专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明申请

WO2007083769A1 接点装置およびその製造方法审中-公开
标题翻译：接触装置及其制造方法
公开(公告)号：WO2007083769A1
公开(公告)日：2007-07-26
申请号：PCT/JP2007/050838
申请日：2007-01-19
申请人：株式会社アドバンテスト , 中村陽登 , 蟻川裕 , 茂呂義明 , 三瓶広和
发明人：中村陽登 , 蟻川　裕 , 茂呂　義明 , 三瓶　広和
IPC分类号： H01H11/04 , H01L21/28 , B81C1/00
CPC分类号： B81C1/00674 , B81B3/0005 , B81B2201/018 , B81B2203/0118 , B81B2203/04 , B81C1/0096 , G01R1/06761 , G01R3/00 , H01H1/0036 , H01H2001/0052 , Y10T428/12493
摘要：　第１導電膜１２を形成する工程と、第１導電膜１２の上に金属または前記金属の合金を含む第２導電膜１３を形成する工程と、第２導電膜１３の上に第３導電膜１４を形成する工程と、酸素を含む雰囲気中で加熱処理して、第２導電膜１３の金属を拡散させて第３導電膜１４の表面に析出させ、第３導電膜１４の上に金属の酸化物１５を含む表面層１７を形成する工程とを有する。こうして製造された接点装置では、表面層１７が、接触抵抗を増大させることなく接点の溶着を防止する。また、表面層１７が磨耗した場合は、熱処理により表面層１７を修復できる。
摘要翻译：一种接触装置的制造方法，包括以下步骤：形成第一导电膜（12）; 将包含其金属或合金的第二导电膜（13）叠加在第一导电膜（12）上; 将第三导电膜（14）叠加在第二导电膜（13）上; 在氧气氛中进行加热，使得第二导电膜（13）的金属扩散以沉积在第三导电膜（14）的表面上，从而在其上形成含有金属氧化物（15）的表面层（17）第三导电膜（14）。在如此制造的接触装置中，表面层（17）防止接触点的熔接，而不会增加接触电阻。当表面层（17）磨损时，可以通过热处理来恢复表面层（17）。

62. 发明申请

WO03081725B1 A MINIATURIZED CONTACT SPRING 审中-公开
标题翻译： MINIATURIZED接触弹簧
公开(公告)号：WO03081725B1
公开(公告)日：2004-03-25
申请号：PCT/US0308520
申请日：2003-03-18
申请人： NANONEXUS INC
发明人： LAHIRI SYAMAL KUMAR , SWIATOWIEC FRANK , CHONG FU-CHIUNG , MOK SAMMY , CHIEH ERH-KONG , MILTER ROMAN L , HAEMER JOSEPH M , LIN CHANG-MING , CHEN YI-HSENG , DOAN DAVID THANH
IPC分类号： B81B3/00 , G01R1/067 , G01R1/073 , G01R3/00 , H01L23/48 , H01R13/24 , H05K3/40 , H05K7/10 , H01R12/04 , H01R12/36
CPC分类号： B81B3/0072 , B81B2201/018 , G01R1/06711 , G01R1/06727 , G01R1/06761 , G01R1/07357 , G01R3/00 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04941 , H01L2924/09701 , H01L2924/14 , H01R12/718 , H01R13/24 , H05K3/4092 , H05K7/1061
摘要： This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs (507), which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs (507). In addition, the invention also presents a method to fabricate the springs (507) that allow passage of relatively higher current without significantly degrading their lifetime.
摘要翻译：本发明提供了一种提高小型化弹簧（507）的屈服强度和疲劳强度的解决方案，其可以以超小间距阵列制造。它还公开了一种解决方案，以便在重复接触时最小化接触垫材料对弹簧尖端的粘附，而不影响小型化弹簧（507）的可靠性。此外，本发明还提供了一种制造弹簧（507）的方法，所述弹簧允许相对较高的电流通过而不会使其寿命显着降低。

63. 发明申请

WO2003005042A1 導電性接触子审中-公开
标题翻译：导电接触
公开(公告)号：WO2003005042A1
公开(公告)日：2003-01-16
申请号：PCT/JP2002/006647
申请日：2002-07-01
申请人：日本発条株式会社 , 風間俊男
发明人：風間俊男
IPC分类号： G01R1/067
CPC分类号： G01R1/06722 , C23C28/023 , G01R1/06738 , G01R1/06761 , G01R3/00 , H01R13/03 , H01R13/2421 , H01R2201/20
摘要： A conductive contact characterized by being provided with a gold−plated layer (8) placed on a conductive needle element (2) via a Ni substrate layer (7a), formed with a Ni substrate (7b) on the gold−plated layer (8) at a needle portion (2a), and provided with an iridium layer (9) (or titanium nitride layer, or rhodium layer, or hafnium nitride layer) by means of sputtering, whereby it is possible to increase difficulty−of−oxidization and abrasion resistance at the tip end, prolong the durability of the needle element, and reduce running costs without using a special material for the needle element.
摘要翻译：一种导电接点，其特征在于，在镀金层（8）上形成有Ni基板（7b），在Ni基板层（7a）上设有镀在导电针元件（2）上的镀金层（8）），并且通过溅射设置有铱层（9）（或氮化钛层或铑层或氮化铪层），由此可以增加氧化难易度，在尖端的耐磨性，延长针元件的耐久性，并且在不使用针元件的特殊材料的情况下降低运行成本。

64. 发明申请

WO2002101830A2 ELECTRONIC COMPONENTS WITH PLURALITY OF CONTOURED MICROELECTRONIC SPRING CONTACTS 审中-公开
标题翻译：具有多层结构的微电子弹簧触头的电子元件
公开(公告)号：WO2002101830A2
公开(公告)日：2002-12-19
申请号：PCT/US2002/017970
申请日：2002-06-06
申请人： FORMFACTOR, INC. , ELDRIDGE, Benjamin, N. , WENZEL, Stuart, W.
发明人： ELDRIDGE, Benjamin, N. , WENZEL, Stuart, W.
IPC分类号： H01L23/498
CPC分类号： G01R1/06716 , G01R1/0483 , G01R1/06711 , G01R1/06727 , G01R1/06733 , G01R1/06744 , G01R1/06761 , G01R1/07342 , G01R3/00 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/30107 , H01R12/52 , H01R12/714 , H01R13/2407 , H01R13/2442 , H01R2201/20 , H05K3/4092 , H05K7/1069 , H01L2924/00
摘要： An electronic component having a plurality of microelectronic spring contacts mounted to a planar face of the component. Each of the microelectronic spring contacts has a contoured beam, which may be formed of an integral layer of resilient material deposited over a contoured sacrificial substrate, and comprises a base mounted to the planar face of the component, a beam connected to the base at a first end of the beam, and a tip positioned at a free end of the beam opposite to the base. The beam has an unsupported span between its free end and its base. The microelectronic spring contacts are advantageously formed by depositing a resilient material over a molded, sacrificial substrate. The spring contacts may be provided with various innovative contoured shapes. In various embodiments of the invention, the electronic component comprises a semiconductor die, a semiconductor wafer, a LGA socket, an interposer, or a test head assembly.
摘要翻译：一种电子部件，具有安装到部件的平面上的多个微电子弹簧触点。微电子弹簧触点中的每一个都具有波纹形梁，其可以由沉积在轮廓牺牲基板上的弹性材料的整体层形成，并且包括安装到部件的平面上的基座，梁的第一端和位于梁的与基座相对的自由端的尖端。梁在其自由端和底座之间具有不受支撑的跨距。微电子弹簧触头有利地通过在模制的牺牲衬底上沉积弹性材料形成。弹簧触点可以具有各种创新的轮廓形状。在本发明的各种实施例中，电子部件包括半导体管芯，半导体晶片，LGA插座，插入件或测试头组件。

65. 发明申请

WO01048870A3 INTERCONNECT FOR MICROELECTRONIC STRUCTURES WITH ENHANCED SPRING CHARACTERISTICS 审中-公开
标题翻译：具有增强弹簧特性的微电子结构互连
公开(公告)号：WO01048870A3
公开(公告)日：2002-02-21
申请号：PCT/US2000/035450
申请日：2000-12-27
IPC分类号： H01L21/48 , H01L23/48 , H01L23/485 , H01R12/00 , H01R13/24
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/06761 , H01L21/4853 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/71 , H01L24/72 , H01L2224/05001 , H01L2224/05568 , H01L2224/11002 , H01L2224/11003 , H01L2224/13099 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01061 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/3011 , H01R12/57 , H01R12/718 , H01R13/03 , H01R13/24 , H05K3/326 , H05K3/4092 , H05K2201/0311 , Y10T29/49147 , Y10T29/49149 , Y10T29/49204 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： An interconnection element and a method of forming an interconnection element. In one embodiment, the interconnection element includes a first structure and a second structure coupled to the first structure. The second structure coupled with the first material has a spring constant greater than the spring constant of the first structure alone. In one embodiment, the interconnection element is adapted to be coupled to an electronic component tracked as a conductive path from the electronic component. In one embodiment, the method includes forming a first (interconnection) structure coupled to a substrate to define a shape suitable as an interconnection in an integrated circuit environment and then coupling, such as by coating, a second (interconnection) structure to the first (interconnection) structure to form an interconnection element. Collectively, the first (interconnection) structure and the second (interconnection) structure have a spring constant greater than a spring constant of the first (interconnection) structure.
摘要翻译：一种互连元件和形成互连元件的方法。在一个实施例中，互连元件包括耦合到第一结构的第一结构和第二结构。与第一材料耦合的第二结构具有大于单独的第一结构的弹簧常数的弹簧常数。在一个实施例中，互连元件适于耦合到从电子部件跟踪为导电路径的电子部件。在一个实施例中，该方法包括形成耦合到衬底的第一（互连）结构，以限定适合于集成电路环境中的互连的形状，然后例如通过将第二（互连）结构涂覆到第一（互连）互连）结构以形成互连元件。总的来说，第一（互连）结构和第二（互连）结构具有大于第一（互连）结构的弹簧常数的弹簧常数。

66. 发明申请

WO01048818A1 RESILIENT INTERCONNECT STRUCTURE FOR ELECTRONIC COMPONENTS AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：电子元件的可靠互连结构及其制造方法
公开(公告)号：WO01048818A1
公开(公告)日：2001-07-05
申请号：PCT/US2000/035448
申请日：2000-12-27
IPC分类号： G01R1/067 , G01R1/073 , G01R3/00 , H01H1/00 , H01L23/48 , H01H59/00
CPC分类号： H01L24/72 , G01R1/06727 , G01R1/06761 , G01R1/07342 , G01R3/00 , H01H1/0036 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01055 , H01L2924/01057 , H01L2924/01058 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/30105 , H01L2924/00
摘要： An interconnection element of a spring (body), and a method for fabricating the interconnection element. The interconnection element is of a size suitable for directly contacting a semiconductor or a packaged semiconductor device such as in an LGA package. The method includes fabricating a multi-tiered structure to form a compact, resilient interconnect structure. Fabricating each tier or leaf includes providing a base substrate material, and applying a masking material over the base substrate material. An opening is patterned in the masking material and a resilient element is formed in the opening. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The method includes repeating this process one or more times to fabricate a chip-level interconnection element.
摘要翻译：弹簧（主体）的互连元件以及互连元件的制造方法。互连元件的尺寸适合于直接接触半导体或诸如LGA封装的封装半导体器件。该方法包括制造多层结构以形成紧凑的弹性互连结构。制造每个层或叶包括提供基底材料，以及在基底材料上施加掩模材料。在掩模材料中形成开口，并且在开口中形成弹性元件。可以使用具有多个这种互连元件的大型衬底作为晶片级接触器。该方法包括重复该过程一次或多次以制造芯片级互连元件。

67. 发明申请

WO00033089A2 LITHOGRAPHIC CONTACT ELEMENTS 审中-公开
标题翻译： LITHOGRAPHIC联系元素
公开(公告)号：WO00033089A2
公开(公告)日：2000-06-08
申请号：PCT/US1999/028597
申请日：1999-12-01
IPC分类号： G01R1/073 , G01B7/34 , G01N27/00 , G01R1/067 , G01R3/00 , H01L21/48 , H01L21/60 , H01L21/66 , H01L23/48 , H01R12/16 , H01R33/76 , H05K3/32 , H05K3/40
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/06761 , H01L2924/0002 , H01L2924/01005 , H01L2924/14 , H05K3/326 , H05K3/4092 , H01L2924/00
摘要： A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.
摘要翻译：通过光刻技术形成包括弹簧接触元件的互连的方法。在一个实施例中，该方法包括在衬底的第一部分上施加掩模材料，掩模材料具有将限定弹簧结构的第一部分的开口，在开口中沉积结构材料（例如导电材料）并用结构材料过度填充开口，去除结构材料的一部分，以及去除掩模材料的第一部分。在该实施例中，弹簧结构的第一部分的至少一部分没有掩蔽材料。在本发明的一个方面，该方法包括平坦化掩模材料层和结构材料以去除结构材料的一部分。另一方面，形成的弹簧结构包括柱部分，梁部分和尖端结构部分中的一个。

68. 发明申请

WO99018445A1 MICROMACHINED ELEMENT AND METHOD OF FABRICATION THEREOF 审中-公开
标题翻译：微型元件及其制造方法
公开(公告)号：WO99018445A1
公开(公告)日：1999-04-15
申请号：PCT/US1998/020849
申请日：1998-10-02
IPC分类号： G01R1/067
CPC分类号： G01R1/06733 , G01R1/06716 , G01R1/06761 , Y10T428/12493 , Y10T428/125 , Y10T428/12507 , Y10T428/12528 , Y10T428/24942 , Y10T428/26
摘要： A micromachined element mounted to a substrate, the element including a cantilever having a proximal portion attached to the substrate and a coilable distal portion terminating in a free distal end. The coilable distal portion, upon being heated, is capable of bending away from the substrate and at least partially coiling upon itself to form a coiled portion. At least part of the micromachined element may be electrically conductive. In various embodiments, the micromachined element may function as a mechanical microspring, an electrically conductive link, and/or a magnetic coil. A method of fabricating the microelement may include the steps of selectively depositing various layers upon the substrate.
摘要翻译：安装到基底的微加工元件，所述元件包括具有附接到基底的近端部分的悬臂和终止于自由远端的可卷曲远端部分。可卷绕的远端部分在加热时能够远离基板弯曲并且至少部分地卷绕在其自身上以形成卷绕部分。至少部分微加工元件可以是导电的。在各种实施例中，微加工元件可以用作机械微小弹簧，导电连杆和/或电磁线圈。制造微元件的方法可以包括以下步骤：在衬底上选择性地沉积各种层。

69. 发明申请

WO99005701A2 COMPOSITE ELECTRICAL CONTACT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：复合电接触结构及其制造方法
公开(公告)号：WO99005701A2
公开(公告)日：1999-02-04
申请号：PCT/US1998/014263
申请日：1998-07-08
IPC分类号： H05K3/00 , G01R1/067 , G01R1/073 , G01R3/00 , H01L21/60 , H01L21/66 , H05K3/24 , H05K3/40 , H05K3/42 , H01L
CPC分类号： G01R1/06761 , G01R3/00 , H01L24/11 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04941 , H01L2924/12042 , H01L2924/14 , H05K3/241 , H05K3/4007 , H05K3/423 , H05K2201/0209 , H05K2201/0347 , H05K2201/0355 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481 , H05K2201/09563 , H01L2924/00
摘要： An improved wear resistant bump contact is produced by the inclusion of small particles of hard materials in the conductive material of the contact bump, preferably by co-deposition at the time of electroplating of the bump bulk material. Desirable attributes of the small particles of hard material include small particle size, hardness greater than the hardness of the bulk material of the contact bump, compatibility with the plating conditions, and electrical conductivity. Nitride, borides, silicides, carbides are typical interstitial compounds suitable for use in satisfying these desirable attributes. In one preferred example, a nickel bulk material and silicon carbide particles are utilized. In one variation, the bump of metal-particle co-deposited material is coated by a thin cap layer of noble, non oxidizing metal to prevent electrical erosion by arcing as contact is made and broken from the pad. Rhodium and ruthenium are suitable metals and can be electrodeposited over the composite bump structure.
摘要翻译：通过在接触凸块的导电材料中包含硬质材料的小颗粒，优选通过在凸块块状材料的电镀时共沉积来制造改进的耐磨凸点接触。硬质材料的小颗粒的理想特性包括小的颗粒尺寸，硬度大于接触凸块的散装材料的硬度，与电镀条件的兼容性和导电性。氮化物，硼化物，硅化物，碳化物是适合用于满足这些所需属性的典型间隙化合物。在一个优选实施例中，使用镍本体材料和碳化硅颗粒。在一个实施例中，金属 - 颗粒共沉积材料的凸块由贵金属非氧化金属的薄盖层涂覆，以防止由于与焊盘接触而断裂而产生的电弧侵蚀。铑和钌是合适的金属，可以电沉积在复合凸块结构上。

70. 发明申请

WO1998011446A1 INTEGRATED COMPLIANT PROBE FOR WAFER LEVEL TEST AND BURN-IN 审中-公开
标题翻译：用于水平测试和烧录的集成合规探测器
公开(公告)号：WO1998011446A1
公开(公告)日：1998-03-19
申请号：PCT/US1997016265
申请日：1997-09-12
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , BEAMAN, Brian, Samuel , FOGEL, Keith, Edward , LAURO, Paul, Alfred , SHIH, Da-Yuan
发明人： INTERNATIONAL BUSINESS MACHINES CORPORATION
IPC分类号： G01R01/073
CPC分类号： G01R1/0735 , G01R1/06738 , G01R1/0675 , G01R1/06761 , G01R1/07307 , G01R1/07342 , G01R1/07357 , H01L2224/1134 , H01L2924/00013 , H01L2924/01033 , H01L2924/09701 , H01L2924/14 , H01L2224/13099
摘要： The present invention is directed to a structure comprising a substrate having a surface; a plurality of elongated electrical conductors extending away from the surface; each of said elongated electrical conductors having a first end affixed to the surface and a second end projecting away from the surface; there being a plurality of second ends; and a means for maintaining the plurality of the second ends in substantially fixed positions with respect to each other. The structure is useful as a probe for testing and burning in integrated circuit chips at the wafer level.
摘要翻译：本发明涉及包括具有表面的基板的结构; 多个细长电导体，远离表面延伸; 每个所述细长电导体具有固定到表面的第一端和远离表面突出的第二端; 存在多个第二端; 以及用于将多个第二端保持在相对于彼此基本上固定的位置的装置。该结构可用作晶圆级集成电路芯片中测试和刻录的探头。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式