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1. 发明申请

WO2008032397A1 電子部品試験装置审中-公开
标题翻译：电子元件测试设备
公开(公告)号：WO2008032397A1
公开(公告)日：2008-03-20
申请号：PCT/JP2006/318361
申请日：2006-09-15
申请人：株式会社アドバンテスト , 島田健一 , 山下和之
发明人：島田健一 , 山下和之
IPC分类号： G01R31/26
CPC分类号： G01R31/2893 , G01R31/2862
摘要：　電子部品試験装置は、プッシャ１２９及びソケット５０を囲む空間を密閉するケーシング１２１と、ケーシング１２１内に存在する流体を昇温又は降温可能な熱交換器１２２と、流体を循環させるファン１２３と、流体を熱交換器１２２から測定位置９００の近傍に直接誘導するダクト１２６と、を備え、さらに、ファン１２３は、ダクト１２６を経由して測定位置９００に誘導された流体を回収する。
摘要翻译：一种电子部件测试装置，其具有密封密封推动器（129）和插座（50）周围的空间的外壳（121）。用于增加或降低存在于壳体（121）中的流体的温度的热交换器（122）; 和用于使流体循环的风扇（123）用于将流体从热交换器（122）直接引导到测量位置（900）附近的管道（126）。此外，风扇123通过导管126回收引导到测量位置900的流体。

2. 发明申请

WO2005101040A1 MICRO THERMAL CHAMBER HAVING PROXIMITY CONTROL TEMPERATURE MANAGEMENT FOR DEVICES UNDER TEST 审中-公开
标题翻译：具有测试设备的近端控制温度管理的微型热室
公开(公告)号：WO2005101040A1
公开(公告)日：2005-10-27
申请号：PCT/JP2005/007491
申请日：2005-04-13
申请人： ADVANTEST CORPORATION , ROY, Shambhu, N
发明人： ROY, Shambhu, N
IPC分类号： G01R31/317
CPC分类号： G01R31/31905 , G01R31/2862 , G01R31/2877
摘要： A temperature unit to control a temperature of a device under test using a fluid includes a block disposed opposite the device under test and which defines a gap therebetween and through which the fluid passes across the device under test at a gap flow rate, and an actuator which moves the block. By adjusting the gap, the gap flow rate of the fluid flowing over the device under test changes so as to adjust the temperature of the device under test. Additionally, the block can be a heater block which generates heat receivable by the device under test across the gap such that the adjustment of the heater block by the actuator changes a thermal resistance across the gap.
摘要翻译：使用流体控制被测设备的温度的温度单元包括与被测设备相对设置的块，其限定了它们之间的间隙，并且流体通过该间隙以间隙流速穿过被测器件，并且致动器它移动块。通过调整间隙，流过被测器件的流体的间隙流量变化，以便调节被测器件的温度。此外，该块可以是加热器块，该加热器块产生受被测器件在间隙上可接收的热量，使得致动器对加热器块的调节改变跨越间隙的热阻。

3. 发明申请

WO2004055530A1 GUARDED TUB ENCLOSURE 审中-公开
标题翻译：保护套管外壳
公开(公告)号：WO2004055530A1
公开(公告)日：2004-07-01
申请号：PCT/US2003/034122
申请日：2003-10-27
申请人： CASCADE MICROTECH, INC. , DUNKLEE, John , NORGDEN, Greg , COWAN, Clarence, E.
发明人： DUNKLEE, John , NORGDEN, Greg , COWAN, Clarence, E.
IPC分类号： G01R31/02
CPC分类号： G01R31/2862 , G01R1/18 , G01R31/2865 , G01R31/2886
摘要： A probe station (110) with an improved guarding structure (130).
摘要翻译：具有改进的防护结构（130）的探测台（110）。

4. 发明申请

WO1998017086A1 METHOD AND APPARATUS FOR SEATING PRINTED CIRCUIT BOARDS WITH ELECTRICAL SOCKETS IN A CHAMBER 审中-公开
标题翻译：用于在室内用电插座打印印刷电路板的方法和装置
公开(公告)号：WO1998017086A1
公开(公告)日：1998-04-23
申请号：PCT/US1997018889
申请日：1997-10-14
申请人： RELIABILITY INCORPORATED
发明人： RELIABILITY INCORPORATED , LILLJA, Charles , HUGH, David, Roy
IPC分类号： H05K03/30
CPC分类号： G01R31/2863 , F23M7/00 , G01R31/2806 , G01R31/2808 , G01R31/2817 , G01R31/2849 , G01R31/2862 , H05K7/1415 , H05K13/0061
摘要： An apparatus and method for electrically inserting or extracting at least one burn-in board (22) to or from at least one electrical socket (108) in a chamber (14) having access opening including at least one insertion tool (120). The insertion tool (120) is capable of moving the board (22) into and away from the socket.
摘要翻译：一种用于在具有包括至少一个插入工具（120）的进入开口的腔室（14）中将至少一个老化板（22）电插入或抽出至少一个电插座（108）的装置和方法。插入工具（120）能够将板（22）移动到插座中并远离插座。

5. 发明申请

WO1990013042A1 METHOD AND DEVICE FOR ACCELERATED DETERMINING OF AGEING OF ONE OR MORE ELEMENTS WITH AN ELECTROMAGNETIC AGEING PARAMETER 审中-公开
标题翻译：用于加速测定一个或多个元件老化与电磁衰老参数的方法和装置
公开(公告)号：WO1990013042A1
公开(公告)日：1990-11-01
申请号：PCT/EP1990000291
申请日：1990-04-19
申请人： INTERUNIVERSITAIR MICRO-ELEKTRONICA CENTRUM VZW , LIMBURGS UNIVERSITAIR CENTRUM , STALS, Lambert, Mathias, Maria , DE SCHEPPER, Luc, Irena , DE CEUNINCK, Ward, Aimé, Stefan , ROGGEN, Jean, Joseph, Marie
发明人： INTERUNIVERSITAIR MICRO-ELEKTRONICA CENTRUM VZW , LIMBURGS UNIVERSITAIR CENTRUM
IPC分类号： G01R31/26
CPC分类号： G01R31/2862 , G01R31/2642 , G01R31/2874 , G01R31/2881
摘要： A method for determining the impedance change of an electromagnetic ageing parameter on one or more elements having such a parameter, wherein the element is placed in an oven at a predetermined temperature and wherein a measurement of the resistance at this temperature is performed.

6. 发明申请

WO2018208586A1 WAFER LEVEL BURN-IN SYSTEM 审中-公开
公开(公告)号：WO2018208586A1
公开(公告)日：2018-11-15
申请号：PCT/US2018/031020
申请日：2018-05-04
申请人： DELTA V INSTRUMENTS, INC.
发明人： STOREY, Robert, W. , CALDWELL, William, Robert , WILSON, Clint, D. , PRINCE, Glenn, Lee , COLLINS, Stephen, Kyle , WALKER, Michael, S. , CAGE, Kerry, F.
IPC分类号： G01R31/26 , G01R31/28 , H01L21/66 , H01L21/68 , H01L21/687
CPC分类号： G01R31/2642 , G01R31/2862 , G01R31/2875 , H01L22/14
摘要： A system for simultaneously burning in, testing and curing all the die on an uncut semiconductor wafer; for establishing electrical connectivity in one-to-one correspondence between each die and a specific current amplifier, for monitoring, displaying, evaluating and recording test parameters in relation to preset parametric limits during a requisite test period; and for shutting down any individual die that exceeds the preset parametric limits. Methods of use and subsystems for raising and lowering a semiconductor wafer in relation to a pin chuck and for controlling wafer temperature by circulating a liquid heat exchange medium through platen assemblies disposed above and below the wafer are also disclosed.

7. 发明申请

WO2014106152A1 SYSTEMS AND METHODS FOR HANDLING SUBSTRATES AT BELOW DEW POINT TEMPERATURES 审中-公开
标题翻译：用于在下面的点温度处理基板的系统和方法
公开(公告)号：WO2014106152A1
公开(公告)日：2014-07-03
申请号：PCT/US2013/078218
申请日：2013-12-30
申请人： CASCADE MICROTECH, INC.
发明人： HIRSCHFELD, Botho , BECKER, Axel
IPC分类号： G01K13/12
CPC分类号： G01N25/66 , G01R31/00 , G01R31/2862
摘要： Disclosed systems and methods for testing a device under test (DUT) with a probe system are selected to test a DUT at a temperature below the dew point of the ambient environment surrounding the probe system. Probe systems include a measurement chamber configured to isolate a cool, dry testing environment and a measurement chamber door configured to selectively isolate the internal volume of the measurement chamber. When a DUT, that is or is included on a substrate, is tested at a low temperature, systems and methods are selected to heat the substrate in a dry environment, at least partially isolated from the measurement chamber, to at least a temperature above the dew point and/or the frost point of the ambient environment.
摘要翻译：选择用于使用探针系统测试被测设备（DUT）的公开的系统和方法，以在低于探针系统周围环境环境露点的温度下测试DUT。探测系统包括被配置为隔离冷却干燥测试环境的测量室和被配置为选择性地隔离测量室的内部体积的测量室门。当在低温下测试被包括在基底上的DUT时，选择系统和方法以将至少部分与测量室隔离的干燥环境中的衬底加热至至少高于露点和/或周围环境的霜点。

8. 发明申请

WO2010129688A1 SEPARATE TEST ELECTRONICS AND BLOWER MODULES IN AN APPARATUS FOR TESTING AN INTEGRATED CIRCUIT 审中-公开
标题翻译：用于测试集成电路的设备中的单独测试电子和喷射模块
公开(公告)号：WO2010129688A1
公开(公告)日：2010-11-11
申请号：PCT/US2010/033748
申请日：2010-05-05
申请人： HENDRICKSON, David S. , JOVANOVIC, Jovan , RICHMOND, II, Donald P. , BARRACLOUGH, William D. , AEHR TEST SYSTEMS
发明人： HENDRICKSON, David S. , JOVANOVIC, Jovan , RICHMOND, II, Donald P. , BARRACLOUGH, William D.
IPC分类号： G01R31/02
CPC分类号： G01R31/2862 , G01R31/2875
摘要： The invention relates to an apparatus for testing an integrated circuit of an electronic device.
摘要翻译：本发明涉及一种用于测试电子设备的集成电路的装置。

9. 发明申请

WO2008032179A1 HOT TESTING OF SEMICONDUCTOR DEVICES 审中-公开
标题翻译：半导体器件的热测试
公开(公告)号：WO2008032179A1
公开(公告)日：2008-03-20
申请号：PCT/IB2007/002607
申请日：2007-09-11
申请人： XPEQT NV , ESCH VAN, Eddy
发明人： ESCH VAN, Eddy
IPC分类号： G01R31/28
CPC分类号： G01R31/2868 , G01R31/2862
摘要： A testing apparatus for testing of integrated circuit devices at elevated temperatures comprises hot belt 111 is operable to transport integrated circuits from a main production line into a hot chamber 121 and thence onto a test area 122 within the hot chamber 121 and a cold belt 112 operable to receive integrated circuits from the test area 122 and transport them back to the main production line. Both the hot and cold belts 111, 112 are indexed stepwise, the indexing distance being equal to the separation of the pockets provided for receiving integrated circuits. In the test area 122 are four vacuum chucks 131a-131d each operable to pick an integrated circuit from adjacent pockets on the hot belt 111 and place it on corresponding test heads 133a-133d (via a corresponding repositioning means 132a-132d ) for diagnostic testing at an elevated temperature. After testing, the vacuum chucks 131a-131d are operable to pick the integrated circuits from the corresponding test heads 133 a- 133d and place them in adjacent pockets on the cold belt 112.
摘要翻译：用于在升高的温度下测试集成电路器件的测试装置包括热带111可操作以将集成电路从主生产线输送到热室121中，然后到达热室121内的测试区域122和可操作的冷带112 从测试区域122接收集成电路并将其传送回主生产线。热带和冷带111,112均逐级地分度，分度距离等于为接收集成电路提供的口袋的分离。在测试区域122中有四个真空卡盘131a-131d，每个真空卡盘131a-131d可操作以从热带111上的相邻袋拾取集成电路，并将其放置在相应的测试头133a-133d上（经由相应的重新定位装置132a-132d）进行诊断测试在高温下。在测试之后，真空卡盘131a-131d可操作以从相应的测试头133a-133d拾取集成电路，并将它们放置在冷带112上的相邻凹穴中。

10. 发明申请

WO2004083747A2 THERMAL STRATIFICATION TEST APPARATUS AND METHOD PROVIDING CYCLICAL AND STEADY-STATE STRATIFIED ENVIRONMENTS 审中-公开
标题翻译：热分析测试装置和提供循环和稳态分析环境的方法
公开(公告)号：WO2004083747A2
公开(公告)日：2004-09-30
申请号：PCT/US2004006049
申请日：2004-02-26
申请人： INTEL CORP
发明人： FENK C WALTER
IPC分类号： G01R31/28 , F25D
CPC分类号： G01R31/2862 , G01R31/2817 , G01R31/2874
摘要： A method and apparatus for a thermal stratification test providing cyclical and steady-state stratified environments. In order to test an electronic device, for example one having one or more levels of ball-grid-array interconnections, e.g., connecting a chip to a flip-chip substrate and connecting the flip-chip substrate to a printed circuit board of a device, an apparatus and method are provided to heat one side of the device while cooling the second side. In some embodiments, the process is then reversed to cool the first side and heat the second. Some embodiments repeat the cycle of heat-cool-heat-cool several times, and then perform functional tests of the electronic circuitry. In some embodiments, the functional tests are performed in one or more thermal-stratification configurations after cycling at more extreme thermal stratification setups. In some embodiments, a test that emphasizes solder creep is employed.
摘要翻译：提供循环和稳态分层环境的热分层测试的方法和装置。为了测试电子设备，例如具有一个或多个级别的球栅阵列互连的电子设备，例如将芯片连接到倒装芯片衬底并将倒装芯片衬底连接到器件的印刷电路板提供了一种在冷却第二侧的同时加热设备的一侧的装置和方法。在一些实施例中，然后反转该过程以冷却第一侧并加热第二侧。一些实施例重复热 - 冷却 - 冷却多次循环，然后执行电子电路的功能测试。在一些实施例中，在更极端的热分层设置循环之后，功能测试在一个或多个热分层结构中进行。在一些实施例中，采用强调焊料蠕变的测试。

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