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    • 13. 发明申请
    • METHOD OF FORMING IN-SITU PRE-GAN DEPOSITION LAYER IN HVPE
    • 在HVPE中形成原位预沉积层的方法
    • WO2010127156A2
    • 2010-11-04
    • PCT/US2010/033030
    • 2010-04-29
    • APPLIED MATERIALS, INC.MELNIK, YuriyKOJIRI, HidehiroKRYLIOUK, OlgaISHIKAWA, Tetsuya
    • MELNIK, YuriyKOJIRI, HidehiroKRYLIOUK, OlgaISHIKAWA, Tetsuya
    • H01L21/205H01L33/02
    • C23C16/4488C23C16/303C23C16/45523C30B25/02C30B29/403
    • A method and apparatus is provided for preparing a substrate for forming electronic devices incorporating III/V compound semiconductors. Elemental halogen gases, hydrogen halide gases, or other halogen or halide gases, are contacted with liquid or solid group III metals to form precursors which are reacted with nitrogen sources to deposit a nitride buffer layer on the substrate. The buffer layer, which may be a transition layer, may incorporate more than one group III metal, and may be deposited with amorphous or crystalline morphology. An amorphous layer may be partially or fully recrystallized by thermal treatment. Instead of a layer, a plurality of discrete nucleation sites may be formed, whose size, density, and distribution may be controlled. The nitrogen source may include reactive nitrogen compounds as well as active nitrogen from a remote plasma source. The composition of the buffer or transition layer may also vary with depth according to a desired profile.
    • 提供了一种用于制备用于形成结合III / V化合物半导体的电子器件的衬底的方法和装置。 元素卤素气体,卤化氢气体或其它卤素或卤化物气体与液体或固体III族金属接触以形成与氮源反应以在衬底上沉积氮化物缓冲层的前体。 可以是过渡层的缓冲层可以结合多于一个III族金属,并且可以以无定形或结晶形态沉积。 非晶层可以通过热处理部分或完全重结晶。 代替层,可以形成多个离散的成核位点,其尺寸,密度和分布可以被控制。 氮源可以包括反应性氮化合物以及来自远程等离子体源的活性氮。 缓冲层或过渡层的组成也可根据所需的轮廓随深度而变化。