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11. 发明申请

WO2008128913A1 ELEKTRONISCHES BAUELEMENT 审中-公开
标题翻译：电子元件
公开(公告)号：WO2008128913A1
公开(公告)日：2008-10-30
申请号：PCT/EP2008/054474
申请日：2008-04-14
申请人： OSRAM GESELLSCHAFT MIT BESCHRÄNKTER HAFTUNG , SIESSEGGER, Bernhard
发明人： SIESSEGGER, Bernhard
IPC分类号： H01F27/28 , H01F17/00
CPC分类号： H01F27/2804 , H01F17/0013 , H01F2027/2809 , H01F2027/2819 , H05K1/141 , H05K1/165 , H05K3/222 , H05K3/3447 , H05K2201/086 , H05K2201/09063 , H05K2201/10303
摘要： Offenbart ist ein elektronisches Bauelement, insbesondere ein Planartransformator (1) oder eine Planarinduktivität, mit zumindest einem Kern (2) und mindestens einer mit elektronischen Bauelementen bestückten Hauptleiterplatte (4). Erfindungsgemäß ist der Hauptleiterplatte (4) zumindest eine ein- und/oder zweilagige Sekundärleiterplatte (6) zugeordnet, die mit mindestens einer als Leiterbahn (28) ausgeführten Wicklung versehen und im Bereich des Kerns (2) angeordnet ist.
摘要翻译：本发明公开了一种电子部件，特别是平面变压器（1）或平面电感线圈，具有至少一个芯（2）和至少一个装配有电子元件主印刷电路板（4）。根据本发明，所述主电路板（4）与至少一种单和/或双电层次级导体板相关联的（6）设置有至少一个作为导体轨道（28）上运行绕组和被布置在所述芯的区域（2）。

12. 发明申请

WO2007016642A3 DUAL FUNCTION COMPOSITE SYSTEM AND METHOD OF MAKING SAME 审中-公开
标题翻译：双功能复合体系及其制备方法
公开(公告)号：WO2007016642A3
公开(公告)日：2007-07-26
申请号：PCT/US2006030161
申请日：2006-07-28
申请人： FOSTER MILLER INC , FARRELL BRIAN , GANNON JOHN J JR , CAMPBELL THOMAS G , COPPOLA PAT ANHTONY , O'REILLY SEAN GERALD , BURKE JOSEPH F
发明人： FARRELL BRIAN , GANNON JOHN J JR , CAMPBELL THOMAS G , COPPOLA PAT ANHTONY , O'REILLY SEAN GERALD , BURKE JOSEPH F
IPC分类号： H01L23/02
CPC分类号： H01Q1/286 , B64D43/00 , H01Q21/065 , H05K1/00 , H05K1/038 , H05K1/147 , H05K3/0058 , H05K3/0064 , H05K3/3447 , H05K3/36 , H05K3/4046 , H05K2201/0116 , H05K2201/0281 , H05K2201/029 , H05K2201/10303
摘要： A dual function composite system includes a first electronic subsystem, a second electronic subsystem, and a composite member between the first and second electronic subsystems. The composite member includes plies of fabric, and resin impregnating the plies of fabric. At least one ply of the fabric includes signal transmission elements integrated therewith and interconnecting the first electronic subsystem with the second electronic subsystem.
摘要翻译：双功能复合系统包括第一电子子系统，第二电子子系统以及第一和第二电子子系统之间的复合元件。复合构件包括织物层和浸渍织物层的树脂。织物的至少一层包括与其集成的信号传输元件，并将第一电子子系统与第二电子子系统相互连接。

13. 发明申请

WO2005074344A1 VORRICHTUNG ZUR SCHÜTTELFESTEN AUFNAHME VON ELEKTRISCHEN SONDERBAUELEMENTEN UND/ODER ELEKTRISCHEN SCHALTUNGEN 审中-公开
标题翻译：设备对电子组件特殊和/或电气线路SCHÜTTELFESTEN录音
公开(公告)号：WO2005074344A1
公开(公告)日：2005-08-11
申请号：PCT/EP2004/053177
申请日：2004-11-30
申请人： ROBERT BOSCH GMBH , MUELLER, Wolfgang , UHLAND, Thomas , SCHMIDT, Dirk , DEGIRMENCI, Ibrahim , DISTLER, Frank
发明人： MUELLER, Wolfgang , UHLAND, Thomas , SCHMIDT, Dirk , DEGIRMENCI, Ibrahim , DISTLER, Frank
IPC分类号： H05K7/20
CPC分类号： H05K3/301 , H05K1/18 , H05K3/0061 , H05K5/0056 , H05K2201/10015 , H05K2201/10303 , H05K2201/10462 , H05K2201/10606 , H05K2201/2045
摘要： Eine Vorrichtung 10 zur schüttelfesten Aufnahme von elektrischen Sonderbauelementen 11, 12 und/oder elektrischen Schaltungen, insbesondere in Ausbildung als zweite Bestückungsebene in einem Steuergerät, besteht aus einem Träger 13, auf dem ein Schaltungsträger 14 mit darauf befestigten Sonderbauelementen 11, 12 elektrisch isoliert wenigstens teilflächig aufgebracht ist, vorzugsweise durch Verkleben.
摘要翻译：在其上具有安装在其上的特殊部件11的电路基板14，用于schüttelfesten进特殊的电气部件11，12和/或电路，特别是在训练中的控制装置的第二装配平面，其由载体13的一种装置10，12电从该区域的至少一部分的绝缘被施加，优选通过粘接。

14. 发明申请

WO2004068920A1 HEAT DISSIPATING ARRANGEMENT FOR AN ELECTRONIC APPLIANCE 审中-公开
标题翻译：电子装置散热装置
公开(公告)号：WO2004068920A1
公开(公告)日：2004-08-12
申请号：PCT/IB2003/006111
申请日：2003-12-18
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , MIES, Cornelis, J.
发明人： MIES, Cornelis, J.
IPC分类号： H05K1/02
CPC分类号： H05K7/20518 , H05K1/0203 , H05K1/144 , H05K3/368 , H05K2201/10303 , H05K2201/10659
摘要： An electronic appliance, such as a computer and the like, comprising a printed circuit board with printed circuits arranged thereon and electromagnetic components electrically connected thereto, as well as a heat dissipating arrangement for dissipating heat generated by the components to the surrounding atmosphere, a special feature being the fact that the heat dissipating arrangement comprises a heat sink with several separate thermal conductors which are thermically connected to the printed circuits, which thermal conductors can be arranged on the printed circuit board in various positions, each position corresponding to a predetermined heat dissipation direction.
摘要翻译：诸如计算机等的电子设备包括布置有印刷电路的印刷电路板和与其电连接的电磁部件，以及用于将组件产生的热量散发到周围大气的散热装置，特别的特征在于散热装置包括散热器，散热器具有几个独立的热导体，其热连接到印刷电路，这些热导体可以以各种位置布置在印刷电路板上，每个位置对应于预定的散热方向。

15. 发明申请

WO02049048A2 MULTI-LAYER AND USER-CONFIGURABLE MICRO-PRINTED CIRCUIT BOARD 审中-公开
标题翻译：用户可配置的多层打印微控制板
公开(公告)号：WO02049048A2
公开(公告)日：2002-06-20
申请号：PCT/US2001/048504
申请日：2001-12-06
IPC分类号： H01F17/00 , H01F27/28 , H05K1/14 , H05K1/16 , H05K3/22 , H05K3/46 , H01F19/00
CPC分类号： H05K1/165 , H01F17/0013 , H01F27/2804 , H05K1/029 , H05K1/141 , H05K3/222 , H05K3/4611 , H05K2201/086 , H05K2201/09063 , H05K2201/10196 , H05K2201/10303 , H05K2203/171
摘要： A multi-layer micro-printed circuit board (PCB) is disclosed, which defines a magnetic component (500), such as a transformer, using planar technology. Instead of using the traditional twelve-layer PCB incorporating both a primary and a secondary winding, this invention stacks multiple PCBs (525, 530, 535), each having four or six layers and each including a single winding (either the primary or the secondary). The PCBs are stacked in an offset arrangement such that the pins (501-504A) penetrating the PCB or PCBs including the primary winding or windings do not penetrate the PCB or PCBs including the secondary winding or windings. Additionally, this offset arrangement prevents the pins penetrating the secondary PCBs from penetrating the primary PCBs in the same manner. This offset configuration thereby avoids significant flashover problems associated with current planar components. Moreover, the invention describes an arrangement whereby a jumper or other connection can be used to connect the windings in a series or in a parallel configuration allowing the user to configure the component according to user-required parameters.
摘要翻译：本发明涉及通过平面技术限定诸如变压器的磁性部件的多层印刷电路板（PCB）。本发明不是使用结合了主绕组和辅助绕组的常规12层PCB，而是将多个PCB组合在一起，每个PCB具有4层或6层，并且每个PCB具有单个绕组（主或辅助））。这些PCB以偏移布置堆叠，以便进入包括主绕组或主绕组的PCB的引脚不会进入包括辅助绕组或线圈的PCB。辅助绕组。同样，这种偏移布局也可以防止进入辅助PCB的引脚进入主板。这种偏移布置因此避免了与当前平面部件相关的主要点火问题的发生。此外，本发明涉及一种配置，其中可以使用跳线或其他连接来串联或并联连接绕组，从而允许用户根据所需的用户参数配置该组件。

16. 发明申请

WO01047014A1 ORGANIC FLIP CHIP PACKAGES WITH AN ARRAY OF THROUGH HOLE PINS 审中-公开
标题翻译：具有通孔孔的阵列的有机墨盒包装
公开(公告)号：WO01047014A1
公开(公告)日：2001-06-28
申请号：PCT/US2000/016788
申请日：2000-06-15
IPC分类号： B23K1/00 , B23K31/02 , B23K35/26 , B23K101/40 , C22C11/10 , C22C13/00 , C22C13/02 , H01L21/48 , H01L23/02 , H01L23/08 , H01L23/498 , H05K3/34
CPC分类号： H01L23/49894 , H01L21/4853 , H01L23/49811 , H01L23/49827 , H01L2224/16225 , H01L2924/01079 , H01L2924/01087 , H01L2924/12044 , H01L2924/15312 , H05K3/3447 , H05K3/3463 , H05K2201/094 , H05K2201/09754 , H05K2201/10303
摘要： An organic carrier member for mounting a semiconductor device is provided that has a plurality of pin leads joined to conductive pads by an internal conductive layer. The pin leads are embedded in the organic carrier member and joined to the conductive layer by a solder alloy having a reflow temperature higher than the temperature necessary to attach the semiconductor device. Embodiments include a bismaleimide-triazine epoxy laminate carrier member having an array of pins joined to the carrier member by a solder alloys having a reflow temperature of about 220 DEG C to about 270 DEG C.
摘要翻译：提供一种用于安装半导体器件的有机载体构件，其具有通过内部导电层连接到导电焊盘的多个引脚引线。引脚引线嵌入有机载体部件中，并且通过具有比连接半导体器件所需的温度高的回流温度的焊料合金接合到导电层。实施方案包括具有通过具有约220℃至约270℃的回流温度的焊料合金连接到载体构件的销阵列的双马来酰亚胺 - 三嗪环氧层压载体构件。

17. 发明申请

WO01033672A1 CIRCUIT BOARD APPARATUS WITH PIN CONNECTORS 审中-公开
标题翻译：带引脚连接器的电路板设备
公开(公告)号：WO01033672A1
公开(公告)日：2001-05-10
申请号：PCT/US2000/041857
申请日：2000-11-02
IPC分类号： H01R12/52 , H01R12/70 , H05K3/12 , H05K3/34 , H01R12/00
CPC分类号： H01R12/7082 , H01R12/523 , H01R12/58 , H05K3/1216 , H05K3/3447 , H05K3/3484 , H05K2201/10303 , H05K2201/10871 , Y10T29/49139 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49163
摘要： A method allowing for the inexpensive automated construction of interconnections between circuit boards is provided. According to the present invention, printed circuit pins (30) are inserted in a circuit board (10) from the top (component side). Provided the heads of the pins are thin enough to lie beneath a solder stencil, the pins may be pre-installed on the circuit board (10) and solder applied to the pins (30) at the same time solder is applied to other regions of the board. Thus, known surface mount techniques may be employed to form solder connections (72) between the pins (30) and conductive traces (12) on the circuit board, which facilitates the automation of the previously manual operation of soldering the printed circuit pins separately.
摘要翻译：提供了允许在电路板之间廉价自动构建互连的方法。根据本发明，印刷电路引脚（30）从顶部（部件侧）插入电路板（10）中。如果引脚的头部足够薄以便位于焊料模板下面，则可将引脚预先安装在电路板（10）上，并将焊料施加到引脚（30）上，同时将焊料施加到董事会。因此，可以采用已知的表面贴装技术来形成电路板上的引脚（30）和导电迹线（12）之间的焊接连接（72），这便于分别焊接印刷电路引脚的先前手动操作的自动化。

18. 发明申请

WO00079853A1 PROCESS FOR CONNECTING ELECTROCONDUCING TRACKS WHICH ARE SEPARATED BY A LAMINAR INSULATING MATERIAL AND PRINTED CIRCUIT OBTAINED 审中-公开
标题翻译：用于连接由层压绝缘材料分离的电焊道和印刷电路的工艺
公开(公告)号：WO00079853A1
公开(公告)日：2000-12-28
申请号：PCT/ES1999/000184
申请日：1999-06-21
IPC分类号： H05K3/32 , H05K3/34 , H05K3/40 , H01R12/32
CPC分类号： H01R12/526 , H01R12/523 , H05K3/3447 , H05K3/3468 , H05K3/4046 , H05K2201/10303 , H05K2201/1081
摘要： Process for connecting electroconducting tracks which are separated by a laminar insulating material, and printed circuit obtained. The process being based on an element (1) which is comprised of a laminar dielectric substrate (2) which is coated on either side by two electroconductor layers from which tracks (3a, 3b) have been configured and which are electrically connected by means of electroconductor pins (5) inserted into transversal holes (4) which are drilled at predetermined points of said element (1). Between a hole (4) et a pin (5), a separation space (4a) is provided; both extremities (5a, 5b) of the pins (5) protrude from the corresponding tracks (3a, 3b) of which the holes (4) are metallized internally before inserting said pins (5); then, both extremities (5a, 5b) of said pins (5) are welded to the corresponding tracks (3a, 3b) by adding molded material (6) to a single extremity (5a) of the pins (5) and adjacent zones of the tracks (3a).
摘要翻译：用于层叠绝缘材料分离的导电轨道的连接方法以及获得的印刷电路。该方法基于元件（1），该元件由层状电介质基板（2）组成，层叠电介质基板（2）由两个电导体层（其中已经构成轨道（3a，3b））的两侧涂覆，并且通过插入到在所述元件（1）的预定点处钻出的横向孔（4）中的导电针（5）。在孔（4）和销（5）之间提供分离空间（4a）在插入所述销（5）之前，销（5）的两个末端（5a，5b）从相应的轨道（3a，3b）突出，其中孔（4）在内部被金属化; 然后，通过将模制材料（6）添加到销（5）的单个末端（5a）和相邻的区域（5）的相邻区域中，将所述销（5）的两个末端（5a，5b）焊接到相应的轨道（3a，3b）轨道（3a）。

19. 发明申请

WO00079852A1 PROCESS FOR INTERCONNECTING PREDETERMINED POINTS OF TWO ELECTROCONDUCTING LAYERS WHICH ARE SEPARATED BY A LAMINAR INSULATING MATERIAL, AND PRINTED CIRCUIT BOARD OBTAINED 审中-公开
标题翻译：用于互连层压绝缘材料分离的两个电极层的预定点的连接过程和获得的印刷电路板
公开(公告)号：WO00079852A1
公开(公告)日：2000-12-28
申请号：PCT/ES1999/000183
申请日：1999-06-21
IPC分类号： H05K3/34 , H05K3/40 , H01R12/32
CPC分类号： H01R12/526 , H05K3/3447 , H05K3/4046 , H05K2201/10303 , H05K2201/1081
摘要： Process for interconnecting predetermined points of two electroconducting layers which are separated by a laminar insulating material, and printed circuit board obtained, comprising the use of an element (1) consisting of a dielectric substrate (2) quoted on each side by two electroconducting layers (3a, 3b) which are electrically connected by conducting pins (5) which are inserted into holes (4) made at said predetermined point of the element (1); a separation space (4a) is provided between the hole (4) and the pin (5). The pins (5) are mechanically and electrically joined to said electroconducting layers (3a, 3b), the electric connection to the layers (3a, 3b) being obtained through the pins (5) by bringing, without heat, and electroconductor material which fills at least some regions of said separation spaces (4a) comprised between some portions of the pins (5) and respective adjacent electroconducting areas of the walls of said holes (4) which correspond to the layers (3a, 3b).
摘要翻译：用于将由层状绝缘材料分离的两个导电层的预定点相互连接的工艺和所获得的印刷电路板的方法，包括使用由两面导电层（每一侧）引用的电介质基板（2）组成的元件（1）通过插入到在元件（1）的所述预定点处形成的孔（4）中的导销（5）电连接; 在孔（4）和销（5）之间设有分隔空间（4a）。销（5）与所述导电层（3a，3b）机械地和电连接，通过引脚（5）获得的层（3a，3b）的电连接通过不加热而导入，并且电导体材料填充所述分隔空间（4a）的至少一些区域包括在销（5）的一些部分和对应于层（3a，3b）的所述孔（4）的壁的相应的相邻导电区域之间。

20. 发明申请

WO00035257A1 CONTACT NODE 审中-公开
标题翻译：联系节点
公开(公告)号：WO00035257A1
公开(公告)日：2000-06-15
申请号：PCT/RU1999/000062
申请日：1999-03-04
IPC分类号： H01R12/06 , H01L23/538 , H01R4/00 , H05K3/46 , H05K1/11 , H05K3/36 , H05K3/42
CPC分类号： H05K3/363 , H01L23/5384 , H01L24/80 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16 , H01L2224/8203 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01039 , H01L2924/01041 , H01L2924/01058 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/14 , H01L2924/3011 , H05K3/3447 , H05K3/368 , H05K3/4007 , H05K3/4647 , H05K2201/0367 , H05K2201/09827 , H05K2201/10303 , H05K2201/10666 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The present invention pertains to the making of permanent connections in the production of apparatus containing microelectronic components and semiconductor devices. This invention essentially relates to contact nodes for assembling inter alia multilayered switching structures for polycrystalline modules and for mounting crystals of large-scale IC on a switching structure during the production of said polycrystalline modules. The contact node comprises at least two metallised contacts connected to electroconductive tracks (2, 6) provided on the surfaces of the switching layers (3, 7). These layers are made of a dielectric material, overlap each other and are electrically and mechanically connected together by an electroconductive binding material (8). The contact node consists of a splice that connects, on the one hand, a contact consisting of a metallised pad (1) connected to the electroconductive tracks (2) at the surface of the lower switching layer (3) and, on the other hand, the corresponding contact consisting of a metallised opening (4) formed in the layer of dielectric material.
摘要翻译：本发明涉及制造包含微电子部件和半导体器件的装置的永久连接。本发明基本上涉及用于组装多晶模块的多层开关结构和用于在所述多晶模块的生产期间将大尺寸IC的晶体安装在开关结构上的接触节点。接触节点包括连接到设置在开关层（3,7）的表面上的导电轨道（2,6）的至少两个金属化触点。这些层由电介质材料制成，彼此重叠并且通过导电结合材料（8）电连接和机械连接在一起。接触节点包括一个接头，其一方面连接由在下部开关层（3）的表面处连接到导电轨道（2）的金属化焊盘（1）组成的触点，另一方面，相应的接触由形成在介电材料层中的金属化开口（4）组成。

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