavity (6) in which an active device (8) is present. On the first side (2) of the substrate an interconnect structure (17) extends over the cavity and the substrate. On the second side (3) of the substrate to which the cavity extends, a heat sink (23) is available. The device is particularly suitable for use at high frequencies, for instance higher than 2 GHz and under conditions of high dissipation.
摘要翻译：电子设备包括具有空腔（6）的衬底（1），其中存在有源器件（8）。在衬底的第一侧（2）上，互连结构（17）在空腔和衬底上延伸。在空腔延伸的基板的第二面（3）上，散热片（23）是可用的。该器件特别适用于高频率，例如高于2GHz和高耗散条件下使用。

8. 发明申请

WO2007054867A2 PRODUCING A COVERED THROUGH SUBSTRATE VIA USING A TEMPORARY CAP LAYER 审中-公开
标题翻译：通过使用临时盖层生产覆盖的基板
公开(公告)号：WO2007054867A2
公开(公告)日：2007-05-18
申请号：PCT/IB2006/054082
申请日：2006-11-03
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , KLOOTWIJK, Johan, H. , KEMMEREN, Antonius, L., A., M. , DEKKER, Ronald , VAN GRUNSVEN, Eric, C., E. , ROOZEBOOM, Freddy
发明人： KLOOTWIJK, Johan, H. , KEMMEREN, Antonius, L., A., M. , DEKKER, Ronald , VAN GRUNSVEN, Eric, C., E. , ROOZEBOOM, Freddy
IPC分类号： H01L21/768
CPC分类号： H01L21/76898 , H01L21/764 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a method for producing a substrate with at least one covered via that electrically and preferably also thermally connects a first substrate side with an opposite second substrate side. The processing involves forming a trench on a the first substrate side remains and covering the trench with a permanent layer on top of a temporary, sacrificial cap-layer, which is decomposed in a thermal process step. The method of the invention provides alternative ways to remove decomposition products of the sacrificial cap-layer material without remaining traces or contamination even in the presence of the permanent layer. This is, according to a first aspect of the invention, achieved by providing the substrate trench with an overcoat layer that has holes. The holes in the overcoat layer leave room for the removal of the decomposition products of the cap-layer material. According to the second aspect of the invention, opening the covered trench from the second substrate side and allowing the cap-layer material to be removed through that opening provides a solution. Both methods of the present invention are based on the common idea of using a temporary cap-layer even in a situation where the substrate opening is permanently covered before the removal of the temporary cap-layer.
摘要翻译：本发明涉及一种制造具有至少一个覆盖通孔的基板的方法，所述至少一个覆盖通孔电连接并优选地将第一基板侧与相对的第二基板侧热连接。所述处理涉及在第一基板侧上形成沟槽，并在热处理步骤中分解的临时牺牲盖层的顶部上保留并覆盖具有永久层的沟槽。本发明的方法提供了即使在存在永久层的情况下除去牺牲帽层材料的分解产物而不留下痕迹或污染物的替代方法。根据本发明的第一方面，这是通过为基底沟槽提供具有孔的外涂层而实现的。外涂层中的孔留下去除盖层材料的分解产物的空间。根据本发明的第二方面，从第二基板侧打开被覆盖的沟槽并且允许通过该开口去除盖层材料提供了一种解决方案。本发明的两种方法都是基于即使在去除临时盖层之前基材开口被永久地覆盖的情况下使用临时盖层的常见思想。

9. 发明申请

WO2007004137A2 ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备
公开(公告)号：WO2007004137A2
公开(公告)日：2007-01-11
申请号：PCT/IB2006/052152
申请日：2006-06-28
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , DEKKER, Ronald , ROOZEBOOM, Freddy , NOTTEN, Peter , KEMMEREN, Antonius, L., A., M.
发明人： DEKKER, Ronald , ROOZEBOOM, Freddy , NOTTEN, Peter , KEMMEREN, Antonius, L., A., M.
IPC分类号： H01L23/538 , H01L23/482
CPC分类号： H03H9/0547 , H01L25/16 , H01L27/14618 , H01L31/0203 , H01L2924/0002 , H03H9/105 , H01L2924/00
摘要： The electronic device comprises a semiconductor substrate (10) with at a first side (l)a circuit of semiconductor elements (20). The substrate (10) is present between a carrier (40) and an encapsulation (70), so that the first side (1) of the substrate (10) faces the carrier (40). The circuit of semiconductor elements (20) is coupled with conductor tracks (25) to a metallization (82) in a groove (80) in the encapsulation (70), which metallization (82) extends to terminals (90) at an outside of the encapsulation (70). At least one further electrical element (120) is defined between the first side (1) of the semiconductor substrate (10) and the encapsulation (70). This further element (120) is provided with at least one conductor track (65) extending to the metallization (82) in the groove (80) so as to incorporate the further element (120) in the circuit of semiconductor elements (20) on the first side (1) of the substrate (10).
摘要翻译：电子器件包括在第一侧（l）半导体元件（20）的电路的半导体衬底（10）。衬底（10）存在于载体（40）和封装（70）之间，使得衬底（10）的第一侧（1）面向载体（40）。半导体元件（20）的电路与导体轨道（25）耦合到封装（70）中的凹槽（80）中的金属化（82），该金属化（82）延伸到端子（90）的外部封装（70）。在半导体衬底（10）的第一侧（1）和封装（70）之间限定至少一个另外的电元件（120）。这个另外的元件（120）设置有至少一个延伸到凹槽（80）中的金属化（82）的导体轨道（65），以便在半导体元件（20）的电路中并入另外的元件（120）衬底（10）的第一侧（1）。

10. 发明申请

WO2006056964A3 ELECTROCHEMICAL ENERGY SOURCE, ELECTRONIC MODULE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING OF SAID ENERGY SOURCE 审中-公开
公开(公告)号：WO2006056964A3
公开(公告)日：2006-06-01
申请号：PCT/IB2005/053913
申请日：2005-11-25
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , ROOZEBOOM, Freddy , NOTTEN, Peter , KEMMEREN, Antonius, L., A., M. , KLOOTWIJK, Johan, H.
发明人： ROOZEBOOM, Freddy , NOTTEN, Peter , KEMMEREN, Antonius, L., A., M. , KLOOTWIJK, Johan, H.
IPC分类号： H01M6/40
摘要： The invention relates to an electrochemical energy source comprising at least one assembly of: a first electrode, a second electrode, and an intermediate solid-state electrolyte separating said first electrode and said second electrode. The invention also relates to an electronic module provided with such an electrochemical energy source. The invention further relates to an electronic device provided with such an electrochemical energy source. Moreover, the invention relates to a method of manufacturing of such an electrochemical energy source.

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