专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07883837B2 Transparent electrically conductive film and process for producing the same 有权
标题翻译：透明导电膜及其制造方法
公开(公告)号：US07883837B2
公开(公告)日：2011-02-08
申请号：US11918700
申请日：2006-04-18
申请人： Kohei Yamada , Hidekazu Shiomi , Hideyuki Yamada
发明人： Kohei Yamada , Hidekazu Shiomi , Hideyuki Yamada
IPC分类号： G03F1/00 , H01L21/00
CPC分类号： H05K9/0096 , B32B27/00 , H05K3/185 , H05K2203/0565 , H05K2203/1415
摘要： This invention provides a transparent electrically conductive film, which, while maintaining the light transparency of a transparent film, has excellent electrical conductivity, can be utilized for electromagnetic wave shielding, and does not cause inclusion of air bubbles in the lamination onto other base material, and a process for producing the same. The production process comprises the steps of forming a large number of concaves and convexes having an average height of not more than 0.1 μm on both sides or one side of a transparent film, forming a resist layer having a pattern shape opposite to the electrically conductive part in the electrically conductive film on the transparent film on its concave-convex side, applying a catalyst for plating onto the resist layer-formed face, separating the resist layer, forming a metal layer by plating, and blackening the metal layer, the metal layer satisfying 1≦W/T≦500 wherein W represents the width of the metal layer and T represents the height of the metal layer.
摘要翻译：本发明提供了一种透明导电膜，其在保持透明膜的透光性的同时具有优异的导电性，可用于电磁波屏蔽，并且不会在叠层到其它基材上引起气泡，及其制造方法。制造方法包括在透明膜的两面或一侧形成平均高度不大于0.1μm的大量凹凸的步骤，形成具有与导电部分相对的图案形状的抗蚀剂层在透明膜的凹凸侧的导电膜中，在抗蚀剂层形成面上涂布电镀用催化剂，分离抗蚀剂层，通过电镀形成金属层，使金属层变黑，金属层满足1＆nlE; W / T＆nlE; 500其中W表示金属层的宽度，T表示金属层的高度。

2. 发明申请

US20090042150A1 Transparent electrically conductive film and process for producing the same 有权
标题翻译：透明导电膜及其制造方法
公开(公告)号：US20090042150A1
公开(公告)日：2009-02-12
申请号：US11918700
申请日：2006-04-18
申请人： Kohei Yamada , Hidekazu Shiomi , Hideyuki Yamada
发明人： Kohei Yamada , Hidekazu Shiomi , Hideyuki Yamada
IPC分类号： G03C1/74 , G03C1/00
CPC分类号： H05K9/0096 , B32B27/00 , H05K3/185 , H05K2203/0565 , H05K2203/1415
摘要： This invention provides a transparent electrically conductive film, which, while maintaining the light transparency of a transparent film, has excellent electrical conductivity, can be utilized for electromagnetic wave shielding, and does not cause inclusion of air bubbles in the lamination onto other base material, and a process for producing the same. The production process comprises the steps of forming a large number of concaves and convexes having an average height of not more than 0.1 μm on both sides or one side of a transparent film, forming a resist layer having a pattern shape opposite to the electrically conductive part in the electrically conductive film on the transparent film on its concave-convex side, applying a catalyst for plating onto the resist layer-formed face, separating the resist layer, forming a metal layer by plating, and blackening the metal layer, the metal layer satisfying 1≦W/T≦500 wherein W represents the width of the metal layer and T represents the height of the metal layer.
摘要翻译：本发明提供了一种透明导电膜，其在保持透明膜的透光性的同时具有优异的导电性，可用于电磁波屏蔽，并且不会在叠层到其它基材上引起气泡，及其制造方法。制造方法包括以下步骤：在透明膜的两侧或一侧形成平均高度不大于0.1μm的大量凹凸，形成具有与导电部分相对的图案形状的抗蚀剂层在透明膜的凹凸侧的导电膜中，在抗蚀剂层形成面上涂布电镀用催化剂，分离抗蚀剂层，通过电镀形成金属层，使金属层变黑，金属层满足1 <= W / T <= 500其中W表示金属层的宽度，T表示金属层的高度。

3. 发明授权

US07291380B2 Laser enhanced plating for forming wiring patterns 有权
标题翻译：激光增强电镀形成布线图案
公开(公告)号：US07291380B2
公开(公告)日：2007-11-06
申请号：US10888450
申请日：2004-07-09
申请人： Peter S. Nyholm , Curt Lee Nelson , Niranjan Thirukkovalur , Paul McClelland
发明人： Peter S. Nyholm , Curt Lee Nelson , Niranjan Thirukkovalur , Paul McClelland
IPC分类号： B32B3/00 , H05K1/02 , B05D1/36
CPC分类号： C23C18/22 , C23C18/1605 , C23C18/1608 , C23C18/1612 , C23C18/204 , C23C18/208 , C23C18/285 , C23C18/30 , C25D5/022 , C25D5/34 , C25D5/54 , H05K3/0032 , H05K3/184 , H05K3/185 , H05K3/381 , H05K2203/0577 , H05K2203/1173 , H05K2203/1415 , Y10S428/901 , Y10T428/12451 , Y10T428/12535 , Y10T428/24917 , Y10T428/2804
摘要： A method of plating a substrate including coating a substrate surface, laser-treating a region of the coated surface, and plating the region.
摘要翻译：一种电镀基板的方法，包括涂覆基板表面，激光处理涂覆表面的区域，以及电镀该区域。

4. 发明授权

US5309632A Process for producing printed wiring board 失效
标题翻译：印刷线路板生产工艺
公开(公告)号：US5309632A
公开(公告)日：1994-05-10
申请号：US970925
申请日：1992-11-02
申请人： Hiroshi Takahashi , Shin Takanezawa , Masao Kanno , Yorio Iwasaki , Toshirou Okamura , Akishi Nakaso , Kiyoshi Hasegawa
发明人： Hiroshi Takahashi , Shin Takanezawa , Masao Kanno , Yorio Iwasaki , Toshirou Okamura , Akishi Nakaso , Kiyoshi Hasegawa
IPC分类号： H05K1/03 , H05K3/18 , H05K3/38 , H05K3/42 , H01K3/10
CPC分类号： H05K3/181 , H05K3/184 , H05K3/426 , H05K1/0373 , H05K2201/0236 , H05K2201/0344 , H05K2203/0709 , H05K2203/1407 , H05K2203/1415 , H05K3/387 , Y10T29/49155 , Y10T29/49165
摘要： A process for producing a printed wiring board characterized by forming a nickel layer by electroless plating and a copper layer formed thereon by electroless plating, or forming a copper undercoating layer before the nickel layer by electroless plating can produce printed circuit boards excellent in resistance to electrolytic corrosion and suitable for mounting parts in high density.
摘要翻译：一种印刷电路板的制造方法，其特征在于，通过无电解电镀形成镍层，通过无电镀形成在其上的铜层，或者通过化学镀在镍层之前形成铜底涂层，可以制造出耐电解质优异的印刷电路板腐蚀，适合高密度安装。

5. 发明授权

US4572764A Preparation of photoformed plastic multistrate by via formation first 失效
标题翻译：首先通过通孔形成制备光致变形塑料多药
公开(公告)号：US4572764A
公开(公告)日：1986-02-25
申请号：US681189
申请日：1984-12-13
申请人： Roxy N. Fan
发明人： Roxy N. Fan
IPC分类号： H05K3/00 , H05K3/10 , H05K3/18 , H05K3/24 , H05K3/46 , B44C1/22 , B05D5/12 , G03C5/00
CPC分类号： H05K3/0023 , H05K3/184 , H05K3/4661 , H05K2201/0347 , H05K2201/0376 , H05K2201/09509 , H05K2203/0525 , H05K2203/072 , H05K2203/1415 , H05K3/102 , H05K3/246 , Y10T29/49155 , Y10T29/49165 , Y10T29/49204
摘要： Process for preparing multilayer printed circuits comprising laminating to a substrate bearing a circuit pattern or electrically conductive surface a photosensitive layer which is tacky or becomes tacky upon exposure; exposing the laminate to actinic radiation through a via image related to the underlying circuit pattern, if present; optionally removing the removable via image of the photosensitive layer in either the exposed or unexposed areas, e.g., with a solvent or peeling apart by removal of a cover sheet, if present; laminating to the remaining tacky photosensitive layer a layer of a second photosensitive composition; exposing the laminate to actinic radiation through a registered image pattern of at least one overlying segment of the via image area and conductive circuit pattern to form an image surface having nontacky areas and removable circuit image areas; removing the removable circuit image areas of the photosensitive layer in the exposed or unexposed areas with a solvent therefor, or peeling apart by means of a cover sheet, if present, the removable via image areas of the lower photosensitive, if present, are removed by a solvent therefor; embedding finely divided material, e.g., copper, into the tacky areas; optionally curing the laminate by means of actinic radiation and/or heat; plating electrolessly to form an interconnected electrically conductive circuit. Additional circuit layers can be added.
摘要翻译：制备多层印刷电路的方法包括层压到承载电路图形或导电表面的基底上，所述光敏层在曝光时发粘或变粘，通过与底层电路图案相关的通孔图像将层压体暴露于光化辐射（如果存在）任选地在暴露或未曝光的区域（例如用溶剂）中去除感光层的可移除通孔图像，或者通过去除覆盖片（如果存在）剥离; 将第二感光组合物的层层压到剩余的粘性感光层上; 通过所述通孔图像区域和导电电路图案的至少一个覆盖段的注册图像图案将所述层压体暴露于光化辐射，以形成具有非粘性区域和可移除电路图像区域的图像表面; 通过其溶剂去除曝光或未曝光区域中的感光层的可移除电路图像区域，或者通过覆盖片剥离（如果存在），可以通过下部光敏剂的可移除通孔图像区域（如果存在的话）被其溶剂; 将细碎的材料例如铜嵌入粘性区域中; 任选地通过光化辐射和/或加热固化层压体; 电化学镀以形成互连的导电电路。可以添加额外的电路层。

6. 发明授权

US3672925A Method of preparing a substrate for depositing a metal on selected portions thereof 失效
标题翻译：制备用于在其选定部分上沉积金属的基板的方法
公开(公告)号：US3672925A
公开(公告)日：1972-06-27
申请号：US3672925D
申请日：1970-10-02
申请人： RCA CORP
发明人： FELDSTEIN NATHAN
IPC分类号： C23C18/16 , G03F7/00 , H05K3/18 , B44D1/52 , B44D1/18
CPC分类号： H05K3/184 , C23C18/1605 , G03F7/00 , H05K2203/0713 , H05K2203/1415 , Y10T428/24917
摘要： STRATE AND MASKING FILM ARE NEXT TREATED WITH A CATALYTIC ACTIVATING SOLUTION, AND A THIN LAYER OF THE CATALYST IS DEPOSITED ONLY ON THE SENSITIZED SELECTED PORTIONS OF THE SUBSTRATE SURFACE.

A METHOD OF PREPARING A SUBSTRATE FOR THE DEPOSITION OF A METAL ON SELECTED PORTIONS OF THE SUBSTRATE SURFACE BY ELECTROLESS PLATING, IN THE PRESENCE OF A CATALYST COMPRISES FIRST COVERING THE UNSELECTED PORTIONS OF THE SUBSTRATE SURFACE WITH A MASKING FILM THAT INCLUDES AN OXIDIZING AGENT. THE SUBSTRATE, INCLUDING THE MASKING FILM, IS THEN TREATED WITH A SENSITIZING SOLUTION AND HEATED TO CAUSE THE OXIDIZING AGENT TO OXIDIZE, AND DESENSITIZE, THE SENSITIZING SOLUTION THAT IS ADSORBED ON THE MASKING FILM, RENDERING THE MASKING FILM INCAPABLE OF ACCEPTING A CATALYST. THE SUB-

7. 发明授权

US08051560B2 Method of fabricating a solder pad structure 有权
标题翻译：制造焊盘结构的方法
公开(公告)号：US08051560B2
公开(公告)日：2011-11-08
申请号：US12580256
申请日：2009-10-16
申请人： Tzyy-Jang Tseng , Shu-Sheng Chiang
发明人： Tzyy-Jang Tseng , Shu-Sheng Chiang
IPC分类号： H01K3/10
CPC分类号： H05K3/422 , B32B7/06 , B32B27/06 , B32B27/36 , B32B2255/00 , B32B2255/10 , B32B2255/205 , B32B2255/28 , B32B2264/105 , B32B2307/204 , B32B2307/40 , B32B2307/748 , B32B2457/08 , H05K3/0035 , H05K3/185 , H05K3/285 , H05K3/4007 , H05K3/421 , H05K2201/0236 , H05K2201/0367 , H05K2203/0191 , H05K2203/0565 , H05K2203/1415 , Y10T29/49124 , Y10T29/49144 , Y10T29/49149 , Y10T29/49165 , Y10T428/24917
摘要： A method for fabricating a solder pad structure. A circuit board having thereon at least one copper pad is provided. A solder resist is formed on the circuit board and covers the copper pad. A solder resist opening, which exposes a portion of the copper pad, is formed in the solder resist by laser. The laser also creates a laser activated layer on sidewalls of the solder resist opening. A chemical copper layer is then grown from the exposed copper pad and concurrently from the laser activated layer.
摘要翻译：一种制造焊盘结构的方法。其上设置有至少一个铜焊盘的电路板。在电路板上形成阻焊剂并覆盖铜焊盘。通过激光在阻焊剂中形成露出铜焊盘的一部分的阻焊剂开口。激光器还在阻焊剂开口的侧壁上产生激光激活层。然后从暴露的铜垫生长化学铜层，同时从激光活化层生长化学铜层。

8. 发明授权

US5373629A Through-hole plate printed circuit board with resist and process for manufacturing same 失效
标题翻译：通孔板印刷电路板与抗蚀剂及其制造方法相同
公开(公告)号：US5373629A
公开(公告)日：1994-12-20
申请号：US836261
申请日：1992-02-28
申请人： Jurgen Hupe , Walter Kronenberg
发明人： Jurgen Hupe , Walter Kronenberg
IPC分类号： C08G61/10 , C08G61/12 , C25D5/56 , C25D7/00 , H05K3/10 , H05K3/40 , H05K3/42 , H05K3/46 , H01K3/10 , B32B3/10
CPC分类号： H05K3/424 , C08G61/123 , H05K3/4038 , H05K2201/0329 , H05K2203/0796 , H05K2203/107 , H05K2203/122 , H05K2203/1415 , H05K3/108 , H05K3/427 , Y10T29/49144 , Y10T29/49165 , Y10T428/24322 , Y10T428/24802 , Y10T428/24917 , Y10T428/31
摘要： A process is described for manufacturing through-hole plated single-layer or multi-layer printed circuit boards based on a polymeric substrate material or on a ceramic material provided optionally on both sides with at least one photoresist layer temporarily exposing the electroconductive circuit pattern by electroplating or electroless plating with a metal layer also on those surfaces which have not been coated with a conductive metal layer, characterized in thata) the surfaces of the substrate, after hole-drilling and a subsequent mechanical surface-treatment, are laminated with a suitable photoresist, exposed to light and developed so that the circuit pattern image is exposed,b) the surfaces of the substrate are pre-treated in a solution having oxidizing activity,c) after removal of the residual solution by rinsing, the substrate is introduced into a solution which contains at least one heterocyclic monomer, and more specifically pyrrole, thiophene, furane or derivative(s) thereof, which in a polymeric form is electrically conductive,d) the substrate is then transferred into an acidic solution whereby an electrically conductive polymeric layer is formed,whereupon, if desired or required, any residual solution is removed by rinsing, and the through-holes and the circuit pattern image are metallized in one step by galvanic or, preferably, electroless metallization.
摘要翻译： PCT No.PCT / EP90 / 01326 Sec。一九九二年二月二十八日 102（e）日期1992年2月28日PCT 1990年8月11日PCT PCT。公开号WO91 / 03920 日本1991年3月21日。描述了一种用于制造基于聚合物基材的通孔电镀单层或多层印刷电路板的工艺，或者在任选地在两侧设置有至少一个光致抗蚀剂层的陶瓷材料在没有涂覆有导电金属层的那些表面上也用金属层进行电镀或无电镀来暴露导电电路图案，其特征在于：a）所述基板的表面，在钻孔后和随后的机械表面 - 处理，与合适的光致抗蚀剂层合，暴露于光并显影，使得电路图案图像被曝光，b）基板的表面在具有氧化活性的溶液中预处理，c）在通过将底物引入含有至少一种杂环单体的溶液中，更具体地说是吡咯，噻吩，呋喃或d 以聚合形式导电，d）然后将基底转移到酸性溶液中，由此形成导电聚合物层，然后如果需要或需要，通过冲洗除去任何残留的溶液，并且通过电流或优选地，无电金属化在一个步骤中对通孔和电路图案图像进行金属化。

9. 发明授权

US5158860A Selective metallization process 失效
标题翻译：选择性金属化过程
公开(公告)号：US5158860A
公开(公告)日：1992-10-27
申请号：US607711
申请日：1990-11-01
申请人： Michael Gulla , Prasit Sricharoenchaikit
发明人： Michael Gulla , Prasit Sricharoenchaikit
IPC分类号： H05K3/02 , C23C18/16 , G03F7/20 , H05K3/18
CPC分类号： G03F7/2022 , C23C18/1608 , C23C18/1612 , C23C18/204 , C23C18/285 , C23C18/30 , C23C18/32 , C23C18/38 , H05K3/184 , H05K2203/0505 , H05K2203/0706 , H05K2203/1415
摘要： A process for selective metallization comprising the steps of providing a substrate coated with a photoresist, imaging the photoresist coating by exposure to pattern radiation and development, flood exposing the photoresist coating to activating radiation, depositing an electroless plating catalyst over the entire imaged photoresist coating and bared underlying substrate, removing the top surface of the flood exposed, catalyzed photoresist coating by development whereby plating catalyst remains in a desired selective pattern and depositing metal over the catalyzed surface to form a metal deposit in a selective pattern such as in a circuit pattern. The process is suitable for the manufacture of diverse articles including printed circuit boards.

10. 发明授权

US4847114A Preparation of printed circuit boards by selective metallization 失效
标题翻译：通过选择性金属化制备印刷电路板
公开(公告)号：US4847114A
公开(公告)日：1989-07-11
申请号：US200861
申请日：1988-06-01
申请人： William R. Brasch , Carlo Favini
发明人： William R. Brasch , Carlo Favini
IPC分类号： H05K3/18 , H05K3/38 , H05K3/42
CPC分类号： H05K3/184 , H05K2203/0716 , H05K2203/122 , H05K2203/1415 , H05K3/381 , H05K3/427
摘要： The method for the manufacture of printed circuit boards which have been imaged by means of a polymeric resist which comprises selectively catalyzing those areas not covered by the image by treating the imaged circuit board with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge on the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause adsorption of the catalysts thereon.
摘要翻译：用于制造已经通过聚合物抗蚀剂成像的印刷电路板的方法，其包括通过用具有高于非磁性材料上的电荷的电荷的催化剂处理成像电路板来选择性催化那些未被图像覆盖的区域，并且足够低于抗蚀剂图像上的电荷以使催化剂从其上排斥，但足够接近非成像区域上的电荷以引起其上的催化剂的吸附。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式