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51. 发明申请

WO2008047918A1 電子機器のパッケージ構造及びパッケージ製造方法审中-公开
标题翻译：电子设备包装结构和包装制造方法
公开(公告)号：WO2008047918A1
公开(公告)日：2008-04-24
申请号：PCT/JP2007/070476
申请日：2007-10-19
申请人：日本電気株式会社 , 百川裕希
发明人：百川裕希
IPC分类号： H01L23/12 , H05K3/32
CPC分类号： H05K3/321 , H01L21/563 , H01L21/565 , H01L21/6835 , H01L23/498 , H01L23/49811 , H01L24/16 , H01L24/81 , H01L24/83 , H01L2221/68345 , H01L2224/134 , H01L2224/16225 , H01L2224/2919 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/32225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/81193 , H01L2224/8184 , H01L2224/83192 , H01L2224/8384 , H01L2224/92125 , H01L2224/92225 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/15788 , H01L2924/181 , H01L2924/19105 , H05K1/095 , H05K3/284 , H05K3/4664 , H05K2201/035 , H05K2201/0391 , H05K2201/09436 , H05K2201/10636 , H05K2201/10674 , H05K2203/1453 , Y02P70/611 , H01L2924/00 , H01L2924/00012
摘要：　電子機器形態の多様化に対応し易く、製造工程数、資源消費の観点から環境に優しい電子機器パッケージを提供する。本発明の第１の実施の形態によるパッケージ構造は、基板１、基板１の表面に形成された配線２、電極パッド３、電子部品５、外部電極６及び電子部品５の外部電極６とを接合する接合材４を備え、配線２、電極パッド３、接合材４が全て同一の材料により構成されており、さらに電極パッド３が接合材４を兼ねる構成となっている。
摘要翻译：提供一种能够容易地应对电子部件配置的多样化并且在制造步骤和资源消耗的方面对环境无害的电子装置包装。一个实施例中的封装结构设置有基板（1），形成在基板（1）的表面上的布线（2），电极焊盘（3），电子部件（5）和接合材料（4），用于接合外部电极（6）和外部部件（5）的外部电极（6）。布线（2），电极焊盘（3）和接合材料（4）都由相同的材料组成，此外，电极焊盘（3）也作为接合材料（4）工作。

52. 发明申请

WO2008032755A1 ELECTRONIC COMPONENT PLACING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD 审中-公开
标题翻译：电子元件放置装置和电子元件安装方法
公开(公告)号：WO2008032755A1
公开(公告)日：2008-03-20
申请号：PCT/JP2007/067779
申请日：2007-09-06
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , OKAMOTO, Kazuo , NISHI, Syoichi , MORITA, Takeshi , HIYOSHI, Masanori , TOMOYASU, Kazuhiko
发明人： OKAMOTO, Kazuo , NISHI, Syoichi , MORITA, Takeshi , HIYOSHI, Masanori , TOMOYASU, Kazuhiko
IPC分类号： H05K3/34 , H05K13/08
CPC分类号： H05K3/3484 , B23K3/0623 , B23K2201/40 , H01L2224/81 , H05K3/3436 , H05K2201/035 , H05K2201/094 , H05K2203/0139 , H05K2203/0338 , Y02P70/613
摘要： To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp deformation is mounted by means of soldering. In the electronic component placing apparatus for placing the electronic component 16 with a plurality of solder bumps 16a formed on a lower surface on a board, a film 7a having a film thickness distribution for transferring a desired transfer amount of solder paste according to a state of warp deformation to each of the plurality of solder bumps is formed in a paste transfer unit 24, based on the component warp information indicating the state of warp deformation in a reflow process of the electronic component. Thereby, it is possible to prevent a cold joint from occurring when the electronic component likely to cause warp deformation is mounted by means of soldering by additionally supplying a just enough amount of solder to each solder bump 16a.
摘要翻译：提供一种电子部件放置装置和电子部件安装方法，其可以通过焊接来安装可能导致翘曲变形的电子部件时发生冷接头。在电子部件放置装置中，电子部件16配置有形成在基板的下表面上的多个焊料凸块16a，具有膜厚分布的膜7a，其根据状态基于表示电子部件的回流工序中的翘曲变形的状态的部件翘曲信息，在糊状物转印部24中形成多个焊料凸块各自的翘曲变形。由此，当通过向每个焊料凸块16a额外提供足够量的焊料，通过焊接来安装可能引起翘曲变形的电子部件时，可以防止发生冷接头。

53. 发明申请

WO2007140463A3 SOLDERABLE PADS UTILIZING NICKEL AND SILVER NANOPARTICLE INK JET INKS 审中-公开
标题翻译：可焊垫用镍和银纳米油墨喷射墨水
公开(公告)号：WO2007140463A3
公开(公告)日：2008-03-13
申请号：PCT/US2007070112
申请日：2007-05-31
申请人： CABOT CORP , HOWARTH JAMES J , JAMES ANTHONY R , VANHEUSDEN KAREL
发明人： HOWARTH JAMES J , JAMES ANTHONY R , VANHEUSDEN KAREL
IPC分类号： H05K3/24 , H05K3/12
CPC分类号： H05K3/247 , H05K1/095 , H05K3/125 , H05K2201/0257 , H05K2201/035 , H05K2203/013 , H05K2203/1476
摘要： A system and a method are provided for ink-jet printing a solderable conductive pad onto a substrate. The system comprises at least one print head and a curing station for curing an ink deposited onto the substrate. The system is configured to: deposit at least a first layer of a first ink onto the substrate; cure the first layer of the first ink; deposit at least an intermediate layer of a second ink on top of the cured first layer of the first ink; cure the intermediate layer of the second ink; deposit at least a last layer of the first ink on top of the cured intermediate layer of the second ink; and cure the last layer of the first ink. The first ink has a relatively high conductivity. The second ink has a relatively low conductivity. The first layer, the intermediate layer, and the last layer may be arranged such that when solder is applied to the last layer, the solder is prevented from leaching through to the first layer.
摘要翻译：提供了一种系统和方法，用于将可焊接导电垫喷墨印刷到基底上。该系统包括至少一个打印头和固化站，用于固化沉积到基底上的油墨。该系统被配置为：将至少第一层第一油墨沉积到基底上; 固化第一层油墨的第一层; 在第一墨水的固化的第一层的顶部上沉积至少第二墨水的中间层; 固化第二墨水的中间层; 在第二墨水的固化中间层的顶部上沉积至少最后一层第一墨; 并固化第一个墨水的最后一层。第一种墨水具有较高的导电性。第二墨水具有较低的导电性。可以将第一层，中间层和最后一层布置成使得当将焊料施加到最后一层时，防止焊料浸入第一层。

54. 发明申请

WO2007140463A2 SOLDERABLE PADS UTILIZING NICKEL AND SILVER NANOPARTICLE INK JET INKS 审中-公开
标题翻译：可焊垫用镍和银纳米油墨喷射墨水
公开(公告)号：WO2007140463A2
公开(公告)日：2007-12-06
申请号：PCT/US2007/070112
申请日：2007-05-31
申请人： CABOT CORPORATION , HOWARTH, James, J. , JAMES, Anthony, R. , VANHEUSDEN, Karel
发明人： HOWARTH, James, J. , JAMES, Anthony, R. , VANHEUSDEN, Karel
IPC分类号： H05K3/24 , H05K3/12
CPC分类号： H05K3/247 , H05K1/095 , H05K3/125 , H05K2201/0257 , H05K2201/035 , H05K2203/013 , H05K2203/1476
摘要： A system and a method are provided for ink-jet printing a solderable conductive pad onto a substrate. The system comprises at least one print head and a curing station for curing an ink deposited onto the substrate. The system is configured to: deposit at least a first layer of a first ink onto the substrate; cure the first layer of the first ink; deposit at least an intermediate layer of a second ink on top of the cured first layer of the first ink; cure the intermediate layer of the second ink; deposit at least a last layer of the first ink on top of the cured intermediate layer of the second ink; and cure the last layer of the first ink. The first ink has a relatively high conductivity. The second ink has a relatively low conductivity. The first layer, the intermediate layer, and the last layer may be arranged such that when solder is applied to the last layer, the solder is prevented from leaching through to the first layer.
摘要翻译：提供了一种系统和方法，用于将可焊接导电垫喷墨印刷到基底上。该系统包括至少一个打印头和固化站，用于固化沉积到基底上的油墨。该系统被配置为：将至少第一层第一油墨沉积到基底上; 固化第一层油墨的第一层; 在第一墨水的固化的第一层的顶部上沉积至少第二墨水的中间层; 固化第二墨水的中间层; 在第二墨水的固化中间层的顶部上沉积至少最后一层第一墨; 并固化第一个墨水的最后一层。第一种墨水具有较高的导电性。第二墨水具有较低的导电性。可以将第一层，中间层和最后一层布置成使得当将焊料施加到最后一层时，防止焊料浸入第一层。

55. 发明申请

WO2006116225A3 THE USE OF SOLDER PASTE FOR HEAT DISSIPATION 审中-公开
标题翻译：焊膏用于散热的使用
公开(公告)号：WO2006116225A3
公开(公告)日：2007-03-29
申请号：PCT/US2006015326
申请日：2006-04-20
申请人： INT RECTIFIER CORP , SAWLE ANDREW NEIL
发明人： SAWLE ANDREW NEIL
IPC分类号： H01L23/34 , H01L23/10
CPC分类号： H05K1/0265 , H01L23/367 , H01L2924/0002 , H05K1/0209 , H05K3/245 , H05K3/3484 , H05K2201/0215 , H05K2201/035 , H05K2201/09781 , H05K2203/043 , H01L2924/00
摘要： A circuit board ( 100) includes at least one trace (104a-d, 205, 305) having at least one heat spreader (120-123, 220, 223, 3 10) disposed thereon, the heater spreader being formed of a solidified paste, such as a paste that includes a mixture of binder particles and filler particles, or a solder paste. As an example, the heater spreader may be configured to increase a cross-sectional area of a portion of the trace, thereby improving heat flow along that portion of the trace. Alternatively, the heater spreader may be configured to increase the surface area of the trace, thereby increasing heat dissipation from the circuit board. As another example, the heat spreader may be disposed between the trace and a semiconductor device ( 108-1 10, 308) and thereby function as a heat sink for the device.
摘要翻译：电路板（100）包括至少一个具有至少一个布置在其上的散热器（120-123,220,223,310）的迹线（104a-d，205,305），所述加热器散热器由凝固的糊状物，例如包含粘合剂颗粒和填料颗粒的混合物的糊料或焊膏。作为示例，加热器撒布机可以被配置为增加痕迹的一部分的横截面面积，从而改善沿该迹线的该部分的热流。或者，加热器吊具可以被配置为增加迹线的表面积，从而增加从电路板的散热。作为另一示例，散热器可以设置在轨迹和半导体器件（108-110,308）之间，从而用作器件的散热器。

56. 发明申请

WO2005089510A3 METHOD OF FORMING ONE OR MORE BASE STRUCTURES ON AN LTCC COFIRED MODULE 审中-公开
标题翻译：在LTCC辅助模块上形成一个或多个基本结构的方法
公开(公告)号：WO2005089510A3
公开(公告)日：2007-02-01
申请号：PCT/US2005009299
申请日：2005-03-17
申请人： NORTHROP GRUMMAN CORP , BERRY CYNTHIA W , BAILEY ALEX E , FISHER ROBERT , GUPTA TAPAN K , BROSEY DANIEL , SMALLEY STEVE M , THOMAS WILLIAM A
发明人： BERRY CYNTHIA W , BAILEY ALEX E , FISHER ROBERT , GUPTA TAPAN K , BROSEY DANIEL , SMALLEY STEVE M , THOMAS WILLIAM A
IPC分类号： H05K3/02 , C03B29/00 , C04B33/34 , C04B37/00 , H01L21/48 , H01L23/00 , H01L23/10 , H01L23/12 , H01L23/495 , H05K1/00 , H05K1/03 , H05K1/09 , H05K1/14 , H05K3/10 , H05K3/22 , H05K3/24
CPC分类号： H05K3/248 , H01L21/4867 , H05K1/092 , H05K3/1291 , H05K2201/035 , H05K2203/1126 , H05K2203/1476 , Y10T29/4913 , Y10T29/49144 , Y10T29/49163
摘要： An LTCC module (10) includes a base (24) on one or more surfaces for receiving one or more external components (26, 30, 36) to be attached to the module. A base (24) is formed of a plurality of layers of metallization (12) in a predetermined pattern. The layers include an adhesion layer (44) on the LTCC module surface, with one or more intermediate layers (46), followed by a top layer (48). The module is fired with each application of the layers at a reduced temperature lower than the normal cofÊring temperamre of the LTCC module, but of sufficient value to partially sinter the layers. After the last applied top layer, the module is fired once at an elevated temperature to fully sinter the layers.
摘要翻译： LTCC模块（10）在一个或多个表面上包括用于接收要连接到模块的一个或多个外部组件（26,30,36）的基座（24）。基底（24）由预定图案的多层金属化（12）形成。这些层包括在LTCC模块表面上的粘附层（44），具有一个或多个中间层（46），随后是顶层（48）。在低于LTCC模块的正常共振温度的降低的温度下，每层施加该模块，但是具有足够的值以部分地烧结层。在最后施加的顶层之后，模块在升高的温度下被烧一次以完全烧结层。

57. 发明申请

WO2006001402A1 METHOD OF SOLDERING ELECTRONIC COMPONENT HAVING SOLDER BUMPS TO SUBSTRATE 审中-公开
标题翻译：将焊接的电子元件焊接到基板上的方法
公开(公告)号：WO2006001402A1
公开(公告)日：2006-01-05
申请号：PCT/JP2005/011690
申请日：2005-06-21
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , SAKAI, Tadahiko , MAEDA, Tadashi
发明人： SAKAI, Tadahiko , MAEDA, Tadashi
IPC分类号： H05K3/34
CPC分类号： H05K3/3436 , H01L24/11 , H01L24/81 , H01L2224/1182 , H01L2224/11822 , H01L2224/1308 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13118 , H01L2224/13139 , H01L2224/13144 , H01L2224/13164 , H01L2224/16 , H01L2224/29499 , H01L2224/75 , H01L2224/75301 , H01L2224/758 , H01L2224/81011 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3489 , H05K2201/0215 , H05K2201/035 , H05K2203/0338 , Y02P70/613 , H01L2924/00014 , H01L2224/13099 , H01L2224/29099
摘要： A method of soldering electronic component (6) having solder bumps (7) formed thereon to substrate (12), wherein bumps (7) are pressed against a flux transferring stage on which a thin film is formed of flux (10) containing metal powder (16) of good wettability to solder so as to cause metal powder (16) to penetrate oxide films (7a) and embed in the surfaces on the bottom parts of bumps (7), and bumps (7) in this state are positioned and mounted to electrodes (12a) on substrate (12). Substrate (12) is then heated to melt bumps (7) and allow the melted solder to flow and spread along the surfaces of metal powder (16) toward electrodes (12a). The method can thus provide solder bonding portions of high quality without any soldering defect and deterioration of the insulating property.
摘要翻译：一种将在其上形成有焊料凸块（7）的电子部件（6）焊接到基板（12）上的方法，其中凸块（7）被压在其上形成有由金属粉末的焊剂（10）形成薄膜的焊剂转移台（16）对焊料具有良好的润湿性，以使金属粉末（16）穿透氧化膜（7a）并嵌入在凸块（7）的底部的表面上，并且在该状态下的凸块（7）被定位，并且安装在基板（12）上的电极（12a）上。然后将基板（12）加热熔融凸块（7），并允许熔化的焊料沿着金属粉末（16）的表面向电极（12a）流动并扩散。因此，该方法可以提供高质量的焊接部分，而没有任何焊接缺陷和绝缘性能的劣化。

58. 发明申请

WO2005089510A2 METHOD OF FORMING ONE OR MORE BASE STRUCTURES ON AN LTCC COFIRED MODULE 审中-公开
标题翻译：在LTCC辅助模块上形成一个或多个基本结构的方法
公开(公告)号：WO2005089510A2
公开(公告)日：2005-09-29
申请号：PCT/US2005/009299
申请日：2005-03-17
申请人： NORTHROP GRUMMAN CORPORATION , BERRY, Cynthia, W. , BAILEY, Alex, E. , FISHER, Robert , GUPTA, Tapan, K. , BROSEY, Daniel , SMALLEY, Steve, M. , THOMAS, William, A.
发明人： BERRY, Cynthia, W. , BAILEY, Alex, E. , FISHER, Robert , GUPTA, Tapan, K. , BROSEY, Daniel , SMALLEY, Steve, M. , THOMAS, William, A.
IPC分类号： C03B29/00 , H01L21/48 , H01L23/495 , H05K1/09 , H05K3/24
CPC分类号： H05K3/248 , H01L21/4867 , H05K1/092 , H05K3/1291 , H05K2201/035 , H05K2203/1126 , H05K2203/1476 , Y10T29/4913 , Y10T29/49144 , Y10T29/49163
摘要： An LTCC module includes a base on one or more surfaces for receiving one or more external components to be attached to the module. A base is formed of a plurality of layers of metallization in a predetermined pattern. The layers include an adhesion layer on the LTCC module surface, with one or more intermediate layers, followed by a top layer. The module is fired with each application of the layers at a reduced temperature lower than the normal cofiring temperature of the LTCC module, but of sufficient value to partially sinter the layers. After the last applied top layer, the module is fired once at an elevated temperature to fully sinter the layers.
摘要翻译： LTCC模块包括在一个或多个表面上的基座，用于接收要连接到模块的一个或多个外部组件。基底由预定图案的多层金属化形成。这些层包括在LTCC模块表面上的粘附层，具有一个或多个中间层，随后是顶层。在低于LTCC模块的正常共烧温度的降低温度下，每层施加该模块，但具有足够的值以部分地烧结层。在最后施加的顶层之后，模块在升高的温度下被烧一次以完全烧结层。

59. 发明申请

WO02000437A1 METHOD FOR THE PRODUCTION OF PRINTED STRUCTURES, SCREEN PRINTING MACHINE, SCREEN PRINTING DOCTOR BLADE AND SURFACE PRINTED WITH STRUCTURES 审中-公开
标题翻译：用于生产印刷结构，SCREEN MACHINE丝网印刷和刮刀颈部结构表面
公开(公告)号：WO02000437A1
公开(公告)日：2002-01-03
申请号：PCT/DE2001/001452
申请日：2001-04-12
IPC分类号： B41F15/08 , B41F15/44 , H05K3/12 , H05K3/24
CPC分类号： H05K3/1233 , B41F15/0818 , B41F15/44 , H05K3/245 , H05K2201/035 , H05K2201/09927 , H05K2203/0139
摘要： A multiple printing is carried out by screen printing, whereby the doctor blade (1) and the screen (5) are employed at a higher separation than for a previous printing. Particularly fine and very high structures can thus be formed.
摘要翻译：在丝网印刷的多打印用刮板（1）和（5）分别由更大的距离比在先前的压力下进行的筛执行。通过这种方式，可以形成很细，但很高的结构。

60. 发明申请

WO00054561A1 METHOD FOR IMPROVING THE MANUFACTURING SAFETY OF WELD JOINTS 审中-公开
标题翻译：方法增加了生产安全焊料连接
公开(公告)号：WO00054561A1
公开(公告)日：2000-09-14
申请号：PCT/DE2000/000377
申请日：2000-02-08
IPC分类号： B23K1/20 , B23K1/00 , H05K1/09 , H05K1/18 , H05K3/00 , H05K3/24 , H05K3/34 , H05K3/40 , H01L23/498
CPC分类号： H05K3/403 , H05K1/092 , H05K3/0052 , H05K3/248 , H05K3/3442 , H05K3/4061 , H05K2201/035 , H05K2201/09181 , H05K2201/10909 , Y02P70/613
摘要： The invention relates to a method of improving the manufacturing safety of weld joints (7) between a ceramic support (1) and a printed-circuit board (10). Said method consists of the deposition of a first metallization layer (5) resistant to alloy breakdown on the ceramic support (1), followed by the imprinting of a second metallization layer (6), which enhances wetting behaviour, on the first metallization layer (5). In this way the thickness of the overall metallization layer (5, 6) can be increased in the area of the edges (8) of a weld joint (7). The resulting raised solder ring in turn permits the fully automatic optical control of the weld joint (7).
摘要翻译：本发明涉及一种用于陶瓷基板（1）和电路板（10）之间增加焊点（7）的生产可靠性。它包括陶瓷基板（1）和第二随后压印上施加第一ablegierungsbeständigen金属化层（5）的步骤中，润湿行为增强金属化层（6）的第一金属化层（5）上。从而增加了Gesamtmetallisierungsschichtdicke（5,6）在边缘区域（8）的焊料接头的（7）是可以实现的，这又使焊接接头（7）的光学Lothochstieg全自动控制。

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