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1. 发明申请

WO2012052334A1 LOAD LOCK CHAMBER, SUBSTRATE PROCESSING SYSTEM AND METHOD FOR VENTING 审中-公开
标题翻译：负载锁仓，底板加工系统及其施工方法
公开(公告)号：WO2012052334A1
公开(公告)日：2012-04-26
申请号：PCT/EP2011/067819
申请日：2011-10-12
申请人： APPLIED MATERIALS, INC. , GEBELE, Thomas , LEIPNITZ, Thomas , BUSCHBECK, Wolfgang , BANGERT, Stefan , LINDENBERG, Ralph
发明人： GEBELE, Thomas , LEIPNITZ, Thomas , BUSCHBECK, Wolfgang , BANGERT, Stefan
IPC分类号： H01L21/67
CPC分类号： H01L21/67201 , Y10T137/0379
摘要： A lock chamber for a substrate processing system is provided which includes at least a first conduit adapted to provide an inner portion of the lock chamber in fluid communication with atmospheric pressure or overpressure. Additionally, the lock chamber includes at least a first control valve for controlling a flow rate of the fluid communication of the inner portion of the chamber with the atmospheric pressure or the overpressure, wherein the control valve is adapted to continuously control the flow rate. Furthermore, an according method, a computer program and a computer readable medium adapted for performing the method is provided.
摘要翻译：提供了一种用于基板处理系统的锁定室，其包括至少第一导管，其适于提供与大气压力或超压力流体连通的锁定室的内部。此外，锁定室至少包括第一控制阀，用于控制室内部与大气压或超压力的流体连通的流量，其中控制阀适于连续地控制流量。此外，提供了一种适用于执行该方法的依据方法，计算机程序和计算机可读介质。

2. 发明申请

WO2015096855A1 HOLDING ARRANGEMENT FOR SUBSTRATES 审中-公开
标题翻译：基板保持布置
公开(公告)号：WO2015096855A1
公开(公告)日：2015-07-02
申请号：PCT/EP2013/077921
申请日：2013-12-23
申请人： APPLIED MATERIALS, INC. , PIERALISI, Fabio , KLEIN, Wolfgang , LINDENBERG, Ralph , BUSCHBECK, Wolfgang , SCHROEDER, Jürgen
发明人： PIERALISI, Fabio , KLEIN, Wolfgang , LINDENBERG, Ralph , BUSCHBECK, Wolfgang , SCHROEDER, Jürgen
IPC分类号： C23C16/458 , C23C14/50 , B65G49/06
CPC分类号： C23C16/4587 , C23C14/50
摘要： A holding arrangement (10) for holding a substrate (20) during vacuum layer deposition is provided. The holding arrangement (10) includes a frame having one or more frame elements; and one or more contact interfaces (50, 500) provided at one or more of the frame elements and configured for contacting one or more conveying rollers (60) of a conveying system, wherein a Shore D hardness of a material of the one or more contact interfaces (50, 500) is in the range of 85 to 90.
摘要翻译：提供了一种用于在真空层沉积期间保持基板（20）的保持装置（10）。保持装置（10）包括具有一个或多个框架元件的框架; 以及一个或多个接触界面（50,500），其设置在一个或多个框架元件处，并且构造成用于接触输送系统的一个或多个输送辊（60），其中所述一个或多个接触界面（50,500）在85至90的范围内。

3. 发明申请

WO2018010770A1 SPUTTER DEPOSITION SOURCE, SPUTTER DEPOSITION APPARATUS AND METHOD OF OPERATING A SPUTTER DEPOSITION SOURCE 审中-公开
标题翻译：溅射沉积源，溅射沉积装置和操作溅射沉积源的方法
公开(公告)号：WO2018010770A1
公开(公告)日：2018-01-18
申请号：PCT/EP2016/066551
申请日：2016-07-12
申请人： APPLIED MATERIALS, INC. , LINDENBERG, Ralph , BUSCHBECK, Wolfgang , LOPP, Andreas
发明人： LINDENBERG, Ralph , BUSCHBECK, Wolfgang , LOPP, Andreas
IPC分类号： H01J37/34
摘要： According to one aspect of the present disclosure, a sputter deposition source (100) with at least one electrode assembly (120) configured for two-side sputter deposition is provided. The electrode assembly (120) comprises: a cathode (125) for providing a target material to be deposited, wherein the cathode is configured for generating a first plasma (131) on a first deposition side (10) and a second plasma (141) on a second deposition side (11) opposite to the first deposition side (10); and an anode assembly (130) with at least one first anode (132) arranged on the first deposition side (10) for influencing the first plasma and at least one second anode (142) arranged on the second deposition side (11) for influencing the second plasma. According to a second aspect, a deposition apparatus with a sputter deposition source (100) is provided. Further, methods of operating a sputter deposition source are provided.
摘要翻译：根据本公开的一个方面，提供了具有至少一个配置用于双面溅射沉积的电极组件（120）的溅射沉积源（100）。所述电极组件（120）包括：用于提供待沉积的靶材料的阴极（125），其中所述阴极被配置用于在第一沉积侧（10）和第二等离子体（141）上产生第一等离子体（131）在与所述第一沉积侧（10）相对的第二沉积侧（11）上; 和阳极组件（130），其具有布置在第一沉积侧（10）上用于影响第一等离子体的至少一个第一阳极（132）和布置在第二沉积侧（11）上的至少一个第二阳极（142），用于影响第二个等离子体。根据第二方面，提供了一种具有溅射沉积源（100）的沉积设备。此外，提供了操作溅射沉积源的方法。

4. 发明申请

WO2020164686A1 METHOD FOR CLEANING A VACUUM SYSTEM, METHOD FOR VACUUM PROCESSING OF A SUBSTRATE, AND APPARATUS FOR VACUUM PROCESSING A SUBSTRATE 审中-公开
公开(公告)号：WO2020164686A1
公开(公告)日：2020-08-20
申请号：PCT/EP2019/053413
申请日：2019-02-12
申请人： APPLIED MATERIALS, INC. , RADEK, Manuel , GEBELE, Thomas , BUSCHBECK, Wolfgang
发明人： RADEK, Manuel , GEBELE, Thomas , BUSCHBECK, Wolfgang
IPC分类号： B08B7/00 , B08B9/00 , B08B7/04 , C23C16/44 , C23C14/12
摘要： A method for cleaning a vacuum chamber, particularly a vacuum chamber used in the manufacture of OLED devices, is described, The method includes igniting a UV source within the vacuum chamber; and adjusting a pressure in the vacuum chamber to a vacuum condition providing a mixture of ozone and active radicals from a process gas in the vacuum chamber.

5. 发明申请

WO2019007515A1 APPARATUS AND METHOD FOR HOLDING A SUBSTRATE 审中-公开
公开(公告)号：WO2019007515A1
公开(公告)日：2019-01-10
申请号：PCT/EP2017/066979
申请日：2017-07-06
申请人： APPLIED MATERIALS, INC. , SCHULTHEIS, Michael Rainer , LOPP, Andreas , BUSCHBECK, Wolfgang , HENRICH, Jürgen , BANGERT, Stefan
发明人： SCHULTHEIS, Michael Rainer , LOPP, Andreas , BUSCHBECK, Wolfgang , HENRICH, Jürgen , BANGERT, Stefan
IPC分类号： C23C14/04 , H01L21/683
摘要： The present disclosure provides an apparatus (100) for holding a substrate (10) or a mask in a vacuum deposition process. The apparatus (100) includes one or more first electrodes and one or more second electrodes connectable to a first power assembly (230) and one or more third electrodes arranged between the one or more first electrodes and the one or more second electrodes and connectable to a second power assembly (240).

6. 发明申请

WO2019201434A1 EVAPORATION SOURCE FOR DEPOSITION OF EVAPORATED MATERIAL ON A SUBSTRATE, DEPOSITION APPARATUS, METHOD FOR MEASURING A VAPOR PRESSURE OF EVAPORATED MATERIAL, AND METHOD FOR DETERMINING AN EVAPORATION RATE OF AN EVAPORATED MATERIAL 审中-公开
公开(公告)号：WO2019201434A1
公开(公告)日：2019-10-24
申请号：PCT/EP2018/059893
申请日：2018-04-18
申请人： APPLIED MATERIALS, INC. , GEBELE, Thomas , BUSCHBECK, Wolfgang
发明人： GEBELE, Thomas , BUSCHBECK, Wolfgang
IPC分类号： C23C14/24 , C23C14/54
摘要： An evaporation source (100) for deposition of evaporated material on a substrate is described. The evaporation source (100) including a crucible (110) for material evaporation; a distribution assembly (120) with one or more outlets (125) for providing the evaporated material to the substrate, the distribution assembly being in fluid communication with the crucible; and a measurement assembly (130). The measurement assembly includes a tube (140) connecting an interior space (121) of the distribution assembly (120) with a pressure sensor (145).

7. 发明申请

WO2022101468A2 VAKUUMPROZESSSYSTEM, STÜTZSTRUKTUR UND VERFAHREN ZUM TRANSPORTIEREN EINES SUBSTRATS 审中-公开
公开(公告)号：WO2022101468A2
公开(公告)日：2022-05-19
申请号：PCT/EP2021/081669
申请日：2021-11-15
申请人： APPLIED MATERIALS, INC. , GEBELE, Thomas , BUSCHBECK, Wolfgang
发明人： GEBELE, Thomas , BUSCHBECK, Wolfgang
IPC分类号： H01L21/67 , H01L21/673 , H01L21/677 , C23C14/56 , C23C16/44 , C23C16/54 , C23C14/564 , C23C14/568 , C23C16/4409 , H01L21/67709 , H01L21/67712 , H01L21/6776
摘要： Vakuumprozesssystem (100) zum Prozessieren eines Substrats, umfassend eine erste Vakuumkammer (105) mit einem ersten Gasdruck, eine zweite Vakuumkammer (106) mit einem zweiten Gasdruck und eine Gastrenneinheit (120) zwischen der ersten Vakuumkammer (105) und der zweiten Vakuumkammer (106). Die Gastrenneinheit stellt eine Verbindung zwischen der ersten Vakuumkammer und der zweiten Vakuumkammer bereit. Die Gastrenneinheit (120) ist angepasst, mit einer oder mehreren Stützstrukturen (110) zusammenzuwirken, um einen Gasfluss von der ersten Vakuumkammer (105) zur zweiten Vakuumkammer (106) und/oder umgekehrt zu minimieren.

8. 发明申请

WO2020244781A1 DEPOSITION SOURCE, DEPOSITION APPARATUS AND METHOD OF DEPOSITING MATERIAL ON A SUBSTRATE 审中-公开
公开(公告)号：WO2020244781A1
公开(公告)日：2020-12-10
申请号：PCT/EP2019/064985
申请日：2019-06-07
申请人： APPLIED MATERIALS, INC. , FRANKE, Sebastian , LOPP, Andreas , MÜLLER, Andreas , BANGERT, Stefan , KELLER, Stefan , BUSCHBECK, Wolfgang
发明人： FRANKE, Sebastian , LOPP, Andreas , MÜLLER, Andreas , BANGERT, Stefan , KELLER, Stefan , BUSCHBECK, Wolfgang
IPC分类号： C23C14/24 , C23C14/34 , C23C14/56 , C23C14/35 , C23C14/54 , H01J37/34 , H01L51/52
摘要： A deposition source (100) for depositing material on a substrate (10) is described. The deposition source (100) includes a sputter source (110). Further, the deposition source (100) includes a reflector shield arrangement (120) for reflecting material provided from the sputter source towards the substrate. Further, a deposition apparatus and a method of depositing material on a substrate are described.

9. 发明申请

WO2019206414A1 VACUUM PROCESSING SYSTEM AND METHOD OF OPERATING A VACUUM PROCESSING SYSTEM 审中-公开
公开(公告)号：WO2019206414A1
公开(公告)日：2019-10-31
申请号：PCT/EP2018/060741
申请日：2018-04-26
申请人： APPLIED MATERIALS, INC. , BANGERT, Stefan , BUSCHBECK, Wolfgang , BERGER, Thomas
发明人： BANGERT, Stefan , BUSCHBECK, Wolfgang , BERGER, Thomas
IPC分类号： H01L21/67 , H01L21/677
摘要： A vacuum processing system for routing a carrier with a substrate is described. The system includes a first vacuum processing chamber for processing the substrate on the carrier; a vacuum buffer chamber providing a processing time delay for the substrate; a second vacuum processing chamber for masked deposition of a material layer on the substrate; and one or more transfer chambers for routing the carrier from the first vacuum chamber to the vacuum buffer chamber and for routing the carrier from the vacuum buffer chamber to the second vacuum chamber.

10. 发明申请

WO2019057310A1 SYSTEM FOR CLEANING A VACUUM CHAMBER, METHOD FOR CLEANING A VACUUM CHAMBER AND USE OF A COMPRESSOR FOR CLEANING A VACUUM CHAMBER 审中-公开
公开(公告)号：WO2019057310A1
公开(公告)日：2019-03-28
申请号：PCT/EP2017/074205
申请日：2017-09-25
申请人： APPLIED MATERIALS, INC. , GEBELE, Thomas , BUSCHBECK, Wolfgang , HAAS, Dieter
发明人： GEBELE, Thomas , BUSCHBECK, Wolfgang , HAAS, Dieter
IPC分类号： C23C14/56 , C23C16/44 , B08B5/02 , H01J37/32
摘要： The present disclosure relates to a system for cleaning a vacuum chamber. The system includes a vacuum chamber and a compressor. The vacuum chamber includes an inlet and an outlet. The compressor includes an inlet side connected to the outlet and an outlet side connected to the inlet.

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