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1. 发明授权

US5373629A Through-hole plate printed circuit board with resist and process for manufacturing same 失效
标题翻译：通孔板印刷电路板与抗蚀剂及其制造方法相同
公开(公告)号：US5373629A
公开(公告)日：1994-12-20
申请号：US836261
申请日：1992-02-28
申请人： Jurgen Hupe , Walter Kronenberg
发明人： Jurgen Hupe , Walter Kronenberg
IPC分类号： C08G61/10 , C08G61/12 , C25D5/56 , C25D7/00 , H05K3/10 , H05K3/40 , H05K3/42 , H05K3/46 , H01K3/10 , B32B3/10
CPC分类号： H05K3/424 , C08G61/123 , H05K3/4038 , H05K2201/0329 , H05K2203/0796 , H05K2203/107 , H05K2203/122 , H05K2203/1415 , H05K3/108 , H05K3/427 , Y10T29/49144 , Y10T29/49165 , Y10T428/24322 , Y10T428/24802 , Y10T428/24917 , Y10T428/31
摘要： A process is described for manufacturing through-hole plated single-layer or multi-layer printed circuit boards based on a polymeric substrate material or on a ceramic material provided optionally on both sides with at least one photoresist layer temporarily exposing the electroconductive circuit pattern by electroplating or electroless plating with a metal layer also on those surfaces which have not been coated with a conductive metal layer, characterized in thata) the surfaces of the substrate, after hole-drilling and a subsequent mechanical surface-treatment, are laminated with a suitable photoresist, exposed to light and developed so that the circuit pattern image is exposed,b) the surfaces of the substrate are pre-treated in a solution having oxidizing activity,c) after removal of the residual solution by rinsing, the substrate is introduced into a solution which contains at least one heterocyclic monomer, and more specifically pyrrole, thiophene, furane or derivative(s) thereof, which in a polymeric form is electrically conductive,d) the substrate is then transferred into an acidic solution whereby an electrically conductive polymeric layer is formed,whereupon, if desired or required, any residual solution is removed by rinsing, and the through-holes and the circuit pattern image are metallized in one step by galvanic or, preferably, electroless metallization.
摘要翻译： PCT No.PCT / EP90 / 01326 Sec。一九九二年二月二十八日 102（e）日期1992年2月28日PCT 1990年8月11日PCT PCT。公开号WO91 / 03920 日本1991年3月21日。描述了一种用于制造基于聚合物基材的通孔电镀单层或多层印刷电路板的工艺，或者在任选地在两侧设置有至少一个光致抗蚀剂层的陶瓷材料在没有涂覆有导电金属层的那些表面上也用金属层进行电镀或无电镀来暴露导电电路图案，其特征在于：a）所述基板的表面，在钻孔后和随后的机械表面 - 处理，与合适的光致抗蚀剂层合，暴露于光并显影，使得电路图案图像被曝光，b）基板的表面在具有氧化活性的溶液中预处理，c）在通过将底物引入含有至少一种杂环单体的溶液中，更具体地说是吡咯，噻吩，呋喃或d 以聚合形式导电，d）然后将基底转移到酸性溶液中，由此形成导电聚合物层，然后如果需要或需要，通过冲洗除去任何残留的溶液，并且通过电流或优选地，无电金属化在一个步骤中对通孔和电路图案图像进行金属化。

2. 发明授权

US07815785B2 Direct metallization of electrically non-conductive polyimide substrate surfaces 有权
标题翻译：非导电聚酰亚胺基板表面的直接金属化
公开(公告)号：US07815785B2
公开(公告)日：2010-10-19
申请号：US11756048
申请日：2007-05-31
申请人： Walter Kronenberg , Jürgen Hupe
发明人： Walter Kronenberg , Jürgen Hupe
IPC分类号： C25D5/34 , C25D5/54 , C25D5/56
CPC分类号： C25D5/56 , H05K1/0346 , H05K3/188 , H05K2201/0154 , H05K2201/0329 , H05K2203/0796
摘要： The present invention relates to an improved method for the direct metallization of non-conductive substrate surfaces, in particular polyimide surfaces, that is characterized by the process steps of etching the substrate surface with an acidic etching solution that contains peroxide; contacting the etched substrate surface with an acidic treatment solution that contains permanganate; activating the treated substrate surface in an acidic activation solution that contains peroxide; contacting the activated substrate surface with an acidic catalytic solution that contains at least a thiophene derivate and at least a sulfonic acid derivate; metallization of the thus treated substrate surface in an acidic galvanic metallization bath.
摘要翻译：本发明涉及用于直接金属化非导电衬底表面，特别是聚酰亚胺表面的改进方法，其特征在于用含有过氧化物的酸性蚀刻溶液蚀刻衬底表面的工艺步骤; 使蚀刻的基底表面与含有高锰酸盐的酸性处理溶液接触; 在含有过氧化物的酸性活化溶液中活化经处理的底物表面; 使活化的底物表面与至少含有噻吩衍生物和至少一种磺酸衍生物的酸性催化溶液接触; 这样处理的基底表面在酸性电镀金属浴中的金属化。

3. 发明申请

US20070298170A1 DIRECT METALLIZATION OF ELECTRICALLY NON-CONDUCTIVE POLYIMIDE SUBSTRATE SURFACES 有权
标题翻译：电导电性聚酰亚胺基层表面的直接金属化
公开(公告)号：US20070298170A1
公开(公告)日：2007-12-27
申请号：US11756048
申请日：2007-05-31
申请人： Walter Kronenberg , Jurgen Hupe
发明人： Walter Kronenberg , Jurgen Hupe
IPC分类号： B05D3/10
CPC分类号： C25D5/56 , H05K1/0346 , H05K3/188 , H05K2201/0154 , H05K2201/0329 , H05K2203/0796
摘要： The present invention relates to an improved method for the direct metallization of non-conductive substrate surfaces, in particular polyimide surfaces, that is characterized by the process steps of etching the substrate surface with an acidic etching solution that contains peroxide; contacting the etched substrate surface with an acidic treatment solution that contains permanganate; activating the treated substrate surface in an acidic activation solution that contains peroxide; contacting the activated substrate surface with an acidic catalytic solution that contains at least a thiophene derivate and at least a sulfonic acid derivate; metallization of the thus treated substrate surface in an acidic galvanic metallization bath.
摘要翻译：本发明涉及用于直接金属化非导电衬底表面，特别是聚酰亚胺表面的改进方法，其特征在于用含有过氧化物的酸性蚀刻溶液蚀刻衬底表面的工艺步骤; 使蚀刻的基底表面与含有高锰酸盐的酸性处理溶液接触; 在含有过氧化物的酸性活化溶液中活化经处理的底物表面; 使活化的底物表面与至少含有噻吩衍生物和至少一种磺酸衍生物的酸性催化溶液接触; 这样处理的基底表面在酸性电镀金属浴中的金属化。

4. 发明授权

US06576111B1 Process for the copper plating of substrates 失效
标题翻译：基板镀铜工艺
公开(公告)号：US06576111B1
公开(公告)日：2003-06-10
申请号：US09674509
申请日：2000-12-28
申请人： Jürgen Hupe , Walter Kronenberg , Eugen Breitkreuz , Ulrich Schmergel
发明人： Jürgen Hupe , Walter Kronenberg , Eugen Breitkreuz , Ulrich Schmergel
IPC分类号： C25D338
CPC分类号： C25D21/14 , H05K3/241
摘要： A process for the copper plating of substrates using insoluble anodes in acidic copper baths with separate replenishing of consumed copper ions, characterized in that the major portion of the copper ions is directly supplied in the form of copper carbonate and/or basic copper carbonate, dispensing with diaphragms and auxiliary electrolytes, in a separate tank operated in a bypass mode with respect to the working electrolyte, the released gaseous CO2 being separated off in said separate tank.
摘要翻译：一种用于在酸性铜浴中使用不溶性阳极镀铜的方法，其中单独补充消耗的铜离子，其特征在于铜离子的主要部分直接以碳酸铜和/或碱式碳酸铜的形式供应，分配具有隔膜和辅助电解质，在相对于工作电解质以旁路模式操作的单独的罐中，释放的气态CO 2在所述单独的罐中被分离。

5. 发明授权

US5194313A Through-hole plated printed circuit board and process for manufacturing same 失效
标题翻译：贯通孔印刷电路板及其制造方法
公开(公告)号：US5194313A
公开(公告)日：1993-03-16
申请号：US573042
申请日：1990-08-17
申请人： Jurgen Hupe , Walter Kronenberg
发明人： Jurgen Hupe , Walter Kronenberg
IPC分类号： C25D5/56 , C08G61/12 , C25D5/54 , C25D7/00 , H01B1/12 , H05K3/28 , H05K3/42 , H05K3/46
CPC分类号： C08G61/123 , H05K3/424 , H05K2201/0329 , H05K2203/0783 , H05K2203/0796 , H05K2203/122 , H05K3/427 , Y10T428/24322 , Y10T428/24802 , Y10T428/24917 , Y10T428/31 , Y10T428/31678
摘要： A process is described for manufacturing through-hole plated single-layer or multi-layer printed circuit boards based on a polymeric substrate material or on a ceramic material provided optionally on both sides with at least one electroconductive layer by electroplating or electroless plating with a metal layer also on those surfaces which have not been coated with a conductive metal layer, said process being characterized in thata) the surfaces of the substrate are pre-treated in a solution having oxidizing activity,b) after removal of the residual soltuion by rinsing, the substrate is introduced into a solution which contains at least one monomer, and more specifically pyrrole, furane, thiophene or derivative(s) thereof, which in a polymeric or copolymeric form is electrically conductive,c) the substrate is then transferred into an acidic solution whereby an electrically conductive polymeric layer is formed, more specifically of polymerized or copolymerized pyrrole, furane, thiophene or derivative(s) thereof,whereupon, if desired or required, any residual solution is removed by rinsing, and the galvanic or electroless metallization is carried out.
摘要翻译： PCT No.PCT / EP89 / 00204 Sec。 371日期1990年8月17日第 102（e）日期1990年8月17日PCT 1989年3月1日PCT公布。出版物WO89 / 08375 描述了一种用于制造基于聚合物基底材料的通孔电镀单层或多层印刷电路板的工艺，或者在任选地在两侧上提供至少一个导电层的陶瓷材料上制造在没有涂覆有导电金属层的那些表面上也用金属层进行电镀或化学镀，所述方法的特征在于a）将基材的表面在具有氧化活性的溶液中进行预处理，b）通过冲洗去除残留溶剂，将底物引入含有至少一种单体的溶液中，更具体地说是吡咯，呋喃，噻吩或其衍生物，其以聚合或共聚形式是导电的，c）然后将基底转移到酸性溶液中，由此形成导电聚合物层，更具体地形成聚合或共聚的吡咯 le，呋喃，噻吩或其衍生物，因此如果需要或需要，通过漂洗除去任何残余溶液，并进行电化学或无电镀金属化。

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