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1. 发明申请

WO2016095975A1 APPARATUS AND METHOD FOR COATING A SUBSTRATE WITH A MOVABLE SPUTTER ASSEMBLY AND CONTROL OVER PROCESS GAS PARAMETERS 审中-公开
标题翻译：用可移动的喷射器组件涂覆基板和控制过程气体参数的装置和方法
公开(公告)号：WO2016095975A1
公开(公告)日：2016-06-23
申请号：PCT/EP2014/078056
申请日：2014-12-16
申请人： APPLIED MATERIALS, INC. , SEVERIN, Daniel , BENDER, Marcus , HANIKA, Markus , LINDENBERG, Ralph
发明人： SEVERIN, Daniel , BENDER, Marcus , HANIKA, Markus , LINDENBERG, Ralph
IPC分类号： C23C14/50 , C23C14/34 , C23C14/35 , C23C14/56 , C23C14/54 , H01J37/34 , C23C14/00 , H01J37/32
CPC分类号： C23C14/562 , C23C14/0063 , C23C14/3492 , C23C14/352 , C23C14/54 , C23C14/542 , H01J37/32449 , H01J37/3405 , H01J37/3417 , H01J37/347
摘要： According to embodiments, an apparatus and a method for coating a substrate are provided. The apparatus includes a vacuum process chamber. The vacuum process chamber includes a gas inlet assembly and a sputter assembly. The gas inlet assembly includes at least one connector for connecting to one or more process gas sources. The sputter assembly includes a sputter source. The sputter assembly is movable in the vacuum process chamber. The apparatus further includes a controller. The controller is configured for controlling, in dependence of a current position of the sputter source in the vacuum process chamber, at least one of: a flow of a process gas introduced through the gas inlet assembly into the vacuum process chamber, a composition of the process gas introduced through the gas inlet assembly into the vacuum process chamber, and a distribution of the process gas introduced through the gas inlet assembly into the vacuum process chamber. The controller may additionally or alternatively be configured for controlling a gas flow pumped out of the vacuum process chamber.
摘要翻译：根据实施例，提供了一种用于涂覆基板的装置和方法。该装置包括真空处理室。真空处理室包括气体入口组件和溅射组件。气体入口组件包括用于连接到一个或多个处理气体源的至少一个连接器。溅射组件包括溅射源。溅射组件可在真空处理室中移动。该装置还包括控制器。控制器被配置为根据真空处理室中的溅射源的当前位置来控制以下中的至少一个：通过气体入口组件引入真空处理室的工艺气体的流动，通过气体入口组件引入真空处理室的工艺气体，以及通过气体入口组件引入到真空处理室中的工艺气体的分布。控制器可以附加地或替代地被配置为用于控制从真空处理室抽出的气流。

2. 发明申请

WO2016095976A1 APPARATUS AND METHOD FOR COATING A SUBSTRATE WITH A MOVABLE SPUTTER ASSEMBLY AND CONTROL OVER POWER PARAMETERS 审中-公开
标题翻译：用于将可移动的飞溅器组件涂覆在基板上的控制装置和方法
公开(公告)号：WO2016095976A1
公开(公告)日：2016-06-23
申请号：PCT/EP2014/078057
申请日：2014-12-16
申请人： APPLIED MATERIALS, INC. , SEVERIN, Daniel , HANIKA, Markus , BENDER, Marcus , LINDENBERG, Ralph
发明人： SEVERIN, Daniel , HANIKA, Markus , BENDER, Marcus , LINDENBERG, Ralph
IPC分类号： C23C14/50 , C23C14/34 , C23C14/35 , C23C14/56 , C23C14/54 , H01J37/34 , C23C14/00 , H01J37/32
CPC分类号： C23C14/3492 , C23C14/0063 , C23C14/352 , C23C14/54 , C23C14/542 , C23C14/562 , H01J37/32733 , H01J37/3405 , H01J37/3417 , H01J37/3444 , H01J37/3447 , H01J37/347
摘要： According to embodiments, an apparatus and a method for coating a substrate in a vacuum process chamber are provided. The method includes sputtering a sputter material from a sputter source while a first power is applied to the sputter source, wherein the sputter source is located in a first position relative to the substrate. The method includes moving the sputter source in a translational movement relative to the vacuum chamber while sputtering. The method further includes sputtering the sputter material from the sputter source while a second power is applied to the sputter source, wherein the sputter source is located in a second position relative to the substrate.
摘要翻译：根据实施例，提供了一种用于在真空处理室中涂覆基板的装置和方法。该方法包括在将第一功率施加到溅射源的同时从溅射源溅射溅射材料，其中溅射源位于相对于衬底的第一位置。该方法包括在溅射时相对于真空室的平移运动移动溅射源。该方法还包括在溅射源施加第二功率的同时从溅射源溅射溅射材料，其中溅射源相对于衬底位于第二位置。

3. 发明申请

WO2013020589A1 ADJUSTABLE MASK 审中-公开
标题翻译：可调面膜
公开(公告)号：WO2013020589A1
公开(公告)日：2013-02-14
申请号：PCT/EP2011/063714
申请日：2011-08-09
申请人： APPLIED MATERIALS, INC. , SCHEER, Evelyn , HANIKA, Markus , LINDENBERG, Ralph , BENDER, Marcus , LOPP, Andreas , SCHWANITZ, Konrad , PIERALISI, Fabio , LIU, Jian
发明人： SCHEER, Evelyn , HANIKA, Markus , LINDENBERG, Ralph , BENDER, Marcus , LOPP, Andreas , SCHWANITZ, Konrad , PIERALISI, Fabio , LIU, Jian
IPC分类号： C23C14/04 , C23C16/04
CPC分类号： C23C14/042 , C23C16/042
摘要： An deposition apparatus for forming a deposition material layer on a substrate is described. The deposition apparatus includes a substrate support adapted for holding a substrate; and an edge (660) exclusion mask (640) for covering a periphery of the substrate (610) during layer deposition. The mask has at least one frame portion defining an aperture. The at least one frame portion of the mask is adapted for being moved (670,680) with respect to the substrate depending on the amount of deposition material deposited on the at least one frame portion of the mask. Further, a method for depositing a deposition material layer on a substrate using an edge exclusion mask is described.
摘要翻译：描述了用于在基板上形成沉积材料层的沉积装置。沉积设备包括适于保持衬底的衬底支撑件; 以及用于在层沉积期间覆盖衬底（610）的周边的边缘（660）排除掩模（640）。掩模具有限定孔的至少一个框架部分。掩模的至少一个框架部分适于相对于基板移动（670,680），这取决于沉积在掩模的至少一个框架部分上的沉积材料的量。此外，描述了使用边缘排除掩模在基板上沉积沉积材料层的方法。

4. 发明申请

WO2013060355A1 MULTIDIRECTIONAL RACETRACK ROTARY CATHODE FOR PVD ARRAY APPLICATIONS 审中-公开
标题翻译： PVD阵列应用的多媒体旋转阴极
公开(公告)号：WO2013060355A1
公开(公告)日：2013-05-02
申请号：PCT/EP2011/068552
申请日：2011-10-24
申请人： APPLIED MATERIALS, INC. , SCHEER, Evelyn , HANIKA, Markus , LINDENBERG, Ralph , BENDER, Marcus , LOPP, Andreas , SCHWANITZ, Konrad , PIERALISI, Fabio , LIU, Jian
发明人： SCHEER, Evelyn , HANIKA, Markus , LINDENBERG, Ralph , BENDER, Marcus , LOPP, Andreas , SCHWANITZ, Konrad , PIERALISI, Fabio , LIU, Jian
IPC分类号： C23C14/34 , C23C14/35 , H01J37/34
CPC分类号： H01J37/32532 , C23C14/3407 , C23C14/35 , H01J37/3405 , H01J37/345 , H01J37/3452 , H01J37/3455
摘要： A cathode assembly (130; 200; 300; 400) for a sputter deposition apparatus and a method for coating a substrate is provided. The cathode assembly has a coating side for coating on a substrate. Further, the cathode assembly includes a rotary target assembly adapted for rotating a target material (210; 310; 410) around a rotary axis (220; 320; 420); at least a first magnet assembly (230; 330; 340; 430; 431; 432; 433) having an inner magnet pole and at least one outer magnet poles and being adapted for generating one or more plasma regions (240; 250; 340; 350; 440; 441; 442; 443). The cathode assembly (130; 200; 300; 400) has a first angular coordinate for a magnet pole, the magnet pole being provided for the coating side, and a second angular coordinate for a further magnet pole, the magnet pole being provided for the coating side; wherein the first angular coordinate (260; 360; 460) and the second angular coordinate (270; 370; 461) define an angle a larger than about 20 degrees and smaller than about 160 degrees.
摘要翻译：提供了一种用于溅射沉积设备的阴极组件（130; 200; 300; 400）和一种用于涂覆衬底的方法。阴极组件具有用于在基板上涂覆的涂层侧。此外，阴极组件包括适于围绕旋转轴线（220; 320; 420）旋转靶材料（210; 310; 410）的旋转靶组件; 至少一个具有内磁极和至少一个外磁极的第一磁体组件（230; 330; 340; 430; 431; 432; 433），并适于产生一个或多个等离子体区域（240; 250; 340; 350; 440; 441; 442; 443）。阴极组件（130; 200; 300; 400）具有用于磁极的第一角度坐标，为涂层侧提供磁极，并且为另一个磁极设置第二角坐标，磁极设置用于涂层面其中所述第一角坐标（260; 360; 460）和所述第二角坐标（270; 370; 461）限定大于约20度且小于约160度的角度。

5. 发明申请

WO2012041557A1 SYSTEMS AND METHODS FOR FORMING A LAYER OF SPUTTERED MATERIAL 审中-公开
标题翻译：用于形成溅射材料层的系统和方法
公开(公告)号：WO2012041557A1
公开(公告)日：2012-04-05
申请号：PCT/EP2011/062674
申请日：2011-07-22
申请人： APPLIED MATERIALS, INC. , BENDER, Marcus , HANIKA, Markus , SCHEER, Evelyn , PIERALISI, Fabio , MAHNKE, Guido , LINDENBERG, Ralph , LOPP, Andreas , SCHWANITZ, Konrad , LIU, Jian
发明人： BENDER, Marcus , HANIKA, Markus , SCHEER, Evelyn , PIERALISI, Fabio , MAHNKE, Guido , LINDENBERG, Ralph , LOPP, Andreas , SCHWANITZ, Konrad , LIU, Jian
IPC分类号： H01J37/34
CPC分类号： C23C14/352 , C23C14/35 , H01J37/34 , H01J37/3473
摘要： The present disclosure describes a method of coating a substrate (110), the method including forming a layer (806) of sputtered material on the substrate (110). Forming the layer of sputtered material may include: sputtering material from at least one rotatable target (120') over the substrate (110); varying the relative position between the at least one target (120') and the substrate (110). In addition, the present disclosure describes varying the distance between a target (120; 120'; 120'') and a substrate during the sputter process. The present disclosure further describes a system for coating a substrate.
摘要翻译：本公开描述了涂覆基底（110）的方法，该方法包括在基底（110）上形成溅射材料层（806）。形成溅射材料层可以包括：从衬底（110）上的至少一个可旋转靶（120'）溅射材料; 改变所述至少一个靶（120'）和所述衬底（110）之间的相对位置。另外，本公开内容描述了在溅射过程期间改变目标（120; 120'; 120“）和衬底之间的距离。本公开进一步描述了用于涂覆基底的系统。

6. 发明申请

WO2016180447A1 METHOD OF MANUFACTURING A LAYER FOR DISPLAY MANUFACTURING USING HYDROGEN AND APPARATUS THEREFORE 审中-公开
标题翻译：使用氢气和装置制造显示器制造层的方法
公开(公告)号：WO2016180447A1
公开(公告)日：2016-11-17
申请号：PCT/EP2015/060232
申请日：2015-05-08
申请人： APPLIED MATERIALS, INC. , SEVERIN, Daniel , KLÖPPEL, Andreas , HANIKA, Markus , BENDER, Marcus
发明人： SEVERIN, Daniel , KLÖPPEL, Andreas , HANIKA, Markus , BENDER, Marcus
IPC分类号： C23C14/08 , C23C14/34 , C23C14/54
CPC分类号： C23C14/083 , C23C14/3492 , C23C14/54
摘要： A method of manufacturing a layer for a plurality of thin film transistors for display manufacturing and an apparatus therefore is described. The method includes sputtering a transparent conductive oxide layer from an indium oxide containing target in a processing gas atmosphere. The processing gas atmosphere includes H 2 , O 2 , and an inert gas, wherein the content of H 2 is from 2.2% to 20.0%, the content of O 2 is from 0.5% to 15.0%, and the content of inert gas is from 65.0% to 97.3 %. The apparatus (200) includes a vacuum chamber (210); one or more indium oxide containing targets (220a, 220b) within the vacuum chamber for sputtering a transparent conductive oxide layer; a gas distribution system (230) for providing a processing gas within the vacuum chamber; and a controller (240) connected to the gas distribution system and configured to execute a program code for conducting the method.
摘要翻译：因此，制造用于显示制造的多个薄膜晶体管的层的方法和装置。该方法包括在处理气体气氛中从含氧化铟的靶溅射透明导电氧化物层。处理气体气氛包括H 2，O 2和惰性气体，其中H 2的含量为2.2％至20.0％，O 2的含量为0.5％至15.0％，惰性气体的含量为65.0％至 97.3％。设备（200）包括真空室（210）; 在真空室内的一个或多个含氧化铟的靶（220a，220b）用于溅射透明导电氧化物层; 气体分配系统（230），用于在所述真空室内提供处理气体; 以及连接到所述气体分配系统并被配置为执行用于执行所述方法的程序代码的控制器（240）。

7. 发明申请

WO2015158391A1 EDGE UNIFORMITY IMPROVEMENT IN PVD ARRAY COATERS 审中-公开
标题翻译： PVD阵列涂层的边缘均匀性改进
公开(公告)号：WO2015158391A1
公开(公告)日：2015-10-22
申请号：PCT/EP2014/057920
申请日：2014-04-17
申请人： APPLIED MATERIALS, INC. , SCHEER, Evelyn , BENDER, Marcus , PIERALISI, Fabio , SEVERIN, Daniel , LINDENBERG, Ralph , GÄRTNER, Harald
发明人： SCHEER, Evelyn , BENDER, Marcus , PIERALISI, Fabio , SEVERIN, Daniel , LINDENBERG, Ralph , GÄRTNER, Harald
IPC分类号： H01J37/34 , H01J37/32 , C23C14/00
CPC分类号： H01J37/347 , C23C14/352 , C23C14/542 , C23C14/568 , H01J37/32385 , H01J37/32449 , H01J37/3405 , H01J37/3417 , H01J37/3464
摘要： An apparatus for deposition of material on a substrate is described. The apparatus includes a deposition array (222) having three or more cathodes (122), wherein the deposition array comprises a first outer deposition assembly (301) comprising at least a first cathode of the three or more cathodes; a second outer deposition assembly (302) opposing the first outer deposition assembly comprising at least a second cathode of the three or more cathodes, and an inner deposition assembly (303) comprising at least one inner cathode located between the first outer deposition assembly and the second outer deposition assembly. At least one of the first outer deposition assembly (301) and the second outer deposition assembly (302) is configured for depositing the material at a higher rate than the inner deposition assembly (303) on the same substrate during the same time.
摘要翻译：描述了用于在衬底上沉积材料的装置。该装置包括具有三个或更多个阴极（122）的沉积阵列（222），其中沉积阵列包括包含三个或更多个阴极的至少第一阴极的第一外部沉积组件（301）与第一外部沉积组件相对的第二外部沉积组件（302），其包括三个或更多个阴极的至少第二阴极，以及内部沉积组件（303），其包括位于第一外部沉积组件和第二外部沉积组件之间的至少一个内部阴极第二外部沉积组件。第一外部沉积组件（301）和第二外部沉积组件（302）中的至少一个被配置用于在相同的时间内以比内部沉积组件（303）更高的速率沉积材料。

8. 发明申请

WO2015172835A1 APPARATUS AND METHOD FOR COATING A SUBSTRATE BY ROTARY TARGET ASSEMBLIES IN TWO COATING REGIONS 审中-公开
标题翻译：用于通过两个涂层区域中的旋转靶组件涂覆基板的装置和方法
公开(公告)号：WO2015172835A1
公开(公告)日：2015-11-19
申请号：PCT/EP2014/059975
申请日：2014-05-15
申请人： APPLIED MATERIALS, INC. , BENDER, Marcus , PIERALISI, Fabio , SCHEER, Evelyn , SEVERIN, Daniel , GÄRTNER, Harald , LINDENBERG, Ralph
发明人： BENDER, Marcus , PIERALISI, Fabio , SCHEER, Evelyn , SEVERIN, Daniel , GÄRTNER, Harald , LINDENBERG, Ralph
IPC分类号： C23C14/22 , C23C14/35 , C23C14/56 , H01J37/34
CPC分类号： C23C14/225 , C23C14/352 , C23C14/568 , H01J37/32733 , H01J37/3405 , H01J37/3417 , H01J37/3429 , H01J37/345 , H01J37/3452
摘要： According to an embodiment, a sputter deposition apparatus for coating a substrate is provided. The sputter deposition apparatus has two or more coating regions for coating the substrate. The sputter deposition apparatus includes a first substrate guiding system for guiding the substrate in a first coating region, wherein the first substrate guiding system defines a first substrate transport direction. The sputter deposition apparatus further includes a second substrate guiding system for guiding the substrate in a second coating region, the second substrate guiding system defining a second substrate transport direction. The second substrate transport direction is the same direction as the first substrate transport direction or is different from the first substrate transport direction. The sputter deposition apparatus further includes a first cathode assembly adapted for generating one or more plasma regions in the first coating region, a second cathode assembly adapted for generating one or more plasma regions in the first coating region, a third cathode assembly adapted for generating one or more plasma regions in the second coating region, and a fourth cathode assembly adapted for generating one or more plasma regions in the second coating region. The first cathode assembly includes: a first rotary target assembly adapted for rotating a target material around a first rotation axis; and a first magnet assembly fixedly positioned in the first rotary target assembly, the first magnet assembly having a first principal plane forming a first angle with a first reference plane which contains the first rotation axis and is perpendicular to the first substrate transport direction. The second cathode assembly includes: a second rotary target assembly adapted for rotating a target material around a second rotation axis; and a second magnet assembly fixedly positioned in the second rotary target assembly, the second magnet assembly having a second principal plane, the second principal plane being parallel to the first principal plane. The third cathode assembly includes: a third rotary target assembly adapted for rotating a target material around a third rotation axis; and a third magnet assembly fixedly positioned in the third rotary target assembly, the third magnet assembly having a third principal plane forming a second angle with a second reference plane which contains the third rotation axis and is perpendicular to the second substrate transport direction, wherein the second angle is different from the first angle. The fourth cathode assembly includes: a fourth rotary target assembly adapted for rotating a target material around a fourth rotation axis; and a fourth magnet assembly fixedly positioned in the fourth rotary target assembly, the fourth magnet assembly having a fourth principal plane, the fourth principal plane being parallel to the third principal plane.
摘要翻译：根据实施例，提供了一种用于涂覆基板的溅射沉积设备。溅射沉积装置具有用于涂覆基板的两个或更多个涂覆区域。溅射沉积设备包括用于在第一涂覆区域中引导衬底的第一衬底引导系统，其中第一衬底引导系统限定第一衬底输送方向。溅射沉积设备还包括用于在第二涂覆区域中引导衬底的第二衬底引导系统，第二衬底引导系统限定第二衬底输送方向。第二基板输送方向与第一基板输送方向相同，也可以不同于第一基板输送方向。溅射沉积设备还包括适于在第一涂覆区域中产生一个或多个等离子体区域的第一阴极组件，适于在第一涂覆区域中产生一个或多个等离子体区域的第二阴极组件，适于产生一个或更多的等离子体区域，以及适于在第二涂覆区域中产生一个或多个等离子体区域的第四阴极组件。第一阴极组件包括：适于围绕第一旋转轴线旋转目标材料的第一旋转靶组件; 以及固定地定位在所述第一旋转靶组件中的第一磁体组件，所述第一磁体组件具有与包含所述第一旋转轴线且垂直于所述第一衬底输送方向的第一参考平面形成第一角度的第一主平面。第二阴极组件包括：适于围绕第二旋转轴线转动目标材料的第二旋转靶组件; 以及固定地定位在所述第二旋转靶组件中的第二磁体组件，所述第二磁体组件具有第二主平面，所述第二主平面平行于所述第一主平面。第三阴极组件包括：适于围绕第三旋转轴线转动目标材料的第三旋转靶组件; 以及固定地定位在所述第三旋转靶组件中的第三磁体组件，所述第三磁体组件具有第三主平面，所述第三主平面与包含所述第三旋转轴线且垂直于所述第二基板输送方向的第二参考平面形成第二角度，其中，第二角度与第一角度不同。第四阴极组件包括：适于围绕第四旋转轴线旋转目标材料的第四旋转靶组件; 以及固定地定位在所述第四旋转靶组件中的第四磁体组件，所述第四磁体组件具有第四主平面，所述第四主平面平行于所述第三主平面。

9. 发明申请

WO2018145751A1 METHOD FOR VACUUM PROCESSING OF A SUBSTRATE, THIN FILM TRANSISTOR, AND APPARATUS FOR VACUUM PROCESSING OF A SUBSTRATE 审中-公开
公开(公告)号：WO2018145751A1
公开(公告)日：2018-08-16
申请号：PCT/EP2017/052884
申请日：2017-02-09
申请人： APPLIED MATERIALS, INC. , HANIKA, Markus , OLSON, Joseph C. , KURUNCZI, Peter F. , YIM, Dong-Kil , BENDER, Marcus
发明人： HANIKA, Markus , OLSON, Joseph C. , KURUNCZI, Peter F. , YIM, Dong-Kil , BENDER, Marcus
IPC分类号： C23C14/02 , C23C14/48 , C23C14/56 , H01L21/26 , H01L21/687
CPC分类号： C23C14/02 , C23C14/022 , C23C14/48 , C23C14/568 , H01L21/26 , H01L21/67173 , H01L21/67709 , H01L21/67712 , H01L21/6776 , H01L21/6831
摘要： A method for vacuum processing of a substrate (10) is provided. The method includes irradiating the substrate (10) or a first material layer on the substrate (10) with particles using an implantation source (130) provided in a processing region (110), and moving the substrate (10) through the processing region (110) along a transportation path (20) while the substrate (10) or the first material layer is irradiated with the particles.

10. 发明申请

WO2011039316A1 METHOD FOR COATING A SUBSTRATE AND COATER 审中-公开
标题翻译：涂层和涂层的方法
公开(公告)号：WO2011039316A1
公开(公告)日：2011-04-07
申请号：PCT/EP2010/064574
申请日：2010-09-30
申请人： APPLIED MATERIALS, INC. , BENDER, Marcus , HANIKA, Markus , SCHEER, Evelyn , PIERALISI, Fabio , MAHNKE, Guido
发明人： BENDER, Marcus , HANIKA, Markus , SCHEER, Evelyn , PIERALISI, Fabio , MAHNKE, Guido
IPC分类号： H01J37/34
CPC分类号： H01J37/3405 , H01J37/3452 , H01J37/3455
摘要： A method is provided for coating a substrate (100) with a cathode assembly (10) having a rotatable target (20). The rotatable target has at least one magnet assembly (25) positioned there within. The method includes positioning the magnet assembly at a first position so that it is asymmetrically aligned with respect to a plane (22) perpendicularly extending from the substrate (100) to the axis (21) of the rotatable target for a predetermined first time interval; positioning the magnet assembly at a second position that is asymmetrically aligned with respect to said plane (22) for a predetermined second time interval; and providing a voltage to the rotatable target that is varied over time during coating. Further, a coater is provided that includes a cathode assembly with a rotatable curved target; and two magnet assemblies positioned within the rotatable curved target wherein the distance between the two magnet assemblies can be varied.
摘要翻译：提供了一种用具有可旋转靶（20）的阴极组件（10）涂覆基底（100）的方法。可旋转靶具有定位在其内的至少一个磁体组件（25）。该方法包括将磁体组件定位在第一位置，使得其相对于从基板（100）垂直延伸到可旋转靶的轴线（21）的平面（22）以预定的第一时间间隔对准地对准; 将磁体组件定位在相对于所述平面（22）不对称对准预定的第二时间间隔的第二位置处; 以及向涂覆期间随时间变化的可旋转靶提供电压。此外，提供一种包括具有可旋转弯曲目标的阴极组件的涂布机; 以及位于可旋转弯曲目标内的两个磁体组件，其中两个磁体组件之间的距离可以改变。

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