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1. 发明申请

WO2012061173A1 CONNECTOR 审中-公开
标题翻译：连接器
公开(公告)号：WO2012061173A1
公开(公告)日：2012-05-10
申请号：PCT/US2011/057802
申请日：2011-10-26
申请人： 3M INNOVATIVE PROPERTIES COMPANY , KAWATE, Yoshihisa, , OHTA, Toshio,
发明人： KAWATE, Yoshihisa, , OHTA, Toshio,
IPC分类号： H01R13/6477 , H01R13/514
CPC分类号： H01R13/6477 , H01R13/514
摘要： To provide a connector able to improve the transmission characteristics of a high frequency signal. A connector 1 includes a plurality of contact pairs 3, each contact pair including two substantially parallel, elongated, and spaced apart contacts(3a, 3b), and a plurality of first supports(41-1 to 41-7, 42-1 to 42-7), each first support being attached to a corresponding contact along a length of the contact. In at least one region, inner faces of contacts in each contact pair face each other and are spaced apart by air, outer faces of the contacts face away from each other, and middle portions, but not edge portions, of the outer faces are attached to corresponding first supports along the lengths of the contacts.
摘要翻译：提供能够提高高频信号的传输特性的连接器。连接器1包括多个接触对3，每个接触对包括两个基本上平行的，细长的和间隔开的触头（3a，3b），以及多个第一支撑件（41-1至41-7,42-1至 42-7），每个第一支撑件沿着接触件的长度附接到相应的触头。在至少一个区域中，每个接触对中的接点的内表面彼此面对并且被空气隔开，接触面的外表面相互离开，并且外表面的中间部分而不是边缘部分被附接沿着接触件的长度到相应的第一支撑件。

2. 发明申请

WO2008005682A1 ATTACHMENT FOR SOCKET AND SEMICONDUCTOR DEVICE-TESTING UNIT HAVING THE SAME 审中-公开
标题翻译：用于插座和半导体器件测试单元的附件
公开(公告)号：WO2008005682A1
公开(公告)日：2008-01-10
申请号：PCT/US2007/071512
申请日：2007-06-19
申请人： 3M INNOVATIVE PROPERTIES COMPANY , OHTA, Toshio,
发明人： OHTA, Toshio,
IPC分类号： H01L21/66 , H01L23/34
CPC分类号： H01L23/4093 , G01R1/0458 , H01L2924/0002 , H01L2924/00
摘要： To provide an attachment for a socket which can cope with automatic testing of the IC devices, and which can enhance the radiation of heat from the IC devices despite of its reduced size, as well as to provide a semiconductor device-testing unit having the same. An attachment 15 for a socket used together with an IC socket 1 for connecting a BGA chip 10 to a testing circuit, to test the BGA chip 10 for its performance, wherein provision is made of a pair of heat sinks 19 of a half-split structure that come in contact with the surface of the BGA chip 10 to remove the heat generated by the BGA chip 10.
摘要翻译：为了提供可以应付IC器件的自动测试的插座的附件，并且其可以增强来自IC器件的热辐射，尽管其尺寸减小，以及提供具有相同的半导体器件测试单元。用于与用于将BGA芯片10连接到测试电路的IC插座1一起使用的插座的附件15，以测试BGA芯片10的性能，其中提供由半分割的一对散热器19 结构与BGA芯片10的表面接触以去除由BGA芯片10产生的热量。

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