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1. 发明申请

WO2010046252A1 GAS SUPPLY SYSTEM, PUMPING SYSTEM, COATING SYSTEM, GAS SUPPLY METHOD, AND PUMPING METHOD 审中-公开
标题翻译：气体供应系统，抽水系统，涂装系统，气体供应方法和抽水方法
公开(公告)号：WO2010046252A1
公开(公告)日：2010-04-29
申请号：PCT/EP2009/063226
申请日：2009-10-09
申请人： APPLIED MATERIALS, INC. , GEBELE, Thomas , HENRICH, Juergen , LEIPNITZ, Thomas , KLEIN, Stefan
发明人： GEBELE, Thomas , HENRICH, Juergen , LEIPNITZ, Thomas , KLEIN, Stefan
IPC分类号： C23C16/44
CPC分类号： C23C16/4412
摘要： A gas supply system 20 for supplying a gas into a pumping system 10 is provided, the pumping system including a plurality of pumping means 14, 16, the gas supply system comprising a gas inlet 22 and plurality of gas conduits 24, 25 fluidly connected to the gas inlet and each having a gas outlet 27, 28 fluidly connectable to the pumping system 10, wherein the gas outlets of the plurality of gas conduits are in parallel fluidly connectable to the pumping system and each gas conduit is provided with a gradient adjustment means adapted to provide at least one gradient of gas amount supplied to the pumping system.
摘要翻译：提供了一种用于将气体供应到泵送系统10中的气体供应系统20，该泵送系统包括多个泵送装置14,16，气体供应系统包括气体入口22和多个气体导管24,25，其流体连接到气体入口并且每个具有可流体地连接到泵送系统10的气体出口27,28，其中多个气体导管的气体出口并联可流动地连接到泵送系统，并且每个气体导管设置有梯度调节装置适于提供供应到泵送系统的气体量的至少一个梯度。

2. 发明申请

WO2017032404A1 APPARATUS FOR VACUUM SPUTTER DEPOSITION AND METHOD THEREFOR 审中-公开
标题翻译：真空溅射沉积装置及其方法
公开(公告)号：WO2017032404A1
公开(公告)日：2017-03-02
申请号：PCT/EP2015/069364
申请日：2015-08-24
申请人： APPLIED MATERIALS, INC. , SEVERIN, Daniel , GEBELE, Thomas , LEIPNITZ, Thomas
发明人： SEVERIN, Daniel , GEBELE, Thomas , LEIPNITZ, Thomas
IPC分类号： H01J37/32 , H01J37/34 , F23N5/24 , C23C14/00 , C23C14/34 , F23M11/00
CPC分类号： H01J37/32844 , C23C14/0063 , C23C14/3464 , H01J37/32449 , H01J37/32834 , H01J37/3405 , H01J37/3473 , Y02C20/30
摘要： An apparatus (100) for vacuum sputter deposition is described. The apparatus includes a vacuum chamber (110); three or more sputter cathodes within the vacuum chamber (110) for sputtering material on a substrate (200); a gas distribution system (130) for providing a processing gas including H 2 to the vacuum chamber (110); a vacuum system (140) for providing a vacuum inside the vacuum chamber (110); and a safety arrangement (160) for reducing the risk of an oxy-hydrogen explosion, wherein the safety arrangement (160) comprises a dilution gas feeding unit (165) connected to the vacuum system (160) for dilution of the H 2 -content of the processing gas (111).
摘要翻译：描述了用于真空溅射沉积的设备（100）。该装置包括一个真空室（110）; 用于在衬底（200）上溅射材料的真空室（110）内的三个或更多个溅射阴极; 用于向真空室（110）提供包括H2的处理气体的气体分配系统（130）; 用于在真空室（110）内提供真空的真空系统（140）; 以及用于降低氢氧爆炸危险的安全装置（160），其中所述安全装置（160）包括连接到所述真空系统（160）的稀释气体供给单元（165），用于稀释所述H 2 - 处理气体（111）。

3. 发明申请

WO2009106962A2 BACKSIDE COATING PREVENTION DEVICE, COATING CHAMBER COMPRISING A BACKSIDE COATING PREVENTION DEVICE, AND METHOD OF COATING 审中-公开
标题翻译：背面涂层防护装置，包括背面涂层防止装置的涂布室和涂布方法
公开(公告)号：WO2009106962A2
公开(公告)日：2009-09-03
申请号：PCT/IB2009/000357
申请日：2009-02-26
申请人： APPLIED MATERIALS, INC. , SAUER, Andreas , HENRICH, Juergen , GEBELE, Thomas
发明人： SAUER, Andreas , HENRICH, Juergen , GEBELE, Thomas
CPC分类号： C23C14/042 , C23C14/56 , C23C14/564 , C23C16/45519 , H01J37/32477 , H01J37/32623 , H01J37/32761
摘要： A backside coating prevention device adapted for a coating chamber for coating plate-shaped substrates is provided, said coating chamber being adapted for coating continuously or discontinuously transported plate-shaped substrates, comprising a front wall having a substrate feeding opening and a rear wall having a substrate discharge opening, a coating material source adapted for dispensing coating material into the coating chamber, and a transport system, a front side of the transport system facing the coating material source, the transport system being adapted for continuously or discontinuously transporting a plurality of plate-shaped substrates along a transport path on the front side of the transport system, wherein said backside coating prevention device is adapted for providing a gas barrier at the front side of the transport system and adjacent to the backsides of the plurality of plate- shapes substrates for preventing backside coating of the plate-shaped substrates.
摘要翻译：提供一种适用于涂布板状基材的涂布室的背面涂层防止装置，所述涂布室适用于连续或不连续传送的板状基材的涂布，包括具有基板供给口的前壁和具有基板供给口的后壁基材排出口，适于将涂料分配到涂布室中的涂料源和运输系统，运送系统的正面与涂料源相对，运输系统适于连续或不连续运送多个板所述背面涂层防止装置适于在所述传送系统的前侧提供与所述多个板状基板的背面相邻的气体阻挡层用于防止板状基板的背面涂覆。

4. 发明申请

WO2012052334A1 LOAD LOCK CHAMBER, SUBSTRATE PROCESSING SYSTEM AND METHOD FOR VENTING 审中-公开
标题翻译：负载锁仓，底板加工系统及其施工方法
公开(公告)号：WO2012052334A1
公开(公告)日：2012-04-26
申请号：PCT/EP2011/067819
申请日：2011-10-12
申请人： APPLIED MATERIALS, INC. , GEBELE, Thomas , LEIPNITZ, Thomas , BUSCHBECK, Wolfgang , BANGERT, Stefan , LINDENBERG, Ralph
发明人： GEBELE, Thomas , LEIPNITZ, Thomas , BUSCHBECK, Wolfgang , BANGERT, Stefan
IPC分类号： H01L21/67
CPC分类号： H01L21/67201 , Y10T137/0379
摘要： A lock chamber for a substrate processing system is provided which includes at least a first conduit adapted to provide an inner portion of the lock chamber in fluid communication with atmospheric pressure or overpressure. Additionally, the lock chamber includes at least a first control valve for controlling a flow rate of the fluid communication of the inner portion of the chamber with the atmospheric pressure or the overpressure, wherein the control valve is adapted to continuously control the flow rate. Furthermore, an according method, a computer program and a computer readable medium adapted for performing the method is provided.
摘要翻译：提供了一种用于基板处理系统的锁定室，其包括至少第一导管，其适于提供与大气压力或超压力流体连通的锁定室的内部。此外，锁定室至少包括第一控制阀，用于控制室内部与大气压或超压力的流体连通的流量，其中控制阀适于连续地控制流量。此外，提供了一种适用于执行该方法的依据方法，计算机程序和计算机可读介质。

5. 发明申请

WO2020025145A1 AN EVAPORATION SOURCE TO DEPOSIT EVAPORATED SOURCE MATERIALS, A METHOD OF SHIELDING EVAPORATED SOURCE MATERIALS AND A SHIELDING DEVICE FOR AN EVAPORATION SOURCE 审中-公开
公开(公告)号：WO2020025145A1
公开(公告)日：2020-02-06
申请号：PCT/EP2018/071169
申请日：2018-08-03
申请人： APPLIED MATERIALS, INC. , GEBELE, Thomas , LOPP, Andreas
发明人： GEBELE, Thomas , LOPP, Andreas
IPC分类号： C23C14/00 , C23C14/12 , C23C14/24 , C23C16/04 , C23C16/44 , H01L21/67 , H01L51/00 , C23C14/04
摘要： Embodiments described herein relate to a shielding device (200) for an evaporation source (20). The evaporation source (20) is configured to guide evaporated source material through one or more outlets (22). The shielding device (200) comprises one or more movable shielding device portions (205) configured to block evaporated source material depending on an emission angle of a plume (342) of evaporated source material from the one or more outlets (22) and configured to be replaced by a movement. A shielding device comprising one or more shielding belts (210) is disclosed. An evaporation source and a method of shielding are also disclosed.

6. 发明申请

WO2019201434A1 EVAPORATION SOURCE FOR DEPOSITION OF EVAPORATED MATERIAL ON A SUBSTRATE, DEPOSITION APPARATUS, METHOD FOR MEASURING A VAPOR PRESSURE OF EVAPORATED MATERIAL, AND METHOD FOR DETERMINING AN EVAPORATION RATE OF AN EVAPORATED MATERIAL 审中-公开
公开(公告)号：WO2019201434A1
公开(公告)日：2019-10-24
申请号：PCT/EP2018/059893
申请日：2018-04-18
申请人： APPLIED MATERIALS, INC. , GEBELE, Thomas , BUSCHBECK, Wolfgang
发明人： GEBELE, Thomas , BUSCHBECK, Wolfgang
IPC分类号： C23C14/24 , C23C14/54
摘要： An evaporation source (100) for deposition of evaporated material on a substrate is described. The evaporation source (100) including a crucible (110) for material evaporation; a distribution assembly (120) with one or more outlets (125) for providing the evaporated material to the substrate, the distribution assembly being in fluid communication with the crucible; and a measurement assembly (130). The measurement assembly includes a tube (140) connecting an interior space (121) of the distribution assembly (120) with a pressure sensor (145).

7. 发明申请

WO2015074725A1 SUBSTRATE CARRIER FOR A REDUCED TRANSMISSION OF THERMAL ENERGY 审中-公开
标题翻译：用于减少热能传输的基板载体
公开(公告)号：WO2015074725A1
公开(公告)日：2015-05-28
申请号：PCT/EP2013/074604
申请日：2013-11-25
申请人： APPLIED MATERIALS, INC. , LOPP, Andreas Ewald , KELLER, Stefan , SCHÜßLER, Uwe , BANGERT, Stefan , GEBELE, Thomas , SPATZ, Norbert
发明人： LOPP, Andreas Ewald , KELLER, Stefan , SCHÜßLER, Uwe , BANGERT, Stefan , GEBELE, Thomas , SPATZ, Norbert
IPC分类号： H01L21/673
CPC分类号： H01J37/32724 , C23C14/50 , C23C16/4581 , H01J2237/3321 , H01J2237/3323 , H01L21/67316 , H01L21/67346 , H01L31/1876 , H01L31/1896
摘要： According to the present disclosure, a semiconductor substrate handling systems and substrate carrier is provided. The substrate carrier for holding a substrate to be processed and for transporting the substrate in or through a processing area with a transport device includes a main portion for holding the substrate; a first end portion adapted to be supported by the transport device; and at least one first intermediate portion connecting the main portion with the first end portion. The at least one first intermediate portion includes one or more cut-outs adapted to reduce thermal energy transfer between the main portion and the first end portion.
摘要翻译：根据本公开，提供了半导体衬底处理系统和衬底载体。用于保持待处理的基板和用于在输送装置中或通过处理区域传送基板的基板载体包括用于保持基板的主要部分; 适于由所述运送装置支撑的第一端部; 以及将主要部分与第一端部连接起来的至少一个第一中间部分。所述至少一个第一中间部分包括一个或多个切口，其适于减小主体部分和第一端部部分之间的热能传递。

8. 发明申请

WO2020164686A1 METHOD FOR CLEANING A VACUUM SYSTEM, METHOD FOR VACUUM PROCESSING OF A SUBSTRATE, AND APPARATUS FOR VACUUM PROCESSING A SUBSTRATE 审中-公开
公开(公告)号：WO2020164686A1
公开(公告)日：2020-08-20
申请号：PCT/EP2019/053413
申请日：2019-02-12
申请人： APPLIED MATERIALS, INC. , RADEK, Manuel , GEBELE, Thomas , BUSCHBECK, Wolfgang
发明人： RADEK, Manuel , GEBELE, Thomas , BUSCHBECK, Wolfgang
IPC分类号： B08B7/00 , B08B9/00 , B08B7/04 , C23C16/44 , C23C14/12
摘要： A method for cleaning a vacuum chamber, particularly a vacuum chamber used in the manufacture of OLED devices, is described, The method includes igniting a UV source within the vacuum chamber; and adjusting a pressure in the vacuum chamber to a vacuum condition providing a mixture of ozone and active radicals from a process gas in the vacuum chamber.

9. 发明申请

WO2020151810A1 DEPOSITION APPARATUS AND METHOD OF OPERATING A DEPOSITION APPARATUS 审中-公开
公开(公告)号：WO2020151810A1
公开(公告)日：2020-07-30
申请号：PCT/EP2019/051463
申请日：2019-01-22
申请人： APPLIED MATERIALS, INC. , MADHU, N S , BIRADAR, Prashant Kasirayagoud , LINDENBERG, Ralph , GEBELE, Thomas
发明人： MADHU, N S , BIRADAR, Prashant Kasirayagoud , LINDENBERG, Ralph , GEBELE, Thomas
IPC分类号： H01J37/32 , C23C14/35 , H01J37/34
摘要： A deposition apparatus is described. The deposition apparatus includes a vacuum chamber (101), a deposition source (120) including at least one sputter source (121) within the vacuum chamber for coating a substrate on a first side of the deposition source, and a shielding arrangement (130) arranged on a second side of the deposition source. The shielding arrangement includes a plurality of shielding units which partially overlap and define gas flow paths (132) therebetween. The shielding arrangement may include front shielding units (135) and back shielding units (136) which are alternately arranged.

10. 发明申请

WO2016184487A1 LOAD LOCK CHAMBER, VACUUM PROCESSING SYSTEM WITH LOAD LOCK CHAMBER AND METHOD FOR EVACUATING A LOAD LOCK CHAMBER 审中-公开
标题翻译：负载锁定室，带有锁定室的真空加工系统和用于装载锁定室的方法
公开(公告)号：WO2016184487A1
公开(公告)日：2016-11-24
申请号：PCT/EP2015/060806
申请日：2015-05-15
申请人： APPLIED MATERIALS, INC. , GEBELE, Thomas , KLEIN, Wolfgang , LINDENBERG, Ralph
发明人： GEBELE, Thomas , KLEIN, Wolfgang , LINDENBERG, Ralph
IPC分类号： H01L21/67
CPC分类号： H01L21/67201
摘要： A load lock chamber (100) for a vacuum processing system (500) is described. The load lock chamber includes load lock walls surrounding a load lock chamber volume, wherein the load lock walls include a first load lock wall (101) and a second load lock wall (102), wherein the second load lock wall (102) is arranged opposite to the first load lock wall (101). The load lock chamber further includes at least one first vacuum suction outlet (110) and at least one second vacuum suction outlet (111) for evacuating the load lock chamber (100); wherein the at least one first vacuum suction outlet (110) is located at the first load lock wall (101) and the at least one second vacuum suction outlet (111) is located at the second load lock wall (102). Further, a vacuum processing system and a method for evacuating a load lock chamber are described.
摘要翻译：描述了一种用于真空处理系统（500）的装载锁定室（100）。负载锁定室包括围绕负载锁定室容积的负载锁定壁，其中负载锁定壁包括第一负载锁定壁（101）和第二负载锁定壁（102），其中第二负载锁定壁（102）被布置与第一负载锁定壁（101）相对。所述装载锁定室还包括至少一个第一真空抽吸出口（110）和至少一个用于抽空所述负载锁定室（100）的第二真空抽吸出口（111）。其中所述至少一个第一真空抽吸出口（110）位于所述第一负载锁定壁（101）处，并且所述至少一个第二真空抽吸出口（111）位于所述第二负载锁定壁（102）处。此外，描述了真空处理系统和用于排空负载锁定室的方法。

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