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1. 发明申请

WO2012026952A1 IN-SITU SYNTHESIS AND DEPOSITION OF BATTERY ACTIVE LITHIUM MATERIALS BY SPRAYING 审中-公开
标题翻译：电喷活性锂离子电池的现场合成与沉积
公开(公告)号：WO2012026952A1
公开(公告)日：2012-03-01
申请号：PCT/US2010/058493
申请日：2010-12-01
申请人： APPLIED MATERIALS, INC. , SHANG, Quanyuan , YANG, Lu , BROWN, Karl, M. , OLGADO, Donald, J., K. , PEBENITO, Victor , BOLANDI, Hooman , ISHIKAWA, Tetsuya , BACHRACH, Robert, Z. , CHEN, Liang-Yuh
发明人： SHANG, Quanyuan , YANG, Lu , BROWN, Karl, M. , OLGADO, Donald, J., K. , PEBENITO, Victor , BOLANDI, Hooman , ISHIKAWA, Tetsuya , BACHRACH, Robert, Z. , CHEN, Liang-Yuh
IPC分类号： H01M4/04 , H01M10/0525 , H01G9/04
CPC分类号： H01G11/50 , H01G11/06 , H01M4/0419 , H01M10/04 , Y02E60/13
摘要： A method and apparatus for forming an electrochemical layer of a thin film battery is provided. A liquid precursor mixture comprising electrochemically active metals is reacted with oxygen to form electrochemically active metal oxides, which are deposited in a layer on a substrate. Carbon may be added to the mixture to control energy input to the reaction and to provide adhesion and conductivity between crystals deposited on the substrate. Conversion of precursors to deposition crystals may be accomplished in a two-stage process.
摘要翻译：提供一种用于形成薄膜电池的电化学层的方法和装置。将包含电化学活性金属的液体前体混合物与氧气反应以形成沉积在基底上的层中的电化学活性金属氧化物。可以向混合物中加入碳以控制反应的能量输入并提供沉积在基底上的晶体之间的粘附和导电性。前体转化为沉积晶体可以在两阶段工艺中完成。

2. 发明申请

WO2012036908A3 SPRAY DEPOSITION MODULE FOR AN IN-LINE PROCESSING SYSTEM 审中-公开
公开(公告)号：WO2012036908A3
公开(公告)日：2012-03-22
申请号：PCT/US2011/049984
申请日：2011-08-31
申请人： APPLIED MATERIALS, INC. , BACHRACH, Robert, Z. , WANG, Connie, P. , LOPATIN, Sergey, D. , BOLANDI, Hooman , BABAYANTS, Ruben , BROWN, Karl, M. , KUTNEY, Michael, C. , OLGADO, Donald, J., K.
发明人： BACHRACH, Robert, Z. , WANG, Connie, P. , LOPATIN, Sergey, D. , BOLANDI, Hooman , BABAYANTS, Ruben , BROWN, Karl, M. , KUTNEY, Michael, C. , OLGADO, Donald, J., K.
IPC分类号： H01M4/04 , B05C5/02 , B05D1/26 , H01M10/04 , H01M10/052
摘要： In one embodiment, an apparatus for simultaneously depositing an anodically or cathodically active material on opposing sides of a flexible conductive substrate is provided. The apparatus comprises a chamber body defining one or more processing regions in which a flexible conductive substrate is exposed to a dual sided spray deposition process, wherein each of the one or more processing regions are further divided into a first spray deposition region and a second spray deposition region for simultaneously spraying an anodically active or cathodically active material onto opposing sides of a portion of the flexible conductive substrate, wherein each of the first and second spray deposition regions comprise a spray dispenser cartridge for delivering the activated material toward the flexible conductive substrate and a movable collection shutter.

3. 发明申请

WO2007145904A2 METHODS AND APPARATUS FOR SUPPORTING A SUBSTRATE IN A HORIZONTAL ORIENTATION DURING CLEANING 审中-公开
标题翻译：在清洗期间支撑水平方向底板的方法和装置
公开(公告)号：WO2007145904A2
公开(公告)日：2007-12-21
申请号：PCT/US2007/013170
申请日：2007-06-04
申请人： APPLIED MATERIALS, INC.
发明人： OLGADO, Donald, J., K. , NANGOY, Roy, C. , TULSHIBAGWALE, Sheshraj, L. , CHEN, Hui , SHIN, Ho, Seon
IPC分类号： A46B13/00 , B08B3/10 , B08B7/04 , B24B51/00
CPC分类号： H01L21/67046 , B08B1/04 , B08B11/02
摘要： In one or more aspects, an apparatus for cleaning a substrate includes (1) a plurality of rollers adapted to contact and support the substrate in a horizontal orientation, and (2) at least one brush adapted to contact a major surface of the substrate while the substrate is supported by the plurality of rollers to clean the major surface of the substrate. At least one of the plurality of rollers.is adapted to move between an opened position allowing the substrate to be loaded onto or unloaded from the plurality of rollers and a closed position in which the substrate is supported by the plurality of rollers. Numerous other aspects are provided.
摘要翻译：在一个或多个方面中，用于清洁基底的装置包括（1）多个辊，其适于以水平取向接触和支撑基底;以及（2）至少一个刷子，其适于接触基底的主表面，同时基板由多个辊支撑以清洁基板的主表面。多个辊中的至少一个适于在允许将衬底装载到多个辊上或从多个辊卸载的打开位置和在多个辊中支撑衬底的关闭位置之间移动。提供了许多其他方面。

4. 发明申请

WO2006116263A1 METHODS AND APPARATUS FOR CLEANING AND EDGE OF A SUBSTRATE 审中-公开
标题翻译：基板清洗和边缘的方法和装置
公开(公告)号：WO2006116263A1
公开(公告)日：2006-11-02
申请号：PCT/US2006/015399
申请日：2006-04-24
申请人： APPLIED MATERIALS, INC.
发明人： HSU, Wei-Yung , OLGADO, Donald, J., K. , SHIN, Ho-Seon , CHEN, Liang-Yuh
IPC分类号： H01L21/00 , B08B1/04 , G03D5/06
CPC分类号： H01L21/67046 , B08B1/04 , H01L21/67028
摘要： In one aspect, an apparatus for cleaning an edge of a substrate is provided. The apparatus includes (1) one or more rollers of a first diameter adapted to contact an edge of a substrate and rotate the substrate; and (2) one or more rollers of a second diameter that is larger than the first diameter adapted to contact an edge of the substrate and to clean the edge of the substrate. The one or more rollers of the first diameter and the one or more rollers of the second diameter may be adapted to rotate at substantially the same speed. Numerous other aspects are provided.
摘要翻译：一方面，提供一种用于清洁基板的边缘的装置。该设备包括（1）一个或多个第一直径的辊，其适于接触衬底的边缘并旋转衬底; 和（2）一个或多个第二直径的辊，其大于适于接触所述衬底的边缘并且清洁所述衬底的所述边缘的所述第一直径。第一直径的一个或多个辊和第二直径的一个或多个辊可以适于以基本上相同的速度旋转。提供了许多其他方面。

5. 发明申请

WO2003034478A2 APPARATUS AND METHOD FOR ELECTRO CHEMICAL PLATING USING BACKSIDE ELECTRICAL CONTACTS 审中-公开
标题翻译：使用背面电气接触的电化学镀层的装置和方法
公开(公告)号：WO2003034478A2
公开(公告)日：2003-04-24
申请号：PCT/US2002/030503
申请日：2002-09-26
申请人： APPLIED MATERIALS, INC.
发明人： OLGADO, Donald, J., K. , WOOD, Michael , LUBOMIRSKY, Dmitry
IPC分类号： H01L21/288
CPC分类号： C25D7/123 , C25D5/028 , C25D17/001 , C25D17/06 , H01L21/2885
摘要： An apparatus and method for securing and electrically contacting a substrate on a non-production surface of the substrate. The apparatus includes a substrate holder assembly having a substrate engaging surface formed thereon, the substrate engaging surface being configured to engage a substrate on the non-production surface. The apparatus further includes an electrical contact device positioned on the substrate engaging surface, the electrical contact device including a plurality of radially spaced electrically conductive members configured to electrically communicate with the non-production surface of the substrate positioned on the substrate engaging surface. The method includes depositing a conductive seed layer on a production surface of the substrate, and depositing a backside conductive layer on a portion of the non-production side of the substrate, the backside conductive layer extending around a bevel of the substrate to electrically communicate with the seed layer. The method further includes securing the substrate in a chuck configured to engage the non-production surface of the substrate, contacting the backside conductive layer with an electrical cathode contact on the non-production side of the substrate, and plating over the conductive seed layer via application of an electrolyte to the production surface of the substrate and applying an electrical bias to the electrical cathode contact and an anode in communication with the electrolyte.
摘要翻译：一种用于固定和电接触衬底的非生产表面上的衬底的装置和方法。该设备包括具有形成在其上的衬底接合表面的衬底保持器组件，衬底接合表面被配置为接合非生产表面上的衬底。所述装置还包括位于所述基板接合表面上的电接触装置，所述电接触装置包括多个径向隔开的导电构件，所述导电构件构造成与位于所述基板接合表面上的所述基板的非生产表面电连通。该方法包括在衬底的生产表面上沉积导电种子层，以及在衬底的非生产侧的一部分上沉积背面导电层，所述背面导电层围绕衬底的斜面延伸以与种子层。该方法还包括将衬底固定在配置成接合衬底的非生产表面的卡盘中，使背面导电层与衬底的非生产侧上的电阴极接触接触，并且在导电种子层上电镀将电解质施加到基材的生产表面上，并将电偏压施加到电阴极接触件和与电解质连通的阳极。

6. 发明申请

WO2003034478A3 APPARATUS AND METHOD FOR ELECTRO CHEMICAL PLATING USING BACKSIDE ELECTRICAL CONTACTS 审中-公开
公开(公告)号：WO2003034478A3
公开(公告)日：2003-04-24
申请号：PCT/US2002/030503
申请日：2002-09-26
申请人： APPLIED MATERIALS, INC.
发明人： OLGADO, Donald, J., K. , WOOD, Michael , LUBOMIRSKY, Dmitry
IPC分类号： H01L21/288
摘要： An apparatus and method for securing and electrically contacting a substrate on a non-production surface of the substrate. The apparatus includes a substrate holder assembly (500) having a substrate engaging surface formed thereon, the substrate engaging surface being configured to engage a substrate on the non-production surface. The apparatus further includes an electrical contact device positioned on the substrate engaging surface, the electrical contact device (502) including a plurality of radially spaced electrically conductive members configured to electrically communicate with the non-production surface of the substrate positioned on the substrate engaging surface. The method includes depositing a conductive seed layer on a production surface of the substrate, and depositing a backside conductive layer on a portion of the non-production side of the substrate, the backside conductive layer extending around a bevel of the substrate to electrically communicate with the seed layer. The method further includes securing the substrate in a chuck configured to engage the non-production surface of the substrate, contacting the backside conductive layer with an electrical cathode contact on the non-production side of the substrate, and plating over the conductive seed layer via application of an electrolyte to the production surface of the substrate and applying an electrical bias to the electrical cathode contact and an anode in communication with the electrolyte.

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