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1. 发明申请

WO2010136986A3 MEMS ELEMENT 审中-公开
公开(公告)号：WO2010136986A3
公开(公告)日：2010-12-02
申请号：PCT/IB2010/052348
申请日：2010-05-26
申请人： NXP B.V. , POHLMANN, Hauke , DEKKER, Ronald , MUELLER, Joerg , DUEMLING, Martin
发明人： POHLMANN, Hauke , DEKKER, Ronald , MUELLER, Joerg , DUEMLING, Martin
IPC分类号： B81C1/00 , H03H3/007
摘要： A method of manufacturing an electronic device that comprises a microelectromechanical (MEMS) element, the method comprising the steps of: providing a material layer (34) on a first side of a substrate (32); providing a trench (40) in the material later (34); etching material from the trench (40) such as to also etch the substrate (32) from the first side of the substrate (32); grinding the substrate (32) from a second side of the substrate to expose the trench (40); and using the exposed trench (40) as an etch hole. The exposed trench (40) is used as an etch hole for releasing a portion of the material layer (34), for example a beam resonator (12), from the substrate (32). An input electrode (6), an output electrode (8), and a top electrode (10) are provided.

2. 发明申请

WO2009027897A3 PRESSURE SENSOR, SENSOR PROBE COMPRISING A PRESSURE SENSOR, MEDICAL APPARATUS COMPRISING A SENSOR PROBE AND A METHOD OF FABRICATING A SENSOR PROBE 审中-公开
标题翻译：压力传感器，包含压力传感器的传感器探测器，包含传感器探针的医疗装置和制造传感器探针的方法
公开(公告)号：WO2009027897A3
公开(公告)日：2009-04-30
申请号：PCT/IB2008053318
申请日：2008-08-19
申请人： KONINKL PHILIPS ELECTRONICS NV , TNO , DEKKER RONALD , VAN DER GRAAF FREDERIK , VELTHUIS JOHANNES F M , HAARTSEN JAAP R
发明人： DEKKER RONALD , VAN DER GRAAF FREDERIK , VELTHUIS JOHANNES F M , HAARTSEN JAAP R
IPC分类号： G01L9/00
CPC分类号： G01L19/148 , G01L9/0042 , G01L19/0038 , H01L2224/24137
摘要： The invention relates to a pressure sensor comprising a flexible membrane deformable in response to a pressure, which covers a cavity (2) and which comprises a strain gauge (21) that produces signals corresponding to the deformation of the flexible membrane, wherein the flexible membrane is a flexible monolithic integrated circuit foil (10). In this way the semiconductor integrated circuit itself serves as the flexible membrane, leading to a less complex fabrication process.
摘要翻译：本发明涉及一种压力传感器，其包括响应于压力而可变形的柔性膜，所述压力传感器覆盖空腔（2）并且包括产生对应于柔性膜的变形的信号的应变仪（21），其中柔性膜是柔性单片集成电路箔（10）。以这种方式，半导体集成电路本身用作柔性膜，导致较不复杂的制造工艺。

3. 发明申请

WO2009027897A2 PRESSURE SENSOR, SENSOR PROBE COMPRISING A PRESSURE SENSOR, MEDICAL APPARATUS COMPRISING A SENSOR PROBE AND A METHOD OF FABRICATING A SENSOR PROBE 审中-公开
标题翻译：压力传感器，包括压力传感器的传感器探针，包括传感器探针的医疗设备以及制造传感器探针的方法
公开(公告)号：WO2009027897A2
公开(公告)日：2009-03-05
申请号：PCT/IB2008/053318
申请日：2008-08-19
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , TNO , DEKKER, Ronald , VAN DER GRAAF, Frederik , VELTHUIS, Johannes, F., M. , HAARTSEN, Jaap, R.
发明人： DEKKER, Ronald , VAN DER GRAAF, Frederik , VELTHUIS, Johannes, F., M. , HAARTSEN, Jaap, R.
CPC分类号： G01L19/148 , G01L9/0042 , G01L19/0038 , H01L2224/24137
摘要： The invention relates to a pressure sensor comprising a flexible membrane deformable in response to a pressure, which covers a cavity (2) and which comprises a strain gauge (21) that produces signals corresponding to the deformation of the flexible membrane, wherein the flexible membrane is a flexible monolithic integrated circuit foil (10). In this way the semiconductor integrated circuit itself serves as the flexible membrane, leading to a less complex fabrication process.
摘要翻译：本发明涉及一种压力传感器，该压力传感器包括响应于压力而可变形的柔性膜，其覆盖空腔（2）并且包括应变仪（21），该应变仪产生对应于所述柔性膜，其中所述柔性膜是柔性单片集成电路箔（10）。通过这种方式，半导体集成电路本身可以用作柔性膜，从而导致制造工艺不太复杂。

4. 发明申请

WO2007116344A1 ELASTICALLY DEFORMABLE INTEGRATED-CIRCUIT DEVICE 审中-公开
标题翻译：弹性可变的集成电路设备
公开(公告)号：WO2007116344A1
公开(公告)日：2007-10-18
申请号：PCT/IB2007/051190
申请日：2007-04-03
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , DEKKER, Ronald , MIICHIELSEN, Theodorus, M. , ZOUMPOULIDIS, Theodorus
发明人： DEKKER, Ronald , MIICHIELSEN, Theodorus, M. , ZOUMPOULIDIS, Theodorus
IPC分类号： H01L23/00 , H01L23/498 , H01L23/538 , H01L25/065
CPC分类号： H05K1/0283 , H01L23/5387 , H01L24/01 , H01L25/0655 , H01L2924/14 , H01L2924/351 , H05K3/007 , H05K2201/0133 , H05K2201/09263 , H05K2201/09781 , H05K2203/016 , H05K2203/0271 , H01L2924/00
摘要： The present invention relates to an integrated-circuit device comprising a multitude of separate rigid substrate islands (202 to 208) with circuit elements, a respective substrate island being connected to respective neighbor substrate islands by respective elastically deformable connections (210 to 222), which contain at least one respective signaling layer that is made of an electrically conductive material. At least one elastically deformable connection between substrate islands has a signaling layer, which is not electrically connected and thus forms a dummy signaling layer (210a to 210c), and the elastically deformable connections, which connect a respective substrate island to respective neighbor substrate islands along a first direction, have an elastic deformability in the first direction governed by respective moduli of elasticity, the ratio of which is between 0.5 and 2.0. This reduces the inhomogeneity of strain in the network of substrate islands that is formed by the integrated-circuit device. The functional reliability of the integrated-circuit device of the invention is increased over prior-art devices without restricting the freedom of circuit design.
摘要翻译：本发明涉及一种集成电路装置，其包括具有电路元件的多个独立的刚性衬底岛（202至208），相应的衬底岛通过相应的可弹性变形的连接（210至222）连接到相应的相邻衬底岛，其中包含由导电材料制成的至少一个相应的信号层。衬底岛之间的至少一个可弹性变形的连接具有信号层，其不是电连接的并且因此形成虚拟信令层（210a至210c）以及可弹性变形的连接，其将相应的衬底岛连接到相应的相邻衬底岛第一方向在第一方向上具有由相应的弹性模量控制的弹性变形能力，其比例在0.5和2.0之间。这降低了由集成电路器件形成的衬底岛的网络中的应变的不均匀性。本发明的集成电路器件的功能可靠性比现有技术的器件增加，而不限制电路设计的自由度。

5. 发明申请

WO2006092754A3 A METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGES AND PACKAGES MADE 审中-公开
标题翻译：制造半导体封装和封装的方法
公开(公告)号：WO2006092754A3
公开(公告)日：2007-01-18
申请号：PCT/IB2006050599
申请日：2006-02-27
申请人： KONINKL PHILIPS ELECTRONICS NV , VAN VEEN NICOLAAS J A , DEKKER RONALD , TAK COEN C
发明人： VAN VEEN NICOLAAS J A , DEKKER RONALD , TAK COEN C
IPC分类号： H01L21/60 , H01L23/498 , H01L23/538
CPC分类号： H01L23/5389 , H01L21/6835 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2221/68331 , H01L2221/68345 , H01L2221/68368 , H01L2223/6677 , H01L2224/24226 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/19041 , H01L2924/19042 , H01L2224/82 , H01L2924/00
摘要： The flexible package (100) has between a first (1) and a second side (2) a semiconductor device (20) with a thinned back substrate (10) and an interconnect structure. Contact means (31,33) for external contact and a first resin layer (52) are present at the first side (2) of the package (100), which contact means (31,33) are coupled to the interconnect structure. At the second side (2) the semiconductor device (20) is at least substantially covered with a second resin layer (12). The contact means (31,33) are present on the first resin layer (52) and are coupled to the interconnect structure with redistribution tracks (32,34) extending through the first resin layer (52). A passivation layer (55) covers the first resin layer (52) and the redistribution tracks (32,34) at least substantially.
摘要翻译：柔性封装（100）在第一（1）和第二侧（2）之间具有带有薄的背衬基板（10）和互连结构的半导体器件（20）。用于外部接触的接触装置（31,33）和第一树脂层（52）存在于封装（100）的第一侧（2）处，该接触装置（31,33）联接到互连结构。在第二侧（2），半导体器件（20）至少基本被第二树脂层（12）覆盖。接触装置（31,33）存在于第一树脂层（52）上，并且通过延伸穿过第一树脂层（52）的再分布轨道（32,34）与互连结构耦合。钝化层（55）至少基本上覆盖第一树脂层（52）和再分布轨道（32,34）。

6. 发明申请

WO2004090975A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：WO2004090975A1
公开(公告)日：2004-10-21
申请号：PCT/IB2004/050365
申请日：2004-03-31
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , VAN NOORT, Wibo, D. , DEKKER, Ronald
发明人： VAN NOORT, Wibo, D. , DEKKER, Ronald
IPC分类号： H01L21/784
CPC分类号： H01L21/6835 , H01L21/78 , H01L23/3677 , H01L24/27 , H01L2221/68322 , H01L2221/6834 , H01L2221/68345 , H01L2224/0401 , H01L2224/04026 , H01L2224/16 , H01L2224/274 , H01L2224/73253 , H01L2924/01029 , H01L2924/01078 , H01L2924/04941 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/00
摘要： Method of manufacturing of semiconductor devices, comprising the steps of: providing a substrate with a plurality of electronic elements on the top face; applying a releasable support to the top face of the substrate; applying a layer of a patternable material to the bottom face of the thinned substrate; patterning the layer of patternable material leaving a pattern of the patternable material on the bottom face of the substrate; applying a layer of an electronically conducting material to the bottom face of the substrate, thereby at least partially filling up said pattern; releasing the releasable support on the top face of the substrate, thereby providing an array of semiconductor devices, each comprising at least one electric element; and separating at least one semiconductor device from the array of semiconductor devices.
摘要翻译：半导体器件的制造方法，包括以下步骤：在顶面上提供具有多个电子元件的基板; 将可释放的支撑件施加到所述基底的顶面; 将可图形材料层施加到所述薄化基板的底面; 图案化可图案材料层，留下可图案材料的图案在基底的底面上; 将一层电子导电材料施加到基底的底面，从而至少部分地填满所述图案; 释放衬底顶表面上的可释放支撑，从而提供一组半导体器件，每个半导体器件包括至少一个电子元件; 以及从所述半导体器件阵列分离出至少一个半导体器件。

7. 发明申请

WO2013001437A1 A TRACKING SYSTEM FOR TRACKING INTERVENTIONAL TOOLS IN ULTRASOUND GUIDED INTERVENTIONS AND AN ULTRASOUND DIAGNOSTIC SYSTEM COMPRISING SUCH A TRACKING SYSTEM 审中-公开
标题翻译：用于跟踪超声引导干预中的传统工具的跟踪系统和包含这种追踪系统的超声诊断系统
公开(公告)号：WO2013001437A1
公开(公告)日：2013-01-03
申请号：PCT/IB2012/053195
申请日：2012-06-25
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , DIRKSEN, Peter , SOER, Wouter Anthon , VAN RENS, Antonia Cornelia , MARCELIS, Bout , DEKKER, Ronald
发明人： DIRKSEN, Peter , SOER, Wouter Anthon , VAN RENS, Antonia Cornelia , MARCELIS, Bout , DEKKER, Ronald
IPC分类号： A61B5/06 , A61B8/08 , A61B17/34 , A61B19/52
CPC分类号： A61B5/066 , A61B8/0841 , A61B34/20 , A61B2034/2063 , A61B2090/3786
摘要： An interventional tooltracking system is disclosed which utilises the response ofa CMUT-based tracking sensor located on the interventional tool to insonification, from a remoteultrasoundsource, in order to determine the position of the interventional tool during an interventional procedure.
摘要翻译：公开了一种介入式工具跟踪系统，其利用位于介入工具上的基于CMUT的跟踪传感器的响应来从远程超声源进行增强，以便在介入过程期间确定介入工具的位置。

8. 发明申请

WO2010136986A2 MEMS ELEMENT 审中-公开
标题翻译： MEMS元件
公开(公告)号：WO2010136986A2
公开(公告)日：2010-12-02
申请号：PCT/IB2010052348
申请日：2010-05-26
申请人： NXP BV , POHLMANN HAUKE , DEKKER RONALD , MUELLER JOERG , DUEMLING MARTIN
发明人： POHLMANN HAUKE , DEKKER RONALD , MUELLER JOERG , DUEMLING MARTIN
IPC分类号： B81C1/00 , H03H3/007
CPC分类号： H03H3/0073 , B81B2201/0271 , B81C1/0019 , Y10T29/49005 , Y10T29/49128 , Y10T29/49156
摘要： A method of manufacturing an electronic device that comprises a microelectromechanical (MEMS) element, the method comprising the steps of: providing a material layer (34) on a first side of a substrate (32); providing a trench (40) in the material later (34); etching material from the trench (40) such as to also etch the substrate (32) from the first side of the substrate (32); grinding the substrate (32) from a second side of the substrate to expose the trench (40); and using the exposed trench (40) as an etch hole. The exposed trench (40) is used as an etch hole for releasing a portion of the material layer (34), for example a beam resonator (12), from the substrate (32). An input electrode (6), an output electrode (8), and a top electrode (10) are provided.
摘要翻译：一种制造包括微机电元件的电子器件的方法，所述方法包括以下步骤：在衬底（32）的第一侧上提供材料层（34）; 在稍后的材料（34）中提供沟槽（40）; 从沟槽（40）蚀刻材料，以便也从衬底（32）的第一侧蚀刻衬底（32）; 从衬底的第二侧研磨衬底（32）以露出沟槽（40）; 并使用暴露的沟槽（40）作为蚀刻孔。暴露的沟槽（40）用作用于从衬底（32）释放材料层（34）的一部分（例如光束谐振器（12））的蚀刻孔。设置有输入电极（6），输出电极（8）和顶部电极（10）。

9. 发明申请

WO2010089718A1 CARDIOMYOCYTES-CONTAINING DEVICE AND METHOD FOR MANUFACTURING AND USING THE SAME 审中-公开
标题翻译：含有血小板活性的装置及其制造和使用方法
公开(公告)号：WO2010089718A1
公开(公告)日：2010-08-12
申请号：PCT/IB2010/050537
申请日：2010-02-05
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , DEKKER, Ronald , VAN DE STOLPE, Anja
发明人： DEKKER, Ronald , VAN DE STOLPE, Anja
IPC分类号： C12M3/04 , C12N5/00
CPC分类号： G01N1/30 , C12N5/0657 , C12N2503/02 , C12N2535/10 , G01N33/5061
摘要： Disclosed is a device for determining the cardiotoxicity of a chemical compound, comprising a substrate (10) carrying a deformable stack (34), said stack being partially detached from the substrate by a cavity (32) allowing an out-of-plane deformation of the stack, said stack comprising a first deformable layer (16), a second deformable layer (20) and a multi-electrode structure (18) sandwiched between the first and second deformable layers, the second deformable layer carrying a pattern of cardiomyocytes (28) adhered thereto; and a liquid container (26) mounted on the substrate for exposing the cardiomyocytes to the chemical compound. A method of manufacturing such a device is also disclosed. The present invention further relates to the use of the device for drug target discovery and/or drug development and a method for developing a disease model for a disease that is caused by or modified by stretching of cells, in particular a cardiac disease model.
摘要翻译：公开了一种用于确定化合物的心脏毒性的装置，包括承载可变形叠层（34）的基底（10），所述叠层通过空腔（32）部分地与基底分离，允许外部变形所述堆叠包括夹在所述第一和第二可变形层之间的第一可变形层（16），第二可变形层（20）和多电极结构（18），所述第二可变形层承载心肌细胞图案（28 ）和安装在基板上的用于将心肌细胞暴露于化合物的液体容器（26）。还公开了制造这种装置的方法。本发明还涉及该装置用于药物靶发现和/或药物开发的用途，以及用于开发由细胞拉伸，特别是心脏疾病模型引起或改变的疾病的疾病模型的方法。

10. 发明申请

WO2010035197A1 FLEXIBLE ALL SOLID STATE BATTERY WITH ENHANCED DEPOSITION FREEDOM 审中-公开
标题翻译：灵活的所有固态电池与增强沉积自由
公开(公告)号：WO2010035197A1
公开(公告)日：2010-04-01
申请号：PCT/IB2009/054105
申请日：2009-09-18
申请人： KONINKLIJKE PHILIPS ELECTRONICS, N.V. , U.S. PHILIPS CORPORATION , NIESSEN, Rogier Adrianus Henrica , NOTTEN, Petrus Henricus Laurentius , DEKKER, Ronald
发明人： NIESSEN, Rogier Adrianus Henrica , NOTTEN, Petrus Henricus Laurentius , DEKKER, Ronald
IPC分类号： H01M2/02 , H01M10/04 , H01M10/0562 , H01M10/052 , H01M10/0585 , G02F1/00 , H01L21/00 , H01M4/52 , H01M4/485
CPC分类号： H01M2/0207 , H01M2/0275 , H01M4/485 , H01M4/52 , H01M10/0436 , H01M10/052 , H01M10/0562 , H01M10/0585 , H01M2002/0297 , H01M2300/0071
摘要： A flexible battery and method for fabricating a flexible battery includes forming (602) at least one battery stack layer on a stop layer (604) formed on a first substrate. The first substrate is capable of withstanding processing temperatures above 400 degrees C. The at least one battery stack layer is transferred (606) to a flexible substrate by a substrate transfer process. The first substrate is removed (610) down to the stop layer.
摘要翻译：用于制造柔性电池的柔性电池和方法包括在形成在第一基板上的阻挡层（604）上形成（602）至少一个电池堆叠层。第一衬底能够承受高于400℃的处理温度。通过衬底转移工艺将至少一个电池堆层转移（606）到柔性衬底。第一衬底被去除（610）到停止层。

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