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1. 发明申请

WO2006062766A2 EFFICIENT MICRO-MACHINING APPARATUS AND METHOD EMPLOYING MULTIPLE LASER BEAMS 审中-公开
标题翻译：使用多激光束的有效微加工设备和方法
公开(公告)号：WO2006062766A2
公开(公告)日：2006-06-15
申请号：PCT/US2005/043112
申请日：2005-11-29
申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC. , CUTLER, Donald, R. , BAIRD, Brian, W. , HARRIS, Richard, S. , HEMENWAY, David, M. , LO, Ho Wai , NILSEN, Brady, E. , OSAKO, Yasu , SUN, Lei , SUN, Yunlong , UNRATH, Mark, A.
发明人： CUTLER, Donald, R. , BAIRD, Brian, W. , HARRIS, Richard, S. , HEMENWAY, David, M. , LO, Ho Wai , NILSEN, Brady, E. , OSAKO, Yasu , SUN, Lei , SUN, Yunlong , UNRATH, Mark, A.
IPC分类号： H01S3/10 , H01S3/08
CPC分类号： B23K26/0673 , B23K26/0622 , B23K26/067 , B23K26/082
摘要： A laser beam switching system (50) employs a laser (52) coupled to a beam switching device (58) that causes a laser beam to switch between first and second beam positioning heads such that while the first beam positioning head (60) is directing the laser beam to process a workpiece target location, the second beam positioning head (62) is moving to another target location and vice versa. A preferred beam switching device includes first and second AOMs. When RF is applied to the first AOM (72), the laser beam is diffracted toward the first beam positioning head, and when RF is applied to the second AOM (74), the laser beam is diffracted toward the second beam positioning head. A workpiece processing system (120) employs a common modular imaged optics assembly (122) and an optional variable beam expander (94) for optically processing multiple laser beams.
摘要翻译：激光束切换系统（50）采用耦合到光束切换装置（58）的激光器（52），该激光器使激光束在第一和第二光束定位头之间切换，使得当第一射束定位头（60）引导激光束来处理工件目标位置，第二射束定位头（62）移动到另一个目标位置，反之亦然。优选的射束切换装置包括第一和第二AOM。当RF施加到第一AOM（72）时，激光束被朝向第一光束定位头衍射，并且当RF被施加到第二AOM（74）时，激光束被衍射向第二光束定位头。工件处理系统（120）采用共同的模块化成像光学组件（122）和可选的可变光束扩展器（94），用于光学处理多个激光束。

2. 发明申请

WO2006060160A1 NONLINEAR CRYSTAL MODIFICATIONS FOR DURABLE HIGH-POWER LASER WAVELENGTH CONVERSION 审中-公开
标题翻译：用于耐用的高功率激光波长转换的非线性晶体修改
公开(公告)号：WO2006060160A1
公开(公告)日：2006-06-08
申请号：PCT/US2005/041379
申请日：2005-11-15
申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC. , SUN, Yunlong , HARRIS, Richard S.
发明人： SUN, Yunlong , HARRIS, Richard S.
IPC分类号： H01S3/109 , G02F1/35
CPC分类号： H01S3/109
摘要： A wavelength converter (34) such as a nonlinear crystal has an angle cut exit surface (36) to separate a harmonic wavelength from a fundamental or different harmonic wavelength. A solid optical overlay medium (28) has an entrance surface (38) that is angle cut to mate with the converter exit surface (36). The optical overlay medium (28) is substantially transparent to the fundamental and selected harmonic wavelengths, has a refractive index similar to that of the wavelength converter (34), and has damage thresholds at the selected wavelengths that are greater than the respective damage thresholds of the wavelength converter (34).
摘要翻译：诸如非线性晶体的波长转换器（34）具有用于将谐波波长与基波或不同谐波波长分离的角度切除出射表面（36）。固体光学覆盖介质（28）具有与转换器出口表面（36）配合的角度切割的入口表面（38）。光学覆盖介质（28）对基波和选定的谐波波长基本上是透明的，具有与波长转换器（34）的折射率类似的折射率，并且在所选波长处具有大于相应损伤阈值的损伤阈值波长转换器（34）。

3. 发明申请

WO2003052890A1 PROCESSING A MEMORY LINK WITH A SET OF AT LEAST TWO LASER PULSES 审中-公开
标题翻译：用一组至少两个激光脉冲处理存储器链接
公开(公告)号：WO2003052890A1
公开(公告)日：2003-06-26
申请号：PCT/US2002/040410
申请日：2002-12-17
申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC. , SUN, Yunlong , SWENSON, Edward, J. , HARRIS, Richard, S.
发明人： SUN, Yunlong , SWENSON, Edward, J. , HARRIS, Richard, S.
IPC分类号： H01S3/10
CPC分类号： H01S3/0057 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/067 , G11C17/14 , G11C17/143 , H01L23/5258 , H01L2924/0002 , H01S5/4012 , H01L2924/00
摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 500 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single "pulse" by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.
摘要翻译：激光脉冲（52）的组（50）被用于切断存储器或其他IC芯片中的导电链路（22）。该组（50）的持续时间优选短于500ns; 并且该组（50）内的每个激光脉冲（52）的脉冲宽度优选在约0.1ps至30ns的范围内。该组（50）可以被视为单个“脉冲” 通过传统的激光定位系统（62）在每个激光系统（60）在每个链路（22）处激发一组（50个）激光脉冲（52）时执行即时链路移除而不停止。传统的红外波长或它们的谐波可以被采用。

4. 发明申请

WO2002073322A1 QUASI-CW DIODE-PUMPED, SOLID-STATE UV LASER SYSTEM AND METHOD EMPLOYING SAME 审中-公开
标题翻译： QUASI-CW二极管泵浦固体紫外线激光系统及其使用方法
公开(公告)号：WO2002073322A1
公开(公告)日：2002-09-19
申请号：PCT/US2002/007486
申请日：2002-03-12
申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC. , HARRIS, Richard, S. , SUN, Yunlong
发明人： SUN, Yunlong
IPC分类号： G05B15/00
CPC分类号： B23K26/382 , B23K2203/50 , H05K3/0026 , H05K3/0038
摘要： A quasi-CW diode- or lamp-pumped, A-O Q-switched solid-state UV laser system (10) synchronizes timing of the quasi-CW pumping with movement of the positioning system (36) to reduce pumping while the positioning system (36) is moving from one target area (31) to the next target area (31) to form multiple vias in a substrate at a high throughput. Thus, the available UV power for via formation is higher even though the average pumping power to the laser medium (16), and thermal loading of the laser pumping diodes (14), remains the same as that currently available through conventional CW pumping with conventionally available laser pumping diodes (14). The quasi-CW pumping current profile can be further modified to realize a preferred UV pulse amplitude profile.
摘要翻译：准CW二极管或灯泵浦的AO Q开关固态紫外激光系统（10）使准CW泵浦的定时与定位系统（36）的运动同步，以减少定位系统（36）的泵送）从一个目标区域（31）移动到下一个目标区域（31），以在高通量下在衬底中形成多个通孔。因此，即使通过激光介质（16）的平均泵浦功率和激光泵浦二极管（14）的热负载仍然保持与通过传统CW泵浦现有可用的通常形式的可用UV功率相同可用的激光泵浦二极管（14）。可以进一步修改准CW泵浦电流分布，以实现优选的UV脉冲幅度分布。

5. 发明申请

WO2005016586A2 METHODS OF AND LASER SYSTEMS FOR LINK PROCESSING USING LASER PULSES WITH SPECIALLY TAILORED POWER PROFILES 审中-公开
标题翻译：使用激光脉冲进行链接处理的特殊定制电源配置文件和激光系统的方法和激光系统
公开(公告)号：WO2005016586A2
公开(公告)日：2005-02-24
申请号：PCT/US2004/026977
申请日：2004-08-18
申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC , SUN, Yunlong , HARRIS, Richard S. , LO, Ho Wai , BAIRD, Brian W. , JOHNSON, Jay Christopher
发明人： SUN, Yunlong , HARRIS, Richard S. , LO, Ho Wai , BAIRD, Brian W. , JOHNSON, Jay Christopher
IPC分类号： B23K
CPC分类号： H01L23/5258 , B23K26/0613 , B23K26/0622 , B23K2201/40 , H01L2924/0002 , H01L2924/00
摘要： A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.
摘要翻译：具有特别定制的时间功率特性的激光脉冲，而不是传统的时间形状或基本上正方形的形状，切断了IC连接。特别定制的激光脉冲优选地在激光脉冲的开始处具有过冲，或者在激光脉冲的持续时间内具有尖峰。尖峰的定时优先设置在链路被大部分去除的时间之前。特别定制的激光脉冲功率轮廓允许使用更宽的激光脉冲能量范围和更短的激光波长（例如绿色和紫外线）来切断连接，而不会对基板和钝化结构材料的任何一侧和底层链接。

6. 发明申请

WO2005043699A2 LASER PROCESSING OF A LOCALLY HEATED TARGET MATERIAL 审中-公开
标题翻译：本地加热目标材料的激光加工
公开(公告)号：WO2005043699A2
公开(公告)日：2005-05-12
申请号：PCT/US2004/034903
申请日：2004-10-20
申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC. , SUN, Yunlong , JINJIAO, Liu , HARRIS, Richard, S. , SUBRAHMANYAN, Pradeep , HAINSEY, Robert, F. , LU, Weixiong
发明人： SUN, Yunlong , JINJIAO, Liu , HARRIS, Richard, S. , SUBRAHMANYAN, Pradeep , HAINSEY, Robert, F. , LU, Weixiong
IPC分类号： H01S
CPC分类号： B23K26/0608 , B23K26/0604 , B23K26/382 , B23K26/389 , B23K26/40 , B23K2203/08 , B23K2203/10 , B23K2203/12 , B23K2203/14 , B23K2203/172 , B23K2203/26 , B23K2203/42 , B23K2203/50 , B23K2203/52 , B23K2203/56 , H05K3/0038 , H05K2203/108 , H05K2203/1105
摘要： A method and laser system effect rapid removal of material from a workpiece (20) by applying heating energy in the form of a light beam (28) to a target location (16) on the workpiece to elevate its temperature while maintaining its dimensional stability. When the target portion of the workpiece is heated, a laser beam (12) is directed for incidence on the heated target location. The laser beam preferably has a processing laser output that is appropriate to effect removal of the target material from the workpiece. The combined incidence of the processing laser output and the heating energy on the target location enables the processing laser output to remove a portion of the target material at a material removal rate that is higher than the material removal rate achievable when the target material is not heated.
摘要翻译：一种方法和激光系统通过将光束（28）形式的加热能量施加到工件上的目标位置（16）来快速地从工件（20）上移除材料，以提高其温度同时保持其尺寸稳定性。当工件的目标部分被加热时，激光束（12）被引导以被加热到目标位置。激光束优选地具有适合于从工件去除目标材料的处理激光输出。处理激光输出和加热能量在目标位置的组合发生率使得处理激光输出能够以高于目标材料不加热时可实现的材料去除速率的材料去除速率去除目标材料的一部分。

7. 发明申请

WO2009073371A2 SYSTEMS AND METHODS FOR LINK PROCESSING WITH ULTRAFAST AND NANOSECOND LASER PULSES 审中-公开
标题翻译：用ULTRAFAST和NANOSECOND激光脉冲串联处理的系统和方法
公开(公告)号：WO2009073371A2
公开(公告)日：2009-06-11
申请号：PCT/US2008/084124
申请日：2008-11-20
申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC. , SUN, Yunlong , HARRIS, Richard S.
发明人： SUN, Yunlong , HARRIS, Richard S.
IPC分类号： H01S3/10 , H01L21/30
CPC分类号： B23K26/0624 , H01L23/5258 , H01L2924/0002 , H01L2924/00
摘要： Systems and methods for processing an electrically conductive link in an integrated circuit use a series of laser pulses having different pulse widths to remove different portions of a target structure without substantially damaging a material underlying the electrically conductive link. In one embodiment, an ultrafast laser pulse or bundle of ultrafast laser pulses removes an overlying passivation layer in a target area and a first portion of link material. Then, a nanosecond laser pulse removes a second portion of the link material to sever an electrical connection between two nodes in the integrated circuit. The nanosecond laser pulse is configured to reduce or eliminate damage to the underlying material.
摘要翻译：用于处理集成电路中的导电链路的系统和方法使用具有不同脉冲宽度的一系列激光脉冲来去除目标结构的不同部分，而不会基本上损坏导电链路下方的材料。在一个实施例中，超快激光脉冲或超快激光脉冲束去除了目标区域中的覆盖钝化层和链接材料的第一部分。然后，纳秒激光脉冲移除链路材料的第二部分以切断集成电路中的两个节点之间的电连接。纳秒激光脉冲被配置为减少或消除对下面的材料的损坏。

8. 发明申请

WO2006009818A2 SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LASER BEAM SPOTS 审中-公开
标题翻译：使用多个激光束的半导体结构处理
公开(公告)号：WO2006009818A2
公开(公告)日：2006-01-26
申请号：PCT/US2005/021406
申请日：2005-06-16
申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC. , BRULAND, Kelly J. , LO, Ho Wai , BAIRD, Brian W. , EVANS, Frank G. , HARRIS, Richard S. , SUN, Yunlong , SWARINGEN, Stephen N.
发明人： BRULAND, Kelly J. , LO, Ho Wai , BAIRD, Brian W. , EVANS, Frank G. , HARRIS, Richard S. , SUN, Yunlong , SWARINGEN, Stephen N.
IPC分类号： H01L21/00 , H01L21/302 , H01L21/26 , H01L21/84 , H01L21/461 , H01L21/324 , H01L21/42 , H01L21/477
CPC分类号： B23K26/067 , B23K26/0676 , B23K26/0853 , B23K2201/40 , G11C17/143 , G11C17/16 , G11C17/18 , G11C29/02 , G11C29/027 , H01L21/268 , H01L23/5258 , H01L2924/0002 , H01L2924/00
摘要： Methods and systems process electrically conductive links on or within a semiconductor substrate (740) using multiple laser beams. For example, a method utilizes N series of laser pulses to obtain a throughput benefit, wherein N ≥ 2. The links are arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction. The N series of laser pulses propagate along N respective beam axes until incident upon selected links. The pattern of resulting laser spots may be on links in N distinct rows, on distinct links in the same row, or on the same link, either partially or completely overlapping. The resulting laser spots may be offset from one another in the lengthwise direction of the rows or offset from one another in a direction perpendicular to the lengthwise direction of the rows, or both.
摘要翻译：方法和系统使用多个激光束在半导体衬底（740）上或内部处理导电链路。例如，一种利用N系列激光脉冲获得吞吐量优点的方法，其中N = 2。所述链路被布置成沿大致长度方向延伸的多个基本平行的行。 N系列激光脉冲沿着N个相应的波束轴传播，直到在所选择的链路上入射。所产生的激光斑点的图案可以是N个不同行中的链接，在相同行中的不同链接上，或者在同一链接上，部分地或完全重叠。所得到的激光点可以在行的长度方向上彼此偏移，或者在与行的长度方向垂直的方向上彼此偏移，或者两者偏离。

9. 发明申请

WO2002060633A1 RESISTOR TRIMMING WITH SMALL UNIFORM SPOT FROM SOLID-STATE UV LASER 审中-公开
标题翻译：电阻器与固体紫外线激光器的小均匀点匹配
公开(公告)号：WO2002060633A1
公开(公告)日：2002-08-08
申请号：PCT/US2002/003006
申请日：2002-01-31
申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC. , SWENSON, Edward, J. , HARRIS, Richard, S. , SUN, Yunlong
发明人： SWENSON, Edward, J. , HARRIS, Richard, S. , SUN, Yunlong
IPC分类号： B23K26/00
CPC分类号： H01C17/242 , B23K26/073
摘要： A uniform laser spot, such as from an imaged shaped Gaussian output (118) or a clipped Gaussian spot, that is less than 20 @m in diameter can be employed for both thin and thick film resistor trimming to substantially reduce microcracking. These spots can be generated in an ablative, nonthermal, UV laser wavelength to reduce the HAZ and/or shift in TCR.
摘要翻译：可以采用均匀的激光光斑，例如从成像高斯输出（118）或截止的高斯光点到直径小于20μm的薄膜电阻器修整，以显着减少微裂纹。这些斑点可以以烧蚀，非热的UV激光波长产生，以减少HAZ和/或TCR中的移位。

10. 发明申请

WO2009120603A2 SYSTEMS AND METHODS FOR LASER PULSE EQUALIZATION 审中-公开
标题翻译：用于激光脉冲均衡的系统和方法
公开(公告)号：WO2009120603A2
公开(公告)日：2009-10-01
申请号：PCT/US2009/037824
申请日：2009-03-20
申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC. , SUN, Yunlong , CHANG, Feng
发明人： SUN, Yunlong , CHANG, Feng
IPC分类号： H01S3/10 , H01S5/06
CPC分类号： H01S3/0941 , H01S3/042 , H01S3/094076 , H01S3/10046 , H01S3/10069 , H01S3/1024 , H01S3/1068 , H01S3/117 , H01S3/1306
摘要： Systems and methods provide laser pulse equalization at different pulse repetition frequencies (PRFs). After initially pumping a lasing medium from a first pumping level to a peak pumping level, a controller may cause a pump source to continue pumping the lasing medium according to a pulse equalization pumping curve. The equalization pumping curve may be determined based on testing laser pulse parameters at different PRFs to achieve an optimal equalization result of the pulse parameters. The optimization metric used to evaluate various equalization pumping curves may include a consistency of the pulse energy level, peak power level, and/or pulse width of the laser under different PRFs. The equalization pumping curve may be a descending curve from the peak pumping level to the first pumping level. The equalization pumping curve may be a linearly declining curve, a substantially exponentially declining curve, a parametrically declining curve, or any other curve type.
摘要翻译：系统和方法在不同的脉冲重复频率（PRF）下提供激光脉冲均衡。在将激光介质从第一泵浦水平泵入峰值泵浦水平之后，控制器可以使得泵浦源根据脉冲均衡泵浦曲线继续泵浦激光介质。均衡泵浦曲线可基于在不同PRF处测试激光脉冲参数来确定，以实现脉冲参数的最佳均衡结果。用于评估各种均衡泵浦曲线的优化度量可以包括不同PRF下激光的脉冲能量水平，峰值功率水平和/或脉冲宽度的一致性。均衡泵送曲线可以是从峰值泵送水平到第一泵水平的下降曲线。均衡泵送曲线可以是线性下降曲线，大致指数下降曲线，参数下降曲线或任何其他曲线类型。

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