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1. 发明申请

WO2014198521A1 METHOD OF CONTACTING INTEGRATED CIRCUIT COMPONENTS IN A TEST SYSTEM 审中-公开
标题翻译：在测试系统中联合集成电路组件的方法
公开(公告)号：WO2014198521A1
公开(公告)日：2014-12-18
申请号：PCT/EP2014/060755
申请日：2014-05-26
申请人： RASCO GMBH
发明人： CROCE, Karl
IPC分类号： G01R31/28 , G01R31/319
CPC分类号： G01R31/2881 , G01R1/0458 , G01R31/2862 , G01R31/2863 , G01R31/2874
摘要： The invention provides a method of contacting integrated circuit components in a test system for testing integrated circuit components comprises the steps of providing an atmosphere comprising an inert gas; and contacting tips of a contactor of the test system with respective contacting areas of an integrated circuit component to be tested, the contacting being performed in the provided atmosphere comprising the inert gas. The invention further provides a test system for testing integrated circuit components that comprises means for providing an atmosphere comprising an inert gas; wherein the test system is configured to contact tips of a contactor of the test system with respective contacting areas of an integrated circuit component to be tested, and the test system is configured to perform the contacting in the provided atmosphere under operating conditions.
摘要翻译：本发明提供一种接触用于测试集成电路部件的测试系统中的集成电路部件的方法，包括提供包括惰性气体的气氛的步骤; 以及将测试系统的接触器的尖端接触待测试的集成电路部件的相应接触区域，所述接触在包括惰性气体的提供的气氛中进行。本发明还提供了一种用于测试集成电路部件的测试系统，其包括用于提供包含惰性气体的气氛的装置; 其中所述测试系统被配置为将所述测试系统的接触器的尖端与待测试的集成电路部件的相应接触区域接触，并且所述测试系统被配置为在操作条件下在所提供的气氛中进行接触。

2. 发明申请

WO2006076315A1 HEAT SINK PEDESTAL WITH INTERFACE MEDIUM CHAMBER 审中-公开
标题翻译：带有接口中间室的散热器
公开(公告)号：WO2006076315A1
公开(公告)日：2006-07-20
申请号：PCT/US2006/000731
申请日：2006-01-11
申请人： DELTA DESIGN, INC. , WETZEL, Stephen, Aloysius , TRIEU, Thanh
发明人： WETZEL, Stephen, Aloysius , TRIEU, Thanh
IPC分类号： G01R1/04
CPC分类号： G01R1/0458 , Y10T29/4935
摘要： A heat sink pedestal device allows for the use of generic thermal units such as heat sinks. An interposer configured to fit a specific device under test is mounted to a retainer. The retainer firmly holds the interposer in position. In addition, the retainer may be mounted to a thermal unit. An interface sealant with a diameter less than that of the interposer, creating the perimeter of an interface medium chamber, is positioned at the periphery of the interposer between the interposer and the thermal unit. Interface material, having high thermal conductive properties, is positioned within the interface sealant. The interface medium chamber provides a high thermally conductive interface between the interposer and the thermal unit. In addition, the heat sink pedestal device minimizes customization because it allows a single heat sink or thermal unit assembly to be used to accommodate a wide range of unit sizes.
摘要翻译：散热器基座装置允许使用诸如散热器的通用热单元。将配置成适合被测试的特定设备的插入件安装到保持器。固定器将插入件牢固地保持在适当的位置。此外，保持器可以安装到热单元。直径小于插入器的接口密封剂，形成界面介质室的周边，位于插入件与热单元之间的中间层周边。具有高导热性能的界面材料位于界面密封剂内。界面介质室在插入器和热单元之间提供高导热接口。此外，散热器基座设备可最大限度地减少定制，因为它允许使用单个散热器或热单元组件来适应宽范围的单元尺寸。

3. 发明申请

WO2005114228A1 積層基板及びプローブカード审中-公开
标题翻译：层压板和探针卡
公开(公告)号：WO2005114228A1
公开(公告)日：2005-12-01
申请号：PCT/JP2005/009439
申请日：2005-05-24
申请人：東京エレクトロン株式会社 , 望月純 , 保坂久富
发明人：望月純 , 保坂久富
IPC分类号： G01R1/073
CPC分类号： G01R1/07342 , G01R1/0458 , G01R1/07307 , G01R1/07357 , H05K1/0271 , H05K1/0306 , H05K3/4688 , H05K2201/068 , H05K2201/09036
摘要：　積層基板やプローブカードにおいて，特殊な材料を使用することなく，熱変形を格段に抑制することを目的とする。　本発明によれば，被検査体と電気的に接触するプローブと電気的に導通自在に接続された回路基板を少なくとも一つ有するプローブカードにおいて，回路基板は，基材層と，この基材層の少なくとも被検査体側の面に積層された表面層とを備えている。表面層は基材層より大きい熱膨張率を有し，かつ表面層を複数に分割する溝が表面層に設けられている。
摘要翻译：在层压板和探针卡中，在不使用特殊材料的情况下，显着地抑制热变形。探针卡设置有至少一个与探针导电连接的电路板，该探针与被检查物体电接触。电路板设置有基材层和至少层叠在待检查对象侧的基材层表面上的表层。表层具有比基材层更高的热膨胀系数，并且在表面层上设置有将表面层分割为多个部分的凹槽。

4. 发明申请

WO0213261A2 HEAT SPREADING DIE COVER 审中-公开
标题翻译：热膨胀套管
公开(公告)号：WO0213261A2
公开(公告)日：2002-02-14
申请号：PCT/US0124186
申请日：2001-08-01
申请人： FORMFACTOR INC , ONDRICEK DOUGLAS S
发明人： ONDRICEK DOUGLAS S
IPC分类号： G01R1/04 , H01L23/367 , H01L23/00
CPC分类号： H01L23/367 , G01R1/0458 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2224/0401
摘要： A heat spreader for a heat generating component. The heat spreader includes a frame having a first top surface and a cover disposed on the first top surface. The cover is made from, at least in part, a thermally conductive material. The frame can be fixed relative to a substrate such that the frame and the cover enclose a heat generating component coupled to the substrate. The frame has non-curved inner walls which bound a space that is capable of accommodating a heat generating component.
摘要翻译：用于发热部件的散热器。散热器包括具有设置在第一顶表面上的第一顶表面和盖的框架。所述盖至少部分地由导热材料制成。框架可以相对于基板固定，使得框架和盖子包围耦合到基板的发热部件。框架具有非弯曲的内壁，其结合能够容纳发热部件的空间。

5. 发明申请

WO2017039936A1 CONDUCTIVE TEMPERATURE CONTROL 审中-公开
标题翻译：导电温度控制
公开(公告)号：WO2017039936A1
公开(公告)日：2017-03-09
申请号：PCT/US2016/045475
申请日：2016-08-04
申请人： TERADYNE, INC.
发明人： ORCHANIAN, Shant , CARVALHO, Valquirio N. , CAMPBELL, Philip , POLLACK, Matthew David
IPC分类号： G01R1/04 , G01R31/28 , G01K1/16
CPC分类号： G01R1/0458 , G01R31/2863 , G01R31/2867
摘要： A test system includes a transporter having test sockets, where each test socket is configured to receive a device to be tested by the test system, and each test socket includes an element that is controllable to change a temperature of a device in the test socket through thermal conduction. The test system includes a test rack comprising slots. The transporter is configured for movement into, and out of, a slot of the test rack to test devices in the test sockets.
摘要翻译：测试系统包括具有测试插座的传送器，其中每个测试插座被配置为接收由测试系统测试的设备，并且每个测试插座包括可控制的元件，以通过以下方式改变测试插座中的设备的温度热传导。测试系统包括包括槽的测试架。传送器被配置为移动到测试架的槽中并从测试架的槽中移出以测试测试插座中的设备。

6. 发明申请

WO2016172648A1 SYSTEMS AND METHODS FOR CONFORMING TEST TOOLING TO INTEGRATED CIRCUIT DEVICE WITH WHIRLWIND COLD PLATE 审中-公开
标题翻译：用于将测试工具结合到具有黑色冷板的集成电路器件的系统和方法
公开(公告)号：WO2016172648A1
公开(公告)日：2016-10-27
申请号：PCT/US2016/029073
申请日：2016-04-23
申请人： ESSAI, INC.
发明人： BARABI, Nasser , HO, Chee, Wah , TIENZO, Joven, R. , KRYACHEK, Oksana , NAZAROV, Elena, V.
IPC分类号： H01L23/34 , H01L23/40 , H05K7/20 , G01R31/319
CPC分类号： G01R31/2874 , G01R1/0458 , G01R1/0466 , H01L2224/16225 , H01L2924/15311 , H01L2924/3511
摘要： A thermal control unit used to maintain a set point temperature on an integrated circuit device under test, has at least one cooling plate configured to facilitate the testing of integrated circuits where the device under test requires efficient cooling.
摘要翻译：用于保持被测集成电路设备上的设定点温度的热控制单元具有至少一个冷却板，其被配置为便于测试被测器件需要有效冷却的集成电路。

7. 发明申请

WO2008055003A1 IC SOCKET HAVING HEAT DISSIPATION FUNCTION 审中-公开
标题翻译： IC插座具有散热功能
公开(公告)号：WO2008055003A1
公开(公告)日：2008-05-08
申请号：PCT/US2007/081719
申请日：2007-10-18
申请人： 3M INNOVATIVE PROPERTIES COMPANY , NAITO, Masahito
发明人： NAITO, Masahito
IPC分类号： H01L23/36
CPC分类号： G01R1/0458 , H01L23/3677 , H01L2924/0002 , H01R12/55 , H01R12/57 , H01R12/585 , H01R12/707 , H01L2924/00
摘要： It is an object of the present invention to provide an IC socket that has a configuration to promote heat dissipation from an IC device in a simple configuration, and prevent overheating of the IC device under test. Contact pins 6c, similar to the contact pins 6a and 6b, are disposed in regions not corresponding to the signal balls 51 and the thermal balls 52 of the BGA device 5. Further, the contact pins 6c and the second contact pins 6b that are contacted to the thermal balls 52 are thermally connected to each other via a heat spreader.
摘要翻译：本发明的目的是提供一种IC插座，其具有能够以简单的结构从IC器件促进散热的结构，并且防止被测IC器件的过热。接触销6c类似于接触销6a和6b设置在不对应于BGA装置5的信号球51和热球52的区域中。此外，接触销6c和接触的第二接触销6b 热球52经由散热器彼此热连接。

8. 发明申请

WO2008005682A1 ATTACHMENT FOR SOCKET AND SEMICONDUCTOR DEVICE-TESTING UNIT HAVING THE SAME 审中-公开
标题翻译：用于插座和半导体器件测试单元的附件
公开(公告)号：WO2008005682A1
公开(公告)日：2008-01-10
申请号：PCT/US2007/071512
申请日：2007-06-19
申请人： 3M INNOVATIVE PROPERTIES COMPANY , OHTA, Toshio,
发明人： OHTA, Toshio,
IPC分类号： H01L21/66 , H01L23/34
CPC分类号： H01L23/4093 , G01R1/0458 , H01L2924/0002 , H01L2924/00
摘要： To provide an attachment for a socket which can cope with automatic testing of the IC devices, and which can enhance the radiation of heat from the IC devices despite of its reduced size, as well as to provide a semiconductor device-testing unit having the same. An attachment 15 for a socket used together with an IC socket 1 for connecting a BGA chip 10 to a testing circuit, to test the BGA chip 10 for its performance, wherein provision is made of a pair of heat sinks 19 of a half-split structure that come in contact with the surface of the BGA chip 10 to remove the heat generated by the BGA chip 10.
摘要翻译：为了提供可以应付IC器件的自动测试的插座的附件，并且其可以增强来自IC器件的热辐射，尽管其尺寸减小，以及提供具有相同的半导体器件测试单元。用于与用于将BGA芯片10连接到测试电路的IC插座1一起使用的插座的附件15，以测试BGA芯片10的性能，其中提供由半分割的一对散热器19 结构与BGA芯片10的表面接触以去除由BGA芯片10产生的热量。

9. 发明申请

WO2005084328A2 BURN-IN TESTING APPARATUS AND METHOD 审中-公开
标题翻译：燃烧测试装置和方法
公开(公告)号：WO2005084328A2
公开(公告)日：2005-09-15
申请号：PCT/US2005/006724
申请日：2005-02-28
申请人： WELLS-CTI, LLC , LOPEZ, Christopher, A. , DENHEYER, Brian, J. , KUENSTER, Gordon, B.
发明人： LOPEZ, Christopher, A. , DENHEYER, Brian, J. , KUENSTER, Gordon, B.
IPC分类号： G01K1/02 , G01K1/16 , G01R1/04 , G01R31/02
CPC分类号： G01R1/0458 , G01K1/16
摘要： An integrated circuit (IC) package testing apparatus integrates a temperature sensor (48), heater (or cooler) (44), and controller (42) within a single modular unit (22, 72). The controller (42) is a microprocessor embedded within the modular unit (22, 72) and in communication with the sensor (48) and heater (44). The controller (42) allows a selected testing temperature to be input by a user via a communications link (71) to the controller (42). Each IC package (54) has its testing temperature individually controlled by a controller (42). The module (22) is easily attached and removed from an open-top socket (20) through the use of latches (26) on the testing socket. Many IC packages (54) can be quickly placed and removed from testing sockets (20) when a matrix of sensors (48), heaters (or coolers) (44) and controllers (42) are located on a single top attach plate (72) with the sensors (48) and heaters (or coolers) (44) individually spring-loaded on the top attach plate (72). A temperature sensor (48) includes a sensor (130) positioned within a conductive housing (134) and an insulating material (138) surrounding the housing (134).
摘要翻译：集成电路（IC）封装测试装置将温度传感器（48），加热器（或冷却器）（44）和控制器（42）集成在单个模块单元（22,72）内。控制器（42）是嵌入模块化单元（22,72）内并与传感器（48）和加热器（44）连通的微处理器。控制器（42）允许用户通过控制器（42）的通信链路（71）输入所选择的测试温度。每个IC封装（54）的测试温度由控制器（42）分别控制。模块（22）通过使用测试插座上的闩锁（26）容易地从敞开式插座（20）上拆下。当传感器（48），加热器（或冷却器）（44）和控制器（42）的矩阵位于单个顶部附接板（72）上时，可以将许多IC封装（54）快速放置并从测试插座（20）中移除）与传感器（48）和加热器（或冷却器）（44）分别弹簧加载在顶部附接板（72）上。温度传感器（48）包括定位在导电壳体（134）内的传感器（130）和围绕壳体（134）的绝缘材料（138）。

10. 发明申请

WO02046781A1 SOCKET FOR ELECTRONIC COMPONENT TEST, AND ELECTRONIC COMPONENT TEST APPARATUS USING THE SOCKET 审中-公开
标题翻译：电子元件测试插座和使用插座的电子元件测试装置
公开(公告)号：WO02046781A1
公开(公告)日：2002-06-13
申请号：PCT/JP2001/010729
申请日：2001-12-07
IPC分类号： G01R31/26 , G01R1/04 , G01R1/06 , G01R1/073 , G01R31/01 , G01R31/28 , H01R33/76 , H01L21/66
CPC分类号： G01R31/2863 , G01R1/0408 , G01R1/0458 , G01R31/01
摘要： An electronic component test apparatus capable of controlling the temperature of a socket for electronic component test such as an IC socket without generating noise in the test signals applied to electronic components such as IC devices and response signals read from the electronic components such as IC devices, wherein a first space (67) in a socket base (6) for electronic component test is allowed to communicate with a socket body internal space (75) in a socket (7) for electronic component test through a gas outlet (65) and a gas inlet (76), and a second space (68) in the socket base (6) for electronic component test is allowed to communicate with the socket body internal space (75) in the socket (7) for electronic component test through a gas inlet (66) and a gas outlet (77).
摘要翻译：一种电子部件测试装置，其能够控制诸如IC插座的电子部件测试用插座的温度，而不会在应用于诸如IC器件的电子部件的测试信号中产生噪声，以及从诸如IC器件的电子部件读取的响应信号，其中用于电子部件测试的插座底座（6）中的第一空间（67）允许通过气体出口（65）和插座（7）与用于电子部件测试的插座（7）中的插座体内部空间（75）连通，气体入口（76）和用于电子部件测试的插座基座（6）中的第二空间（68）与插座（7）中的插座主体内部空间（75）连通，用于通过气体进行电子部件测试入口（66）和气体出口（77）。

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