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1. 发明申请

US20190062922A1 DEPOSITING A STRUCTURALLY HARD, WEAR RESISTANT METAL COATING ONTO A SUBSTRATE 审中-公开
公开(公告)号：US20190062922A1
公开(公告)日：2019-02-28
申请号：US15688337
申请日：2017-08-28
申请人： The Boeing Company
发明人： Antonio Paesano
IPC分类号： C23C18/20 , C23C18/16 , C23C18/22 , C23C18/32 , C25D3/12 , C25D5/54
CPC分类号： C23C18/2073 , C23C18/1641 , C23C18/165 , C23C18/1653 , C23C18/208 , C23C18/22 , C23C18/285 , C23C18/30 , C23C18/32 , C25D3/12 , C25D5/54
摘要： An example method of coating a substrate involves cleaning the substrate and, after cleaning the substrate, sensitizing the substrate using a sensitizing solution including tin chloride and hydrochloric acid. The method also involves, after sensitizing the substrate, activating the substrate in an activating solution including palladium chloride and hydrochloric acid. Further, the method involves subsequently neutralizing the substrate using a neutralizing solution including ammonium hydroxide. Still further, the method involves, after neutralizing the substrate, depositing an electroless nickel layer on the substrate. The method may then involve depositing an electrolytic nickel layer on top of the electroless nickel layer, and depositing an outer layer of metallic material, ceramic material, polymeric material, or any combination thereof on top of the electrolytic nickel layer.

2. 发明授权

US09919493B2 Electromagnetic wave penetrative metal film, manufacturing method of electromagnetic wave penetrative metal film, and radome for vehicle-mounted radar devices 有权
公开(公告)号：US09919493B2
公开(公告)日：2018-03-20
申请号：US14355888
申请日：2012-11-02
申请人： Sankei Giken Kogyo Co., Ltd.
发明人： Shuji Yamamoto
IPC分类号： B32B15/00 , B32B15/04 , C23C18/20 , C23C18/28 , C23C18/30 , C23C18/44 , G01S7/03 , H01Q1/42 , C23C18/16 , C23C18/48 , C23C18/31 , C23C18/42 , B32B15/08 , B32B3/10 , G01S13/93
CPC分类号： B32B15/04 , B32B3/10 , B32B15/08 , C23C18/1646 , C23C18/165 , C23C18/1689 , C23C18/2086 , C23C18/285 , C23C18/30 , C23C18/31 , C23C18/42 , C23C18/44 , C23C18/48 , G01S7/032 , G01S13/931 , G01S2013/9378 , H01Q1/42 , Y10T428/24917 , Y10T428/25 , Y10T428/256
摘要： An object of the present invention is to provide an electromagnetic wave penetrative metal film having high mass productivity and an extremely low attenuation rate in the electromagnetic wave penetrated through, a manufacturing method of the electromagnetic wave penetrative metal film, and a radome for a vehicle-mounted radar devices using the electromagnetic wave penetrative metal file. To achieve the object, the present invention provides an electromagnetic wave penetrative metal film composed of more than 10000 of fine metal film pieces per unit area (1 mm2) provided on a surface of a substrate through an electroless plating step, wherein fine metal film pieces adjacent to each other are electrically isolated, a manufacturing method of the electromagnetic wave penetrative metal film, and a radome for a vehicle-mounted radar devices using the electromagnetic wave penetrative metal film.

3. 发明申请

US20170358384A1 SILVER-COATED RESIN PARTICLES, METHOD FOR MANUFACTURING SAME, AND ELECTROCONDUCTIVE PASTE USING SAME 审中-公开
公开(公告)号：US20170358384A1
公开(公告)日：2017-12-14
申请号：US15542246
申请日：2016-01-06
申请人： MITSUBISHI MATERIALS ELECTRONIC CHEMICALS CO., LTD.
发明人： Kensuke KAGEYAMA , Hirokazu TSUKADA
IPC分类号： H01B5/14 , H01B1/22 , H01B13/00 , C23C18/42
CPC分类号： H01B5/14 , C23C18/1658 , C23C18/20 , C23C18/285 , C23C18/42 , H01B1/22 , H01B13/0036
摘要： A silver-coated resin particle including a heat-resistant resin core particle and a silver coating layer formed on the surface of the resin core particle. The average grain diameter of the resin core particle is 0.1 to 10 μm, the amount of silver contained in the silver coating layer is 60 to 90 parts by mass, relative to 100 parts by mass of the silver-coated resin particle, and the exothermic peak temperature of the silver-coated resin particle by differential thermal analysis is 265° C. or higher.

4. 发明申请

US20170330861A1 NOVEL METHOD FOR ELECTROMAGNETIC SHIELDING AND THERMAL MANAGEMENT OF ACTIVE COMPONENTS 审中-公开
公开(公告)号：US20170330861A1
公开(公告)日：2017-11-16
申请号：US15536185
申请日：2015-12-22
申请人： Atotech Deutschland GmbH
发明人： Kenichiroh MUKAI , Kwonil KIM , Lee GAHERTY , Lutz BRANDT , Tafadzwa MAGAYA
IPC分类号： H01L25/065 , H01L25/00
CPC分类号： H01L23/552 , C23C18/1605 , C23C18/1641 , C23C18/1651 , C23C18/1653 , C23C18/1698 , C23C18/285 , C23C18/30 , C23C18/36 , C23C18/405 , C23C18/42 , C23C18/50 , C23C18/54 , H01L21/02076 , H01L21/02211 , H01L21/02282 , H01L21/02301 , H01L21/4871 , H01L23/295 , H01L23/3121 , H01L23/3128 , H01L23/3135 , H01L23/3142 , H01L23/3735 , H01L23/3736 , H01L2924/15311
摘要： The present invention concerns a method for forming a metal layer for electromagnetic shielding and thermal management of active components, preferably by wet chemical metal plating, using an adhesion promotion layer on the layer of molding compound and forming at least one metal layer on the adhesion promotion layer or forming at least one metal layer on the adhesion promotion layer by wet chemical metal plating processes.

5. 发明授权

US09797043B1 Shielding coating for selective metallization 有权
公开(公告)号：US09797043B1
公开(公告)日：2017-10-24
申请号：US15263640
申请日：2016-09-13
申请人： Rohm and Haas Electronic Materials LLC
发明人： Hung Tat Chan , Ka Ming Yip , Chit Yiu Chan , Kwok Wai Yee
IPC分类号： H01B13/00 , C23C18/16 , C23C18/38 , C23C18/18
CPC分类号： C23C18/38 , C23C18/1605 , C23C18/1641 , C23C18/2006 , C23C18/2013 , C23C18/204 , C23C18/22 , C23C18/285 , C23C18/30 , C23C18/40
摘要： Shielding coatings are applied to polymer substrates for selective metallization of the substrates. The shielding coatings include a primer component and a hydrophobic top coat. The primer is first applied to the polymer substrate followed by application of the top coat component. The shielding coating is then selectively etched to form an outline of a desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating in the etched portions. The portions of the polymer substrate which contain the shielding coating inhibit electroless metal plating. The primers contain aromatic heterocyclic compounds and the top coat contains hydrophobic alky organic compounds.

6. 发明授权

US09657226B2 Composition for etching treatment of resin material 有权
公开(公告)号：US09657226B2
公开(公告)日：2017-05-23
申请号：US14655555
申请日：2014-10-16
申请人： OKUNO CHEMICAL INDUSTRIES CO., LTD.
发明人： Shingo Nagamine , Koji Kita , Kuniaki Otsuka
IPC分类号： C09K13/00 , C09K13/04 , C03C15/00 , C03C25/68 , C23C18/16 , C23F3/02 , C23F1/14 , C23C18/24 , C25B1/28 , C08J7/14 , C23C18/20 , H01L21/306 , H01L21/02 , C23C18/30 , C25D5/14 , C23C18/28 , C23C18/32 , C23C18/38
CPC分类号： C09K13/00 , C08J7/14 , C09K13/04 , C23C18/1641 , C23C18/1653 , C23C18/2086 , C23C18/24 , C23C18/285 , C23C18/30 , C23C18/32 , C23C18/38 , C23F1/14 , C23F3/02 , C25B1/28 , C25D5/14 , H01L21/02052 , H01L21/30604
摘要： The present invention provides a composition for etching treatment of a resin material, the composition comprising an aqueous solution having a permanganate ion concentration of 0.2 mmol/L or more and a total acid concentration of 10 mol/L or more, and the aqueous solution satisfying at least one of the following conditions (1) to (3): (1) containing an organic sulfonic acid in an amount of 1.5 mol/L or more, (2) setting the divalent manganese ion molar concentration to 15 or more times higher than the permanganate ion molar concentration, and (3) setting the addition amount of an anhydrous magnesium salt to 0.1 to 1 mol/L. The composition for etching treatment of the present invention is a composition containing no hexavalent chromium and having excellent etching performance and good bath stability.

7. 发明申请

US20170096113A1 BLACK PLATED RESIN PART AND METHOD FOR MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20170096113A1
公开(公告)日：2017-04-06
申请号：US15262513
申请日：2016-09-12
申请人： TOYODA GOSEI CO., LTD.
发明人： Yuji HOTTA , Koji NAKATANI
IPC分类号： B60R13/02 , C23C18/38 , C23C18/16 , C25D3/12 , C25D3/08 , C25D5/48 , C25D5/14 , C23C18/32 , C25D3/06
CPC分类号： B60R13/02 , B32B15/08 , C23C18/1633 , C23C18/1653 , C23C18/2086 , C23C18/285 , C23C18/30 , C23C18/32 , C23C18/38 , C23C30/00 , C25D3/06 , C25D3/08 , C25D3/12 , C25D5/14 , C25D5/48 , C25D11/36 , Y10T428/12556 , Y10T428/12569 , Y10T428/12611 , Y10T428/12618 , Y10T428/1266 , Y10T428/12667 , Y10T428/12826 , Y10T428/12847 , Y10T428/12854 , Y10T428/12882 , Y10T428/12903 , Y10T428/1291 , Y10T428/12944 , Y10T428/264 , Y10T428/265 , Y10T428/31678 , Y10T428/31681
摘要： A black plated resin part includes a resin base material, an underlying plating layer including a copper plating layer and a nickel plating layer formed in this order on the resin base material, a black chromium plating layer formed on the nickel plating layer, formed of trivalent chromium, and having a film thickness of not less than 015 μm, and a corrosion resistant film formed on the black chromium plating layer, formed of chromic phosphate or molybdenum phosphate, and having a film thickness of not less than 7 nm. A brightness of the black chromium plating layer seen through the corrosion resistant film is expressed by an L* value of not more than 54 based on the L*a*b* color system.

8. 发明授权

US09593423B2 Process for forming metal film, and product equipped with metal film 有权
标题翻译：金属膜成型工艺及配有金属膜的产品
公开(公告)号：US09593423B2
公开(公告)日：2017-03-14
申请号：US14218670
申请日：2014-03-18
申请人： Kunio Mori , Sulfur Chemical Laboratory Incorporated , Meiko Electronics Co., Ltd.
发明人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shigeru Michiwaki , Manabu Miyawaki
IPC分类号： C23C18/20 , C23C18/16 , C25D11/00 , C25D5/56 , C23C18/28 , C23C18/30 , H05K3/38
CPC分类号： C23C18/1608 , C23C18/1612 , C23C18/1653 , C23C18/20 , C23C18/204 , C23C18/2086 , C23C18/285 , C23C18/30 , C25D5/56 , C25D11/00 , H05K3/389 , H05K2203/072 , H05K2203/122 , H05K2203/124 , Y10T428/31663 , Y10T428/31678
摘要： The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (α) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (α) by a wet-mode plating technique, wherein the compound (α) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
摘要翻译：本发明的目的在于提供一种金属膜不容易脱离的布线基板。形成金属膜的方法包括在化合物（α）的表面上将含有化合物（α）的试剂涂布在基材表面上的步骤（X）和在化合物（α）的表面上形成金属膜的工序（Y）湿式电镀技术，其中化合物（α）是每分子具有OH基或OH生成基团，叠氮基和三嗪环的化合物，并且碱包含聚合物。

9. 发明授权

US09587316B2 Thermoplastic resin composition, resin molded article, and method for manufacturing resin molded article having a plated layer 有权
标题翻译：热塑性树脂组合物，树脂成型体，以及具有镀层的树脂成形品的制造方法
公开(公告)号：US09587316B2
公开(公告)日：2017-03-07
申请号：US14427849
申请日：2013-09-05
申请人： MITSUBISHI ENGINEERING-PLASTICS CORPORATION
发明人： Takahiro Takano , Takahiko Sumino , Kentarou Ishihara , Naohisa Akashi
IPC分类号： C08K3/40 , C23C18/28 , C08K3/22 , C08K7/14 , H01Q1/38 , H01Q1/24 , C08G69/26 , C08L77/06 , C23C18/16 , C23C18/20 , C23C18/38 , H05K3/18 , H05K1/03
CPC分类号： C23C18/285 , C08G69/265 , C08K3/22 , C08K3/2279 , C08K7/14 , C08K2003/2231 , C08K2003/2241 , C08L53/02 , C08L77/06 , C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/204 , C23C18/38 , H01Q1/243 , H01Q1/38 , H05K1/0366 , H05K1/0373 , H05K3/182 , H05K2201/0236 , H05K2203/107
摘要： Provide is a thermoplastic resin composition from which a resin molded article having high whiteness and mechanical strength can be obtained while retaining the plating properties of the resin molded article. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive, 0.1 to 20 parts by weight of a titanium oxide and 10 to 230 parts by weight of a glass fiber per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive has an L value of 50 or more, and the glass fiber comprises SiO2 and Al2O3 in a proportion of 60 to 70% by weight of SiO2 and 20 to 30% by weight of Al2O3.
摘要翻译：提供一种热塑性树脂组合物，其中可以获得具有高白度和机械强度的树脂模塑制品，同时保持树脂模塑制品的电镀性能。包含热塑性树脂的热塑性树脂组合物和1至30重量份的激光直接结构化添加剂，0.1至20重量份的氧化钛和10至230重量份的玻璃纤维，相对于每100重量份的所述热塑性树脂，其中所述激光直接结构化添加剂的L值为50以上，所述玻璃纤维包含SiO 2和Al 2 O 3，所述SiO 2和Al 2 O 3的比例为60〜70重量％的SiO 2和20〜30重量％的Al 2 O 3。

10. 发明申请

US20160258066A1 PLATING METHOD 审中-公开
标题翻译：涂层方法
公开(公告)号：US20160258066A1
公开(公告)日：2016-09-08
申请号：US15051746
申请日：2016-02-24
申请人： TOYODA GOSEI CO., LTD.
发明人： Takao HIEI , Atsushi KAWAHARA
IPC分类号： C23C18/16 , C23C18/32 , C23C28/02 , C23C18/30 , C25D5/54 , C25D5/34
CPC分类号： C23C18/1671 , C23C18/1619 , C23C18/163 , C23C18/1632 , C23C18/1653 , C23C18/2086 , C23C18/24 , C23C18/285 , C23C18/30 , C23C18/32 , C23C28/023 , C25D5/14 , C25D17/00 , C25D17/005 , C25D17/06 , C25D17/12
摘要： A plating method has an electroless plating step for forming a conductive coating on a non-conductive substrate and an electrolytic plating step for forming a metallic coating on the conductive coating by using an auxiliary electrode. In the electroless plating step, with the position of the auxiliary electrode adjusted in relation to the non-conductive substrate, the non-conductive substrate and the auxiliary electrode are both immersed in an electroless plating solution to form the conductive coating. In the electrolytic plating step, with the position of the auxiliary electrode adjusted in relation to the non-conductive substrate, the non-conductive substrate and the auxiliary electrode are both immersed in an electrolytic plating solution to form the metallic coating. In the electroless plating step, electric current is applied by using the auxiliary electrode as an anode and a conductive member immersed in the electroless plating solution as a cathode.
摘要翻译：电镀方法具有用于在非导电性基材上形成导电性涂层的无电镀步骤，以及通过使用辅助电极在导电性涂层上形成金属被膜的电解电镀工序。在化学镀步骤中，随着辅助电极相对于非导电衬底的调整位置，非导电衬底和辅助电极均浸没在化学镀溶液中以形成导电涂层。在电解电镀工序中，将辅助电极的位置相对于非导电性基板进行了调整，将非导电性基板和辅助电极浸渍在电解电镀液中，形成金属被膜。在化学镀步骤中，通过使用作为阳极的辅助电极和浸在化学镀溶液中的导电构件作为阴极来施加电流。

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