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1. 发明申请

WO2006096543A2 TEMPERATURE SENSING AND PREDICTION IN IC SOCKETS 审中-公开
标题翻译： IC插座温度感测和预测
公开(公告)号：WO2006096543A2
公开(公告)日：2006-09-14
申请号：PCT/US2006/007687
申请日：2006-03-03
申请人： WELLS-CTI, LLC , LOPEZ, Christopher, A. , DENHEYER, Brian, J.
发明人： LOPEZ, Christopher, A. , DENHEYER, Brian, J.
IPC分类号： G01R31/02
CPC分类号： G01R31/2874 , G01K7/425 , G01R31/2891
摘要： An apparatus and method are provided which preferably combines temperature sensing and prediction for more accurate temperature control of integrated circuits. An IC temperature sensing and prediction device (20) includes a current sensing device (26) that measures current passing through an IC (24), and a temperature control apparatus (28) that measures a surface temperature of the IC (24). The device further includes an electronic controller (30) that calculates the power consumed by the IC (24) according to the measured current and adjusts the temperature of a heater or cooler (28) responsive to the measured surface temperature and power consumption.
摘要翻译：提供了一种装置和方法，其优选地组合温度感测和预测以用于集成电路的更精确的温度控制。 IC温度感测和预测装置（20）包括测量通过IC（24）的电流的电流感测装置（26）和测量IC（24）的表面温度的温度控制装置（28）。该装置还包括电子控制器（30），该电子控制器根据所测量的电流来计算由IC（24）消耗的功率，并响应于测量的表面温度和功率消耗来调节加热器或冷却器（28）的温度。

2. 发明申请

WO2005084328A2 BURN-IN TESTING APPARATUS AND METHOD 审中-公开
标题翻译：燃烧测试装置和方法
公开(公告)号：WO2005084328A2
公开(公告)日：2005-09-15
申请号：PCT/US2005/006724
申请日：2005-02-28
申请人： WELLS-CTI, LLC , LOPEZ, Christopher, A. , DENHEYER, Brian, J. , KUENSTER, Gordon, B.
发明人： LOPEZ, Christopher, A. , DENHEYER, Brian, J. , KUENSTER, Gordon, B.
IPC分类号： G01K1/02 , G01K1/16 , G01R1/04 , G01R31/02
CPC分类号： G01R1/0458 , G01K1/16
摘要： An integrated circuit (IC) package testing apparatus integrates a temperature sensor (48), heater (or cooler) (44), and controller (42) within a single modular unit (22, 72). The controller (42) is a microprocessor embedded within the modular unit (22, 72) and in communication with the sensor (48) and heater (44). The controller (42) allows a selected testing temperature to be input by a user via a communications link (71) to the controller (42). Each IC package (54) has its testing temperature individually controlled by a controller (42). The module (22) is easily attached and removed from an open-top socket (20) through the use of latches (26) on the testing socket. Many IC packages (54) can be quickly placed and removed from testing sockets (20) when a matrix of sensors (48), heaters (or coolers) (44) and controllers (42) are located on a single top attach plate (72) with the sensors (48) and heaters (or coolers) (44) individually spring-loaded on the top attach plate (72). A temperature sensor (48) includes a sensor (130) positioned within a conductive housing (134) and an insulating material (138) surrounding the housing (134).
摘要翻译：集成电路（IC）封装测试装置将温度传感器（48），加热器（或冷却器）（44）和控制器（42）集成在单个模块单元（22,72）内。控制器（42）是嵌入模块化单元（22,72）内并与传感器（48）和加热器（44）连通的微处理器。控制器（42）允许用户通过控制器（42）的通信链路（71）输入所选择的测试温度。每个IC封装（54）的测试温度由控制器（42）分别控制。模块（22）通过使用测试插座上的闩锁（26）容易地从敞开式插座（20）上拆下。当传感器（48），加热器（或冷却器）（44）和控制器（42）的矩阵位于单个顶部附接板（72）上时，可以将许多IC封装（54）快速放置并从测试插座（20）中移除）与传感器（48）和加热器（或冷却器）（44）分别弹簧加载在顶部附接板（72）上。温度传感器（48）包括定位在导电壳体（134）内的传感器（130）和围绕壳体（134）的绝缘材料（138）。

3. 发明申请

WO2006096543A3 TEMPERATURE SENSING AND PREDICTION IN IC SOCKETS 审中-公开
标题翻译： IC插座温度感测和预测
公开(公告)号：WO2006096543A3
公开(公告)日：2009-04-16
申请号：PCT/US2006007687
申请日：2006-03-03
申请人： WELLS CTI LLC , LOPEZ CHRISTOPHER A , DENHEYER BRIAN J
发明人： LOPEZ CHRISTOPHER A , DENHEYER BRIAN J
IPC分类号： F25B41/04 , G01R31/01
CPC分类号： G01R31/2874 , G01K7/425 , G01R31/2891
摘要： An apparatus and method are provided which preferably combines temperature sensing and prediction for more accurate temperature control of integrated circuits. An IC temperature sensing and prediction device (20) includes a current sensing device (26) that measures current passing through an IC (24), and a temperature control apparatus (28) that measures a surface temperature of the IC (24). The device further includes an electronic controller (30) that calculates the power consumed by the IC (24) according to the measured current and adjusts the temperature of a heater or cooler (28) responsive to the measured surface temperature and power consumption.
摘要翻译：提供了一种装置和方法，其优选地组合温度感测和预测以用于集成电路的更精确的温度控制。 IC温度感测和预测装置（20）包括测量通过IC（24）的电流的电流感测装置（26）和测量IC（24）的表面温度的温度控制装置（28）。该装置还包括电子控制器（30），该电子控制器根据所测量的电流来计算由IC（24）消耗的功率，并响应于测量的表面温度和功率消耗来调节加热器或冷却器（28）的温度。

4. 发明申请

WO2005084328A3 BURN-IN TESTING APPARATUS AND METHOD 审中-公开
标题翻译：燃烧测试装置和方法
公开(公告)号：WO2005084328A3
公开(公告)日：2005-12-22
申请号：PCT/US2005006724
申请日：2005-02-28
申请人： WELLS CTI LLC , LOPEZ CHRISTOPHER A , DENHEYER BRIAN J , KUENSTER GORDON B
发明人： LOPEZ CHRISTOPHER A , DENHEYER BRIAN J , KUENSTER GORDON B
IPC分类号： G01K1/02 , G01K1/16 , G01R1/04 , G01R31/02
CPC分类号： G01R1/0458 , G01K1/16
摘要： An integrated circuit (IC) package testing apparatus (Figure 5) integrates a temperature sensor (48), heater (or cooler) (44), and controller (42) within a single modular unit (22). The controller is a microprocessor embedded within the modular unit in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket.
摘要翻译：集成电路（IC）封装测试装置（图5）在单个模块单元（22）内集成了温度传感器（48），加热器（或冷却器）（44）和控制器（42）。控制器是嵌入在与传感器和加热器通信的模块化单元内的微处理器。控制器允许用户将控制器输入选定的测试温度。每个IC封装的测试温度由控制器独立控制。该模块可轻松地从开放式插座上安装和拆卸。

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